JPH0666365B2 - Probe device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a probe device.

(Prior Art) A wafer supply device in which a probe device, for example, a loader of a semiconductor wafer prober, that is, a wafer storage container installation part and a wafer supply / storage mechanism is arranged on any of the front, rear, left and right sides of the semiconductor wafer prober is a practically developed device. It is well known in the publication.

A probe device in which a plurality of measuring stage mechanisms for measuring a wafer are arranged in one loader, that is, a wafer supply / accommodation mechanism is known from Japanese Patent Laid-Open No. 168236/1986.

(Problems to be Solved by the Invention) A variety of ICs and LSIs are produced in a semiconductor factory due to technological innovation. In a clean room, which is usually a semiconductor factory, depending on the type of IC to be formed, for example, a memory IC line, a gate array IC line, etc., and semiconductor manufacturing equipment suitable for each line are configured, and a probe device is also set for each line. Was there. However, due to urgent production demands, the production volume of each line will change significantly. In this way, the production amount of ICs frequently changes from line to line, so it is necessary for the probe device to handle the change. Moreover, since the clean room is expensive, it is necessary to prevent the floor area from being expanded, to replace the layout with a minimum number of probe devices, and to prevent the processing capability of the probe devices from deteriorating.

However, in the conventional probe device, most of the loader section having a mechanism for storing a large number of measured objects and supplying the measured objects and the measuring section measuring the measured objects have a one-to-one relationship. The probe device is composed of a pair of the loader unit and the measuring unit. Therefore, when a wafer of a type that needs to be measured in a hurry arrives, one cassette is usually used from the previous process.
The probe process is performed in 25-piece units, so waiting for 25 measurements to be completed with one probe device, or artificially extracting several wafers from the cassette and performing several measurements on multiple probe devices, is extremely useful. It was a labor-intensive task.

Further, in the probe device having a plurality of measuring units for one loader unit, the above problem is solved, but the layout frequently performed requires that the probe devices be exchanged between other semiconductor factories. However, it has been found that such a device is delayed in response, takes a long time to transport, and is costly. That is, this device exerts an excellent ability under limited conditions, but on the contrary, if application conditions such as arrangement conversion are added, the deterioration of the measurement processing capability of the measured object is amplified as a result. was there. Furthermore, since this apparatus has only one transfer mechanism, there is no wafer on the stage until the wafer for which measurement has been completed is returned to the cassette, and measurement stops. Further, since there is only one wafer waiting place for a plurality of stages to wait for the measurement order, it is impossible to place the wafers on each stage at the same time, which is a great disadvantage in terms of production efficiency.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to set two cassettes, each of which stores an object to be measured, on a cassette mounting table in front of and behind a cassette housing section of one loader section, and By simply moving the front and rear cassette mounting tables up and down individually, the transport mechanism at the lower part of the cassette on the cassette mounting table on both the front and rear can quickly take it out by the forward and backward movements and selectively select the left and right prober parts. During measurement, prepare to return the measured object from the other prober unit to the cassette and carry in the next object to be measured. Even if a measured object of a product type that can be measured well and needs to be measured urgently due to an urgent production request,
It is to provide a high-performance probe device that can easily and smoothly cope with the problem.

(Means for Solving the Problem) In order to achieve the above-mentioned object, the present invention arranges prober units for measuring an object to be measured placed on each measurement stage on the left and right sides, and provides the left and right prober units. In the probe device, in which a loader unit for taking out the object to be measured from the cassette and carrying it in or returning it to the other side is provided between the left and right prober units, the loader unit moves up and down a pair of front and rear cassette mounting tables. A cassette storage part that is drivable, and the left and right prober parts are taken out from the cassettes that are installed behind the cassette storage part so as to be movable back and forth and that are set on the ascending side of the front and rear cassette mounting tables. And a transport mechanism for selectively loading and unloading.

The transfer mechanism of the loader unit is arranged behind the cassette storage unit and horizontally moves back and forth to take out the object to be measured from the cassette set on the ascending side of the cassette mounting table before and after the cassette storage unit. And a vacuum suction tweezers that can be returned in the reverse direction, a pre-alignment stage that can be moved between the vacuum suction tweezers and the cassette storage unit to receive and pre-align the object to be measured on the vacuum suction tweezers, and the pre-alignment stage. It is desirable to provide a pair of left and right vacuum suction arms each having an upper and lower two-stage structure for receiving and waiting the object to be measured on the alignment stage, rotating it to the measuring stage of the prober unit, and returning it to the reverse.

