JPH0651826B2 - Flame-retardant epoxy resin composition - Google Patents
Flame-retardant epoxy resin compositionInfo
- Publication number
- JPH0651826B2 JPH0651826B2 JP62048705A JP4870587A JPH0651826B2 JP H0651826 B2 JPH0651826 B2 JP H0651826B2 JP 62048705 A JP62048705 A JP 62048705A JP 4870587 A JP4870587 A JP 4870587A JP H0651826 B2 JPH0651826 B2 JP H0651826B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- flame
- acid
- bromine
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 22
- 229920000647 polyepoxide Polymers 0.000 title claims description 22
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims description 14
- 239000003063 flame retardant Substances 0.000 title claims description 14
- 239000000203 mixture Substances 0.000 title claims description 8
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 16
- 229910052794 bromium Inorganic materials 0.000 claims description 16
- -1 halogen ion Chemical class 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 9
- 229910052736 halogen Inorganic materials 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 4
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 claims description 3
- 239000001263 FEMA 3042 Substances 0.000 claims description 3
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims description 3
- LRBQNJMCXXYXIU-QWKBTXIPSA-N gallotannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@H]2[C@@H]([C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-QWKBTXIPSA-N 0.000 claims description 3
- 229960001545 hydrotalcite Drugs 0.000 claims description 3
- 229910001701 hydrotalcite Inorganic materials 0.000 claims description 3
- 229910000462 iron(III) oxide hydroxide Inorganic materials 0.000 claims description 3
- 229940033123 tannic acid Drugs 0.000 claims description 3
- 235000015523 tannic acid Nutrition 0.000 claims description 3
- 229920002258 tannic acid Polymers 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 125000001246 bromo group Chemical group Br* 0.000 claims 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 11
- 229920003986 novolac Polymers 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、耐湿性に優れる難燃性エポキシ樹脂組成物に
関するものである。TECHNICAL FIELD The present invention relates to a flame-retardant epoxy resin composition having excellent moisture resistance.
近年、ＩＣ、ＬＳＩなどの半導体素子を安価に封止する
ために、セラミック封止や金属封止に代わり、熱硬化性
樹脂成形材料を用いて樹脂封止する方法が行なわれてい
る。そして、この封止用成形材料としては、低圧成形用
エポキス樹脂成形材料が最も一般的に用いられている。In recent years, in order to inexpensively seal semiconductor elements such as IC and LSI, a method of resin-sealing with a thermosetting resin molding material has been used instead of ceramic or metal sealing. As the molding material for sealing, the epoxy resin molding material for low pressure molding is most commonly used.
この樹脂封止化に伴い、封止樹脂の信頼性特に耐湿性の
向上は強く要求されている。樹脂封止の耐湿性はその配
合組成に依るところが大きく、バルク透湿、界面よりの
水侵入、不純物レベル、電気特性等が支配要因と考えら
れるが、この中で高温高湿の条件下で不純物の発生は、
耐湿性に大きく影響する。With this resin encapsulation, it is strongly required to improve the reliability of the encapsulating resin, especially the moisture resistance. Moisture resistance of resin encapsulation largely depends on its composition, and bulk moisture permeability, water penetration from the interface, impurity level, electrical characteristics, etc. are considered to be the controlling factors. The occurrence of
It greatly affects the moisture resistance.
封止樹脂の耐湿性試験にて、Ａｌ配線腐食の要因となる
不純物としては、ナトリウム、塩素、臭素などがあげら
れる。この中で、ナトリウムや塩素は原料の製造方法及
び精製により、耐湿性にほぼ問題のないレベルにまで低
減している。これに対し、臭素に関しては、この発生原
が難燃剤として使用している。臭素化合物で有る為にそ
の低減化は難しい。臭素系以外の難燃方法も数種提案さ
れているが、成形性、信頼性、価格の面でバランスよ
り、現在の半導体封止用エポキシ樹脂の難燃剤として
は、臭素化エポキシ樹脂／三酸化アンチモン系が最も一
般的である。しかし、高温高湿の条件下で、臭素化エポ
キシ樹脂より解離発生する臭素イオンが、耐湿性向上の
阻害要因となているのが現状である。In the moisture resistance test of the encapsulating resin, the impurities causing Al wiring corrosion include sodium, chlorine, bromine and the like. Among these, sodium and chlorine have been reduced to a level where there is almost no problem in moisture resistance by the raw material manufacturing method and purification. On the other hand, regarding bromine, this source is used as a flame retardant. Since it is a bromine compound, its reduction is difficult. Several flame retardant methods other than bromine have been proposed, but due to the balance of moldability, reliability, and price, the current flame retardant for semiconductor encapsulation epoxy resins is brominated epoxy resin / trioxide. Antimony is the most common. However, under the high temperature and high humidity condition, the bromine ion generated by dissociation from the brominated epoxy resin is an obstacle to the improvement of the moisture resistance under the present circumstances.
