JPH065749A - Heat dissipating device - Google Patents
Heat dissipating deviceInfo
- Publication number
- JPH065749A JPH065749A JP4160630A JP16063092A JPH065749A JP H065749 A JPH065749 A JP H065749A JP 4160630 A JP4160630 A JP 4160630A JP 16063092 A JP16063092 A JP 16063092A JP H065749 A JPH065749 A JP H065749A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- liquid
- heat dissipation
- dissipation device
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims description 25
- 238000005192 partition Methods 0.000 claims description 4
- 239000000110 cooling liquid Substances 0.000 claims 1
- 238000009423 ventilation Methods 0.000 abstract description 2
- 238000012935 Averaging Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 11
- 230000005855 radiation Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】電子部品から熱を有効に逃がすた
めの液冷式の放熱装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid cooling type heat dissipation device for effectively releasing heat from electronic parts.
【０００２】[0002]
【従来の技術】電子部品の放熱技術については、日経エ
レクトロニクス、１９９１年１−２１号Ｐ．１２３−１
４１（日経ＢＰ社刊）で特集された記事に詳しく述べら
れている。これまでの放熱装置はバイポーラＬＳｉを使
う汎用コンピユータ、あるいはパワー・デバイスを使う
電気機器が対象で主として空冷方式が採用されていた。
現在はワークステーションやパソコンなどで消費電力の
大きいＬＳｉが使われるようになり、従来の空冷による
放熱装置では不十分となりつつある。また、機器の小型
化のために部品の実装密度が上がり、冷却空気を流せる
空間が減ってきたことから、空冷では限界があり、将来
は液冷が主になることが考えられている。2. Description of the Related Art Regarding heat dissipation technology for electronic parts, see Nikkei Electronics, No. 1-21, 1991, p. 123-1
No. 41 (published by Nikkei BP) provides detailed information. Up to now, the heat dissipation device has been mainly applied to a general-purpose computer using a bipolar LSi or an electric equipment using a power device, and an air cooling method has been mainly adopted.
Currently, LSi, which consumes a large amount of power, is used in workstations, personal computers, etc., and the conventional air-cooled heat dissipation device is becoming insufficient. In addition, since the packaging density of components has increased due to the miniaturization of equipment and the space in which cooling air can flow has decreased, there is a limit in air cooling, and it is considered that liquid cooling will predominate in the future.
【０００３】従来の空冷方式による放熱装置では、電子
部品に接して巨大な放熱板（フィン）と冷却用ファンを
取り付ける必要がある。しかし、これらの構造では、プ
リント配線基板上の突出部分の容積が大きくなるととも
に、部品の間に空気の通り道を設けるための基板間スペ
ースを必要とすることから、実装されたセット自体の大
型化につながりかねない。本発明は上記した問題を解決
するためのもので、液冷により放熱効率を高め、しかも
それによるセットの小型化を確保することのできる放熱
装置を提供することにある。In a conventional air-cooling type heat dissipation device, it is necessary to attach a huge heat dissipation plate (fin) and a cooling fan in contact with electronic components. However, in these structures, the volume of the protruding portion on the printed wiring board becomes large, and the space between the boards for providing the air passage between the components is required, so that the mounted set itself becomes large. Could lead to. The present invention is intended to solve the above-mentioned problems, and it is an object of the present invention to provide a heat dissipation device capable of increasing the heat dissipation efficiency by liquid cooling and ensuring the miniaturization of the set.
【０００４】[0004]
【課題を解決するための手段】本発明は、熱伝導性の大
きい液体を放熱媒体に使用し、熱を放散すべき電子部品
の一主面に接して取付けた２段に仕切られた容器内に上
記媒体を封入し、対流現象を利用して電子部品よりの熱
を外部に放散すことを特徴とするものである。このよう
な構造により電子部品から発生する熱は媒体を通じて外
部に伝導し、逃がすことができ、構造的にもそれほど大
きくならなくてすむ。According to the present invention, a liquid having a high heat conductivity is used as a heat dissipation medium, and the container is divided into two stages and is attached in contact with one main surface of an electronic component in which heat is to be dissipated. The above-mentioned medium is sealed in and the heat from the electronic component is dissipated to the outside by utilizing the convection phenomenon. With such a structure, the heat generated from the electronic component can be conducted to the outside through the medium and released, and the structure does not have to be so large.
【０００５】上記装置に加えて放熱ファンを取付けるこ
とにより、より効率的に放散することが可能となる。ま
た、複数の放熱装置間を接続管により接続することによ
り装置全体として小型にまとめめることができる。By installing a heat radiation fan in addition to the above device, it is possible to more efficiently dissipate the heat. Further, by connecting a plurality of heat dissipation devices with a connecting pipe, the entire device can be made compact.
【０００６】[0006]
【実施例】以下本発明をいくつかの実施例について説明
する。図１は本発明による液冷式放熱装置を面実装形電
子部品に装着した一実施例の切断面斜視図である。１は
電子部品の主要部である半導体装置（ＬＳｉ）、５はそ
れを封止する樹脂パッケージ、１０は外部へ導出された
リードで先端が面実装できるように形成されている。２
は放熱装置の容器で、仕切板３により上下２室に分けら
れ、内部に熱伝導性の良い液体たとえば水が媒体として
注入される。仕切板３にはいくつかの孔４があけられ、
液体が上室と下室の間を自由に往来できるようになって
いる。EXAMPLES The present invention will be described below with reference to some examples. FIG. 1 is a sectional perspective view of an embodiment in which a liquid cooling type heat dissipation device according to the present invention is mounted on a surface mount type electronic component. Reference numeral 1 is a semiconductor device (LSi) which is a main part of an electronic component, 5 is a resin package for encapsulating the semiconductor device, and 10 is a lead led out to the outside so that the tip can be surface-mounted. Two
Is a container of a heat radiating device, which is divided into two chambers, an upper chamber and a lower chamber, by a partition plate 3, into which a liquid having good thermal conductivity, such as water, is injected as a medium. Some holes 4 are made in the partition plate 3,
Liquid can freely move between the upper chamber and the lower chamber.
【０００７】図２は図１の放熱装置において、液体の対
流現象を説明するための正面断面図である。電子部品１
より発生した熱はパッケージ５を経て、上部の放熱装置
の容器本体２に伝わる。パッケージに接している部分の
液体（冷媒）の温度が上り、容器（本体）内で対流現象
が生じる。すなわち、図の黒い矢印８で示す方向に熱が
孔４を通じて上昇し、一方、温度の低い液体が白い矢印
９で示す方向に下降して液体全体の温度が平均化する方
向に循環移動する。上方に上った熱は放熱フィン６を通
じ矢印１２のように外部へ放散される。FIG. 2 is a front sectional view for explaining the convection phenomenon of liquid in the heat dissipation device of FIG. Electronic component 1
The generated heat is transmitted to the container body 2 of the upper heat dissipation device through the package 5. The temperature of the liquid (refrigerant) in the portion in contact with the package rises, and a convection phenomenon occurs in the container (main body). That is, heat rises through the holes 4 in the direction indicated by the black arrow 8 in the drawing, while liquid having a low temperature descends in the direction indicated by the white arrow 9 and circulates in a direction in which the temperature of the entire liquid is averaged. The heat rising upward is dissipated to the outside through the radiation fins 6 as indicated by an arrow 12.
【０００８】図３は一つの共通基板７上に複数個の電子
部品５が配置され、各電子部品にそれぞれ本発明の放熱
装置を設置し、放熱装置間を容器側面の接続管１１によ
り接続した状態で、冷媒である液体を各放熱管の間に通
過させて熱を外部へ逃がす構造を示すものである。この
場合、液体はポンプ等により強制的に移動させるもの
で、温度管理が容易となる。In FIG. 3, a plurality of electronic components 5 are arranged on one common substrate 7, the heat radiator of the present invention is installed in each electronic component, and the heat radiators are connected by a connecting pipe 11 on the side of the container. In this state, a structure is shown in which a liquid, which is a refrigerant, is allowed to pass between the radiating pipes and heat is released to the outside. In this case, the liquid is forcibly moved by a pump or the like, which facilitates temperature control.
【０００９】[0009]
【発明の効果】本発明は以上説明したように構成されて
いるので、以下に記載のような効果を奏する。液冷式に
よるため単なる強制空冷に比し熱交換効率がよく、通風
空間が少なくて済み、同じ基板上での部品搭載数が増
え、スペース効率の向上が図られる。また、回路配線の
自由度が増し、実装時での配線変更も容易となる。Since the present invention is configured as described above, it has the following effects. Since it is a liquid cooling type, it has better heat exchange efficiency than simple forced air cooling, requires less ventilation space, and increases the number of parts mounted on the same board, improving space efficiency. In addition, the degree of freedom in circuit wiring is increased, and wiring can be easily changed during mounting.
【図１】本発明による放熱装置を搭載した電子部品の切
断面斜視図である。FIG. 1 is a cross-sectional perspective view of an electronic component equipped with a heat dissipation device according to the present invention.
【図２】図１における放熱装置の正面断面図で熱の移動
状態を示す。2 is a front cross-sectional view of the heat dissipation device in FIG. 1 showing a heat transfer state.
【図３】本発明の応用例で、複数の電子部品上に取付け
た複数の放熱装置の接続形態を示す正面断面図である。FIG. 3 is a front cross-sectional view showing a connection form of a plurality of heat dissipation devices mounted on a plurality of electronic components in an application example of the present invention.
１ 電子部品（半導体装置） ２ 放熱装置本体（液体容器） ３ 仕切板 ４ 液体通過孔 ５ パッケージ ６ 放熱板（フィン） ７ プリント配線基板 ８ 熱された液体の移動方向を示す矢印 ９ 低温液体の移動方向を示す矢印 １０ 電子部品のリード １１ 接続管 １２ 放熱方向を示す矢印 1 Electronic Component (Semiconductor Device) 2 Heat Dissipator Main Body (Liquid Container) 3 Partition Plate 4 Liquid Passing Hole 5 Package 6 Heat Sink (Fin) 7 Printed Wiring Board 8 Arrows indicating the direction of movement of heated liquid 9 Movement of low temperature liquid Arrow indicating direction 10 Lead of electronic component 11 Connection tube 12 Arrow indicating heat radiation direction
Claims (3)
の大きい液体を放熱媒体として、電子部品の一主面上に
接して設けられた容器内に封入するとともに容器内には
液体が対流作用により電子部品よりの熱を容器上面に移
動させる仕切板が設けられいいることを特徴とする放熱
装置。1. A heat dissipation device for electronic parts, wherein a liquid having a high thermal conductivity is used as a heat dissipation medium in a container provided in contact with one main surface of the electronic part, and the liquid is contained in the container. A heat dissipation device characterized in that a partition plate is provided to move heat from an electronic component to the upper surface of the container by convection.
体を入れた容器表面には放熱フィンが設けてある。2. The heat dissipation device according to claim 1, wherein heat dissipation fins are provided on the surface of the container containing the upper liquid.
複数の電子部品に対しそれぞれ放熱装置が付設され、各
放熱装置をその容器側面に設けられた接続管で相互に接
続し、この接続管を通じて複数の放熱装置の間で共通の
冷却液を通過させる。3. The heat dissipation device according to claim 1 or 2,
A heat dissipation device is attached to each of the plurality of electronic components, and each heat dissipation device is connected to each other by a connection pipe provided on the side surface of the container, and a common cooling liquid is passed between the plurality of heat dissipation devices through the connection pipe. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4160630A JPH065749A (en) | 1992-06-19 | 1992-06-19 | Heat dissipating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4160630A JPH065749A (en) | 1992-06-19 | 1992-06-19 | Heat dissipating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH065749A true JPH065749A (en) | 1994-01-14 |
Family
ID=15719087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4160630A Withdrawn JPH065749A (en) | 1992-06-19 | 1992-06-19 | Heat dissipating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH065749A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004028410A1 (en) * | 2004-02-05 | 2005-09-01 | Wincomm Corporation | Device for dissipating heat |
| GB2443657A (en) * | 2006-11-08 | 2008-05-14 | 4Energy Ltd | Thermoelectric refrigerating device |
| JP2010147286A (en) * | 2008-12-19 | 2010-07-01 | Denso Corp | Radiator plate |
| CN102709374A (en) * | 2012-05-25 | 2012-10-03 | 中海阳新能源电力股份有限公司 | Efficient and natural cyclic back radiator for photovoltaic battery panel |
-
1992
- 1992-06-19 JP JP4160630A patent/JPH065749A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004028410A1 (en) * | 2004-02-05 | 2005-09-01 | Wincomm Corporation | Device for dissipating heat |
| GB2443657A (en) * | 2006-11-08 | 2008-05-14 | 4Energy Ltd | Thermoelectric refrigerating device |
| WO2008056154A1 (en) * | 2006-11-08 | 2008-05-15 | 4Energy Limited | Thermoelectric refrigerating device |
| JP2010147286A (en) * | 2008-12-19 | 2010-07-01 | Denso Corp | Radiator plate |
| CN102709374A (en) * | 2012-05-25 | 2012-10-03 | 中海阳新能源电力股份有限公司 | Efficient and natural cyclic back radiator for photovoltaic battery panel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990831 |