Further, it is desirable that the pair of front and rear cassette mounting bases of the cassette accommodating portion of the loader portion are supported by two guide shafts on one side and can be vertically driven.

Further, the loader unit has a single microscope at the rear portion thereof so as to be rotatable left and right via a column and a rotating arm, and this single microscope can be used to cover the left and right prober units on the measurement stage. It is preferable to enlarge the tip of the measurement object so that the position can be confirmed.

Further, it is preferable that the left and right prober units each include an operation panel unit having a joystick for finely adjusting the chip position of the object to be measured by driving the measurement stage in the X and Y directions while looking at the microscope.

(Operation) In the case of the probe device having the above-described configuration, the loader unit installed between the pair of left and right prober units has a cassette storage unit having a pair of front and rear cassette mounting tables that can be moved up and down, and this cassette. The object to be measured is taken out from the cassette installed in the rear part of the storage part so that it can move back and forth and set in the ascending side of the front and rear cassette mounting tables, and it can be selectively loaded into the left and right prober parts and returned to the reverse. It is possible to freely set and set the cassettes containing the required DUTs on the cassette mounting tables in the front and back of the cassette storage section, respectively, and the cassette mounting tables before and after that can be individually moved up and down. By simply moving it, the transport mechanism quickly takes out the DUT from any cassette on the cassette mounting table before or after that and selectively carries it to the left and right prober sections. You will be able to enter and reverse.

That is, one of the front and rear cassette mounting bases of the cassette storage unit is raised to a predetermined height, and the other cassette mounting base is lowered so as not to get in the way. The object to be measured in the cassette on the ascending-side cassette mounting table is quickly taken out by the transfer mechanism and transferred to either the left or right prober section for measurement.
During the measurement, preparations such as returning the measured object of the other prober unit to the cassette and carrying in the next object to be measured can be performed, and the object to be measured can be measured very efficiently one after another.

In particular, even if an object to be measured of a product type that must be measured urgently is generated due to an urgent production request, etc., the device to be measured of that product type is stored in a cassette, and either the cassette mounting table before or after the cassette storage unit is placed. The existing cassette can be freely exchanged and set on top of it, and by raising the cassette mounting table to a predetermined height and lowering the other cassette mounting table, the object to be measured of the emergency type in the cassette can be transferred by the transport mechanism. It can be taken out quickly and transported to either the left or right prober unit, and the measurement can be performed easily and efficiently.

Further, as the transport mechanism of the loader unit, as described above, it is arranged in the rear of the cassette storage unit and horizontally moved back and forth to measure the inside of the cassette set on the ascending side of the cassette mounting table before and after the cassette storage unit. A vacuum suction tweezers for taking out and returning the body, and a pre-alignment stage that can be moved between the vacuum suction tweezers and the cassette storage part to receive and pre-align the object to be measured on the vacuum suction tweezers. With the provision of the vacuum suction tweezers, if the vacuum suction tweezers adsorb the object to be measured from the inside of the cassette on the cassette mounting table either before or after the cassette storage part and move it backwards to take it out, the vacuum suction tweezers are rotated (swirl) or the like. The pre-alignment stage can be quickly received by the pre-alignment stage without any movement that may cause displacement of the measurement body. Imento work will be able to better efficiency.

In addition, by providing a pair of left and right vacuum suction arms each having an upper and lower two-stage structure for receiving the object to be measured on the pre-alignment stage and waiting it, rotating it to the measuring stage of the prober unit, and returning it in reverse, One of the left and right vacuum suction arms of the upper and lower two-stage structure receives the object to be measured on the pre-alignment stage and waits for it, and the measurement of the preceding object to be measured on the measuring stage of the prober unit is completed. Then, it rotates to receive the measured object to be measured on the other stage and show it on the pre-alignment stage, and also to transfer the next object to be measured on the one stage to the measuring stage of the prober unit. The vacuum suction arm of each performs the preparation for carrying in the next measured object during measurement of the measured object at the left and right prober parts. Very it becomes possible measure high efficiently sequentially time loss is small.

Further, by providing a pair of front and rear cassette mounting bases of the cassette accommodating portion of the loader unit on one side with two guide shafts respectively supported on one side so that they can be driven up and down, the type of the object to be measured on the cassette mounting bases. It is convenient that different sizes of cassettes can be mounted and set freely without being disturbed by the guide shaft.

