JPH0661413A - Substrate for hybrid ic and manufacture of hybrid ic using it - Google Patents

Abstract

PURPOSE:To provide a substrate for hybrid ICs which can cope with a reduction in pitch and increase in the number of pins without manual aid and without consuming a large amount of man-hours and a hybrid IC manufacturing method using the substrate. CONSTITUTION:The substrate is composed of circuit boards 2 on which semiconductor elements and individual components 6 and 7 are mounted along conductor patterns and flexible printed boards 3 provided in the peripheries of the substrates 2 in a state where the boards 3 are electrically connected to conductor patterns on the bards 2. The outer leads of this substrate are formed by punching the wiring boards 3 provided in the peripheries of the substrate 2 with a punch and die and, at the same time, bending the remaining parts in prescribed shapes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC substrate in which basically different kinds of components are mounted to form one electronic circuit function, and a hybrid IC manufacturing method using the same.

[0002]

2. Description of the Related Art In a conventional hybrid IC substrate, semiconductor elements and individual parts are mounted on a circuit board on which a predetermined conductor pattern is formed, and parts having different functions are electrically connected via the above-mentioned conductor pattern. Were connected to each other. A plurality of such circuit boards are provided on one main board, and they are divided one by one after component mounting is completed. Further, a plurality of lands are formed on the peripheral edge of each circuit board at a predetermined pitch, and after the board is divided, for example, F-type leads are fitted and soldered to the lands, respectively. There were external leads on both sides.

[0003]

However, in the above-mentioned conventional hybrid IC substrate, since the land portion of the circuit board and the external lead are connected by soldering, the work is labor-intensive and the number of lands is large. However, there is a problem that as the number increases, a lot of man-hours are required for soldering.

Further, conventionally, there is another problem that the terminal (land portion, external lead) interval cannot be set too small due to the occurrence of a bridge due to soldering and the difficulty in positioning the circuit board and the external lead. . further,
Since the F-type lead serving as an external lead sandwiches the circuit board from both sides, the external lead cannot be provided in all four directions of the circuit board. For these reasons, it has been very difficult for the conventional hybrid IC substrate to cope with the fine pitch and the increased number of pins that accompany the digitalization of the circuit.

The present invention has been made in order to solve the above problems, and is a hybrid IC capable of dealing with a fine pitch and a large number of pins without manpower and enormous man-hours.
It is an object of the present invention to provide a substrate for manufacturing and a method for manufacturing a hybrid IC using the substrate.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above object, and a circuit board on which a semiconductor element and individual parts are mounted on a conductor pattern, and a conductor pattern of the circuit board are provided. It is a hybrid IC substrate configured by a flexible printed wiring board provided around the circuit board in an electrically connected state. A plurality of the above-mentioned circuit boards and flexible printed wiring boards are arranged side by side on the main board. Furthermore, a method of manufacturing a hybrid IC using the above hybrid IC substrate, in which a flexible printed wiring board provided around a circuit board is cut by upper and lower molds and bent into a predetermined shape to form an external lead. Is.

[0007]

In the hybrid IC substrate of the present invention,
The part formed as an external lead is composed of a flexible printed wiring board, and since this flexible printed wiring board is electrically connected to the conductor pattern of the circuit board, it is easy to pattern the flexible printed wiring board. The terminal spacing can be set smaller than that. Further, in the hybrid IC substrate of the present invention, by arranging the flexible printed wiring boards around the circuit board, it is possible to provide external leads in all four directions of the circuit board. Further, in the hybrid IC manufacturing method of the present invention, the flexible printed wiring board is cut by the upper and lower molds, bent into a predetermined shape, and thermocompression-bonded, thereby eliminating the need for subsequent reflow soldering work. External leads can be provided around the substrate.

[0008]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 shows a hybrid IC according to the present invention.
FIG. 2 is a plan view showing an example of a substrate for use in the present invention, and FIG. 2 is a cross-sectional view of the main part of FIG. As shown in the figure, the hybrid IC substrate 1 of this embodiment is roughly composed of a circuit board 2 and a flexible printed wiring board 3, and these circuit board 2 and flexible printed wiring board 3 are on a main board 4. A plurality of (4 in the illustrated example) are arranged in parallel.

Conductor patterns (not shown) are formed on the upper and lower surfaces of the circuit board 2, respectively, and the semiconductor element 5 (see FIGS. 3 and 4) and the individual components 6 and 7 are mounted on the conductor patterns. It is like this. The semiconductor element 5 and the individual components 6 and 7 are electrically connected to each other through the above-described conductor pattern, and thus a predetermined electronic circuit function is formed on the circuit board 2.

The flexible printed wiring board 3 is made of, for example, a thin film having an insulating property such as polyimide or polyester, and has a predetermined wiring pattern formed on one surface thereof. This flexible printed wiring board 3 has a circuit board 2 as shown in FIG.
Are provided at four locations on the periphery of and are electrically connected to the conductor pattern of the circuit board 2 by means described later.

The internal structure of the hybrid IC substrate 1 will now be described with reference to FIG. In this embodiment, the upper and lower surfaces of the flexible printed wiring board 3 are sandwiched by, for example, a glass epoxy substrate 2a and sandwiched. The conductor pattern of the circuit board 2 and the wiring pattern 3a of the flexible printed wiring board 3 are electrically connected as follows. That is, the through hole 8 connected to the conductor pattern is provided on the periphery of the circuit board 2, and the through hole plating 8a applied to the through hole 8 and the through hole plating 3b applied to the flexible printed wiring board 3 are provided. An electrical connection is made between and. The wiring pattern 3a of the flexible printed wiring board 3 is formed so as to be interrupted at a position slightly intruding into the circuit board 2 side, thereby maintaining insulation between the patterns.

