JPH06340782A - Resin composition containing hollow inorganic microspheres - Google Patents
Resin composition containing hollow inorganic microspheresInfo
- Publication number
- JPH06340782A JPH06340782A JP14974993A JP14974993A JPH06340782A JP H06340782 A JPH06340782 A JP H06340782A JP 14974993 A JP14974993 A JP 14974993A JP 14974993 A JP14974993 A JP 14974993A JP H06340782 A JPH06340782 A JP H06340782A
- Authority
- JP
- Japan
- Prior art keywords
- ethylene
- weight
- density
- group
- rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 22
- 239000004005 microsphere Substances 0.000 title description 2
- -1 Polypropylene Polymers 0.000 claims abstract description 46
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000005977 Ethylene Substances 0.000 claims abstract description 26
- 229920000642 polymer Polymers 0.000 claims abstract description 25
- 239000005060 rubber Substances 0.000 claims abstract description 25
- 229920001577 copolymer Polymers 0.000 claims abstract description 23
- 229920001971 elastomer Polymers 0.000 claims abstract description 23
- 229920001155 polypropylene Polymers 0.000 claims abstract description 20
- 239000004711 α-olefin Substances 0.000 claims abstract description 20
- 239000004743 Polypropylene Substances 0.000 claims abstract description 18
- 239000004698 Polyethylene Substances 0.000 claims abstract description 16
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims abstract description 15
- 229920000573 polyethylene Polymers 0.000 claims abstract description 15
- 229920001038 ethylene copolymer Polymers 0.000 claims abstract description 13
- 238000010526 radical polymerization reaction Methods 0.000 claims abstract description 11
- 229920001567 vinyl ester resin Polymers 0.000 claims abstract description 10
- 229920001684 low density polyethylene Polymers 0.000 claims abstract description 9
- 239000004702 low-density polyethylene Substances 0.000 claims abstract description 9
- 125000000524 functional group Chemical group 0.000 claims description 24
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- 125000004018 acid anhydride group Chemical group 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 4
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 21
- 238000000465 moulding Methods 0.000 abstract description 6
- 230000002542 deteriorative effect Effects 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 description 27
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
- 229920005672 polyolefin resin Polymers 0.000 description 11
- 239000011521 glass Substances 0.000 description 9
- 239000003063 flame retardant Substances 0.000 description 8
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 7
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 6
- 239000004708 Very-low-density polyethylene Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000011256 inorganic filler Substances 0.000 description 6
- 229910003475 inorganic filler Inorganic materials 0.000 description 6
- 229920005604 random copolymer Polymers 0.000 description 6
- 229920001866 very low density polyethylene Polymers 0.000 description 6
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229920000092 linear low density polyethylene Polymers 0.000 description 4
- 239000004707 linear low-density polyethylene Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 3
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 229920003049 isoprene rubber Polymers 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 239000013585 weight reducing agent Substances 0.000 description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 2
- LPIQIQPLUVLISR-UHFFFAOYSA-N 2-prop-1-en-2-yl-4,5-dihydro-1,3-oxazole Chemical compound CC(=C)C1=NCCO1 LPIQIQPLUVLISR-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004035 construction material Substances 0.000 description 2
- 239000011258 core-shell material Substances 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 229940069096 dodecene Drugs 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 229920005676 ethylene-propylene block copolymer Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000011796 hollow space material Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000012796 inorganic flame retardant Substances 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 150000002763 monocarboxylic acids Chemical class 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 229920006124 polyolefin elastomer Polymers 0.000 description 2
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920001384 propylene homopolymer Polymers 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 1
- QIBMYZSHLJAOMN-GORDUTHDSA-N (e)-2-(oxiran-2-ylmethyl)but-2-enoic acid Chemical compound C\C=C(C(O)=O)/CC1CO1 QIBMYZSHLJAOMN-GORDUTHDSA-N 0.000 description 1
- WLQXEFXDBYHMRG-UPHRSURJSA-N (z)-4-(oxiran-2-ylmethoxy)-4-oxobut-2-enoic acid Chemical compound OC(=O)\C=C/C(=O)OCC1CO1 WLQXEFXDBYHMRG-UPHRSURJSA-N 0.000 description 1
- KJOIQMXGNUKOLD-UHFFFAOYSA-N 1-[diacetyl(ethenyl)silyl]ethanone Chemical compound CC(=O)[Si](C=C)(C(C)=O)C(C)=O KJOIQMXGNUKOLD-UHFFFAOYSA-N 0.000 description 1
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- ZOJIBRUWYLWNRB-UHFFFAOYSA-N 2-(2-ethenoxyethoxymethyl)oxirane Chemical compound C=COCCOCC1CO1 ZOJIBRUWYLWNRB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- JJRUAPNVLBABCN-UHFFFAOYSA-N 2-(ethenoxymethyl)oxirane Chemical compound C=COCC1CO1 JJRUAPNVLBABCN-UHFFFAOYSA-N 0.000 description 1
- CRQSAKXMWFFXJG-UHFFFAOYSA-N 2-[(4-ethenylphenyl)methyl]oxirane Chemical compound C1=CC(C=C)=CC=C1CC1OC1 CRQSAKXMWFFXJG-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- BQBSIHIZDSHADD-UHFFFAOYSA-N 2-ethenyl-4,5-dihydro-1,3-oxazole Chemical group C=CC1=NCCO1 BQBSIHIZDSHADD-UHFFFAOYSA-N 0.000 description 1
- SMNDYUVBFMFKNZ-UHFFFAOYSA-N 2-furoic acid Chemical compound OC(=O)C1=CC=CO1 SMNDYUVBFMFKNZ-UHFFFAOYSA-N 0.000 description 1
- LLRNYKKVBIRYRB-UHFFFAOYSA-N 2-prop-1-en-2-yl-5,6-dihydro-4h-1,3-oxazine Chemical compound CC(=C)C1=NCCCO1 LLRNYKKVBIRYRB-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- URUDUSNEBVXHDF-DUXPYHPUSA-N C(C1CO1)/C(/C(=O)O)=C\C(=O)O Chemical compound C(C1CO1)/C(/C(=O)O)=C\C(=O)O URUDUSNEBVXHDF-DUXPYHPUSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- DCXXMTOCNZCJGO-UHFFFAOYSA-N Glycerol trioctadecanoate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC DCXXMTOCNZCJGO-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- YIYBQIKDCADOSF-UHFFFAOYSA-N alpha-Butylen-alpha-carbonsaeure Natural products CCC=CC(O)=O YIYBQIKDCADOSF-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- PVEOYINWKBTPIZ-UHFFFAOYSA-N but-3-enoic acid Chemical compound OC(=O)CC=C PVEOYINWKBTPIZ-UHFFFAOYSA-N 0.000 description 1
- WJAKXPUSJAKPHH-UHFFFAOYSA-N buta-1,3-diene;ethene;styrene Chemical group C=C.C=CC=C.C=CC1=CC=CC=C1 WJAKXPUSJAKPHH-UHFFFAOYSA-N 0.000 description 1
- XZKRXPZXQLARHH-UHFFFAOYSA-N buta-1,3-dienylbenzene Chemical compound C=CC=CC1=CC=CC=C1 XZKRXPZXQLARHH-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- HKKJCFWKEDEXBE-UHFFFAOYSA-N ethene;2-methylbuta-1,3-diene;styrene Chemical group C=C.CC(=C)C=C.C=CC1=CC=CC=C1 HKKJCFWKEDEXBE-UHFFFAOYSA-N 0.000 description 1
- ZBGRMWIREQJHPK-UHFFFAOYSA-N ethenyl 2,2,2-trifluoroacetate Chemical compound FC(F)(F)C(=O)OC=C ZBGRMWIREQJHPK-UHFFFAOYSA-N 0.000 description 1
- GLVVKKSPKXTQRB-UHFFFAOYSA-N ethenyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC=C GLVVKKSPKXTQRB-UHFFFAOYSA-N 0.000 description 1
- LZWYWAIOTBEZFN-UHFFFAOYSA-N ethenyl hexanoate Chemical compound CCCCCC(=O)OC=C LZWYWAIOTBEZFN-UHFFFAOYSA-N 0.000 description 1
- QBDADGJLZNIRFQ-UHFFFAOYSA-N ethenyl octanoate Chemical compound CCCCCCCC(=O)OC=C QBDADGJLZNIRFQ-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229920005674 ethylene-propylene random copolymer Polymers 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000002557 mineral fiber Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- RFCUFYLDFMHKKW-UHFFFAOYSA-N oxiran-2-ylmethyl 2-chloroprop-2-enoate Chemical compound ClC(=C)C(=O)OCC1CO1 RFCUFYLDFMHKKW-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 125000006235 propyl amino ethyl group Chemical group [H]N(C([H])([H])C([H])([H])*)C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- BHZOKUMUHVTPBX-UHFFFAOYSA-M sodium acetic acid acetate Chemical class [Na+].CC(O)=O.CC([O-])=O BHZOKUMUHVTPBX-UHFFFAOYSA-M 0.000 description 1
- 239000011949 solid catalyst Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- YIYBQIKDCADOSF-ONEGZZNKSA-N trans-pent-2-enoic acid Chemical compound CC\C=C\C(O)=O YIYBQIKDCADOSF-ONEGZZNKSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
(57)【要約】
【目的】 寸法安定性、成形加工性等を低下させずに、
成形品の軽量化を計ると共に、高剛性、耐熱性、耐摩耗
性等を付与した、耐衝撃性、特に低温下における耐衝撃
性等にすぐれた樹脂組成物を開発する。
【構成】 (A)ポリプロピレン系重合体および/また
は密度が0.94g/cm3以上のポリエチレン50〜98
重量%、(B)下記(B1)〜(B4)から選ばれた少なく
とも1種のエチレン(共)重合体またはゴム2〜50重
量%、(B1)密度が0.86〜0.94 g/cm3未満の高
圧ラジカル重合法による低密度ポリエチレンまたはエチ
レン・αーオレフィン共重合体、(B2)エチレンービニ
ルエステル共重合体、(B3)エチレンーα,βー不飽和
カルボン酸アルキルエステル共重合体、(B4)ゴム、上
記(A)+(B)100重量部と、(C)無機微小中空
体5〜100重量部を含む無機微小中空体含有樹脂組成
物により目的を達成できる。(57) [Abstract] [Purpose] Without deteriorating dimensional stability, molding processability, etc.