Further, the loader unit has a single microscope rotatably left and right via a column and a rotating arm at the rear portion of the loader unit, and the single object microscope has an object to be measured on a measurement stage of the left and right prober units. By enlarging the chip of (1) and confirming the position, only one expensive microscope is needed for the two prober units on the left and right, which is economical.

Further, by providing each of the left and right prober sections with an operation panel section having a joystick, by operating the joystick while looking at the microscope, the measurement stage of the left and right prober sections is driven in the X and Y directions, The teaching work can be easily performed so that the tip position of the object to be measured is finely adjusted to enable accurate measurement.

(Example) Next, an example in which the probe device of the present invention is applied to a semiconductor wafer prober will be described with reference to the drawings.

This wafer prober has a plurality of systems, for example, a first prober unit (30a) and a second prober unit (30b), each of which is an independent housing with respect to a loader unit (1) formed of one system of an independent housing. Consisting of the first and second prober sections (30a) (3
0b) is arranged on the left and right side surfaces of the loader section (1).

This loader section (1) has a depth of, for example, 1000 m as shown in FIG.
It is composed of an independent housing with a width of 380 mm and a height of 800 mm, and a caster (2) is set so that the loader section (1) can be immediately installed and moved to a desired position on a square in the floor direction on the bottom surface of this housing. Has been done. It is possible to set and fix the caster (2) at a desired position by providing a stopper on each of the casters (2). Both side surfaces of the loader portion (1) are composed of detachable side plates, and the side plates are attached and detached by screwing bolts at eight points in total at the peripheral square and the midpoint of each corner. . The front side of the loader section (1) is a cassette storage section (3). This compartment (3)
A motor (4) is connected to the motor, and four rotatable guide shafts (5) are installed vertically along the side surface of the loader unit (1) housing. Attach one side of one cassette mounting table (6) to. That is, the guide shaft (5) is rotated by the rotation of the motor (4), and the mounting table is adapted to this rotation.
(6) is moved up and down to vertically move the cassette (7) mounted on the mounting table (6). In this cassette storage section (3), two cassettes (7) each of which stores 25 wafers (10) on which semiconductor chips to be measured are regularly formed at appropriate intervals are mounted. It can be placed.

The vacuum suction tweezers (11) for loading and unloading the wafer (10) from the cassette (7) has a support rod (14) vertically attached to a horizontally configured rotating shaft (13) connected to a motor (12). It is provided and attached to this support rod (14). With this structure, the vacuum suction tweezers (11) can slide in parallel. Further, the tweezers (11) is formed by two attraction plates (11a) which are parallel to each other from the tip to the central part, and the central part and the support rod (14) installation part are formed as one plate. There is. Vacuum suction tweezers (11) and cassette compartment (3)
A pre-alignment stage (15) on which the wafer (10) can be placed is set between and, and it can be driven in the Z direction and the θ direction by being engaged with the motor (16). Also, a slide-rotatable vacuum suction arm that transfers the wafer (10) from the pre-alignment stage (15) to the measurement stage of the prober unit.
(17) is installed. The arm (17) is connected to the motor (18) and can rotate horizontally 360 °. A column (19) is installed on the rear surface side above the loader unit (1) housing, and an arm capable of rotating 360 ° horizontally about the column (19).
(20) is attached to the column (19). This arm (20)
Microscope at the tip of the magnified chip (21)
Is installed, and can be vertically moved, for example, by 200 mm. In addition, a CPU is incorporated to control the operation of the loader unit (1), and is wired to a keyboard (22) detachably installed on the upper surface of the loader unit casing. In addition, the power supply section (23) is arranged on the bottom section, and the prober section (30a) (30b)
It is said that power can be supplied to. Next, the prober unit will be described. The first prober unit (30a) and the second prober unit (30b) are independent casings of the same configuration, and are either left or right with respect to the loader unit (1). It can be installed from the side. Explaining the first prober section (30a), the first prober section (30a) has a depth of 1000 m, for example.
It consists of a stand-alone enclosure measuring m, width 620 mm, and height 800 mm. The first prober section (30a) is attached to the bottom square of this enclosure in the floor direction.
The casters (3
1) is set. Each of the casters (31) is provided with a stopper so that it can be set and fixed at a desired position. On both sides of this first prober section (30a), the loader section (1) can be set on either side,
It can be attached and detached simply by screwing the bolts at eight locations.
The eight points are the squares at the peripheral edge of the first prober unit (30a) housing and the midpoints between the corners. As an internal configuration, the measurement stage (32a) can be driven in the X direction, Y direction, Z direction, and θ direction by a known means. Particularly, the drive range in the X direction and Y direction is the first prober unit (30a). ) It is possible to perform symmetrical movement in front, rear, left and right at the center point. As a preliminary mechanism, the wafer mounted on the pre-alignment stage (15)
A vacuum suction arm (33a) for vacuum-sucking (10) to the measurement stage (32a) and carrying it in rotation is mounted. The arm (33a) is placed on the right side surface of the housing of the first prober section (30a). The waiting wafers are kept waiting on this arm (33a). Further, a vacuum suction arm (not shown) having the same shape as the arm (33a) is installed below the arm (33a). At the measurement position, a probe card is set at a position facing the measurement stage (32a), and the object to be measured is measured by a known means. The operation of the first prober unit (30a) is the first
As shown in the figure, it is input from the operation panel section (34a) and arithmetic processing is performed by a CPU (not shown) to control each operating mechanism. The first prober section (30a) and the second prober section (30b)
Have the same configuration as described above, and the description of the first prober unit (30a) can be said to be the same for the second prober unit (30b). Since the first prober unit (30a) and the second prober unit (30b) use the same mechanism as described above, the vacuum suction arm (33b) of the second prober unit (30b) can be installed with a preliminary mechanism. However, this embodiment is not used directly. Next is the loader section
The connection and position setting of (1) and the first and second prober units (30a) and (30b) will be described.

