JPH0675774B2 - Solder forming supply device - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a solder forming and feeding device suitable for use in soldering the entire circumference of a cylindrical or columnar product.

[Background of the Invention]

It is difficult to uniformly solder the entire circumference of a cylindrical or columnar product by the soldering method, and the placement soldering method that uses ring-shaped solder that matches the external dimensions of the product gives better results. can get.

Conventionally, when such a ring-shaped solder is used, it is possible to automatically supply a ring-shaped solder from a storage container to a predetermined position to be soldered by a method such as spirally winding and cutting a thread-shaped solder in advance. Attempts have been made, but since the material of the solder itself is soft, it deforms during feeding, causing frequent feeding chute clogging and defective charging at the charging part, etc., making it impossible to reliably supply the solder. There was no choice but to manually supply solder to the parts, and efficiency did not improve.

[Object of the Invention]

An object of the present invention is to provide a solder forming / supplying device which is capable of consistently performing the forming of the ring-shaped solder and the charging of the solder into the soldering portion and which has high supply reliability.

[Outline of Invention]

According to the present invention, a feeding means for feeding out the filamentous solder continuously wound on a reel and guiding it to a forming table, and introducing the filamentous solder between a semi-circular groove portion of the forming table and a core metal to form a U-shape. First
Forming means, second forming means for forming the filamentous solder from the U-shape into a ring shape along the outer circumference of the core metal, and the filamentous shape while the molded ring-shaped portion is mounted on the core metal. A cutting means for separating the solder from the solder, and a charging means for moving the inserted object to a lower position coaxial with the core bar, and moving the molded ring-shaped solder to a circumferential soldering portion of the inserted object. It is characterized by.

Example of Invention

 Embodiments of the present invention will be described below with reference to the drawings.

A schematic configuration of one embodiment of the present invention is shown in FIG.

Here, the filamentous solder 1 is pulled out from the solder reel 2. The feed roller 4a driven by the step motor 3,
Reference numeral 4b is a main constituent element of a feeding means for quantitatively feeding the filamentous solder 1 in its original form, and the filamentous solder 1 is fed to the molding means through the guide tube 5 by the rotation of the feed rollers 4a and 4b.

The molding table 6, the molding pin 7 and the cutting blade 8 are the main constituent elements of the molding means for molding the meteredly fed filamentous solder 1 into a ring shape, and the molding table 6 is a semicircular groove 9 for molding and the molding pin 7.
The molding pin 7 is attached to a rotating disk 11 located below the forming table 6, and the semicircular groove 9 is formed by rotation of the rotating disk 11 connected to a drive source (not shown). It moves on the circumference of a circle concentric with about 180 °.

In this example, a columnar cored bar 12 is used as an object to be wound on which the filamentous solder is wound. This core metal 12 has the same external dimensions as the load 13 into which the ring-shaped solder is charged,
It moves forward and backward with respect to the forming table 6 by a drive source (not shown), and is placed at a position concentric with the semicircular groove portion 9 of the forming table 6 during solder forming.

The rotating disk 11 is provided with a radial groove portion 14 for allowing the core metal 12 to pass therethrough. The cutting blade 8 is the core metal 12 of the filamentous solder 1.
This is for cutting the part wound around the part from the subsequent part, and is moved forward and backward with respect to the molding table 6 by a drive source different from the cored bar 12.

Reference numeral 15 is a loading plate that moves up and down along the outer periphery of the cored bar 12 by a drive source (not shown), and is a device for moving the ring-shaped solder wound around the cored bar 12 to a predetermined position on the loading target 13 to be soldered. It is a component of the input means. In the figure, A is an arrow indicating the feeding direction of the filamentous solder 1, B, C, and D are arrows indicating the moving directions of the molding pin 7, the cutting blade 8, and the core metal 12 during molding, and E is during charging. 11 is an arrow showing the moving direction of the charging plate 15.

An example of the charging object is shown in FIG. 1 (b). The charging object 13 shown here is an example in which an oil dash pot cylinder (made of brass) 16 and a steel lid 17 which are relay parts of a circuit breaker for wiring are soldered all around, and 18 is a soldering portion thereof. . In the present embodiment, the loading object 13 is set at a loading position in contact with the cored bar 12 by a jig (not shown) which moves up and down.

