JPH0666714A - Detecting board for settled particles and detecting method therefor - Google Patents

Abstract

PURPOSE:To obtain particle adhering information by passing an inspecting board in which a plurality of crystal vibrators are disposed to be held through electrodes through a semiconductor manufacturing unit to inspect a quantity, position of the adhered particles. CONSTITUTION:A crystal vibrator 1 is held by electrodes 2 therebetween, and a power source 4, a pulse counter 5 are provided. When a voltage is applied to the electrodes 2, a frequency of the vibrator 1 can be counted. When particles ride on the vibrator 1, a vibrating frequency is altered, and hence a quantity of the particles sequentially adhered at times can be known. Such vibrators 11 are disposed on a board 10 to form an inspecting board. Further, an analysis personal computer is used to graphically obtain particle adhering time and positions in real time. Further, the board is placed instead of the board in an actual semiconductor manufacturing unit such as an etching unit, a depositing unit, a cleaning unit, passed therethrough to know adherence of the particles of any positions and any quantity of the unit and the board in real time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a foreign substance inspection substrate and an inspection method for a semiconductor device used in a semiconductor manufacturing factory. In recent semiconductor factories, contamination by foreign substances adhering to a processing substrate (wafer) inside and outside a processing apparatus has become a problem. In order to quickly investigate the cause of the contamination and feed it back to the site, it is necessary to develop an inspection device that can obtain a lot of information in real time and can perform the inspection itself at low cost.

[0002]

2. Description of the Related Art In the conventional investigation of the cause of wafer contamination in a semiconductor factory, the number, size, and substrate of foreign substances are mainly measured by a surface inspection device after actually passing the wafer through the device. I got information such as the adhesion position to the.

[0003]

However, in this method, it was difficult to know at what point dust was attached from the result. Therefore, it takes time and labor (such as passing through the wafer to the inspection device) and the cost which cannot be ignored (the enormous amount of required semiconductor) in order to investigate the contamination of each of the semiconductor manufacturing devices of many kinds and types. Number of survey wafers). In addition, during the survey period, the equipment is often stopped, so there was a problem that the loss during that period was immeasurable.

In view of the above points, an object of the present invention is to provide an inspection method and apparatus capable of performing the inspection quickly and obtaining a large amount of information at one time.

[0005]

In order to achieve the above object, the present invention provides a plurality of crystal oscillators sandwiched by electrodes so that dust or particles can be attached to the crystal oscillators on the surface of a substrate. And a substrate for detecting precipitated particles, characterized in that the electrodes are configured to be connectable to the outside for each individual crystal oscillator, and an inspection substrate in which a large number of crystal oscillators are arranged on the substrate surface, Provided is a method for detecting sedimented particles in a semiconductor manufacturing apparatus, which is passed through the semiconductor manufacturing apparatus and inspects the amount of particles adhering to the inspection substrate together with the adhering position in real time.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the basic structure of a quartz oscillator for detecting and counting particle adhesion. 1 is a water vibration body, 2 is an electrode,
Reference numeral 3 is a wiring (lead), 4 is a power source, and 5 is a pulse counter. When a voltage is applied to the electrodes, the frequency of the crystal oscillator can be counted, and when particles are placed on the oscillator, the vibration frequency changes, so that the amount of particles that adhere can be known over time.

According to the present invention, a large number of crystal oscillators as described above are arranged on a substrate to fabricate an inspection substrate.
FIG. 2 shows such an inspection board. 10 is a substrate, 11
Is a crystal oscillator, 12 is a lead wire, and 13 is a connector. The crystal unit and the lead wire may be manufactured on the substrate by applying a semiconductor device manufacturing technique. The pulse counter and power supply are connected via this connector. Furthermore, by using a personal computer for analysis (coordinate analysis software), the adhesion time and position of particles can be graphically obtained in real time.

FIG. 3 shows a modification of the inspection substrate. In this example, the surface of the crystal unit A is made to coincide with the surface of the substrate B,
This is an attempt to inspect the adhered particles in a more realistic form. By mounting such an inspection substrate on an actual semiconductor manufacturing apparatus such as an etching apparatus, a deposition apparatus, or a cleaning apparatus in place of the substrate and allowing it to pass, the particles in the semiconductor manufacturing apparatus where and how many particles are You can know in real time where it adheres.

A semiconductor manufacturing apparatus generally has a structure as shown in FIG.
The carrier cassette 21 enters the apparatus main body 23 under vacuum through the leak prevention chamber 22 on the inlet side, is subjected to processing such as etching there, and is then stored again in the carrier cassette 25 via the leak prevention chamber 24 on the outlet side. It is a composition.
An inspection substrate is mounted instead of the substrate mounted in the carrier cassette 21, and the apparatus is passed through. At this time, it is desirable to prepare a connector to be paired with the connector for the inspection board in the processing apparatus main body 23 so that the connector is connected to the inspection board when it enters the main body.

[0010]

As described above, according to the present invention, by simply passing the inspection substrate through the processing apparatus once, the foreign matter in the processing apparatus, when, how much and how much foreign matter is present on the substrate can be determined. Since it is possible to know whether or not it has adhered to the site, it greatly contributes to shortening the inspection time for adhered foreign matter and reducing the number of substrates used for investigation.

When forming a film on a substrate, it can also be used to investigate the distribution of the formed film thickness.

[Brief description of drawings]

FIG. 1 shows a basic configuration for detecting adhered particles by a crystal oscillator.

FIG. 2 shows a basic structure of an inspection board.

FIG. 3 shows a modification of the inspection board.

FIG. 4 shows a basic configuration of a semiconductor manufacturing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Crystal oscillator 2 ... Electrode 3 ... Lead wire 4 ... Power supply 5 ... Pulse counter 10 ... Substrate 11 ... Crystal oscillator 12 ... Lead wire 13 ... Connector 21, 25 ... Carrier cassette 22, 24 ... Leak prevention chamber 23 ... Semiconductor Manufacturing (processing) device body

Claims (2)

[Claims] 1. A plurality of crystal oscillators sandwiched between electrodes are arranged on a substrate surface so that dust or particles can adhere to the crystal oscillator, and the electrodes are connected to the outside for each individual crystal oscillator. A substrate for detecting settling particles, which is configured to be possible. 2. An inspection substrate having a large number of crystal oscillators arranged on the surface of the substrate is passed through a semiconductor manufacturing apparatus, and the amount of particles adhering to the inspection substrate is inspected in real time together with the attachment position. And a method for detecting sedimented particles in a semiconductor manufacturing apparatus.