To the left and right side surfaces of the loader unit (1), for example, face the loader unit
(1) The first prober section (30a) is set on the left side surface, and the second prober section (30b) is set on the right side surface. In this case, both side plates of the loader section (1) and the first prober section (3
0a) right side plate and second prober part (30b)
Remove the left side plate of each. A guide plate is installed on the side surface of the prober part (30a) (30b) from which the side plate is removed so as to cross the center, and the guide pin is projected at an appropriate interval on the guide plate. There is. or,
On the loader section (1) with the side plate removed, the prober section (30
a) A cylindrical guide hole is installed so as to correspond to the guide pin of (30b), and by inserting the guide pin of the prober part into this guide hole, the loader part (1) and the prober part (30a ) Position (30b). After positioning, the prober sections (30a, 30b) and the loader section (1) are screwed and fixed with bolts. Further, the CPU of the loader unit (1) and the CPUs of the prober units (30a) (30b) are connected to each other, and the power supply unit (23) arranged in the loader unit (1) causes the prober unit (3
Supply power to 0a) and (30b). Next, the flow of measuring the wafer (10) with this wafer prober will be described.

Each mechanism of the loader unit (1) and the prober units (30a, 30b) operates according to a predetermined program input to each CPU.

First, 25 wafers (10) are stored in the cassette mounting table (6) of the cassette storage section (3). Set the cassette (7) to carry in two cassettes. The cassette (7) is lowered, the vacuum suction tweezers (11) is slid into the cassette (7), and one wafer is suctioned to the vacuum suction section (11a).
Is carried out by a vacuum suction tweezers (11). The vacuum suction part (11a) of this vacuum suction tweezers (11) is set at the place where the pre-alignment stage (15) is installed, and the pre-alignment stage (15) is raised there to pre-load the unloaded wafer (10). Place on the alignment stage (15). The wafer (10) mounted on the pre-alignment stage (15) is mounted on the wafer by the well-known means of the LED-sensor mechanism.
Perform (10) centering and pre-positioning with an accuracy of about ± 1 °. The pre-positioned wafer (10) is rotatably transferred to the measurement stage (32a) by the vacuum suction arm (33a) of the first prober unit (30a). This first prober section (30a)
The wafer (10) placed on the measurement stage (32a) is accurately positioned by the laser recognition mechanism and the pattern recognition mechanism, and then the probe needle is brought into contact with the electrode pad of each chip by a well-known means to make an electrical measurement. To execute. In order to transfer the wafer to the first prober unit (30a), the wafer is transferred from the pre-alignment stage (15) to the vacuum suction arm (33a), and then the wafer cassette (7) is vacuum suction tweezers. After fixing the horizontal position of (11) and raising it by a predetermined set interval so that the next wafer (10) can be taken out, the second wafer (1
0) is carried out from the cassette (7) by the vacuum suction tweezers (11). After pre-positioning the second wafer (10) with the pre-alignment stage (15), the second wafer (10) is sucked by the vacuum suction arm (17) installed in the loader unit (1). Then, the measurement stage (3) of the second prober unit (30b)
2b) rotates around the other end of the suction part of the arm (17) to rotate and transfer the wafer (10). The transferred wafer 10 is accurately aligned and then measured. Then, after the second wafer (10) is mounted on the vacuum suction arm (17) from the pre-alignment stage (15), the third wafer is pre-positioned by the pre-alignment stage (15) as above. It is mounted on a vacuum suction arm (not shown) of the same shape located under the vacuum suction arm (33a) and waits for the next measurement order. Next, similarly, the fourth wafer is put on standby on a vacuum suction arm (not shown) located below the vacuum suction arm (17). When the measurement of the first wafer (10) is completed by the first prober unit (30a), the first wafer (10) is sucked by the vacuum suction arm (33a), and the pre-alignment stage (15) To the first measurement stage (32a), the pre-alignment stage (15) on which the first wafer (10) is placed is lowered, and vacuum suction tweezers The wafer is transferred to the suction section (11a) of (11). Here, the wafer cassette (7) is lowered by a set interval so that it can be set so that the wafer (10) can be carried into the place where it was originally set. The tweezers (11) attracting the first wafer (10) is slid forward in this cassette, and the first wafer (10) is loaded to the original setting position of the first wafer (10). To do. Next, the fifth wafer (10) is taken out and the setting operation described above is performed, and it stands by on the first vacuum suction arm. Finished the above measurement 2
The fourth wafer (10) is transferred to the pre-alignment stage (15) and the fourth wafer (10) is transferred to the second measurement stage (32b).
The second wafer is transferred to the original position of the cassette (7), and the sixth wafer (10) is made to stand by on the second vacuum suction arm. A mechanism for measuring all the wafers (10) housed in the cassette (7) in such an operation is provided. The wafer measurement sequence will be described here. Since two wafer cassettes (7) are set in the loader unit (1) in the vertical direction, the wafer (10) set at the uppermost stage of the inner cassette is set. Measurement is started, and then the wafers (10) set on the uppermost stage of the outer cassette are measured in this order.
All wafers (10) stored in the inner cassette
After the measurement is completed, the cassette is raised and the vacuum suction tweezers (11) slide and move the lower side of the cassette to carry the wafer (10) in and out of the outer cassette.

It is necessary to perform a teaching operation prior to the execution of such a continuous process. This teaching operation will be described.

After accurately positioning the wafer (10) set on the measurement stage (32a) of the first prober section (30a), the measurement stage (32) is set on the measurement section of the probe card (36a).
Set a). Here, the operator attaches the electrode part of the chip formed on the wafer (10) and the probe card (36a) with a microscope, for example, a microscope (21) installed on the upper surface of the housing of the loader part (1). Probe needle (37a)
Check the contact with the joystick (35a) of the operation panel (34a) installed on the first prober (30a).
Is operated to operate the XY drive of the measurement stage (32a) to perform a teaching operation capable of measuring all the chips formed on the wafer (10). In addition, the teaching operation of the second prober unit (30b) is performed by the first prober unit (3
The CPU of 0a) is connected to the CPU of the second prober unit (30b) by solving the CPU of the loader unit (1). It is only necessary to confirm the contact between the electrode part of the chip and the probe needle (37b) attached to the probe card (36b) with the scope (21). If this contact position is misaligned, the second prober The joystick (35b) of the operation panel (34b) of the section (30b) is operated to correct the contact position.

In addition, since the microscope (21) is installed in the loader unit (1), one microscope (21), which was conventionally required for each one, is provided for every two probe devices, thus reducing the cost. As shown in FIG. 4, the test head (40) is
The prober housing can be installed from the rear side, or the cable from the test head to the tester body can be taken out to the rear side, and the prober can be installed in a clean room with a space between the prober and the prober. It has become possible to shorten. Further, for the above-mentioned reason, it is not necessary to make the test head dedicated to the left and dedicated to the right, and it is possible to use the same standard test head, which makes the modification of the test head unnecessary.

In addition, when the first prober unit (30a) fails, or when the first prober unit (30a) cannot operate for some reason, the CPU built in the loader unit (1) causes It is configured to automatically switch to the measurement of the prober section (30b) only. Similarly, when the second prober unit (30b) is inoperable, the measurement is switched to only the first prober unit (30a). Input to the CPU of the loader unit (1) is performed by operating a keyboard (22) installed in the loader unit casing.