Next, a method of manufacturing a hybrid IC using the hybrid IC substrate 1 having the above structure will be described. First, the semiconductor element 5 and the individual components 6 and 7 are mounted on the conductor pattern of each circuit board 2. At this time, the semiconductor element 5 is sealed by the potting resin 9 after wire bonding. Flexible printed wiring board 3
It is preferable that the wiring pattern 3a is previously plated with gold or the like so that the pattern is not oxidized when the potting resin 9 is cured.

Subsequently, when the components are mounted on all the circuit boards 2, the hybrid IC board 1 is set in the magazine of the dedicated processing machine. This dedicated processing machine is equipped with an upper die 10 and a lower die 11 for lead processing, and the hybrid IC substrate 1 set in the magazine is transported to the upper die 10 and the lower die by a transport mechanism (not shown). It is conveyed between the molds 11.

When the hybrid IC substrate 1 is conveyed to a predetermined position, the upper mold 10 and the lower mold 11 move up and down. As a result, the circuit board 2 and the flexible printed wiring board 3 are separated from the main board 4, and the flexible printed wiring board 3 is bent into a predetermined shape. In this embodiment, the flexible printed wiring board 3 provided around the circuit board 2 is bent in a crank shape to form the external leads (3) as shown in FIG. After that, the circuit board 2 and the flexible printed wiring board 3 are sequentially transferred while feeding the hybrid IC board 1 at a predetermined pitch.
Cut and bend the and. Thereby, the hybrid ICs 12 as shown in FIG. 4 are manufactured one after another.

In the hybrid IC substrate 1 of this embodiment, the flexible printed wiring board 3 electrically connected to the conductor pattern of the circuit board 2 forms the external leads of the hybrid IC 12. Of course, there is no risk of bridging, and because of the ease of patterning the flexible printed wiring board 3, it is possible to set the terminal spacing to a much smaller value than in the prior art.

Incidentally, according to the experimental results of the present inventor,
In the past, the terminal spacing could be set to a small value of only 1.2 mm, but the hybrid IC substrate 1 of the present embodiment
It has been confirmed that the terminal spacing can be set as small as about 0.5 mm.

Further, in the conventional case using the F-type lead or the like, the external leads can be provided only on both sides (two directions) of the circuit board, but the hybrid IC of the present embodiment.
The circuit board 1 can be provided with external leads (3) in all four directions of the circuit board 2.

In addition, in the method of manufacturing a hybrid IC using the hybrid IC substrate 1, since the external leads are formed around the circuit board 2 at the same time when the substrate is divided, the external leads are fitted after the substrate is divided. Compared to the conventional method such as soldering, it requires less manpower and can significantly reduce man-hours, and the man-hours do not increase as the number of terminals increases. Furthermore, the main substrate 4
If the plurality of circuit boards 2 and the flexible printed wiring board 3 provided above are punched at once by the upper mold 10 and the lower mold 11 of the dedicated processing machine, further reduction of man-hours can be expected.

Further, the hybrid IC 12 punched by the upper and lower molds 10 and 11 is further conveyed as it is, and for example, as shown in FIG. 5, dedicated heating is performed on the conductor pattern 14 of the mother board 13 preliminarily pre-soldered. It is also possible to perform automatic mounting using the crimping tool 15. In addition, the hybrid IC 12 to the motherboard 13
The joining is not limited to the thermocompression bonding method described above, and may be, for example, a laser method.

[0020]

As described above, according to the present invention,
The terminal spacing can be set significantly smaller than before, and external leads can be provided in all four directions of the circuit board, so it is sufficient to cope with fine pitch and multiple pins accompanying digitalization of the circuit. It becomes possible.

Further, in the manufacturing process of the hybrid IC, since a series of manual operations such as fitting the external leads and soldering after dividing the substrate is not required at all, it is possible to significantly reduce the number of steps as compared with the conventional method. Become. Further, even in the case of supporting fine pitch / multi-pin, the circuit board and the flexible printed wiring board are electrically connected by a predetermined means, and the flexible printed wiring board becomes an external lead by cutting and bending. This does not cause an increase in man-hours.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a hybrid IC substrate according to the present invention.

FIG. 2 is a cross-sectional view of a main part of FIG.

FIG. 3 is an explanatory diagram of a manufacturing method according to the present invention.

FIG. 4 is a schematic side view of a hybrid IC according to the present invention.

FIG. 5 is a schematic side view illustrating a mounting example of a hybrid IC.

[Explanation of symbols]

 1 Hybrid IC Substrate 2 Circuit Board 3 Flexible Printed Wiring Board 4 Main Board 5 Semiconductor Elements 6, 7 Individual Parts 10 Top Mold 11 Bottom Mold

Claims (3)

[Claims] 1. A circuit board on which a semiconductor element and individual components are mounted on a conductor pattern, and a flexible printed wiring provided around the circuit board in a state of being electrically connected to the conductor pattern of the circuit board. A substrate for a hybrid IC, which is composed of a plate. 2. A substrate for a hybrid IC, wherein a plurality of the circuit boards and the flexible printed wiring board are arranged side by side on a main board. 3. A method of manufacturing a hybrid IC using the hybrid IC substrate according to claim 1 or 2, wherein the flexible printed wiring board provided around the circuit board is cut by upper and lower molds. And a method of manufacturing a hybrid IC, which comprises bending into a predetermined shape to form an external lead.