本発明では、高温高湿の条件下で、臭素の解離しにくい
臭素化合物を得んとして研究した結果、本発明により得
られる難燃剤を適用したエポキシ樹脂は、耐湿性に極め
て優れ、且つ成形性・信頼性・難燃性等の他特性も従来
と同等であることを見出したものである。In the present invention, as a result of studying to obtain a bromine compound in which bromine is difficult to dissociate under the condition of high temperature and high humidity, the epoxy resin to which the flame retardant obtained by the present invention is applied is extremely excellent in moisture resistance and has a good moldability.・ We have found that other characteristics such as reliability and flame retardancy are the same as before.
即ち本発明は、ハイドロタルサイト、鉄酸、タン酸、ス
ズ酸、ジルコニウ酸、ビスマス酸の含水酸化物群から選
ばれるものと臭素を置換反応させたハロゲンイオン交換
体からなる難燃剤として使用することを特徴とする難燃
性エポキシ樹脂組成物である。That is, the present invention is used as a flame retardant consisting of hydrotalcite, ferric acid, tannic acid, stannic acid, zirconium acid, and a halogen ion exchanger obtained by subjecting bromine to a substitution reaction with one selected from the group of hydroxides of bismuth acid. It is a flame-retardant epoxy resin composition characterized by the above.
エポキシ樹脂組成物は、その主成分としてエポキシ樹
脂、硬化剤、充填材からなるが、エポキシ樹脂とは、ビ
スフェノール型エポキシ樹脂、フェノールノボラック型
エポキシ樹脂、クレゾールノボラック型エポキシ樹脂等
エポキシを有するもの全般をいい、硬化剤とは、フェノ
ールノボラック類、酸無水物類、アミン類等エポキシ樹
脂と架橋反応するもの全般をいい、無機質充填材とは、
シリカ、アルミナ、マイカ等のことをいう。The epoxy resin composition is composed of an epoxy resin as a main component, a curing agent, and a filler, and the epoxy resin is a bisphenol type epoxy resin, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin or any other substance having epoxy. The curing agent refers to all those that undergo a crosslinking reaction with an epoxy resin such as phenol novolacs, acid anhydrides and amines, and the inorganic filler is
Refers to silica, alumina, mica and the like.
但し、半導体封止用としては、特にエポキシ樹脂はクレ
ゾールノボラック型エポキシ樹脂、硬化剤はフェノール
ノボラック、充填材はシリカを使用することが望まし
い。又、これら原料中に含まれるアルカリ金属及びハロ
ゲン等の不純物は、極めて少ないことが必須である。However, for semiconductor encapsulation, it is preferable to use cresol novolac type epoxy resin as the epoxy resin, phenol novolac as the curing agent, and silica as the filler. In addition, it is essential that impurities such as alkali metals and halogens contained in these raw materials are extremely small.
本発明で用いられる、ハロゲンイオン交換体には、ハイ
ドロタルサイト、鉄酸、タン酸、スズ酸、ジルコニウム
酸、ビスマス酸の含水酸化物を挙げることができる。こ
のハロゲンイオン交換体を臭素イオンを含む水溶液中で
処理、臭素を置換反応させた後、充分に洗浄を繰返し遊
離不純物を除去することにより、目的の化合物を得るこ
とができる。Examples of the halogen ion exchanger used in the present invention include hydrotalcite, ferric acid, tannic acid, stannic acid, zirconic acid, and hydrous oxides of bismuth acid. The target compound can be obtained by treating the halogen ion exchanger in an aqueous solution containing bromine ions, subjecting the bromine to a substitution reaction, and washing it sufficiently to remove free impurities.
難燃剤としては、得られる臭素含有のハロゲンイオン交
換体を単独で用いても、又数種類を併用してもよい。更
に、難燃効果を高める為に、三酸化アンチモン等のアン
チモン化合物を併用してもよい。As the flame retardant, the obtained bromine-containing halogen ion exchanger may be used alone or in combination of several kinds. Further, an antimony compound such as antimony trioxide may be used in combination for enhancing the flame retardant effect.
