JPH06350258A - Production of printed wiring board - Google Patents

Abstract

PURPOSE:To provide a method for producing a printed wiring board realizing high density wiring and mounting with high reliability and high yield through a simple process. CONSTITUTION:The method for producing a printed wiring board comprises a step for laminating the main surface of a synthetic resin sheet 3 onto the main surface of a supporting base body 1 provided with a group of conductor bumps 2 at a predetermined position, and a step for pressing the laminate to pierce the synthetic resin sheet 3, in the direction of thickness, with the group 2 of bumps thus forming a through type conductor wiring part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and more particularly, it has a structure in which wiring layers are connected by a through-type conductor wiring portion, and high-density wiring and mounting are highly reliable. The present invention relates to a method capable of manufacturing a printed wiring board with a good yield while reducing the number of steps.

[0002]

2. Description of the Related Art For example, in a double-sided printed wiring board or a multi-layered printed wiring board, electrical connection between wiring layers such as double-sided conductive patterns is made as follows. For example, in the case of a double-sided printed wiring board, perforation processing (perforation processing) is performed at a predetermined position on the double-sided copper foil-clad board, and chemical plating is performed on the entire surface, including the inner wall surface of the perforated hole,
The metal layer on the inner wall surface of the hole is thickened by electroplating to improve reliability and electrically connect the wiring layers. Also, in the case of a multilayer printed wiring board, after patterning the copper foils stretched on both sides of the substrate respectively, stacking and arranging the copper foils on the patterned surfaces via an insulating sheet (eg prepreg), and applying heat and pressure. After the integration, as in the case of the double-sided printed wiring board described above, a multilayer printed wiring board is obtained by electrical connection between wiring layers by punching and plating, and patterning of the surface copper foil. In the case of a multilayer printed wiring board having more wiring layers, it can be manufactured by a method of increasing the number of double-sided printed wiring boards inserted in the middle.

In the method of manufacturing a printed wiring board, as a method of electrically connecting wiring layers without using a plating method, a hole is made at a predetermined position on a double-sided copper foil-clad substrate, and a conductive paste is printed in the hole. There is also a method in which the resin component of the conductive paste poured into the holes is cured by a method or the like to electrically connect the wiring layers.

[0004]

As described above, in a method of manufacturing a printed wiring board that uses a plating method for electrical connection between wiring layers, holes for electrical connection between wiring layers are formed in a substrate. It has the disadvantages that it requires a drilling (drilling) process, a plating process including the inner wall surface of the drilled hole, the manufacturing process of the printed wiring board is redundant, and the process control is complicated. On the other hand, in the case of embedding a conductive paste in the holes for electrical connection between wiring layers by printing,
As in the case of the plating method, a drilling process is required.
Moreover, it is difficult to evenly (uniformly) pour and embed the conductive paste into the bored holes, and there is a problem in reliability of electrical connection. In any case, the need for the perforating step is reflected in the cost and yield of the printed wiring board, and there is a drawback that it cannot meet the demand for cost reduction. Further, in the case of the electrical connection configuration between the wiring layers, since conductor holes for connecting wiring layers are provided on the front and back surfaces of the printed wiring board, the wiring is formed and arranged in the area of the conductor holes. This is not possible, and since electronic parts cannot be mounted, there is a problem that improvement in wiring density is restricted and improvement in mounting density of electronic parts is also hindered. In other words, the printed wiring board obtained by the conventional manufacturing method cannot fully meet the demand for compact circuit devices by high-density wiring and high-density mounting, and further miniaturization of electronic devices. Including faces
A practically more effective method for producing a printed wiring board is desired. The present invention has been made in consideration of the above circumstances, and enables high-density wiring and mounting with a simple process,
An object of the present invention is to provide a method capable of manufacturing a highly reliable printed wiring board with high yield.

[0005]

According to a first method for manufacturing a printed wiring board of the present invention, a main surface of a synthetic resin sheet is brought into contact with a main surface of a supporting substrate having conductor bump groups formed at predetermined positions. And a step of stacking and arranging them, and a step of pressurizing the laminated body to form a through-type conductor wiring part by respectively inserting the bump groups in the thickness direction of the synthetic resin sheet. The second method for producing a printed wiring board according to the present invention is characterized in that the main surface of the conductive metal foil having conductor bump groups formed at predetermined positions is contacted with the main surface of the synthetic resin sheet. And a step of arranging them in a stacked manner, a step of pressurizing the laminated body to form a through-type conductor wiring part by respectively inserting the bump groups in the thickness direction of the synthetic resin sheet, and the through-type The conductive metal foil of the laminated body on which the conductor wiring part of Subjected to, characterized in that formed by a step of forming a wiring pattern connected to the conductor wiring portion of the transmembrane.

In the present invention, examples of the supporting substrate on which the conductor bump group is formed include synthetic resin sheets having good peelability, or conductive sheets (foil),
The supporting substrate may be a single sheet or may be patterned, and its shape is not particularly limited, and the conductor bump group is not limited to one main surface,
You may use the thing formed in each main surface respectively.

Here, the conductor bump is, for example, silver,
Conductive powder such as gold, copper, solder powder, alloy powder or composite (mixed) metal powder of these, and binder component such as polycarbonate resin, polysulfone resin, polyester resin, phenoxy resin, phenol resin, polyimide resin, etc. are mixed. It is composed of a conductive composition prepared by the above or a conductive metal. When the bump group is formed of a conductive composition, a bump having a high aspect ratio can be formed by, for example, a printing method using a relatively thick metal mask. In addition, it is preferable that the height of the bump group is 100 to 400 μm, and the height of the bump group that can penetrate one layer of the synthetic resin sheet and the height that can penetrate the plurality of layers of the synthetic resin sheet may be appropriately mixed. .

On the other hand, as means for forming a bump group with a conductive metal, (a) fine metal particles having a certain shape or size are dispersed on the surface of a supporting substrate provided with an adhesive layer in advance and selected. Or (b) if copper foil or the like is used as the supporting substrate, the plating resist is printed and patterned to form copper,
Tin, gold, silver, solder, etc. are plated to selectively form minute metal pillars (bumps), (c) Solder resist is applied / patterned on the supporting substrate surface, and then immersed in a solder bath to selectively For example, formation of minute metal pillars (bumps) can be mentioned. Here, a small metal pillar without a small metal soul corresponding to a bump is
A multi-layer structure or a multi-layer shell structure formed by combining different metals may be used. For example, copper may be used as a core and the surface may be coated with a gold or silver layer to impart oxidation resistance, or copper may be used as a core and the surface may be coated with a solder layer so as to have solder bondability. In the present invention, when the bump group is formed of a conductive composition,
Compared with the case of using a plating method or the like, the process can be further simplified, which is effective in terms of cost reduction.

In the present invention, examples of the synthetic resin sheet for penetrating the conductor bump group to form the through-hole type conductor wiring portion include a thermoplastic resin film (sheet) and have a thickness of 50. It is preferably about 800 μm. Here, examples of the thermoplastic resin sheet include sheets of polycarbonate resin, polysulfone resin, thermoplastic polyimide resin, tetrafluoropolyethylene resin, hexafluoropolypropylene resin, polyetheretherketone resin, and the like. Further, as the thermosetting resin sheet which is kept in the pre-curing state, epoxy resin, bismaleimide triazine resin, polyimide resin, phenol resin, polyester resin, melamine resin, butadiene rubber, butyl rubber, natural rubber, neoprene rubber,
Examples include raw rubber sheets such as silicone rubber.
These synthetic resins may be used alone or may contain an insulating inorganic or organic filler, and are a sheet formed by combining with a reinforcing material such as glass cloth or mat, organic synthetic fiber cloth or mat, or paper. It may be.

Further, according to the present invention, when a laminated body in which a synthetic resin sheet main surface is placed in contact with a main surface of a support base or the like on which a bump group is formed is laminated or is heated and pressed. As a base (patch plate) on which a synthetic resin sheet is placed, a metal plate or a heat-resistant resin plate with little size or deformation, for example, a stainless plate, a brass plate, a polyimide resin plate (sheet), a polytetrafluoroethylene resin Plates (sheets) are used. When the laminated body is pressed, when the resin group of the synthetic resin sheet is heated to be softened, and the bump group is inserted, better insertion of the bump group can be achieved.

[0011]

According to the method of manufacturing a printed wiring board according to the present invention,
The conductor wiring portions between the wiring layers that electrically connect the wiring layers are made into a plastic state of the synthetic resin sheet forming the interlayer insulating layer by heating and pressing in the so-called laminated integration process, and the conductor bumps on the surface of the supporting substrate. The press-fitting of the group ensures reliable electrical connection between the wiring layers. In other words, while simplifying the process, it is possible to form highly accurate and reliable electrical connections between fine wiring pattern layers at arbitrary positions (locations), so that a printed wiring board with a high wiring density can be formed. It is possible to manufacture at low cost, and it is not necessary to form a connection hole for electrical connection between the wiring pattern layers, so that a printed wiring board capable of high density wiring and high density mounting can be obtained. Will be done.

[0012]

EXAMPLES Examples 1 (a) and (b), FIGS. 2 (a) and (b), and FIG. 3 (a)
An embodiment of the present invention will be described with reference to FIGS. 4 (b), 4 (a) and 4 (b) and FIGS. 5 (a) and 5 (b).

Example 1 FIGS. 1 (a) and (b) and FIGS. 2 (a) and 2 (b) schematically show an embodiment of this example. First, a 50 μm thick polyimide resin film (trade name, Kapton film, manufacturer: Toray KK) is used as a supporting substrate sheet 1, and a polymer type silver-based conductive paste (trade name, thermosetting conductive paste DW-250H -5, Manufacturer: Toyobo KK)
In addition, 0.4 mm is placed at a specified location on a 200 μm thick stainless steel plate.
A metal mask with a diameter hole was prepared. Then, the metal mask is positioned and arranged on the surface of the polyimide resin film to print a conductive paste, and after the printed conductive paste is dried, it is printed again at the same position using the same mask three times. Repeated printing, height 200μ
Formed (shaped) a little m-shaped pumb 2 Figure 1 (a)
Shows a side view of the shape of the conductive bump 2 thus formed. On the other hand, a 100 μm thick polyetherimide resin film (trade name, Sumilite FS-1400,
Manufacturer: Sumitomo Bakelite KK) is prepared as
As shown in a sectional view in (a), the supporting substrate sheet 1 was positioned and arranged on the synthetic resin sheet 3 with the formed conductive bumps 2 facing each other to form a laminated body. afterwards,
On the back surface of the synthetic resin sheet 3, a polyimide resin film of the same type as the support sheet 1 is laminated as a backing plate 4.
After arranging it, the resin pressure of 1 MPa was applied and the sheet was taken out as it was, and the front and back sheets 1 and 4 were peeled off. As shown in the sectional view of FIG. As shown in a side view in FIG. 1 (b), the sheet 3 is press-fitted into the sheet 3 and is in contact with the back sheet 4 to form the same plane in which the tip is crushed to form a synthetic resin sheet 3 A printed wiring board having a conductor wiring portion 5 penetrating in the direction was obtained. Regarding the formed through-type conductor wiring portion 5,
When a continuity test was conducted on each conductor wiring part 5 from the front and back surfaces with a tester, the total number was 0.01 Ω or less.

Example 2 FIGS. 3 (a) and 3 (b) are sectional views schematically showing an embodiment of this example. The present embodiment is the same as the above first embodiment except that
Instead of the polyimide resin film as the supporting base sheet 1, a thickness of 35 which is usually used in the production of printed wiring boards is used.
As in Example 1, except that the electrolytic copper foil 1 ′ having a thickness of 35 μm was used as the back sheet (patch plate) 4 while the electrolytic copper foil 1 ′ having a thickness of 3 μm was used. As shown in Fig.2, the layers are arranged in layers, and this layered body is 270 ℃, 1 M
Pressing was performed under the action of Pa to prepare a double-sided copper clad plate having a conductor wiring portion 5 in which the two copper foils 1 ′ and 4 ′ were connected in a penetrating manner as shown in FIG. 3 (b). Normal etching resist ink (trade name, PS
R-4000 H, manufacturer: Taiyo Ink KK) was screen-printed to mask the conductor pattern portion, and after the etching treatment using cupric chloride as an etching solution, the resist mask was peeled off to obtain a double-sided printed wiring board. . When the thus-produced double-sided printed wiring board was subjected to an electrical check that is usually carried out, no problems such as defects or reliability were found in all connections.

Example 3 In this example, instead of the polyimide resin film as the supporting substrate sheet 1 in the case of Example 1 above, an electrolytic copper foil having a thickness of 35 μm, which is usually used in the production of printed wiring boards, is used. 1'is also used as a back sheet (patch plate) 4 in the same manner as an electrolytic copper foil 4'having a thickness of 35 μm, while a synthetic resin sheet 3 having a thickness of 200 μm formed by impregnating glass cloth impregnated with epoxy resin. Using a prepreg, as shown in FIG. 3 (a), the laminates are arranged, and the laminate is pressed under the following conditions. As shown in FIG. 3 (b), both copper foils 1 ', A double-sided copper clad plate having a conductor wiring portion 5 connected between 4'in a penetrating manner was prepared. In the press processing, after setting the laminated body, start heating and 120 ° C
At that time, a resin pressure of 2 MPa was applied, and further heating was performed in this state, and when it reached 170 ° C, it was held for 1 hour, cooled, and then taken out.

A normal etching resist ink (trade name, PSR-4000 H, manufacturer: Taiyo Ink KK) is screen-printed on both sides of this double-sided copper clad board, the conductor pattern portion is masked, and then cupric chloride After the etching treatment with the above as an etching solution, the resist mask was peeled off to obtain a double-sided printed wiring board. Regarding the double-sided printed wiring board manufactured in this way,
When the electrical check that was normally performed was performed, no problems such as defects or reliability were found in all the connections. In addition, in order to evaluate the reliability of the connection between the double-sided conductive patterns, a hot oil test (a cycle of immersion in oil at 260 ° C for 10 seconds and immersion in oil at 20 ° C for 20 seconds 1
As a cycle), no defect was observed even after 500 times, and the connection reliability between the conductive (wiring) pattern layers was remarkably excellent as compared with the case of the conventional copper plating method.

Embodiment 4 FIGS. 4 (a) and 4 (b) are sectional views schematically showing an embodiment of this embodiment. In this example, a PPS resin sheet (trade name, Torelina 3000, manufacturer: Toray KK) is impregnated into a glass cloth to form a synthetic resin sheet 3 having a thickness of 120 μm. Average grain size on the main surface 1
After printing the conductor paste consisting of μm silver powder and polysulfone resin using a 300 mesh stainless screen to form the required conductor pattern 6, a 180 mesh stainless screen is used at the required location of the conductor pattern 6. Bumps 2 of 0.4 mm square and 80 μm in height were formed respectively.

