JPH0645393U - Heat dissipation structure of heating element - Google Patents
Heat dissipation structure of heating elementInfo
- Publication number
- JPH0645393U JPH0645393U JP081833U JP8183392U JPH0645393U JP H0645393 U JPH0645393 U JP H0645393U JP 081833 U JP081833 U JP 081833U JP 8183392 U JP8183392 U JP 8183392U JP H0645393 U JPH0645393 U JP H0645393U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- protrusion
- radiator
- heating element
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】
【目的】発熱素子から発熱された熱を効率良く放熱でき
るようにする。
【構成】印刷配線基板１０には貫通穴１１が形成され、
この貫通穴１１に対応する印刷配線基板１０の一方の面
には発熱素子１３が実装されている。また印刷配線基板
１０の他方の面から、放熱器１５に形成された突起部１
６が貫通穴１１に挿入されている。なお発熱素子１３と
突起部１６との間には、隙間２０が形成される。この隙
間２０には、突起部１６に有する透孔１７を介して充て
んされた熱伝導性接着剤により、熱伝導性接着剤層２２
が設けられる。そして放熱器１５は、熱伝導性接着剤層
２２を介して発熱素子１３に接着される。従って発熱素
子１３から発熱された熱は、熱伝導性接着剤層２２を介
して突起部１６に熱伝導され、放熱器１５全体に拡散し
て放熱される。
(57) [Summary] [Purpose] To efficiently dissipate the heat generated by the heating element. [Structure] A through hole 11 is formed in a printed wiring board 10,
A heating element 13 is mounted on one surface of the printed wiring board 10 corresponding to the through hole 11. Further, from the other surface of the printed wiring board 10, the protrusion 1 formed on the radiator 15 is formed.
6 is inserted in the through hole 11. A gap 20 is formed between the heating element 13 and the protrusion 16. A heat conductive adhesive layer 22 is filled in the gap 20 with the heat conductive adhesive filled through the through holes 17 provided in the protrusions 16.
Is provided. Then, the radiator 15 is adhered to the heating element 13 via the heat conductive adhesive layer 22. Therefore, the heat generated from the heating element 13 is conducted to the protrusion 16 via the heat conductive adhesive layer 22, diffused to the entire radiator 15 and radiated.
Description
【０００１】[0001]
本考案は、発熱素子から発熱された熱を効率良く放熱させる発熱素子の放熱構 造に関するものである。 The present invention relates to a heat dissipation structure for a heat generating element that efficiently dissipates heat generated by the heat generating element.
【０００２】[0002]
従来、電子機器装置の印刷配線基板上には、ＩＣ（集積回路）をはじめ数多く の電子部品が実装されている。これら電子部品のうち、ある部品は発熱するもの がある。そのためこの発熱する電子部品（以下発熱素子と称す）から発熱された 熱を効率良く放熱させる必要があった。 Conventionally, many electronic components such as ICs (integrated circuits) are mounted on a printed wiring board of an electronic device. Some of these electronic components generate heat. Therefore, it is necessary to efficiently dissipate the heat generated from this heat-generating electronic component (hereinafter referred to as a heat generating element).
【０００３】 図４において、１は印刷配線基板（以下基板と称す）であり、この基板１には 貫通穴２が形成されている。そして基板１の一方の面には、貫通穴２に対応して 発熱素子３が配設されている。この発熱素子３の端子３Ａは、基板１に形成され た印刷パッド（図示せず）に、はんだ４によってはんだ付けされている。 一方基板１の他方の面から、放熱器５の略中央に基板１の厚みとほぼ同じ高さ 寸法に形成された突起部６が貫通穴２に挿入されている。In FIG. 4, reference numeral 1 is a printed wiring board (hereinafter referred to as a board), and a through hole 2 is formed in the board 1. A heating element 3 is arranged on one surface of the substrate 1 so as to correspond to the through hole 2. The terminals 3A of the heating element 3 are soldered to the print pads (not shown) formed on the substrate 1 with the solder 4. On the other hand, from the other surface of the substrate 1, a protrusion 6 is formed in the through hole 2 in the approximate center of the radiator 5 and has a height dimension substantially the same as the thickness of the substrate 1.
【０００４】 また基板１と放熱器５との接触面には、熱伝導性接着剤が塗布され、熱伝導性 接着剤層（以下接着剤層と称す）７が設けられている。この接着剤層７を介して 放熱器５が基板１に取着されることにより、突起部６の先端は発熱素子３の素子 パッケージ３Ｂに接触するように構成されていた。 このような構成によると、発熱素子３から発熱された熱は、突起部６を介して 放熱器５に熱伝導されるとともに、放熱器５全体に拡散して放熱されていた。A heat conductive adhesive is applied to the contact surface between the substrate 1 and the radiator 5, and a heat conductive adhesive layer (hereinafter referred to as an adhesive layer) 7 is provided. The radiator 5 is attached to the substrate 1 via the adhesive layer 7 so that the tip of the protrusion 6 contacts the element package 3B of the heating element 3. According to such a configuration, the heat generated from the heating element 3 is conducted to the radiator 5 through the protrusions 6 and diffused and radiated to the entire radiator 5.
【０００５】[0005]
上述の如く発熱素子の放熱構造では、発熱素子から発熱された熱は、突起部を 介して放熱器に熱伝導されるとともに、放熱器全体に拡散して放熱をうながすよ うに構成されていた。 As described above, in the heat dissipation structure of the heat generating element, the heat generated from the heat generating element is configured to be conducted to the radiator via the protrusion and diffused to the entire radiator to promote heat dissipation.
【０００６】 しかしながら突起部の高さ寸法を基板の厚みより短い寸法で加工したり、ある いは発熱素子を基板に実装した際、素子パッケージが基板から離間された状態で 実装されると、突起部が発熱素子に接触されず発熱素子から発熱された熱が放熱 器に効率良く熱伝導されないという問題点があった。 また放熱器は突起部の先端が発熱素子に接触するように精密な加工作業が必要 であるとともに、放熱器の生産性が良くないという問題点を生じていた。However, when the height dimension of the protrusion is processed to be shorter than the thickness of the substrate, or when the heat generating element is mounted on the substrate and the element package is mounted in a state of being separated from the substrate, the protrusion There is a problem that the heat generated from the heat generating element is not efficiently conducted to the radiator because the portion is not in contact with the heat generating element. In addition, the radiator requires precision machining work so that the tip of the protrusion contacts the heating element, and the productivity of the radiator is not good.
【０００７】 そこで本考案ではこれらの問題点を除去し、突起部を基板の厚みより短い高さ 寸法で加工した際でも、発熱素子から発熱された熱を効率良く放熱させることが 可能な、発熱素子の放熱構造を提供することを目的とする。Therefore, in the present invention, these problems are eliminated, and even when the protrusion is processed with a height dimension shorter than the thickness of the substrate, it is possible to efficiently dissipate the heat generated from the heating element. An object is to provide a heat dissipation structure for an element.
【０００８】[0008]
本考案は、貫通穴が形成された印刷配線基板の一方の面に、前記貫通穴に対応 して実装された発熱素子と、この発熱素子に対応して前記印刷配線基板の他方の 面から、前記貫通穴に挿入される突起部を有する放熱器と、この放熱器の前記突 起部に形成された透孔と、この透孔を介して前記発熱素子と前記突起部との間の 隙間に設けられた熱伝導性接着剤層とを具備したことを特徴とする発熱素子の放 熱構造である。 According to the present invention, a heating element mounted corresponding to the through hole on one surface of the printed wiring board having a through hole and the other surface of the printed wiring board corresponding to the heating element, A radiator having a protrusion inserted into the through hole, a through hole formed in the protrusion of the radiator, and a gap between the heating element and the protrusion through the through hole. A heat-dissipating structure of a heat-generating element, comprising: a heat-conductive adhesive layer provided.
【０００９】[0009]
本考案では、印刷配線基板に形成された貫通穴に対応して、印刷配線基板の一 方の面に発熱素子が配設され、また印刷配線基板の他方の面には、透孔を有する 放熱器が突起部を貫通穴に挿入した状態で取着されている。そして透孔を介して 熱伝導性接着剤が充てんされ、突起部と発熱素子との間の隙間には熱伝導性接着 剤層が設けられる。そのため発熱素子から発熱された熱は、熱伝導性接着剤層を 介して突起部に熱伝導され、放熱器全体に拡散して放熱される。 In the present invention, a heat-generating element is arranged on one surface of the printed wiring board in correspondence with the through hole formed on the printed wiring board, and a heat dissipation element having a through hole on the other surface of the printed wiring board. The container is attached with the protrusion inserted in the through hole. A heat conductive adhesive is filled through the through holes, and a heat conductive adhesive layer is provided in the gap between the protrusion and the heating element. Therefore, the heat generated from the heat generating element is conducted to the protrusion through the heat conductive adhesive layer, diffused to the entire radiator and radiated.
【００１０】 また上記構造によると、突起部の高さ寸法を印刷配線基板の厚みより短く加工 した際でも、発熱素子から発熱された熱は、熱伝導性接着剤層を介して突起部に 熱伝導される。Further, according to the above structure, even when the height dimension of the protrusion is processed to be shorter than the thickness of the printed wiring board, the heat generated from the heat generating element is transferred to the protrusion through the heat conductive adhesive layer. Conducted.
【００１１】[0011]
以下本考案の一実施例を図１乃至図３を参照して詳細な説明をする。 Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS.
【００１２】 図１において、１０は印刷配線基板（以下基板と称す）であり、この基板１０ には貫通穴１１が形成され、さらに貫通穴１１の周辺にはネジ穴１２が形成され ている。そして貫通穴１１に対応して、基板１０の一方の面には、発熱素子１３ が配設されている。この発熱素子１３は、端子１３Ａが基板１０に形成された印 刷パッド（図示せず）にはんだ１４によってはんだ付けされ、基板１０に実装さ れている。なお発熱素子１３は、端子１３Ａにより、発熱素子１３の素子パッケ ージ１３Ｂが基板１０から離間された状態で実装されている。In FIG. 1, reference numeral 10 denotes a printed wiring board (hereinafter referred to as a board), a through hole 11 is formed in the board 10, and a screw hole 12 is formed around the through hole 11. A heating element 13 is provided on one surface of the substrate 10 corresponding to the through hole 11. The heating element 13 is mounted on the board 10 by soldering the terminals 13A to a printing pad (not shown) formed on the board 10 with the solder 14. The heating element 13 is mounted in a state in which the element package 13B of the heating element 13 is separated from the substrate 10 by the terminal 13A.
【００１３】 また基板１０の他方の面に位置する放熱器１５は、図２に示すように放熱板１ ５Ａの略中央に基板１０の厚みとほぼ同じ高さ寸法の突起部１６が形成されてい る。この突起部１６の略中央には、放熱板１５Ａから突起部１６の方向に透孔１ ７が形成され、放熱板１５Ａの両端部には、ネジ穴１２（図１参照）に対応する 位置にネジ係止穴１８が形成されている。Further, as shown in FIG. 2, the radiator 15 located on the other surface of the substrate 10 has a protrusion 16 having substantially the same height as the thickness of the substrate 10 formed at substantially the center of the radiator plate 15A. It Through holes 17 are formed substantially in the center of the protrusion 16 in the direction from the heat dissipation plate 15A to the protrusion 16, and at both ends of the heat dissipation plate 15A at positions corresponding to the screw holes 12 (see FIG. 1). A screw locking hole 18 is formed.
【００１４】 前記放熱器１５は図３に示すように、基板１０の他方の面から貫通穴１１に突 起部１６が挿入され、発熱素子１３の位置に対応して基板１０に配設される。そ して放熱器１５は、ネジ穴１２を介して挿入されたネジ１９がネジ係止穴１８に 係止され、基板１０に取着される。As shown in FIG. 3, the radiator 15 has a protruding portion 16 inserted into the through hole 11 from the other surface of the substrate 10 and disposed on the substrate 10 in correspondence with the position of the heat generating element 13. . Then, in the radiator 15, the screw 19 inserted through the screw hole 12 is locked in the screw locking hole 18, and is attached to the substrate 10.
【００１５】 なお貫通穴１１に挿入された突起部１６と素子パッケージ１３Ａとの間には隙 間２０が形成される。この隙間２０には例えば注入器２１によって、透孔１７を 介して熱伝導性接着剤が充てんされる。この熱伝導性接着剤を充てんする際には 、熱伝導性接着剤が端子１３Ａの領域に流れ込まないように、隙間２０に充てん した熱伝導性接着剤の量を確認しながら行われる。すると隙間２０には、熱伝導 性接着剤層（以下接着剤層と称す）２２が設けられ、この接着剤層２２を介して 放熱器１５が発熱素子１３に接着される。A gap 20 is formed between the protrusion 16 inserted into the through hole 11 and the device package 13A. The gap 20 is filled with a heat conductive adhesive through the through hole 17 by, for example, an injector 21. When filling the heat conductive adhesive, the amount of the heat conductive adhesive filled in the gap 20 is checked so that the heat conductive adhesive does not flow into the area of the terminal 13A. Then, a heat conductive adhesive layer (hereinafter referred to as an adhesive layer) 22 is provided in the gap 20, and the radiator 15 is bonded to the heat generating element 13 via the adhesive layer 22.
【００１６】 このような構造によると発熱素子１３から発熱された熱は、接着剤層２２を介 して突起部１６に熱伝導されるとともに、放熱器１５全体に拡散して放熱される 。According to such a structure, the heat generated from the heating element 13 is conducted to the protrusion 16 via the adhesive layer 22 and diffused to the entire radiator 15 to be radiated.
【００１７】 なお本考案は上記実施例に限定されるものではなく、例えば突起部１６の高さ 寸法が、基板１０の厚みより短い寸法で形成されていても良い。すなわち突起部 １６の高さ寸法を基板１０の厚みより短いで形成した際においても、隙間２０に 熱伝導性接着剤を充てんすることにより、放熱器１５は接着剤層２２を介して発 熱素子１３に接着される。The present invention is not limited to the above embodiment, and the height dimension of the protrusion 16 may be shorter than the thickness of the substrate 10, for example. That is, even when the height dimension of the protrusion 16 is formed to be shorter than the thickness of the substrate 10, the radiator 15 is filled with the heat conductive adhesive by filling the gap 20 with the heat conductive adhesive. Bonded to 13.
【００１８】 また放熱器１５は図１乃至図３で示した形状に限定することなく、図示しない が放熱フィンが形成されたものでも良い。その他本考案の要旨を逸脱しない範囲 において種々変形して実施することができる。Further, the radiator 15 is not limited to the shape shown in FIGS. 1 to 3, and may have a radiator fin (not shown). Other various modifications can be implemented without departing from the gist of the present invention.
【００１９】[0019]
以上説明したように、基板の一方の面には、貫通穴に対応して発熱素子が実装 され、基板の他方の面には、突起部が貫通穴に挿入された状態で放熱器が取着さ れている。そして発熱素子と突起部との間の隙間には、放熱器に有する透孔を介 して充てんされた熱伝導性接着剤によって、熱伝導性接着剤層が設けられる。 As explained above, the heat generating element is mounted on one surface of the board corresponding to the through hole, and the radiator is attached to the other surface of the board with the protruding part inserted in the through hole. It is being touched. A heat conductive adhesive layer is provided in the gap between the heat generating element and the protrusion by the heat conductive adhesive filled through the through hole of the radiator.
【００２０】 このような構造によると、発熱素子から発熱された熱は、熱伝導性接着剤層を 介して突起部に熱伝導し、放熱器全体に拡散して効率良く放熱される。更に突起 部は、透孔を介して充てんされた熱伝導性接着剤によって、発熱素子に確実に接 着される。According to such a structure, the heat generated from the heat generating element is conducted to the protrusion through the heat conductive adhesive layer, diffused to the entire radiator and efficiently radiated. Further, the protrusion is securely attached to the heat generating element by the heat conductive adhesive filled through the through hole.
【００２１】 また突起部の高さ寸法を、基板の厚みより短い寸法で加工した際でも、放熱器 は熱伝導性接着剤層を介して発熱素子に接着される。そのため突起部の高さ寸法 は、基板の厚みと同等もしくは短い寸法で形成されていても良い。従って放熱器 は、突起部の高さ寸法の精密な加工作業が不要であるとともに、放熱器の生産性 を向上させることができる。Further, even when the height dimension of the protrusion is processed to be shorter than the thickness of the substrate, the radiator is bonded to the heat generating element via the heat conductive adhesive layer. Therefore, the height of the protrusion may be equal to or shorter than the thickness of the substrate. Therefore, the radiator does not require precise processing work for the height of the protrusion, and the productivity of the radiator can be improved.
【図１】本考案の一実施例に係わる分解断面図。FIG. 1 is an exploded sectional view according to an embodiment of the present invention.
【図２】本考案の一実施例に係わる放熱器の斜視図。FIG. 2 is a perspective view of a radiator according to an embodiment of the present invention.
【図３】本考案の一実施例に係わる断面図。FIG. 3 is a sectional view according to an embodiment of the present invention.
【図４】従来の一例に係わる断面図。FIG. 4 is a sectional view according to a conventional example.
１０…基板、１１…貫通穴、１３…発熱素子、１５…放
熱器、１６…突起部、１７…透孔、２０…隙間、２２…
熱伝導性接着剤層。10 ... Substrate, 11 ... Through hole, 13 ... Heating element, 15 ... Radiator, 16 ... Projection part, 17 ... Through hole, 20 ... Gap, 22 ...
Thermally conductive adhesive layer.
Claims (1)
の面に、前記貫通穴に対応して実装された発熱素子と、
この発熱素子に対応して前記印刷配線基板の他方の面か
ら前記貫通穴に挿入される突起部を有する放熱器と、こ
の放熱器の前記突起部に形成された透孔と、この透孔を
介して前記発熱素子と前記突起部との間の隙間に設けら
れた熱伝導性接着剤層とを具備したことを特徴とする発
熱素子の放熱構造。1. A heating element mounted on one surface of a printed wiring board in which a through hole is formed so as to correspond to the through hole,
A radiator having a protrusion that is inserted into the through hole from the other surface of the printed wiring board corresponding to the heating element, a through hole formed in the protrusion of the radiator, and the through hole. A heat dissipating structure for a heat generating element, comprising: a heat conductive adhesive layer provided in a gap between the heat generating element and the protrusion via a heat conductive adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP081833U JPH0645393U (en) | 1992-11-27 | 1992-11-27 | Heat dissipation structure of heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP081833U JPH0645393U (en) | 1992-11-27 | 1992-11-27 | Heat dissipation structure of heating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0645393U true JPH0645393U (en) | 1994-06-14 |
Family
ID=13757481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP081833U Pending JPH0645393U (en) | 1992-11-27 | 1992-11-27 | Heat dissipation structure of heating element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0645393U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001144233A (en) * | 1999-11-12 | 2001-05-25 | Fujitsu Ltd | Semiconductor unit, cooling device, and manufacturing method thereof |
| JP2004288726A (en) * | 2003-03-19 | 2004-10-14 | Tektronix Japan Ltd | Heat dissipation method for electronic devices |
| JP2006066725A (en) * | 2004-08-27 | 2006-03-09 | Sony Corp | Semiconductor device equipped with heat dissipation structure, and its assembly method |
| JP2012104660A (en) * | 2010-11-10 | 2012-05-31 | Fujitsu Optical Components Ltd | Electronic device, method for implementing device, and optical communication device |
| WO2016013362A1 (en) * | 2014-07-22 | 2016-01-28 | 株式会社オートネットワーク技術研究所 | Circuit structure |
| KR20180060572A (en) * | 2016-11-29 | 2018-06-07 | 주식회사 이진스 | Device package having heat dissipating member and the manufacturing method thereof |
-
1992
- 1992-11-27 JP JP081833U patent/JPH0645393U/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001144233A (en) * | 1999-11-12 | 2001-05-25 | Fujitsu Ltd | Semiconductor unit, cooling device, and manufacturing method thereof |
| JP2004288726A (en) * | 2003-03-19 | 2004-10-14 | Tektronix Japan Ltd | Heat dissipation method for electronic devices |
| JP2006066725A (en) * | 2004-08-27 | 2006-03-09 | Sony Corp | Semiconductor device equipped with heat dissipation structure, and its assembly method |
| JP2012104660A (en) * | 2010-11-10 | 2012-05-31 | Fujitsu Optical Components Ltd | Electronic device, method for implementing device, and optical communication device |
| WO2016013362A1 (en) * | 2014-07-22 | 2016-01-28 | 株式会社オートネットワーク技術研究所 | Circuit structure |
| CN106471870A (en) * | 2014-07-22 | 2017-03-01 | 株式会社自动网络技术研究所 | circuit structure |
| US9974182B2 (en) | 2014-07-22 | 2018-05-15 | Autonetworks Technologies, Ltd. | Circuit assembly |
| KR20180060572A (en) * | 2016-11-29 | 2018-06-07 | 주식회사 이진스 | Device package having heat dissipating member and the manufacturing method thereof |
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