Next, the molding operation and charging operation of this embodiment will be described with reference to FIGS. 2 and 3.

The molding operation is performed in the order shown in FIGS.

(A) The feed rollers 4a and 4b shown in FIG. 1 feed a fixed amount of the filamentous solder 1 corresponding to the circumferential length of the cored bar 12, and the filamentous solder 1 fed is molded with the semicircular groove portion 9 of the molding table 6 and It is located across the front of the relief groove 10 in which the pin 7 is inserted.

(B) The core metal 12 is advanced to a position where it is concentric with the semi-circular groove portion 9, and the filamentous solder 1 fed between the semi-circular portion of the core metal 12 and the semi-circular groove portion 9 is shaped into a U shape.

(C) The forming pin 7 moves in the direction of the arrow B on the circumference concentric with the cored bar 12 to wind the tip of the U-shaped filamentous solder 1 around the remaining half of the cored bar 12 for feeding. The formed thread solder 1 is formed into a ring shape as a whole.

(D) The forming pin 7 returns to the original position in the escape groove 10, and then the cutting blade 8 advances to cut the ring-shaped portion of the filamentous solder 1 from the subsequent portion.

(E) The cored bar 12 and the cutting blade 8 retract, and the cored bar 12 returns to the original position while holding the ring-shaped solder 1a.

The charging operation is performed in the order shown in FIGS.

(A) An object to be charged 13 is set under the cored bar 12 holding the ring-shaped solder 1a.

(B) The loading object 13 is lifted up to a position in contact with the cored bar 12.

(C) The charging plate 15 descends, and the ring-shaped solder 1a is applied to the core metal 12
Using the guide as a guide, the insert 13 is moved to a predetermined position to be soldered [soldering portion 18 in FIG. 1 (b)].

(D) The charge 15 rises, and the load 13 into which the ring-shaped solder 1a is charged is separated from the cored bar 12.

An example of a concrete configuration of the above-mentioned feeding, molding, and charging means is shown in FIGS.

As shown in FIGS. 4 to 6, a solder feeding unit, which is a specific example of feeding means, has a solder reel support 19 that rotatably supports the solder reel 2 and feed rollers 4a and 4b. Feed roller supports 20a, 20b for supporting, a base 21 accommodating the step motor 3, solder guides 22, 23 for guiding the filamentous solder 1, and gears 24 to 27 for transmitting rotation from the step motor 3 to the feed rollers 4a, 4b. And the feed roller support
The fulcrum pin 28 that serves as the center of rotation of the 20a and the feed roller support 20a
It is composed of a plunger 29, an open cylinder 30, a stopper 31, etc.

Here, the clearance between the feed rollers 4a and 4b is set to be smaller than the wire diameter of the filamentous solder 1, and the stopper 31 receives the clockwise rotational moment given to the feed roller support 20a by the spring built in the plunger 29. The clearance is maintained at the set dimension. When setting the solder,
The release cylinder 30 rotates the feed roller support 20a counterclockwise about the fulcrum pin 28 to rotate the feed rollers 4a and 4b.
A space is opened, and in this state, the filamentous solder 1 pulled out from the solder reel 2 is set through the solder guides 22 and 23. After that, by releasing the open cylinder 30, the filamentous solder 1 is sandwiched between the feed rollers 4a and 4b by the spring force and becomes ready to be fed. In this state, step motor 3
Thus, the feed rollers 4a and 4b are rotated through the gears 24-27 to feed the filamentous solder 1. The feed amount is a fixed amount determined by the number of drive pulses of the step motor 3.

The solder feeding unit and the solder forming / charging unit to be described next can be arranged at arbitrary positions by connecting them with a guide tube 5 [FIG. 1 (d)] adapted to the diameter of the solder wire.

A solder molding charging unit, which is a specific example of the molding unit and charging unit, is configured as shown in FIGS.