In the above embodiment, if two systems are not measured at the same time, the measurement logic circuit can be switched to configure one system.
In case of the simultaneous measurement state, each measurement logic circuit is required.

Further, in the above-described embodiment, the prober unit is disposed on the left and right side surfaces of the loader unit of one system. That is, (prober section)
-(Loader section)-(prober section) is shown, but the arrangement of the loader section and the prober section can be switched depending on the degree of integration and urgency of the measured object. For example,
A plurality of loader units, for example 3 between the prober unit and the prober unit.
The system may be installed, and as another example, two prober units are provided on each of the left and right sides of the loader unit of one system, that is, (prober part)-(prober part)-(loader part)-(prober part).
-(Prober part) may be provided.

When the wafer is arranged as described above, the wafer can be transferred to each stage by transferring the wafer between the vacuum suction arm provided in the loader section and the vacuum suction arm provided as a preliminary mechanism in the prober section.

Further, in the above embodiment, the power supply unit is arranged in the loader unit to supply power to each prober unit. However, the power supply unit may be provided outside the loader unit casing, and an independent power supply unit may be provided. By supplying power to the plurality of loader units and the prober unit from the independent power source unit, the prober unit and the loader unit can be downsized and the cost can be reduced.

〔The invention's effect〕

Since the probe device of the present invention is configured as described above, it is possible to set two cassettes containing the measured object on the cassette mounting table before and after the cassette housing part of one loader part,
In addition, by simply moving the cassette mounting table before and after it individually up and down, the transport mechanism at the low part can quickly take out the measured object from the cassette on either of the cassette mounting tables before and after it and move it to the left and right prober parts. Selectively transport and measure, and during the measurement, make preparations such as returning the measured object of the other prober part to the cassette and carrying in the next object to be measured. In addition, even if a measurement target of a product type that needs to be measured urgently due to an urgent production request or the like can be measured efficiently, it is possible to obtain the effect of being able to handle it easily and smoothly.

[Brief description of drawings]

1 is a plan view of a wafer prober for explaining an embodiment of the present invention, FIG. 2 is a front view of the wafer prober of FIG. 1, FIG. 3 is an explanatory view of a loader section of FIG. 4 is the first
It is a side view of a test head attachment state in the figure. 1 ... loader section, 3 ... cassette storage section 10 ... wafer, 11 ... vacuum suction tweezers 15 ... pre-alignment stage 30a ... first prober section, 30b ... second prober section

Claims (5)

[Claims] 1. A prober unit for measuring an object to be measured placed on each measuring stage is arranged on the left and right, and the object to be measured is taken out from a cassette and carried in or returned to the left and right prober units. In a probe device having a loader unit provided between the left and right prober units, the loader unit includes a cassette storage unit having a pair of front and rear cassette mounting tables that can be driven up and down, and a cassette storage unit behind the cassette storage unit. A transport mechanism is provided that is movable back and forth and that takes out the DUT from the cassette set on the ascending side of the front and rear cassette mounting tables and selectively loads it into the left and right prober units and returns it to the reverse. A probe device characterized by being provided. 2. The transfer mechanism of the loader unit is arranged behind the cassette storage unit and horizontally moved back and forth to measure the object to be measured from inside the cassette set on the ascending side of the cassette mounting table before and after the cassette storage unit. A vacuum suction tweezers for taking out or returning to the reverse, and a pre-alignment stage that can be moved between the vacuum suction tweezers and the cassette housing to receive and pre-align the object to be measured on the vacuum suction tweezers, It is equipped with a pair of left and right vacuum suction arms each having an upper and lower two-stage structure for receiving and waiting the object to be measured on the pre-alignment stage, rotating it to the measuring stage of the prober unit, and returning it in reverse. The probe device according to claim 1. 3. The pair of front and rear cassette mounting bases of the cassette accommodating portion of the loader portion are provided so that two guide shafts are respectively supported on one side so that they can be vertically driven. The probe device according to the item. 4. The loader section has one microscope rotatably left and right via a column and a pivot arm at the rear of the loader section, and the one microscope is mounted on the measurement stage of the left and right probe sections. The probe device according to claim 1, wherein the tip of the object to be measured is enlarged to enable position confirmation. 5. The left and right prober units each include an operation panel unit having a joystick for finely adjusting the chip position of the object to be measured by driving the measurement stage in the X and Y directions while looking at the microscope. The probe device according to claim 4, characterized in that: