JPH0638478Y2 - Hybrid IC device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial application field) The present invention relates to a hybrid IC device provided with an electromagnetic shield.

(Problems to be Solved by Prior Art and Invention) FIG. 2 is a front view showing a part of a conventional hybrid IC device. In the figure, 1 is a motherboard on which a plurality of hybrid IC boards (hereinafter referred to as HIC boards) 2 and parts (not shown) are mounted, 3 is various parts mounted on the HIC board 2, and 4 is a HIC board 2. Motherboard 1 with various terminals
Electrically connected to. In this way, on the motherboard 1
When HIC board 2 is mounted, motherboard 1 and HIC board 2
Requires a certain height H and the mounting efficiency is poor. Furthermore, when the electronic circuit of the HIC board 2 requires an electromagnetic shield, the heights of the various components 3 are not uniform. For example, when the shield shown in FIG. Requires an interval indicated by the distance L, which makes the device large.

As a conventional hybrid IC device for solving such a problem, there is also one shown in FIGS. 3 (a) and 3 (b), in which FIG. 3 (a) is a plan view, FIG. 3 (b) is a side view and FIG. (C) is a front view. In the figure, various components 3 are mounted on the HIC board 2. The terminals 4 provided on the HIC board 2 are extended to the mounting side of the component 3. Reference numeral 5 is a conductive film formed on the back surface of various components 3 mounted on the HIC substrate 2 for electromagnetic shielding. When the conductive portion of the component 3 is exposed on the conductive film 5 side, the conductive portion is insulated by applying an insulating coating or the like, and the conductive film 5 is provided thereon.

In this way, it is mounted on the motherboard and hybrid
By configuring the IC device, a hybrid IC device provided with an electromagnetic shield with a high volume ratio can be obtained.However, even in the hybrid IC device having such a configuration, the electromagnetic shield is performed only on one side of the hybrid IC substrate. The electromagnetic shield is insufficient.

The present invention solves the above problems and has a large shield effect,
It is an object of the present invention to provide a miniaturized hybrid IC device.

(Means for Solving the Problems) In order to achieve the above object, the present invention has terminals for connection extending in the same direction as the surface on which various components are mounted, and the rear surface of the surface on which various components are mounted. A hybrid in which a hybrid IC substrate with a conductive film is mounted on a motherboard
In the IC device, the hybrid IC device is characterized in that the connecting terminal is attached to the motherboard so that the conductive film formed on the surface of the motherboard and the hybrid IC substrate face each other.

(Embodiment) An embodiment of the present invention will be described below with reference to the drawings.
It is needless to say that the embodiment is merely an example, and various modifications and improvements can be made without departing from the spirit of the present invention.

1 (a), (b) and (c) are views showing an embodiment of the present invention, wherein FIG. 1 (a) is a plan view of an HIC substrate and FIG. 1 (b).
Is a front view of the hybrid IC device, and FIG. 7C is a plan view of the motherboard.

In FIGS. 1A and 1B, a conductive film as a wiring conductor used also for an electromagnetic shield on one surface of the motherboard 1 (may be formed only for the purpose of electromagnetic shield).
6 is formed.

The HIC board 2 is similar to that shown in FIG. 3, and various components 3 are mounted on one surface of the HIC substrate 2, and a conductive film is formed on the other surface thereof. Terminal 4
Has been extended.

FIG. 1 (c) is a plan view of the mother board, and the conductive film 6 is HI.
When the C board 2 is mounted, it is provided at a position facing the HIC board 2. In this figure, terminal 4A is on the ground side, eg +
Alternatively, the negative electrode is conductively connected to the conductive portion 6A of the conductive film 6, and the conductive film 6 becomes a ground side wiring pattern as a whole. Therefore, for example, the notch 6B is provided at a position corresponding to the terminal 4B of the conductive film 6, and the terminal 4B is insulated from the conductive film 6. These notches are provided at necessary positions for the circuit pattern.

Thus, the electronic circuit of the HIC substrate 2 is electromagnetically shielded from both the top surface and the bottom surface by the conductive film 5 provided on the HIC substrate 2 and the conductive film 6 provided on the mother board 1.

(Effects of the Invention) As described above, according to the present invention, the connecting terminals are extended in the same direction as the surface on which various components are mounted, and the conductive film is formed on the back surface of the surface on which various components are mounted. In a hybrid IC device in which the formed hybrid IC substrate is mounted on a motherboard, a conductive film formed on the surface of the motherboard and having an area equal to or larger than the area of the hybrid IC substrate faces the hybrid IC substrate. Along with the arrangement, a part of the conductive film 6 of the mother board is removed to form a notch to insulate a part of the connecting terminal from the conductive film 6, and the remaining connecting terminals are connected to the conductive film 6. As described above, since the connection terminals are attached to the motherboard, the electronic circuit of the motherboard can be satisfactorily electromagnetically shielded. Increase the rate, connection configuration of the small-sized terminal can provide a simple hybrid IC device.

[Brief description of drawings]

1 (a), (b) and (c) are views showing an embodiment of the present invention, wherein FIG. 1 (a) is a plan view of a hybrid IC substrate,
FIG. 2B is a front view of the hybrid IC device, and FIG.
Is a plan view of the motherboard, and Fig. 2 is a conventional hybrid
The front view of the IC device, FIGS. 3 (a), (b), and (c) are views showing another example of the conventional hybrid IC device. FIG. 3 (a) is a plan view and FIG. A side view and the same figure (c) are front views. 1 ... Motherboard 2 ... Hybrid IC substrate 3 ... Various parts 4,4A, 4B ... Terminals 5, 6 ... Conductive film

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Creator Yasuo Kii 1-1-18 Takada, Toshima-ku, Tokyo Inside ORIGIN ELECTRIC CO., LTD. (72) Naoki Murakami 1-1-6 Uchisaiwai-cho, Chiyoda-ku, Tokyo Nihon Telegraph and Telephone Corporation (56) References: Kaihei Hei 2-86199 (JP, U)

Claims (1)

[Scope of utility model registration request] 1. A hybrid IC substrate having connecting terminals extending on two sides in the same direction as a surface on which various components are mounted, and a conductive film formed on the back surface of the surface on which the various components are mounted. In a hybrid IC device mounted on a motherboard, the conductive film 6 formed on the surface of the motherboard 1 and having an area equal to or larger than the area of the hybrid IC substrate and the hybrid IC substrate are arranged to face each other. , A part of the connecting terminal is insulated from the conductive film 6 by a notch formed by removing a part of the conductive film 6, and the remaining connecting terminals are connected to the conductive film 6. A hybrid IC device, wherein the connecting terminal is attached to the motherboard.