Here, the cored bar 12 is connected to the rod 34 of the air cylinder 33 horizontally mounted on the base 32 through the cored bar holder 35, and the cutting blade 8 of the air cylinder 37 horizontally mounted on the base 36. It is connected to the rod 38. Also, the charging plate 15
Is an air cylinder mounted vertically on the charging plate guide 39.
A U-shaped groove portion 42 is provided in the lower portion of the charging plate 15 in accordance with the outer shape of the cored bar 12 so as to be connected to the rod 41 of 40.

The core metal 12 and the cutting blade 8 are guided by the guide plate 43 to move linearly, and the charging plate 15 is guided by the charging plate guide 39 to move linearly.

The molding table 6 having the semicircular groove portion 9 and the clearance groove 10 is a base 32.
The rotating disk 11 fixed on the upper side and having the forming pin 7 attached thereto is located below the forming table 6, and the teeth provided on the outer periphery thereof are the base 32.
It engages with a gear 45 connected to the upper air motor 44 and is given a rotary motion.

The rotating disk 11 has a radial groove 14 through which the core 12 passes.
Is provided.

Forming table 6, forming pin 7, cutting blade 8 and rotating disc 1 described above
The positional relationship between 1, the core metal 12, and the charging plate 15 is shown in Fig. 1 (a).
Which is the same as that shown in FIG. 2, and by the operation of the above-mentioned parts shown in FIGS. 2 and 3, the ring-shaped molding of the thread-shaped solder 1 fed from the solder feeding unit through the guide tube 5 and the formed ring. The solder paste is charged into the object 13 to be charged.

As in FIGS. 1 to 3, the feeding direction of the thread solder is indicated by arrow A.
The moving directions of the molding pin 7, the cutting blade 8, the core metal 12, and the charging plate 15 are indicated by arrows B, C, D, and E, respectively.

In this example, the solder molding charging unit is fixed, and it has been described that the object to be charged 13 is raised to a position in contact with the core metal 12 at the time of solder charging, but a mechanism for moving the solder molding charging unit up and down is provided, The core metal 12 may be lowered to a position where the core metal 12 comes into contact with the object 13 when the solder is charged.

Further, in this example, the core metal 12 and the cutting blade 8 are driven by the separate air cylinders 33 and 37, but in order to simplify the drive mechanism, as shown in FIG. It is also possible to drive the cutting blade 8 and one air cylinder 46 to perform bending and cutting of the filamentous solder 1 at the same time. In this case, in order to avoid the interference between the molding pin 7 and the cutting blade 8, the solder cutting position 47 cannot be brought close to the semicircular groove portion 9 of the molding table 6 as in the above-mentioned embodiment. Although the protrusion 1b remains at the end of the ring-shaped solder 1a that is cut as shown in
There is no problem unless soldering requires precision.

Next, another example of the molding means will be described with reference to FIGS. 12 and 13.

The example of FIG. 12 should be called a winding method, and as a component of the forming means, a holding plate that can be moved forward and backward with respect to the cored bar 12 and can be moved in the circumferential direction with the rotation of the cored bar 12.
A cutting blade 49 that also serves as a molding die is used. The operation sequence is as shown in the figure. When a certain amount of the filamentous solder 1 is fed from the state of (a), the pressing plate 48 advances as shown in (b) and the tip of the filamentous solder 1 is pressed against the cored bar 12. After the attachment, the pressing plate 48 is rotated together with the core metal 12 as shown in (c) and (d) to wind the filamentous solder 1 fed to the core metal 12 and wind it at 270 °.
The rotation is stopped when it is wound up. Next, as shown in (e), the cutting blade 49 advances to cut the wound-up filamentous solder 1 from the subsequent portion, and the cut end of the solder is pressed against the core metal 12 to form a ring shape. , After molding, (f),
As shown in (g), the cutting blade 49 and the holding plate 48 return to their original positions,
The ring-shaped solder 1a remains on the cored bar 12.