As shown in FIG. 4 (a), synthetic resin sheets 3 each having conductive bumps 2 for interlayer connection formed on both sides thereof are laminated and sandwiched between polyimide resin films 1, and this laminated The body is pressed at a temperature set to 295 ° C, and then the polyimide resin film 1 is peeled off, as shown in Fig. 4 (b), and the conductor wiring part in which the conductor patterns 6 on both sides are connected in a through type. A double-sided printed wiring board having No. 5 was prepared. In the case of this embodiment, a portion (area) of the conductor pattern 6 where the conductive bumps 2 are to be formed is partially cut off, and the conductive protrusions 2 are formed.
It is preferable to make it easy to press into the synthetic resin sheet 3.

The double-sided printed wiring board thus manufactured was subjected to an electrical check, which is usually carried out.
No problems were found in all connections, such as defects or reliability.

Example 5 FIGS. 5 (a) and 5 (b) are sectional views schematically showing an embodiment of this example.

As shown in FIG. 5 (a), a double-sided wiring board prepared in the same manner as in the above-mentioned Example 3 was used, as shown in FIG. 5 (a), of the same kind as that used in Example 3, with a glass cloth-impregnated epoxy resin prepreg of 100 μm in thickness. The conductive bumps 2 of the same type as those used in Example 3 are stacked and arranged so as to be sandwiched between two pieces.
Were placed and laminated so as to be sandwiched between the copper foils 1 ′ formed with. This laminated body was subjected to hot press working / treatment under the same conditions as in Example 3, and the inner layers of the conductive patterns and the inner layer of the conductive patterns had copper foils 1'on the surface.
A double-sided copper foil-clad substrate to be connected in a through type was prepared.

Next, a normal etching resist ink (trade name, PSR-4000 H, manufacturer: Taiyo Ink KK) is screen-printed on both sides of this double-sided copper clad board to mask the conductor pattern portion and then chloride After the etching treatment using 2 copper as an etching solution, the resist mask was peeled off to obtain a double-sided printed wiring board. When the thus-produced four-layer printed wiring board was subjected to a usual electrical check, no problems such as defects or reliability were found in all the connections. Moreover, in order to evaluate the reliability of the connection between the double-sided conductive patterns, a hot oil test was conducted (a cycle of immersion in oil at 260 ° C for 10 seconds and immersion in oil at 20 ° C for 20 seconds as one cycle). No defect was found even after repeated use. Compared with the conventional copper plating method,
The connection reliability between the conductive (wiring) patterns was remarkably excellent.

Example 6 FIGS. 6 (a) and 6 (b) are sectional views schematically showing an embodiment of this example.

As a supporting base sheet, a copper foil 6 ', in which conductive bumps 2 having different heights are formed on at least one surface of a conductor pattern which has been processed into a required structure (shape) in advance, are formed. 6 ″, a prepreg 3 of the same kind as used in Example 3 and having a thickness of 100 μm, an electrolytic copper foil 1 ′ having a thickness of 35 μm, and a back sheet (patch plate) 4 similarly having a thickness of 35 μm
Each of the electrolytic copper foils 4'was prepared and laminated and arranged as shown in FIG. 6 (a). This laminated body is subjected to hot press working / treatment under the same conditions as in Example 3 so that the inner layer conductive patterns 6 ′ and the inner layer conductive pattern 6 ′ penetrate the copper foil 1 ′ on the surface. A double-sided copper foil-clad substrate to be connected to the mold was created.

Next, a normal etching resist ink (trade name, PSR-4000 H, manufacturer: Taiyo Ink KK) is screen-printed on both sides of the double-sided copper clad board to mask the conductor pattern portion, and then chloride chloride After the etching treatment using 2 copper as an etching solution, the resist mask was peeled off to obtain a double-sided printed wiring board. When the thus-produced four-layer printed wiring board was subjected to a usual electrical check, no problems such as defects or reliability were found in all the connections. Moreover, in order to evaluate the reliability of the connection between the double-sided conductive patterns, a hot oil test was conducted (a cycle of immersion in oil at 260 ° C for 10 seconds and immersion in oil at 20 ° C for 20 seconds as one cycle). No defect was found even after repeated use. Compared with the conventional copper plating method,
The connection reliability between the conductive (wiring) patterns was remarkably excellent.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

Example 7 In the above Example 2, except that the configuration of the bump group was changed,
This is an example of manufacturing a printed wiring board by basically the same steps, and therefore, an explanation will be given with reference to an example of an embodiment schematically shown in FIGS. In this example, instead of the polyimide resin film as the supporting substrate sheet 1, an electrolytic copper foil 1'having a thickness of 35 μm, which is usually used in the production of printed wiring boards, is used, and the roughened surface of this copper foil 1'is used. After the plating resist is printed on the side and the exposed surface group with a diameter of 0.3 mm is left in a predetermined position (location), patterning is performed, and then copper plating is applied to the exposed surface area on the copper layer with a height of about 100 μm. , A nickel layer having a height of about 10 μm was overlaid to form a conductor bump group of about 110 μm in total. The same as in Example 1 except that the copper foil 1'where the bump group is formed by plating is used, while the electrolytic copper foil 4'having a thickness of 35 μm is also used as the back sheet (patch plate) 4. Then, as shown in FIG. 3 (a), the laminates are arranged, and the laminated body is pressed under the same conditions, and as shown in FIG. 3 (b), the copper foils 1'and 4'are penetrated. A double-sided copper clad plate having a conductor wiring portion 5 connected to the mold was prepared. A normal etching resist ink (trade name, PSR-4000 H, manufacturer: Taiyo Ink KK) is screen-printed on both sides of this double-sided copper clad board, the conductor pattern is masked, and then the cupric chloride etching solution is used. After the etching treatment, the resist mask was peeled off to obtain a double-sided printed wiring board. When the thus-produced double-sided printed wiring board was subjected to an electrical check that is usually carried out, no problems such as defects or reliability were found in all connections.

Similar results were obtained even when the bump group formation in this embodiment was carried out by the solder dipping method using a solder resist mask. Even if the bump group was formed of the conductive composition in another example by the plating method, it was possible to obtain a printed wiring board in which wiring layers were connected.

[0029]

According to the present invention, the steps of forming conductive bumps for connecting pattern layers, arranging synthetic resin sheets in a laminated manner and hot pressing, and patterning outer layers are simplified. In other words, it is possible to easily manufacture a double-sided printed wiring board or a multilayer printed wiring board while reducing the number of manufacturing steps to a significantly smaller number of steps as compared with the conventional manufacturing method. Particularly in the production of a multilayer printed wiring board in which many steps are repeated, the number of steps is significantly reduced, which is effective in improving productivity or mass productivity.
In addition, since the drilling process and the plating process, which are indispensable in the conventional manufacturing process of the multilayer printed wiring board and the like, are not necessary, the defects occurring in the manufacturing process are significantly suppressed, and the yield is improved. Not only that, a highly reliable printed wiring board can be obtained. In addition, since the printed wiring board manufactured does not have holes for interlayer connection on the surface, wiring density can be significantly improved, and the electronic component mounting area can be set regardless of the position of the holes. As a result, the packaging density can be remarkably improved, and the distance between the mounted electronic components can be shortened, so that the circuit performance can be improved. That is, it can be said that the present invention not only contributes to the reduction of the cost of the printed wiring board, but also contributes to the downsizing of the mounted circuit device and the high performance thereof.

[Brief description of drawings]

FIG. 1 schematically shows a first embodiment example of the present invention, in which (a) is a side view showing conductive bumps formed on the surface of a supporting substrate, and (b) is a synthetic resin formed by hot pressing. FIG. 3 is a cross-sectional view showing the shape of a conductive bump press-fitted into a system sheet.

2A and 2B schematically show a first embodiment of the present invention, in which FIG. 2A is a sectional view showing a stacking / arrangement of a supporting substrate, a synthetic resin sheet and a backing plate, and FIG. 2B is a hot press. FIG. 6 is a cross-sectional view showing a state in which a conductor wiring portion penetrating in the thickness direction of a synthetic resin sheet is press-fitted and formed by the above method.

FIG. 3 schematically shows a second embodiment of the present invention, in which (a) is a cross-sectional view showing stacking and arrangement of a supporting substrate, a synthetic resin sheet and a backing plate, and (b) is a hot press. FIG. 6 is a cross-sectional view showing a state in which a conductor wiring portion penetrating in the thickness direction of a synthetic resin sheet is press-fitted and formed by the above method.

FIG. 4 schematically shows a third embodiment of the present invention, in which (a) is a cross-sectional view showing stacking and arrangement of a supporting substrate, a synthetic resin sheet and a backing plate, and (b) is a hot press. FIG. 6 is a cross-sectional view showing a state in which a conductor wiring portion penetrating in the thickness direction of a synthetic resin sheet is press-fitted and formed by the above method.

5A and 5B schematically show a fourth embodiment of the present invention, in which FIG. 5A is a sectional view showing a stacking and arrangement of a supporting substrate, a synthetic resin sheet and a backing plate, and FIG. 5B is a hot press. FIG. 6 is a cross-sectional view showing a state in which a conductor wiring portion penetrating in the thickness direction of a synthetic resin sheet is press-fitted and formed by the above method.

FIG. 6 schematically shows a fourth embodiment of the present invention, in which (a) is a cross-sectional view showing stacking and arrangement of a supporting substrate, a synthetic resin sheet and a backing plate, and (b) is a hot press. FIG. 6 is a cross-sectional view showing a state in which a conductor wiring portion penetrating in the thickness direction of a synthetic resin sheet is press-fitted and formed by the above method.

[Explanation of symbols]

1, 1 '... Support base sheet 2 ... Conductor bump 3 ...
Synthetic resin type sheet 4, 4 '... Patch plate (back sheet) 5 ... Interlayer penetration type conductor wiring part 6, 6' ... Conductor pattern

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Koji Arai 1 Komukai Toshiba Town, Komu-shi, Kawasaki City, Kanagawa Prefecture Komu Factory, Toshiba Corporation (72) Kenji Sasaoka Komukai-Toshiba, Kawasaki City, Kanagawa Prefecture Town No. 1 Incorporation company Toshiba Komukai Factory (72) Inventor Takahiro Mori Komukai Toshiba Town No. 1, Komukai-ku, Kawasaki City, Kanagawa Prefecture Incorporated company Toshiba Komukai Factory (72) Inventor Fumitoshi Ikegaya Kawasaki City, Kanagawa Prefecture Komukai-ku, Toshiba No. 1 in the Komukai factory, Toshiba Corporation (72) Inventor Sadao Furuwata No. 1, Komu-shiba town, Saiwai-ku, Kawasaki-shi, Kanagawa Komukai factory, the Toshiba corporation

Claims (2)

[Claims] 1. A step of arranging a main surface of a synthetic resin sheet on a main surface of a supporting substrate having conductor bump groups formed at predetermined positions so as to be in contact with each other, and stacking the laminated body so as to apply pressure to the synthetic resin. And a step of forming a through-type conductor wiring part by penetrating each of the bump groups in the thickness direction of the sheet. 2. A step of laminating and placing a main surface of a synthetic resin sheet on a main surface of a conductive metal foil having a group of conductor bumps formed at predetermined positions in a laminated manner, pressurizing the laminate, and performing the synthesis. In the thickness direction of the resin-based sheet, a step of penetrating each of the bump groups to form a through-type conductor wiring portion, and etching the conductive metal foil of the laminate in which the through-type conductor wiring portion is formed, And a step of forming a wiring pattern to be connected to the through-type conductive wiring portion, the method being the method of manufacturing a printed wiring board.