本発明方法に従うと、高温高湿の条件下で、難燃剤とし
て用いる臭素化合物より発生する遊離臭素を効果的に抑
制できる。即ち、耐湿性の極めて優れる難燃性エポキシ
樹脂組成物を得ることができる。According to the method of the present invention, free bromine generated from a bromine compound used as a flame retardant can be effectively suppressed under high temperature and high humidity conditions. That is, a flame-retardant epoxy resin composition having extremely excellent moisture resistance can be obtained.
本発明は、ＩＣ、ＬＳＩのプラスチック化を今後更に促
進させるものであり、ＩＣ、ＬＳＩの汎用化に寄与する
効果は非常に大きいものである。The present invention further promotes the plasticization of ICs and LSIs in the future, and the effect of contributing to the generalization of ICs and LSIs is extremely great.
以下、低圧封入成形材料での実施例を用い説明する。実
施例で用いた原料は次の通りである。又、配合における
部は全て重量部である。Hereinafter, an example using a low-pressure encapsulating molding material will be described. The raw materials used in the examples are as follows. All parts in the formulation are parts by weight.
臭素含有ハロゲンイオン交換体 表１に示す２種類の臭素含有ハロゲンイオン交換体を調
整した。 Bromine-containing halogen ion exchanger Two types of bromine-containing halogen ion exchangers shown in Table 1 were prepared.
エポキシ樹脂、硬化剤、硬化促進剤、充填材、表面処理
剤、顔料、離型剤、臭素化エポキシ樹脂、三酸化アンチ
モン、臭素含有ビスマス化合物を表２の様に配合し、３
分間混練し、数種の低圧封入材料を得た。 Epoxy resin, curing agent, curing accelerator, filler, surface treatment agent, pigment, mold release agent, brominated epoxy resin, antimony trioxide, bromine-containing bismuth compound are blended as shown in Table 2 and 3
After kneading for several minutes, several low-pressure encapsulating materials were obtained.
これらの材料の信頼性を評価した結果、表２に示す様
に、本発明によると、従来品に比べて極めて優れた耐湿
性を示すことが判った。As a result of evaluating the reliability of these materials, as shown in Table 2, it was found that according to the present invention, extremely excellent moisture resistance was exhibited as compared with the conventional products.
Claims (1)
ロタルサイト、鉄酸、タン酸、スズ酸、ジルコニウ酸、
ビスマス酸の含水酸化物群から選ばれるものと臭素を置
換反応させたハロゲンイオン交換体からなる難燃剤を必
須成分とすることを特徴とする難燃性エポキシ樹脂組成
物。1. Epoxy resin, curing agent, filler and hydrotalcite, ferric acid, tannic acid, stannic acid, zirconium acid,
A flame-retardant epoxy resin composition comprising a flame-retardant consisting of a halogen ion exchanger obtained by substituting bromine with a hydrous oxide of bismuth acid as an essential component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62048705A JPH0651826B2 (en) | 1987-03-05 | 1987-03-05 | Flame-retardant epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62048705A JPH0651826B2 (en) | 1987-03-05 | 1987-03-05 | Flame-retardant epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63215715A JPS63215715A (en) | 1988-09-08 |
| JPH0651826B2 true JPH0651826B2 (en) | 1994-07-06 |
Family
ID=12810732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62048705A Expired - Fee Related JPH0651826B2 (en) | 1987-03-05 | 1987-03-05 | Flame-retardant epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0651826B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2043147A2 (en) | 2007-09-28 | 2009-04-01 | Shin-Etsu Chemical Co., Ltd. | Automotive electric/electronic package |
| US7999016B2 (en) | 2004-08-02 | 2011-08-16 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6019339B2 (en) * | 1977-02-24 | 1985-05-15 | 協和化学工業株式会社 | Flame retardant thermoplastic resin composition |
| JPS60226147A (en) * | 1984-04-25 | 1985-11-11 | Hitachi Ltd | electronic components |
-
1987
- 1987-03-05 JP JP62048705A patent/JPH0651826B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7999016B2 (en) | 2004-08-02 | 2011-08-16 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
| EP2043147A2 (en) | 2007-09-28 | 2009-04-01 | Shin-Etsu Chemical Co., Ltd. | Automotive electric/electronic package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63215715A (en) | 1988-09-08 |
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