The example of FIG. 13 should be called a folding method, and as a component of the forming means, a pair of forming claws 51a and 51b connected by a fulcrum pin 50 and a presser foot that moves forward and backward with respect to the core metal 12. A plate 52 and a pair of cutting blades 53a and 53b are used. The operation sequence is as shown in the figure. When a certain amount of the filamentous solder 1 is fed from the state of (a), the pressing plate 52 advances as shown in (b) and the fed filamentous solder 1 is transferred to the core metal 12. The filamentous solder 1 fed by the cutting blades 53a, 53b in the pressed state is cut from the subsequent portion, and after cutting, the cutting blades 53a, 53b return as shown in (c). Next, as shown in (d), the forming claws 51a and 51b move forward to bend and form the filamentous solder 1 held by the core metal 12 and the pressing plate 52 into a U-shape, and further as shown in (e), the forming claws. Both ends of the U-shaped filamentous solder 1 formed by closing 51a and 51b are folded so as to be wound around the core metal 12 and molded into a ring shape. After molding, the molding claws 51a and 51b and the pressing plate 52 return to their original positions as shown in (f), and the ring-shaped solder 1a remains on the cored bar 12.

In the above examples, for convenience, the filamentous solder is once wound around another core metal, and after molding, is charged into the object to be charged, but in each example, instead of the core metal, the object to be charged is replaced. It is also possible to directly wind the thread-shaped solder on an appropriate position and move the molded ring-shaped solder to the predetermined position to be soldered by using the object to be inserted as a guide. Even when the solder cannot be directly wound around the position at the end or the like, the ring-shaped solder can be reliably charged into the predetermined position.

〔The invention's effect〕

According to the present invention, after the filamentous solder is fed in a fixed amount and wound around the object to be wound to form a ring, the formed ring-shaped solder is used as a guide to solder at a predetermined position to be soldered. Since the ring-shaped solder is moved to a different position, unlike the case where the pre-formed ring-shaped solder is supplied from the storage container, the ring-shaped solder is reliably deformed without causing supply interruption or charging failure. It can be loaded in position and can achieve consistent automation of forming and dispensing ring solder.

[Brief description of drawings]

FIGS. 1 (a) and 1 (b) are schematic views of an embodiment of the present invention and a partially cut side view showing an example of an object to be charged, and FIG. 2 is an explanatory view of a molding operation of the present embodiment, and FIG. FIG. 4 is an explanatory view of the charging operation of the above, FIG. 4 is a plan view of a solder feeding unit embodying the feeding means of the present embodiment, FIG. 5 is a partially cut front view of the same, and FIG. 5, a sectional side view taken along the line AA ′ of FIG.
FIG. 7 is a plan view of a solder molding charging unit embodying the molding means and charging means of this embodiment, FIG. 8 is a partially cut front view of the same, and FIG. 9 is a partial cutaway of the same. Side view,
FIG. 10 is a sectional plan view taken along the line BB ′ of FIG.
(A), (b) is a partially cut plan view showing a modified example of the above embodiment and a plan view of a molded ring-shaped solder,
FIG. 13 is an operation explanatory view showing another example of the molding means. DESCRIPTION OF SYMBOLS 1 ... Thread-shaped solder, 1a ... Ring-shaped solder 2 ... Reel, 6 ... Molding stand, 13 ... Charged material feeding means: 3 ... Step motor, 4a, 4b ... Feed roller, 5 ... Guide tube 1st shaping means: 9 ... Semi-circular groove portion, 12 ... Core metal Second forming means: 7 ... Forming pin, 10 ... Escape groove, 11 ... Rotating disc 12 ... Core metal (wrapped object) Cutting means: 8 ... Cutting blade Inserting means : 15 ... Charging plate

Claims (1)

[Claims] 1. A feeding means for feeding a filamentous solder continuously wound on a reel to guide it to a molding table, and a filamentous solder introduced between a semi-circular groove portion of the molding table and a core metal to form a U-shape. A second forming means for forming the filamentous solder into a ring shape from a U-shape along the outer circumference of the core metal; and the formed ring-shaped portion attached to the core metal. Cutting means for separating the filamentous solder as it is, and charging means for moving the inserted object to a lower position coaxial with the core metal and moving the molded ring-shaped solder to the circumferential soldering part of the inserted object. A solder forming and feeding device comprising: