JPH0648955Y2 - Electronic device cover - Google Patents
Electronic device coverInfo
- Publication number
- JPH0648955Y2 JPH0648955Y2 JP1987091428U JP9142887U JPH0648955Y2 JP H0648955 Y2 JPH0648955 Y2 JP H0648955Y2 JP 1987091428 U JP1987091428 U JP 1987091428U JP 9142887 U JP9142887 U JP 9142887U JP H0648955 Y2 JPH0648955 Y2 JP H0648955Y2
- Authority
- JP
- Japan
- Prior art keywords
- cover
- electronic device
- wire mesh
- metal chassis
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 229920003023 plastic Polymers 0.000 claims description 15
- 239000004033 plastic Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は電子装置の開口部を閉塞するカバーに関し、特
に電子回路カバーが搭載されている電子回路モジュール
に用いて好適な電子装置カバーに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a cover for closing an opening of an electronic device, and more particularly to an electronic device cover suitable for use in an electronic circuit module equipped with an electronic circuit cover.
一般に電子装置は、金属製のシャーシ内に各種電子部品
や電子回路を内装し、その開口部をカバーで覆ってい
る。従来、この種のカバーはアルミニウム等の金属やプ
ラスチック等で形成されており、このカバーで電子装置
内を封止することにより外部からの影響の低減を図って
いる。Generally, in an electronic device, various electronic components and electronic circuits are provided inside a metal chassis, and an opening thereof is covered with a cover. Conventionally, this type of cover is formed of a metal such as aluminum or plastic, and the like to reduce the influence from the outside by sealing the inside of the electronic device with this cover.
上述した従来の電子装置カバーのうち、金属で形成され
ているものは一般特性面で重く,高価であり、内部が見
えないという短所がある。更に、電気特性面では導体で
あるため、例えば静電気放電等により、誘導雑音が電子
回路及びカバーに隣接するケーブルに影響を与えている
という問題がある。Among the conventional electronic device covers described above, those made of metal are heavy in terms of general characteristics, are expensive, and have the disadvantages that the inside cannot be seen. Furthermore, since it is a conductor in terms of electrical characteristics, there is a problem that induced noise affects the electronic circuit and the cable adjacent to the cover due to, for example, electrostatic discharge.
一方、プラスチックで形成されているものは、一般特性
面においては金属に比べて有利となるが、電気特性面で
は静電気に加えてEMI障害(電磁障害)に対処できない
問題がある。On the other hand, those made of plastic are more advantageous than metals in terms of general characteristics, but have a problem in terms of electrical characteristics that they cannot deal with EMI interference (electromagnetic interference) in addition to static electricity.
本考案は上記問題を解消して、一般特性面及び電気特性
面を夫々改善した電子装置カバーを提供することを目的
としている。SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and provide an electronic device cover with improved general and electrical characteristics.
本考案の電子装置カバーは、電子部品や電子回路等を内
装した金属製シャーシの開口部に被着するカバーを、金
網と透明度のあるプラスチックとを一体に形成してお
り、かつその内面においては、その周辺部においてのみ
金属製シャーシの開口縁に対応する幅で金網を露呈さ
せ、その他の部分はプラスチックで被覆し、金属製シャ
ーシの開口部に被着したときに金網の露呈部とシャーシ
の開口縁とを直接接触させて両者を電気的に導通させる
ように構成している。In the electronic device cover of the present invention, the cover attached to the opening of the metal chassis in which the electronic parts, the electronic circuit, etc. are built is integrally formed of the wire mesh and the transparent plastic, and the inner surface thereof is , Expose the wire mesh only in the peripheral part with a width corresponding to the opening edge of the metal chassis, and cover the other part with plastic, and when exposed to the opening of the metal chassis, the exposed part of the wire mesh and the chassis The opening edge and the opening edge are in direct contact with each other to electrically connect them.
次に、本考案を図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第1図乃至第3図は本考案の一実施例を示す図である。
即ち、第1図及び第2図に示すように、ここでは金属製
シャーシ1内に複数枚の電子回路カード2を内装した電
子装置を示しており、この金属製シャーシ1の開口にカ
バー3を被着してシャーシ1内を封止している。1 to 3 are views showing an embodiment of the present invention.
That is, as shown in FIGS. 1 and 2, here, an electronic device in which a plurality of electronic circuit cards 2 are housed in a metal chassis 1 is shown, and a cover 3 is provided in an opening of the metal chassis 1. It is adhered to seal the inside of the chassis 1.
前記カバー3は、第3図に断面構造を示すように、金網
4をプラスチック5a,5bでサンドイッチして所定の形状
となるように一体に成形した構成としている。そして、
この例ではその四周囲は金網4を露出させており、この
金網4の露呈された部分4aを同図矢印の方向に折曲げて
カバー3の内面周囲に沿って延設している。As shown in the sectional structure of FIG. 3, the cover 3 is formed by sandwiching a metal net 4 with plastics 5a and 5b and integrally molding the wire mesh 4 into a predetermined shape. And
In this example, the wire netting 4 is exposed at the four sides, and the exposed portion 4a of the wire netting 4 is bent in the direction of the arrow in the figure to extend along the circumference of the inner surface of the cover 3.
この構成のカバー3は図外のストッパやロックナット等
の止め具を用いて、第1図及び第2図に示したように金
属製シャーシ1の開口部に被着するが、このとき、カバ
ー3の四周囲の金網の露呈部分4aを金属製シャーシ1の
開口縁に合わせた状態で被着する。これにより、金属製
シャーシ1と金網4とは電気的に導通されて金網4つま
りカバー3が接地され、シャーシ1内の電子回路カード
2の電気・磁気シールドを行うことができる。The cover 3 having this structure is attached to the opening of the metal chassis 1 as shown in FIGS. 1 and 2 by using a stopper such as a stopper or a lock nut (not shown). The exposed portion 4a of the wire net around the four edges of 3 is attached in a state of being aligned with the opening edge of the metal chassis 1. As a result, the metal chassis 1 and the wire net 4 are electrically connected to each other to ground the wire net 4, that is, the cover 3, so that the electronic circuit card 2 in the chassis 1 can be electrically and magnetically shielded.
したがって、このカバーによれば、金属部分は金網構成
であるために、軽量化を図れるとともに金属製カバーと
同等のシールド効果を得ることができ、静電気問題及び
EMI問題を同時に解消できる。また、金網をサンドイッ
チしたプラスチックを透明材で構成することにより、カ
バー3に透過性を与えることができ、装置内部の内部表
示やLEDの点灯等を外部から確認することも可能とな
る。この場合、プスチックであるためスモーク度(透過
度)の程度を自由に設定することができる。Therefore, according to this cover, since the metal portion has the wire mesh structure, it is possible to reduce the weight and obtain the shielding effect equivalent to that of the metal cover, and to prevent static electricity problems and
Can solve EMI problems at the same time. Further, by forming the plastic sandwiching the wire mesh with a transparent material, the cover 3 can be provided with transparency, and it is possible to confirm the internal display inside the device and the lighting of the LED from the outside. In this case, since it is plastic, the degree of smoke (transparency) can be freely set.
更に、カバーの製造に際しても、自由な形成が可能とな
り、かつ安価に製造することが可能となる。Furthermore, the cover can be manufactured freely and can be manufactured at low cost.
ここで、金網の露呈部分4aを一部折曲げないで残してお
き、この部分でカバー3の前面の一部を構成することに
より、金網の通気性を利用してシャーシ内への空気通流
による冷却を行わせることも可能である。Here, the exposed portion 4a of the wire mesh is left unbent, and by forming a part of the front surface of the cover 3 with this portion, the ventilation of the wire mesh is used to allow air to flow into the chassis. It is also possible to perform cooling by.
第4図は本考案の他の実施例を示す図であり、ここでは
金網4をサンドイッチするプラスチックの一方5bを周辺
部で除去し、この部分で金網4の周辺部分4aが露呈され
るように構成している。この構成では、金網4の露呈部
分4aを折り曲げる必要はなく、そのままの状態で金属シ
ャーシ1の開口縁部との導通を可能にする。FIG. 4 is a view showing another embodiment of the present invention, in which one of the plastics 5b sandwiching the wire netting 4 is removed at the peripheral portion so that the peripheral portion 4a of the wire netting 4 is exposed. I am configuring. With this configuration, it is not necessary to bend the exposed portion 4a of the wire netting 4, and it is possible to conduct electricity to the opening edge portion of the metal chassis 1 as it is.
上記した第4図の例においても、第1図と同様の効果を
得ることができるのは言うまでもない。It goes without saying that the same effect as that of FIG. 1 can be obtained in the example of FIG. 4 described above.
なお、金網は必ずしも金属ワイヤを編んだ構成でなくと
もよく、例えばポリスチレン製のネットに金属メッキを
施したものでもよい。The metal net does not necessarily have to have a structure in which metal wires are braided, and may be, for example, a polystyrene net plated with metal.
ここで、上記実施例は基本部分について記述している
が、本考案は例えば基本部分を同様の考え方でビルトア
ップして大きなシステムまで適用できることは言うまで
もない。Here, the above embodiment describes the basic part, but it goes without saying that the present invention can be applied to a large system by building up the basic part with the same idea.
以上説明したように本考案は、金属製シャーシの開口部
に被着するカバーを、金網と透明度のあるプラスチック
とを一体に形成しており、かつその内面においてはその
周辺部においてのみ金属製シャーシの開口縁に対応する
幅で金網を露呈させ、その他の部分はプラスチックで被
覆し、金属製シャーシの開口部に被着したときに金網の
露呈部とシャーシの開口縁とを直接接触させて両者を電
気的に導通させるので、単にカバーを金属製シャーシに
取着するだけで、金属製シャーシの開口部を金網によっ
てシールドすることができ、従来の金属カバーと同等の
シールド効果を経て静電気問題をEMI問題を同時に解決
する等、電気的特性を向上することができる。また、透
明プラスチックを透して装置外部から装置内部の状態を
確認することができる。更に、金網はカバーの内面の周
辺部においてのみ露呈され、内面のその他の部分はプラ
スチックにより被覆された状態であるため、金属シャー
シ内の電子部品が金網に接触して電気的な短絡事故を防
止することができる効果も得られる。As described above, according to the present invention, the cover attached to the opening of the metal chassis is formed by integrally forming the wire mesh and the transparent plastic, and the inner surface of the metal chassis is only in the peripheral portion. The wire mesh is exposed with a width corresponding to the opening edge of the metal wire, and the other parts are covered with plastic. Since it is electrically conducted, the opening of the metal chassis can be shielded by a wire mesh simply by attaching the cover to the metal chassis, and the static effect is generated through the shielding effect equivalent to the conventional metal cover. It is possible to improve electrical characteristics such as solving EMI problems at the same time. Also, the state inside the device can be confirmed from outside the device through the transparent plastic. In addition, the wire mesh is exposed only on the periphery of the inner surface of the cover, and the other parts of the inner surface are covered with plastic, preventing electronic components in the metal chassis from contacting the wire mesh and causing an electrical short circuit accident. The effect that can be obtained is also obtained.
第1図は本考案のカバーを適用した電子装置の外観斜視
図、第2図はカバーを取り外した状態の斜視図、第3図
はカバーの断面図、第4図は異なる実施例におけるカバ
ーの断面図である。 1……金属製シャーシ、2……電子回路カード、3……
カバー、4……金網、4a……露呈部分、5a,5b……プラ
スチック。FIG. 1 is an external perspective view of an electronic device to which the cover of the present invention is applied, FIG. 2 is a perspective view with the cover removed, FIG. 3 is a sectional view of the cover, and FIG. FIG. 1 ... Metal chassis, 2 ... Electronic circuit card, 3 ...
Cover, 4 ... wire mesh, 4a ... exposed part, 5a, 5b ... plastic.
Claims (1)
ャーシの開口部に被着して電子装置内部を封止する電子
装置カバーにおいて、前記カバーは金網と透明度のある
プラスチックとを一体に形成し、かつその内面において
は、その周辺部においてのみ金属製シャーシの開口縁に
対応する幅で前記金網を露呈させ、その他の部分はプラ
スチックで被覆し、前記金属製シャーシの開口部に被着
したときに金網の露呈部とシャーシの開口縁とを直接接
触させて両者を電気的に導通させるように構成したこと
を特徴とする電子装置カバー。1. An electronic device cover for sealing the inside of an electronic device by covering the inside of an electronic device by covering the opening of a metal chassis containing electronic parts, electronic circuits and the like, wherein the cover is made of a wire mesh and a transparent plastic integrally. On the inner surface of the metal chassis, the wire mesh is exposed only at the peripheral portion thereof with a width corresponding to the opening edge of the metal chassis, and the other portion is covered with plastic and attached to the opening of the metal chassis. An electronic device cover, characterized in that the exposed part of the wire mesh and the opening edge of the chassis are brought into direct contact with each other so as to electrically conduct the two.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987091428U JPH0648955Y2 (en) | 1987-06-16 | 1987-06-16 | Electronic device cover |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987091428U JPH0648955Y2 (en) | 1987-06-16 | 1987-06-16 | Electronic device cover |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63201391U JPS63201391U (en) | 1988-12-26 |
JPH0648955Y2 true JPH0648955Y2 (en) | 1994-12-12 |
Family
ID=30952203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987091428U Expired - Lifetime JPH0648955Y2 (en) | 1987-06-16 | 1987-06-16 | Electronic device cover |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0648955Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022102859A1 (en) | 2022-02-08 | 2023-08-10 | Audi Aktiengesellschaft | Housing cover with integrated shielding for a battery housing and battery housing with such a housing cover |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2713059B2 (en) * | 1992-10-07 | 1998-02-16 | 三菱電機株式会社 | A method for manufacturing a housing comprising a box or a lid for storing electronic components or electronic devices. |
JP4532679B2 (en) * | 2000-06-20 | 2010-08-25 | キヤノン株式会社 | Display device |
JP4811245B2 (en) * | 2006-11-27 | 2011-11-09 | パナソニック電工株式会社 | Electromagnetic wave shielding case body article and manufacturing method thereof |
JP7300277B2 (en) * | 2019-02-20 | 2023-06-29 | 三井化学株式会社 | CASE FOR ELECTRONIC DEVICE, METAL-RESIN BONDING BOARD WITH EXPANDED DRAWING, METHOD FOR MANUFACTURING CASE FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59124193A (en) * | 1982-12-29 | 1984-07-18 | 松下電器産業株式会社 | Electronic device housing |
JPS60156656U (en) * | 1984-03-28 | 1985-10-18 | 協和ガス化学工業株式会社 | Transparent plate with electromagnetic shielding properties |
JPS624794U (en) * | 1985-06-22 | 1987-01-12 | ||
JPS6251140A (en) * | 1985-08-29 | 1987-03-05 | Mitsubishi Plastics Ind Ltd | Display filter |
-
1987
- 1987-06-16 JP JP1987091428U patent/JPH0648955Y2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022102859A1 (en) | 2022-02-08 | 2023-08-10 | Audi Aktiengesellschaft | Housing cover with integrated shielding for a battery housing and battery housing with such a housing cover |
Also Published As
Publication number | Publication date |
---|---|
JPS63201391U (en) | 1988-12-26 |
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