We will develop a resin composition that not only reduces the weight of molded products but also has high rigidity, heat resistance, wear resistance, etc., and is excellent in impact resistance, especially impact resistance at low temperatures. [Structure] (A) Polypropylene polymer and / or polyethylene 50 to 98 having a density of 0.94 g / cm 3 or more
% By weight, (B) 2 to 50% by weight of at least one ethylene (co) polymer or rubber selected from the following (B1) to (B4), (B1) density is 0.86 to 0.94 g / low-density polyethylene or ethylene / α-olefin copolymer by high-pressure radical polymerization method of less than cm 3 , (B2) ethylene-vinyl ester copolymer, (B3) ethylene-α, β-unsaturated carboxylic acid alkyl ester copolymer, The object can be achieved by the inorganic fine hollow body-containing resin composition containing (B4) rubber, 100 parts by weight of the above (A) + (B), and 5 to 100 parts by weight of the inorganic fine hollow body (C).
Description
【0001】[0001]
【産業上の利用分野】本発明は無機微小中空体含有樹脂
組成物に関し、さらに詳しくは、該組成物は、ポリプロ
ピレン系重合体および/または密度が0.94g/cm3以
上のポリエチレン、エチレン(共)重合体またはゴム、
および無機微小中空体からなる組成物、または前記組成
物に特定の官能基を含有した組成物からなり、寸法安定
性、成形加工性等を低下させることなく、成形品の軽量
化を計ると共に、高剛性、耐熱性、耐摩耗性等を付与せ
しめた、耐衝撃性、特に低温下における耐衝撃性にすぐ
れた組成物であって、電気電子部品、建築用資材、自動
車部品等に有効に利用することができる無機微小中空体
含有樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition containing an inorganic micro-hollow body, and more specifically, the composition comprises a polypropylene polymer and / or polyethylene having a density of 0.94 g / cm 3 or more, ethylene ( Co) polymer or rubber,
And a composition consisting of an inorganic micro hollow body, or a composition containing a specific functional group in the composition, without reducing the dimensional stability, molding processability, etc., while reducing the weight of the molded product, It is a composition with high rigidity, heat resistance, wear resistance, etc. that has excellent impact resistance, especially impact resistance at low temperatures, and is effectively used for electrical and electronic parts, construction materials, automobile parts, etc. The present invention relates to an inorganic microhollow body-containing resin composition that can be used.
【0002】[0002]
【従来の技術】従来、種々のプラスチックをマトリック
スとしてガラスバルーン、シラスバルーン等の無機微小
中空体を配合した複合材料が開発され、新しい用途が開
拓されてきている。このような複合材料としては、ポリ
プロピレン樹脂に高圧法ポリエチレン樹脂またはダル化
した中低圧法ポリエチレン樹脂およびシリカ系中空微小
球体を配合し、一軸延伸テープ用樹脂組成物を製造する
方法(特開昭54−60369号公報)、ポリアセター
ル、ポリアミド等のエンプラやポリエチレン、ポリプロ
ピレン等のポリオレフィンおよびポリオレフィンを主体
とする共重合体等に、特定の壁厚比の中空状充填材を配
合して、自動車のボデー、電気機器、OA機器等の外装
材とする方法(特開昭61−236859号公報)、結
晶性プロピレン系重合体に繊維状無機充填材、シリカ・
アルミナ中空体、変性プロピレン系重合体からなる組成
物により自動車部品、電気・電子機器のハウジング類を
製造する方法(特開平3−200853号公報)、ポリ
エチレン、ポリプロピレン等結晶性ポリオレフィンおよ
び特殊なアクリル酸アルキルエステルを共重合した脂肪
族ポリオレフィン樹脂に、ウオラストナイトおよび中空
球状無機物質より選ばれる少なくとも1種以上の無機充
填材、さらにマイカ等の無機充填材よりなる組成物か
ら、スピーカーボックス、レコードプレーヤーキャビネ
ット等の音響振動板を製造する樹脂組成物(特開平3−
223355号公報)等が開示されている。2. Description of the Related Art Conventionally, composite materials have been developed in which various plastics are used as matrices and inorganic fine hollow bodies such as glass balloons and shirasu balloons have been developed, and new applications have been developed. As such a composite material, a method for producing a resin composition for a uniaxially stretched tape by blending a polypropylene resin with a high-pressure polyethylene resin or a dulled medium- and low-pressure polyethylene resin and silica-based hollow microspheres (JP-A-54). No. -60369), engineering plastics such as polyacetal and polyamide, polyolefins such as polyethylene and polypropylene, and copolymers mainly composed of polyolefin, and the like, and a hollow filler having a specific wall thickness ratio are blended to form an automobile body, A method of using as an exterior material for electric equipment, office automation equipment, etc. (Japanese Patent Laid-Open No. 61-236859), crystalline propylene-based polymer with fibrous inorganic filler, silica.
Method for producing automobile parts, housings for electric and electronic devices by a composition comprising hollow alumina and modified propylene polymer (JP-A-3-200853), crystalline polyolefin such as polyethylene and polypropylene, and special acrylic acid A speaker box, a record player from a composition comprising an aliphatic polyolefin resin copolymerized with an alkyl ester, at least one inorganic filler selected from wollastonite and hollow spherical inorganic substances, and an inorganic filler such as mica. A resin composition for producing an acoustic diaphragm for a cabinet or the like (Patent Document 3)
No. 223355) is disclosed.
【0003】これらはいずれも、軽量化を主たる目的と
し、高剛性、耐熱性、遮音性、吸音性、高内部損失特
性、成形性、寸法安定性等の改善、向上をはかっている
ことは、公然と知られているところである。しかし、微
小中空体を加えることにより引張強度等の機械的強度の
低下は避けられず、さらに剛性を高めると耐衝撃性が著
しく低下し、とくに低温下における耐衝撃性は極めて悪
化するため、上記の各組成物も性能的にまだ十分でな
く、さらに特性においてバランスのとれた成形品を提供
しえる樹脂組成物の開発が望まれている。The main purpose of all of these is to reduce weight, and to improve and improve high rigidity, heat resistance, sound insulation, sound absorption, high internal loss characteristics, moldability, dimensional stability, etc. It is openly known. However, the addition of micro hollow bodies inevitably causes a decrease in mechanical strength such as tensile strength, and further increase in rigidity causes a marked decrease in impact resistance, and particularly the impact resistance at low temperatures is extremely deteriorated. Each of the above compositions is still insufficient in performance, and there is a demand for the development of a resin composition that can provide a molded product with well-balanced properties.
【0004】[0004]
【発明が解決しようとする課題】本発明はこれらの問題
点を改善し、寸法安定性、成形加工性等を低下させるこ
となく、成形品の軽量化を計ると共に、高剛性、耐熱
性、耐摩耗性等を付与せしめた、耐衝撃性、特に低温下
における耐衝撃性にすぐれた組成物であって、電気電子
部品、建築用資材、自動車部品等に有効に利用すること
ができる無機微小中空体含有樹脂組成物を提供すること
を目的とするものである。The present invention solves these problems and reduces the weight of molded products without deteriorating dimensional stability, molding processability, etc., and also provides high rigidity, heat resistance, and resistance to heat. It is a composition with excellent wear resistance, especially impact resistance at low temperature, which has abrasion resistance, and is an inorganic micro hollow material that can be effectively used for electric and electronic parts, construction materials, automobile parts, etc. The object of the present invention is to provide a body-containing resin composition.
【0005】[0005]
【課題を解決するための手段】本発明の第1の発明は、 (A)ポリプロピレン系重合体および/または密度が0.94g/cm3以上の ポリエチレン 50〜98重量%、 (B)下記(B1)〜(B4)から選ばれた少なくとも1種のエチレン(共)重 合体またはゴム 2〜50重量%、 (B1)密度が0.86〜0.94 g/cm3未満の高圧ラジ
カル重合法による低密度ポリエチレンまたはエチレン・
αーオレフィン共重合体、(B2)エチレンービニルエス
テル共重合体、(B3)エチレンーα,βー不飽和カルボ
ン酸アルキルエステル共重合体、(B4)ゴム、上記
(A)+(B)100重量部と、 (C)無機微小中空体5〜100重量部を含む無機微小
中空体含有樹脂組成物を提供するものである。The first invention of the present invention is (A) a polypropylene polymer and / or 50 to 98% by weight of polyethylene having a density of 0.94 g / cm 3 or more, and (B) the following ( At least one ethylene (co) polymer or rubber selected from B1) to (B4) 2 to 50% by weight, (B1) High-pressure radical polymerization method having a density of 0.86 to less than 0.94 g / cm 3. By low density polyethylene or ethylene
α-olefin copolymer, (B2) ethylene-vinyl ester copolymer, (B3) ethylene-α, β-unsaturated carboxylic acid alkyl ester copolymer, (B4) rubber, (A) + (B) 100 parts by weight And (C) 5 to 100 parts by weight of the inorganic microhollow body, the resin composition containing the inorganic microhollow body is provided.
【0006】本発明の第2の発明は、 (A)ポリプロピレン系重合体および/または密度が
0.94 g/cm3以上のポリエチレン (B)下記(B1)〜(B4)から選ばれた少なくとも1種
のエチレン(共)重合体またはゴム(B1)密度が0.8
6〜0.94 g/cm3未満の高圧ラジカル重合法による低
密度ポリエチレンまたはエチレン・αーオレフィン共重
合体、(B2)エチレンービニルエステル共重合体、(B
3)エチレンーα,βー不飽和カルボン酸アルキルエス
テル共重合体、(B4)ゴム、上記(A)+(B)100
重量部と、(C)無機微小中空体5〜100重量部を含
む組成物であって、(A)+(B)成分中の、(A)成
分の含有量が50〜98重量%、(B)成分の含有量が
2〜50重量%であり、かつ全重合体成分中に、下記a
〜fから選択された少なくとも1種の官能基を、全重合
体1g当り10-3g当量以下を含有していることを特徴
とする無機微小中空体含有樹脂組成物を提供するもので
ある。 a:カルボン酸基または酸無水基 b:エポキシ基 c:ヒドロキシル基 d:アミノ基 e:アルケニル環状イミノエーテル基 f:シラン基A second invention of the present invention is (A) a polypropylene polymer and / or polyethylene having a density of 0.94 g / cm 3 or more (B) at least one selected from the following (B1) to (B4) One ethylene (co) polymer or rubber (B1) density is 0.8
Low density polyethylene or ethylene / α-olefin copolymer by high pressure radical polymerization of 6 to less than 0.94 g / cm 3 , (B2) ethylene-vinyl ester copolymer, (B
3) Ethylene-α, β-unsaturated carboxylic acid alkyl ester copolymer, (B4) rubber, (A) + (B) 100 above
A composition comprising 5 parts by weight and (C) 5 to 100 parts by weight of an inorganic micro hollow body, wherein the content of the (A) component in the (A) + (B) components is 50 to 98% by weight, The content of the component B) is from 2 to 50% by weight, and the following a is contained in all the polymer components.
The present invention provides a resin composition containing an inorganic micro-hollow body, which contains at least one functional group selected from the group (1) to (f) in an amount of 10 -3 g equivalent or less per 1 g of the total polymer. a: carboxylic acid group or acid anhydride group b: epoxy group c: hydroxyl group d: amino group e: alkenyl cyclic iminoether group f: silane group
【0007】以下、本発明を詳細に説明する。本発明で
使用する(A)成分とはポリプロピレン系重合体および
/または密度0.94 g/cm3以上のポリエチレンであ
る。ポリプロピレン系重合体として具体的には、プロピ
レン単独重合体(以下、ポリプロピレンと称す)、エチ
レンープロピレンブロック共重合体あるいはランダム共
重合体などの公知のポリプロピレン共重合体またはそれ
らの混合物を使用することができ、これらの内でも高剛
性を要求される音響用部材としてはプロピレン単独重合
体が望ましくアイソタクティ シテイ 95%以上、特にア
イソタクテイックペンタッド率0.95以上のものを選択
することが望ましい。また、低温衝撃性等が要求される
ハウジング部材、自動車部材としては、エチレンープロ
ピレンブロック共重合体が好ましい。該ポリプロピレン
のメルトフローレート(以下、MFRと称す)は0.1
〜50g/10min.、好ましくは1〜40g/10min.、さ
らに好ましくは5〜30g/10min.の範囲から選択するの
がよい。The present invention will be described in detail below. The component (A) used in the present invention is a polypropylene polymer and / or polyethylene having a density of 0.94 g / cm 3 or more. As the polypropylene-based polymer, specifically, a known polypropylene copolymer such as propylene homopolymer (hereinafter referred to as polypropylene), ethylene-propylene block copolymer or random copolymer, or a mixture thereof is used. Among these, propylene homopolymer is desirable as an acoustic member requiring high rigidity, and isotacticity of 95% or more, particularly isotactic pentad ratio of 0.95 or more is preferably selected. . Further, ethylene-propylene block copolymers are preferable as the housing members and automobile members required to have low-temperature impact resistance and the like. The melt flow rate (hereinafter referred to as MFR) of the polypropylene is 0.1
˜50 g / 10 min., Preferably 1-40 g / 10 min., More preferably 5-30 g / 10 min.
【0008】本発明で使用する(A)成分のもうひとつ
の成分である密度が0.94g/cm3以上のポリエチレン
とは、エチレン単独またはエチレンと炭素数3〜12の
αーオレフィンの共重合体およびそれらの混合物で、具
体的なαーオレフィンとしては、プロピレン、1−ブテ
ン、4−メチル−1−ペンテン、1ーヘキセン、1−オ
クテン、1−ドデセン等を挙げることができる。これら
のαーオレフィンうち特に好ましいのは、プロピレンと
1ーブテンである。その密度は0.94 g/cm3〜0.9
8 g/cm3の範囲で、MFRは0.1〜50g/10min.、
好ましくは1〜40g/10min.、さらに好ましくは5〜
30g/10min.の範囲から選択するのがよい。The polyethylene having a density of 0.94 g / cm 3 or more, which is another component of the component (A) used in the present invention, is ethylene alone or a copolymer of ethylene and an α-olefin having 3 to 12 carbon atoms. Specific examples of α-olefins in the mixture and their mixtures include propylene, 1-butene, 4-methyl-1-pentene, 1-hexene, 1-octene, 1-dodecene and the like. Of these α-olefins, propylene and 1-butene are particularly preferable. Its density is 0.94 g / cm 3 to 0.9
In the range of 8 g / cm 3 , MFR is 0.1-50 g / 10 min.,
Preferably 1 to 40 g / 10 min., More preferably 5 to
It is better to select from the range of 30 g / 10 min.
【0009】上記(A)ポリプロピレン系重合体および
/または密度が0.94 g/cm3以上のポリエチレンの配
合量は50〜98重量%、好ましくは60〜90重量%
である。50重量%より少ないと剛性、成形性、成形加
工性が劣り、98重量%より多いと耐衝撃性、特に低温
下における耐衝撃性に欠けるので、この範囲から選択す
るのがよい。The amount of the polypropylene polymer (A) and / or polyethylene having a density of 0.94 g / cm 3 or more is 50 to 98% by weight, preferably 60 to 90% by weight.
Is. If it is less than 50% by weight, the rigidity, moldability and molding processability are deteriorated, and if it is more than 98% by weight, the impact resistance, especially the impact resistance at low temperature is insufficient, so it is preferable to select from this range.
【0010】本発明における(B)成分としては、(B
1)密度が0.86〜0.94g/cm3未満の高圧ラジカ
ル重合法による低密度ポリエチレンまたはエチレン・α
ーオレフィン共重合体、(B2)エチレンービニルエステ
ル共重合体、(B3)エチレンーα,βー不飽和カルボン
酸アルキルエステル共重合体、(B4)ゴムから選ばれた
少なくとも1種であるエチレン(共)重合体またはゴム
が挙げられる。The component (B) in the present invention includes (B
1) Low-density polyethylene or ethylene / α produced by high-pressure radical polymerization with a density of 0.86 to less than 0.94 g / cm 3.
-Olefin copolymer, (B2) ethylene-vinyl ester copolymer, (B3) ethylene-α, β-unsaturated carboxylic acid alkyl ester copolymer, (B4) at least one ethylene (copolymer ) Polymers or rubbers.
【0011】該(B1)密度0.86〜0.94g/cm3未
満の高圧ラジカル重合法による低密度ポリエチレンまた
はエチレン・αーオレフィン共重合体とは、高圧ラジカ
ル重合法による密度0.91〜0.94g/cm3未満の低
密度ポリエチレンおよび、チーグラー触媒等を用いる高
中低圧法及びその他の公知の方法によるエチレンと炭素
数3〜12のαーオレフィンとの共重合体であり、密度
0.86〜0.91g/cm3未満のエチレン・αーオレフ
ィン共重合体(超低密度ポリエチレン、以下VLDPE
と称す)および密度0.91〜0.94 g/cm3未満のエ
チレン・αーオレフィン共重合体(直鎖状低密度ポリエ
チレン、以下LLDPEと称す)である。具体的なαー
オレフィンとしては、プロピレン、1−ブテン、4−メ
チル−1−ペンテン、1ーヘキセン、1−オクテン、1
−ドデセンなどを挙げることができる。これらのうち好
ましいのは1−ブテン、4−メチル−1−ペンテン、1
ーヘキセン、1−オクテンであり、とくに好ましいのは
1ーブテンである。エチレン共重合体中のαーオレフィ
ン含有量は5〜40モル%であることが好ましい。The low density polyethylene or ethylene / α-olefin copolymer (B1) having a density of 0.86 to less than 0.94 g / cm 3 by a high pressure radical polymerization method means a density of 0.91 to 0 by a high pressure radical polymerization method. A low-density polyethylene of less than 94 g / cm 3 and a copolymer of ethylene and an α-olefin having a carbon number of 3 to 12 by a high, medium and low pressure method using a Ziegler catalyst and the like, and a density of 0.86 to Ethylene / α-olefin copolymer less than 0.91 g / cm 3 (ultra low density polyethylene, hereinafter VLDPE
And an ethylene / α-olefin copolymer having a density of 0.91 to less than 0.94 g / cm 3 (linear low density polyethylene, hereinafter referred to as LLDPE). Specific α-olefins include propylene, 1-butene, 4-methyl-1-pentene, 1-hexene, 1-octene, 1
-Dodecene and the like can be mentioned. Of these, preferred are 1-butene, 4-methyl-1-pentene, and 1.
-Hexene and 1-octene, and particularly preferred is 1-butene. The α-olefin content in the ethylene copolymer is preferably 5 to 40 mol%.
【0012】該VLDPEとは、密度が0.86 g/cm3
〜0.91g/cm3未満であり、示差走査熱量測定法(D
SC)による最大ピーク温度(Tm )50℃以上、好ま
しくは100℃以上、かつ沸騰n−ヘキサン不溶分10
重量%以上の性状を有し、直鎖状低密度ポリエチレンと
エチレン・α−オレフィン共重合体ゴムとの中間の性状
を示すポリエチレンである。さらに詳しくはエチレンと
炭素数3〜12のαーオレフィンとの共重合体であっ
て、このVLDPEはLLDPEが示す高結晶部分とエ
チレン・α−オレフィン共重合体ゴムが示す非晶部分と
を合わせ持つ樹脂であって、前者の特徴である機械的強
度、耐熱性などと、後者の特徴である自己粘着性、ゴム
状弾性、耐低温衝撃性などがバランスよく共存してお
り、本発明に用いるときは極めて有用である。該VLD
PEは、少なくともマグネシウムとチタンおよび/また
はバナジウムを含有する固体触媒成分に有機アルミニウ
ム化合物を組み合わせた触媒系を用いて製造することが
できる。The VLDPE has a density of 0.86 g / cm 3
Is less than 0.91 g / cm 3 , and the differential scanning calorimetry (D
SC) maximum peak temperature (Tm) 50 ° C. or higher, preferably 100 ° C. or higher, and boiling n-hexane insoluble matter 10
It is a polyethylene having a property of not less than wt% and showing a property intermediate between the linear low-density polyethylene and the ethylene / α-olefin copolymer rubber. More specifically, it is a copolymer of ethylene and an α-olefin having 3 to 12 carbon atoms, and this VLDPE has both a highly crystalline portion represented by LLDPE and an amorphous portion represented by an ethylene / α-olefin copolymer rubber. Resin, the mechanical characteristics, heat resistance, etc., which are the characteristics of the former, and the self-adhesion, rubber-like elasticity, low-temperature impact resistance, etc., which are the characteristics of the latter, coexist in a well-balanced manner, and when used in the present invention. Is extremely useful. The VLD
PE can be produced using a catalyst system in which a solid catalyst component containing at least magnesium and titanium and / or vanadium is combined with an organoaluminum compound.
【0013】該(B2)エチレンービニルエステル共重合
体は、高圧ラジカル重合法で製造されるエチレンを主成
分とするプロピオン酸ビニル、酢酸ビニル、カプロン酸
ビニル、カプリル酸ビニル、ラウリル酸ビニル、ステア
リン酸ビニル、トリフルオル酢酸ビニルなどのビニルエ
ステル単量体および他の不飽和単量体との共重合体であ
る。これらの中でも特に好ましいものとしては、エチレ
ンー酢酸ビニル共重合体を挙げることができる。すなわ
ち、エチレン50〜99.5重量%、酢酸ビニル0.5
〜50重量%および他の不飽和単量体0〜25重量%か
らなる共重合体が好ましい。The ethylene-vinyl ester copolymer (B2) is a vinyl propionate, vinyl acetate, vinyl caproate, vinyl caprylate, vinyl laurate, stearin produced by a high pressure radical polymerization method and containing ethylene as a main component. It is a copolymer with vinyl ester monomers such as vinyl acid acid and vinyl trifluoroacetate and other unsaturated monomers. Among these, ethylene-vinyl acetate copolymers are particularly preferable. That is, ethylene 50 to 99.5% by weight, vinyl acetate 0.5
Copolymers consisting of .about.50% by weight and 0 to 25% by weight of other unsaturated monomers are preferred.
【0014】該(B3)エチレンーα,βー不飽和カルボ
ン酸アルキルエステル誘導体との共重合体としては、エ
チレンとα,βー不飽和カルボン酸アルキルエステルお
よび他の不飽和単量体との共重合体、およびそれらの金
属塩、アミド、イミド等が挙げられるが、好ましくは高
圧ラジカル重合法で製造されるエチレンーアクリル酸エ
チル共重合体等を挙げることができる。すなわち、エチ
レン50〜99.5重量%、アクリル酸エチルエステル
0.5〜50重量%および他の不飽和単量体0〜25重
量%からなる共重合体が好ましい。The copolymer (B3) with the ethylene-α, β-unsaturated carboxylic acid alkyl ester derivative is a copolymer of ethylene with an α, β-unsaturated carboxylic acid alkyl ester and other unsaturated monomers. Examples thereof include polymers and their metal salts, amides, imides, and the like, with preference given to ethylene-ethyl acrylate copolymers and the like produced by a high-pressure radical polymerization method. That is, a copolymer composed of 50 to 99.5% by weight of ethylene, 0.5 to 50% by weight of acrylic acid ethyl ester and 0 to 25% by weight of another unsaturated monomer is preferable.
【0015】上記他の不飽和単量体とは、プロピレン、
ブテンー1、ヘキセンー1、4ーメチルペンテンー1、
オクテンー1、デセンー1等の炭素数3〜10のオレフ
ィン類、C2〜C3アルカンカルボン酸のビニルエステ
ル類、アクリル酸またはメタクリル酸メチル、アクリル
酸またはメタクリル酸エチル、アクリル酸またはメタク
リル酸プロピル、グリシジルアクリレートまたはグリシ
ジルメタクリレート等のアクリル酸またはメタクリル酸
エステル類、アクリル酸、メタクリル酸、マレイン酸、
フマル酸および無水マレイン酸等のエチレン性不飽和カ
ルボン酸またはその無水物類などの群から選ばれた少な
くとも1種である。The other unsaturated monomer is propylene,
Butene-1, hexene-1, 4-methylpentene-1,
C3-10 olefins such as octene-1, decene-1, vinyl esters of C2-C3 alkanecarboxylic acids, acrylic acid or methyl methacrylate, acrylic acid or ethyl methacrylate, acrylic acid or propyl methacrylate, glycidyl acrylate Or acrylic acid or methacrylic acid esters such as glycidyl methacrylate, acrylic acid, methacrylic acid, maleic acid,
It is at least one selected from the group consisting of ethylenically unsaturated carboxylic acids such as fumaric acid and maleic anhydride, or their anhydrides.
【0016】該(B4)ゴムとしては、エチレンプロピレ
ン系ゴム、ブタジエン系ゴム、イソプレン系ゴム、天然
ゴム、ニトリルゴム、イソブチレンゴムなどが挙げら
れ、これらは単独でも混合物でもよい。Examples of the (B4) rubber include ethylene propylene rubber, butadiene rubber, isoprene rubber, natural rubber, nitrile rubber and isobutylene rubber, and these may be used alone or as a mixture.
【0017】上記エチレンプロピレン系ゴムとは、エチ
レンおよびプロピレンを主成分とするランダム共重合体
(EPM)、および第3成分としてジエンモノマー(ジ
シクロペンタジエン、エチリデンノルボルネン等)を加
えたものを主成分とするランダム共重合体(EPDM)
を指す。The ethylene propylene rubber is a random copolymer (EPM) containing ethylene and propylene as main components, and a diene monomer (dicyclopentadiene, ethylidene norbornene, etc.) as a third component added as a main component. Random copolymer (EPDM)
Refers to.
【0018】上記ブタジエン系ゴムとは、ブタジエンを
構成要素とする共重合体をいい、スチレンーブタジエン
ブロック共重合体(SBS)およびその水添または部分
水添誘導体であるスチレンーブタジエンーエチレン共重
合体(SBES)、1,2ーポリブタジエン(1,2ー
PB)、無水マレイン酸ーブタジエンースチレン共重合
体、コアシェル構造を有する変性ブタジエンゴム等が例
示される。The butadiene-based rubber means a copolymer having butadiene as a constituent element, and is a styrene-butadiene block copolymer (SBS) and its hydrogenated or partially hydrogenated derivative, styrene-butadiene-ethylene copolymer. Examples thereof include polymer (SBES), 1,2-polybutadiene (1,2-PB), maleic anhydride-butadiene-styrene copolymer, and modified butadiene rubber having a core-shell structure.
【0019】上記イソプレンゴムとは、イソプレンを構
成要素とする共重合体をいい、スチレンーイソプレンブ
ロック共重合体(SIS)およびその水添または部分水
添誘導体であるスチレンーイソプレンーエチレン共重合
体(SIES)、コアシェル構造を有する変性イソプレ
ンゴム等が例示される。The above isoprene rubber means a copolymer having isoprene as a constituent element, and is a styrene-isoprene block copolymer (SIS) and a styrene-isoprene-ethylene copolymer which is a hydrogenated or partially hydrogenated derivative thereof. (SIES), modified isoprene rubber having a core-shell structure and the like are exemplified.
【0020】本発明における(B)成分である、エチレ
ン(共)重合体またはゴムの中では、VLDPEが最も
好ましい。該VLDPEのMFRは0.1〜50g/10mi
n.、好ましくは0.5〜20g/10min.の範囲から選択す
るのがよい。MFRが0.1g/10min. 未満では樹脂組
成物の流動性が悪くなり、50g/10min.を越えると引張
強度などの低下が起こり好ましくない。該エチレン
(共)重合体またはゴムの配合量は2〜50重量%であ
る。50重量%より多いと剛性、耐熱性が劣り、2重量
%より少ないと耐衝撃性、特に低温下における耐衝撃性
に劣るので、この範囲から選択するのがよい。Among the ethylene (co) polymers or rubbers which are the component (B) in the present invention, VLDPE is most preferable. The MFR of the VLDPE is 0.1-50g / 10mi
n., preferably 0.5 to 20 g / 10 min. If the MFR is less than 0.1 g / 10 min., The fluidity of the resin composition will be poor, and if it exceeds 50 g / 10 min. The amount of the ethylene (co) polymer or rubber compounded is 2 to 50% by weight. If it is more than 50% by weight, the rigidity and heat resistance are inferior, and if it is less than 2% by weight, the impact resistance, especially the impact resistance at low temperature is inferior, so it is preferable to select from this range.
【0021】本発明における(C)成分である無機微小
中空体としては、例えば、ガラスバルーン、シリカバル
ーン、アルミナバルーン、カーボンバルーン、シラスバ
ルーン、アルミノシリケート系バルーン等があげられる
が、これらの内では、ガラスバルーンが最も好ましい。
ガラスバルーンの平均粒径は5〜200μm、好ましく
は10〜100μm、見かけ比重0.4〜1.0 g/c
m3、好ましくは0.5〜1.0 g/cm3、耐圧強度400
kg/cm2以上であることが望ましい。平均粒径が200μ
mを越えると成形物の表面平滑性が低下して外観が悪化
し、見かけ比重が0.4g/cm3 以下であると、耐圧強度
が低下し、樹脂成分と混合し溶融する際に、押出成形機
や射出成形機の圧力やせん断力、および結晶性樹脂の固
化時の収縮圧力により中空体が破壊されてしまう欠点が
生じ、1.0 g/cm3 以上であると、成形品の比重が高
くなり、軽量化の目的が達成出来ない。無機微小中空体
の配合量は(A)+(B)100重量部に対し5〜10
0重量部である。5重量部以下では剛性が不十分である
上に、軽量化の目的が達成出来ず、100重量部以上で
は混練に難がある。Examples of the inorganic fine hollow body which is the component (C) in the present invention include glass balloons, silica balloons, alumina balloons, carbon balloons, shirasu balloons, aluminosilicate balloons, and the like. , Glass balloons are most preferred.
Glass balloons have an average particle size of 5 to 200 μm, preferably 10 to 100 μm, and an apparent specific gravity of 0.4 to 1.0 g / c.
m 3 , preferably 0.5 to 1.0 g / cm 3 , pressure strength 400
It is desirable to be kg / cm 2 or more. Average particle size is 200μ
If it exceeds m, the surface smoothness of the molded product will be deteriorated and the appearance will be deteriorated. If the apparent specific gravity is 0.4 g / cm 3 or less, the compression strength will be decreased, and when extruded when the resin component is mixed and melted. When the hollow body is destroyed by the pressure and shearing force of the molding machine or injection molding machine, and the contraction pressure when the crystalline resin is solidified, the specific gravity of the molded product is 1.0 g / cm 3 or more. Becomes higher and the purpose of weight reduction cannot be achieved. The compounding amount of the inorganic micro hollow body is 5 to 10 parts by weight based on 100 parts by weight of (A) + (B).
0 parts by weight. If the amount is less than 5 parts by weight, the rigidity is insufficient and the object of weight reduction cannot be achieved. If the amount is more than 100 parts by weight, kneading is difficult.
【0022】本発明において無機微小中空体を使用する
場合には、その表面をステアリン酸、オレイン酸等の脂
肪酸またはパラフィン、ワックス、有機シラン、有機チ
タネート、エポキシ樹脂等で被覆するなどの表面処理を
施すのが好ましい。When the inorganic micro hollow body is used in the present invention, the surface thereof is coated with a fatty acid such as stearic acid and oleic acid or paraffin, wax, organic silane, organic titanate, epoxy resin and the like. It is preferably applied.
【0023】本発明における無機微小中空体含有樹脂組
成物に含有される官能基とは、a:カルボン酸基または
酸無水基、b:エポキシ基、c:ヒドロキシル基、d:
アミノ基、e:アルケニル環状イミノエーテル基、f:
シラン基から選ばれた少なくとも1種の官能基である。The functional groups contained in the resin composition containing an inorganic microhollow body in the present invention include a: carboxylic acid group or acid anhydride group, b: epoxy group, c: hydroxyl group, d:
Amino group, e: alkenyl cyclic iminoether group, f:
It is at least one functional group selected from silane groups.
【0024】上記官能基a:カルボン酸基または酸無水
基を導入する化合物としては、マレイン酸、フマル酸、
シトラコン酸、イタコン酸等のα,β- 不飽和ジカルボ
ン酸、アクリル酸、メタクリル酸、フラン酸、クロトン
酸、ビニル酢酸、ペンテン酸等の不飽和モノカルボン
酸,あるいはこれらα,β- 不飽和ジカルボン酸または
不飽和モノカルボン酸のエステルまたは無水物等が挙げ
られる。The functional group a: a compound for introducing a carboxylic acid group or an acid anhydride group, maleic acid, fumaric acid,
Α, β-Unsaturated dicarboxylic acids such as citraconic acid and itaconic acid, unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, furanic acid, crotonic acid, vinylacetic acid and pentenoic acid, or these α, β-unsaturated dicarboxylic acids Examples thereof include esters of acid or unsaturated monocarboxylic acids or anhydrides.
【0025】b:エポキシ基を導入する化合物として
は、アクリル酸グリシジル、メタクリル酸グリシジル等
のグリシジル類、イタコン酸モノグリシジルエステル、
ブテントリカルボン酸モノグリシジルエステル、ブテン
トリカルボン酸ジグリシジルエステル、ブテントリカル
ボン酸トリグリシジルエステル、α−クロロアクリル酸
グリシジルエステル、マレイン酸グリシジルエステル、
クロトン酸グリシジルエステル、フマ−ル酸グリシジル
エステル等のグリシジルエステル類、またはビニルグリ
シジルエ−テル、アリルグリシジルエ−テル、グリシジ
ルオキシエチルビニルエ−テル、スチレン−p−グリシ
ジルエ−テル等のグリシジルエ−テル類、p−グリシジ
ルスチレン等が挙げられるが、特に好ましいものとして
はメタクリル酸グリシジル、アリルグリシジルエ−テル
を挙げることができる。B: As a compound for introducing an epoxy group, glycidyls such as glycidyl acrylate and glycidyl methacrylate, monoglycidyl itaconic acid ester,
Butene tricarboxylic acid monoglycidyl ester, butene tricarboxylic acid diglycidyl ester, butene tricarboxylic acid triglycidyl ester, α-chloroacrylic acid glycidyl ester, maleic acid glycidyl ester,
Glycidyl esters such as glycidyl crotonic acid and glycidyl fumaric acid, or glycidyl ethers such as vinyl glycidyl ether, allyl glycidyl ether, glycidyl oxyethyl vinyl ether, and styrene-p-glycidyl ether Examples thereof include p-glycidyl styrene and the like, and particularly preferable examples include glycidyl methacrylate and allyl glycidyl ether.
【0026】c:ヒドロキシル基を導入する化合物とし
ては、1−ヒドロキシプロピル(メタ)アクリレート、
2−ヒドロキシプロピル(メタ)アクリレート、ヒドロ
キシエチル(メタ)アクリレート等が挙げられる。C: 1-hydroxypropyl (meth) acrylate as a compound for introducing a hydroxyl group,
2-hydroxypropyl (meth) acrylate, hydroxyethyl (meth) acrylate and the like can be mentioned.
【0027】d:アミノ基を導入する化合物としては、
アミノエチル(メタ)アクリレート、プロピルアミノエ
チル(メタ)アクリレート、ジメチルアミノエチル(メ
タ)アクリレート、ジエチルアミノエチル(メタ)アク
リレート、ジブチルアミノエチル(メタ)アクリレー
ト、アミノプロピル(メタ)アクリレート、フェニルア
ミノエチル(メタ)アクリレート、シクロヘキシルアミ
ノエチル(メタ)アクリレート等が挙げられる。D: As a compound for introducing an amino group,
Aminoethyl (meth) acrylate, propylaminoethyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, dibutylaminoethyl (meth) acrylate, aminopropyl (meth) acrylate, phenylaminoethyl (meth ) Acrylate, cyclohexylaminoethyl (meth) acrylate and the like.
【0028】e:アルケニル環状イミノエーテル基を導
入する化合物としては、以下の構造式(化1)で表され
る物である。ここでnは1〜3の整数であり、好ましく
は2および3、より好ましくは2である。またR1 、R
2 、R3 、RはそれぞれC1 〜C12の不活性なアルキル
基および/または水素を示し、アルキル基にはそれぞれ
不活性な置換基があってもよい。ここでいう不活性とは
グラフト反応やその生成物の機能に悪影響を及ぼさない
ことを意味する。またRはすべて同一である必要はな
い。好ましくは R1 =R2 =水素、R3 =水素あるい
はメチル基、R=水素すなわち、2−ビニルおよび/ま
たは2−イソプロペニル−2−オキサゾリン、2−ビニ
ルおよび/または2−イソプロペニル−5,6−ジヒド
ロ−4H−1,3−オキサジンである。これらは単独で
も混合物でもよい。この中でも特に2−ビニルおよび/
または2−イソプロペニル−2−オキサゾリンが好まし
い。E: The compound having an alkenyl cyclic iminoether group introduced is represented by the following structural formula (Formula 1). Here, n is an integer of 1 to 3, preferably 2 and 3, and more preferably 2. Also R 1 , R
2 , R 3 and R each represent a C1 to C12 inactive alkyl group and / or hydrogen, and the alkyl group may have an inactive substituent. The term "inert" as used herein means that the graft reaction and the function of the product are not adversely affected. Also, all R need not be the same. Preferably R 1 = R 2 = hydrogen, R 3 = hydrogen or methyl group, R = hydrogen ie 2-vinyl and / or 2-isopropenyl-2-oxazoline, 2-vinyl and / or 2-isopropenyl-5 , 6-dihydro-4H-1,3-oxazine. These may be used alone or as a mixture. Among these, especially 2-vinyl and /
Alternatively, 2-isopropenyl-2-oxazoline is preferable.
【0029】[0029]
【化1】 [Chemical 1]
【0030】f:シラン基を導入する化合物としては、
ビニルトリメトキシシラン、ビニルトリエトキシシラ
ン、ビニルトリアセチルシラン、ビニルトリクロロシラ
ン等が挙げられる。これらの官能基の内では無水マレイ
ン酸基を含有するものが最も好ましい。F: As a compound for introducing a silane group,
Examples thereof include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriacetylsilane, vinyltrichlorosilane and the like. Of these functional groups, those containing a maleic anhydride group are most preferred.
【0031】本発明における無機微小中空体含有樹脂組
成物に少なくとも1種の該官能基を導入する具体的な方
法としては、該官能基をポリオレフィン系樹脂にグラ
フトした変性ポリオレフィン系樹脂として導入する方
法、エチレンと該官能基含有化合物とのランダム共重
合体として導入する方法、ポリオレフィン系樹脂と該
官能基とを有機過酸化物等の存在下で押出機等で付加反
応させて導入する方法等が挙げられる。As a specific method for introducing at least one kind of the functional group into the resin composition containing an inorganic micro-hollow body in the present invention, a method of introducing the functional group as a modified polyolefin resin obtained by grafting the functional group on a polyolefin resin. , A method of introducing as a random copolymer of ethylene and the functional group-containing compound, a method of introducing a polyolefin resin and the functional group by addition reaction with an extruder or the like in the presence of an organic peroxide and the like. Can be mentioned.
【0032】上記ポリオレフィン系樹脂としては、ポリ
プロピレン系重合体または密度が0.94g/cm3 以
上のポリエチレン等の高結晶性ポリオレフィン系樹脂、
密度が0.86〜0.94g/cm3 未満の高圧ラジカ
ル重合法による低密度ポリエチレンまたはエチレン・α
ーオレフィン共重合体、エチレンービニルエステル共重
合体、エチレンーα,βー不飽和カルボン酸アルキルエ
ステル共重合体等のエチレン(共)重合体またはゴム等
が挙げられる。これらの内では、密度が0.86〜0.
94g/cm3 未満のエチレン・αーオレフィン共重合
体が好ましい。The polyolefin resin is a polypropylene polymer or a highly crystalline polyolefin resin such as polyethylene having a density of 0.94 g / cm 3 or more,
Low-density polyethylene or ethylene / α by high-pressure radical polymerization having a density of 0.86 to less than 0.94 g / cm 3.
Examples thereof include ethylene (co) polymers such as -olefin copolymers, ethylene-vinyl ester copolymers, ethylene-α, β-unsaturated carboxylic acid alkyl ester copolymers, and rubbers. Among these, the density is 0.86-0.
Ethylene / α-olefin copolymers of less than 94 g / cm 3 are preferred.
【0033】前記官能基を有する化合物の少なくとも1
種をポリオレフィン系樹脂またはゴムにグラフト変性す
る方法としては、例えば、ポリオレフィン系樹脂または
ゴムを適当な有機溶媒に溶解し反応させる溶液法、前記
各成分を溶融混練して反応させる溶融法等があるが、こ
れらの中では溶融法が好ましい。At least one of the compounds having the above functional group
Examples of the method for graft-modifying the seed to the polyolefin-based resin or rubber include a solution method in which the polyolefin-based resin or rubber is dissolved and reacted in an appropriate organic solvent, and a melting method in which the components are melt-kneaded and reacted. However, among these, the melting method is preferable.
【0034】また、上記ポリオレフィン系樹脂中の官能
基の含有量は、グラフト変性共重合体の場合においては
樹脂1g当り10-8〜10-5g当量、好ましくは10-7
〜10-6g当量の範囲であり、10-5g当量を超える濃
度の付加量を有するグラフト変性共重合体は製造するこ
とは難しい。また、ランダム共重合体の場合においては
樹脂1g当り10-6〜10-3g当量、好ましくは10-5
〜10-4g当量の範囲で選択される。10-3g当量を超
える濃度の付加量を有するランダム共重合体を製造する
ことは難しい。Further, the content of the functional group in the polyolefin resin is 10 -8 to 10 -5 g equivalent, preferably 10 -7 , per 1 g of the resin in the case of the graft modified copolymer.
It is difficult to produce a graft-modified copolymer having an addition amount in the range of 10 -6 g equivalent and a concentration exceeding 10 -5 g equivalent. Further, in the case of a random copolymer, it is 10 -6 to 10 -3 g equivalent per 1 g of resin, preferably 10 -5.
It is selected in the range of 10 -4 g equivalent. It is difficult to produce a random copolymer having an added amount of a concentration exceeding 10 −3 g equivalent.
【0035】本発明における無機微小中空体含有樹脂組
成物は、該官能基が全重合体1g当り10-3g当量以下
の範囲、好ましくは10-8〜10-3の範囲になるように
調製される。10-8〜10-3の範囲に調製された場合に
は、引張強度等の機械的強度、耐衝撃性等の改良効果が
著しい。本発明において、全重合体1g当り含有される
官能基の1g当量は、官能基を導入する化合物の1モル
を意味する。これら官能基を含有する変性ポリオレフィ
ン系樹脂またはエチレンと官能基含有化合物とのランダ
ム共重合体の中でも特に無水マレイン酸変性エチレン・
αーオレフィン共重合体が好ましく使用される。The resin composition containing an inorganic micro-hollow body in the present invention is prepared so that the functional group is in the range of 10 -3 g equivalent or less per 1 g of the whole polymer, preferably in the range of 10 -8 to 10 -3. To be done. When prepared in the range of 10 −8 to 10 −3, the effect of improving mechanical strength such as tensile strength and impact resistance is remarkable. In the present invention, 1 g equivalent of the functional group contained per 1 g of the whole polymer means 1 mol of the compound introducing the functional group. Among the modified polyolefin resins containing these functional groups or random copolymers of ethylene and functional group-containing compounds, maleic anhydride modified ethylene.
α-Olefin copolymers are preferably used.
【0036】本発明においては、(A)〜(C)成分お
よび特定の官能基を含有する組成物に対して、本発明の
特性を本質的に損なわない範囲において、無機充填剤お
よび難燃剤の少なくとも1種を配合して耐熱性、難燃性
等の特性を付与向上することができる。該無機充填剤と
しては、粉粒体、平板状、針状、球状または繊維状等が
挙げられ、具体的には、炭酸カルシウム、炭酸マグネシ
ウム、硫酸カルシウム、珪酸カルシウム、クレー、珪藻
土、タルク、アルミナ、珪砂、酸化鉄、金属粉、三酸化
アンチモン、炭化珪素、窒化珪素、シリカ、窒化ホウ
素、窒化アルミニウム、カーボンブラックなどの粉粒状
充填剤、マイカ、セリサイト、パイロフィライト、アル
ミフレークなどの箔状充填剤、カーボングラファイトな
どの平板状もしくは鱗片状充填剤、ガラス繊維、炭素繊
維、グラファィト繊維、ウィスカー、金属繊維、シリコ
ーンカーバイト繊維、アスベスト、ウォラストナイトな
どの鉱物繊維等の例を挙げることができる。In the present invention, with respect to the composition containing the components (A) to (C) and the specific functional group, an inorganic filler and a flame retardant are used as long as the characteristics of the present invention are not impaired. At least one kind can be blended to impart and improve properties such as heat resistance and flame retardancy. Examples of the inorganic filler include powders, flat plates, needles, spheres, fibers, and the like. Specific examples include calcium carbonate, magnesium carbonate, calcium sulfate, calcium silicate, clay, diatomaceous earth, talc, and alumina. Powder filler such as silica sand, iron oxide, metal powder, antimony trioxide, silicon carbide, silicon nitride, silica, boron nitride, aluminum nitride, carbon black, foil of mica, sericite, pyrophyllite, aluminum flake, etc. Fillers, flat or scaly fillers such as carbon graphite, glass fibers, carbon fibers, graphite fibers, whiskers, metal fibers, silicone carbide fibers, asbestos, mineral fibers such as wollastonite, etc. You can
【0037】該難燃剤としては、一般に効果のあるとさ
れる難燃剤を使用することができ、目的、用途によって
ハロゲン系難燃剤、リン系難燃剤、無機系難燃剤などの
群から少なくとも1種が選択される。例えば、ハロゲン
系難燃剤等の有機難燃剤は、少量の添加で優れた難燃性
を付与することができ、水酸化マグネシウム等の無機系
難燃剤においては、ハロゲンフリーの組成物を提供する
際に好ましく使用される。As the flame retardant, a generally effective flame retardant can be used, and at least one selected from the group consisting of halogen flame retardants, phosphorus flame retardants, inorganic flame retardants and the like depending on the purpose and application. Is selected. For example, an organic flame retardant such as a halogen-based flame retardant can impart excellent flame retardancy with a small amount of addition, and an inorganic flame-retardant such as magnesium hydroxide can be used when providing a halogen-free composition. It is preferably used for.
【0038】本発明において無機充填材を使用する場合
には、その表面をステアリン酸、オレイン酸等の脂肪酸
またはパラフィン、ワックス、有機シラン、有機チタネ
ート、エポキシ樹脂等で被覆するなどの表面処理を施す
のが好ましい。When the inorganic filler is used in the present invention, its surface is subjected to surface treatment such as coating with a fatty acid such as stearic acid or oleic acid or paraffin, wax, organic silane, organic titanate, epoxy resin or the like. Is preferred.
【0039】さらに、本発明においては(A)〜(C)
成分および特定の官能基を含有する組成物に対して、各
成分を混合溶融し、成形する際、必要に応じて帯電防止
剤、防曇剤、有機フィラー、酸化防止剤、滑剤、有機あ
るいはは無機系顔料、紫外線防止剤、分散剤、可塑剤、
核剤、発泡剤、架橋剤などの公知の添加剤を、本願発明
の特性を本質的に阻害しない範囲で添加することができ
る。Further, in the present invention, (A) to (C)
When a component containing a component and a specific functional group is mixed and melted and molded, an antistatic agent, an antifogging agent, an organic filler, an antioxidant, a lubricant, an organic or Inorganic pigments, UV inhibitors, dispersants, plasticizers,
Known additives such as a nucleating agent, a foaming agent, and a crosslinking agent can be added within a range that does not substantially impair the characteristics of the present invention.
【0040】本発明の組成物の調製は、従来の樹脂組成
物調製法として一般に用いられる公知の方法により容易
に調製される。例えば、上記(A)〜(C)成分からな
る組成物、または(A)〜(C)成分および特定の官能
基を含有する組成物、所望により難燃剤、添加剤をタン
ブラー、リボンブレンダーまたはヘンシェルタイプミキ
サー等の混合機を使用してドライブレンドした後、単軸
押出機、二軸押出機等の連続式溶融混練機により溶融混
合し、押出してペレットを調製することによって該樹脂
組成物を得ることができる。また、構成成分の一部をド
ライブレンドして単軸押出機、二軸押出機等に供給し、
構成成分の残部の内、ガラスバルーン等の溶融混合時に
破壊されやすい成分を該押出機の中間部からサイドフィ
ードすることにより供給するなどの方法によりペレット
を調製して該樹脂組成物を得ることができる。本発明に
おいては、これらの方法の内では、ガラスバルーンをサ
イドフィードにより供給する方法が好ましい。このよう
にして得られるペレットを、一般的に用いられる射出成
形法、押出成形法等によって本発明の利用分野である電
気電子部品、建築用資材、自動車部品等を成形すること
ができる。The composition of the present invention can be easily prepared by a known method which is generally used as a conventional resin composition preparation method. For example, a composition comprising the above components (A) to (C), or a composition containing the components (A) to (C) and a specific functional group, optionally a flame retardant, an additive in a tumbler, a ribbon blender or a Henschel. After dry blending using a mixer such as a type mixer, the resin composition is obtained by melt-mixing with a continuous melt-kneader such as a single-screw extruder or a twin-screw extruder and extruding to prepare pellets. be able to. In addition, a part of the components are dry blended and supplied to a single-screw extruder, a twin-screw extruder, etc.
Among the rest of the constituent components, pellets may be prepared by a method such as supplying a component such as a glass balloon that is easily broken during melt mixing by side-feeding from the intermediate portion of the extruder to obtain the resin composition. it can. In the present invention, of these methods, the method of supplying a glass balloon by side feed is preferable. The pellets thus obtained can be molded into electric and electronic parts, building materials, automobile parts and the like, which are the fields of application of the present invention, by a commonly used injection molding method, extrusion molding method or the like.
【0041】[0041]
【実施例】次に実施例により本発明をさらに詳しく説明
するが、本発明はこれらによって限定されるものではな
い。実施例および比較例において使用する(A)〜
(D)成分を以下に示す。 (A)成分: A1: ポリプロピレン [密度=0.905g/cm3 、MFR=8g/10min.、商品
名:日石ポリプロ J650G、日本石油化学(株)
製] A2: ポリエチレン [密度=0.948g/cm3 、MFR=7g/10min.、商品
名:日石スタフレン E870、日本石油化学(株)
製]The present invention will be described in more detail by way of examples, which should not be construed as limiting the invention. (A) Used in Examples and Comparative Examples
The component (D) is shown below. (A) component: A1: polypropylene [Density = 0.905 g / cm 3 , MFR = 8 g / 10 min., Product name: Nisseki Polypro J650G, Nippon Petrochemical Co., Ltd.
Made] A2: Polyethylene [Density = 0.948g / cm 3 , MFR = 7g / 10min., Product name: Nisseki Stafren E870, Nippon Petrochemical Co., Ltd.
Made]
【0042】(B)成分(エチレン共重合体またはゴ
ム): B1: VLDPE [密度=0.905g/cm3 、MFR=5g/10min.、Tm
=120℃n−ヘキサン不溶分=94Wt%、商品名:
日石ソフトレックス D9550、日本石油化学(株)
製] B2: エチレンープロピレン共重合体ゴム [プロピレン=27Wt%、MFR=0.7g/10min.、
商品名:EP07P 日石合成ゴム(株)製] B3: エチレンーアクリル酸エチル共重合体 [EA含有量=10Wt%、MFR=3g/10min.、商品
名:日石レクスロン A3100、日本石油化学(株)
製]Component (B) (ethylene copolymer or rubber): B1: VLDPE [Density = 0.905 g / cm 3 , MFR = 5 g / 10 min., Tm
= 120 ° C. n-hexane insoluble matter = 94 Wt%, trade name:
Nisseki Softlex D9550, Nippon Petrochemical Co., Ltd.
Made] B2: ethylene-propylene copolymer rubber [propylene = 27 Wt%, MFR = 0.7 g / 10 min.,
Trade name: EP07P manufactured by Nisseki Synthetic Rubber Co., Ltd.] B3: Ethylene-ethyl acrylate copolymer [EA content = 10 Wt%, MFR = 3 g / 10 min., Trade name: Nisseki Lexlon A3100, Nippon Petrochemical ( stock)
Made]
【0043】(C)成分(無機微小中空体): C1: ガラスバルーン [平均粒径=50μm、平均粒子密度=0.60 g/c
m3、耐圧強度=700kg/cm2、商品名:グラスバブルズ
S60/1000、住友スリーエム(株)製]Component (C) (inorganic micro hollow material): C1: glass balloon [average particle size = 50 μm, average particle density = 0.60 g / c
m 3 , pressure strength = 700 kg / cm 2 , product name: Glass Bubbles S60 / 1000, manufactured by Sumitomo 3M Ltd.]
【0044】(D)成分(官能基を含有するポリオレフ
ィン系樹脂): D1: 無水マレイン酸変性エチレン・αーオレフィン共重
合体 [密度=0.92g /cm3 、MFR=1.2 g/10min.
、商品名:日石Nポリマー L6200 日本石油化
学(株)製] D2: エチレンーグリシジルメタクリレート共重合体 [密度=0.928g /cm3 、MFR=3 g/10min. 、
商品名:日石レクスパール RA3050 日本石油化
学(株)製]Component (D) (polyolefin resin containing a functional group): D1: Maleic anhydride-modified ethylene / α-olefin copolymer [density = 0.92 g / cm 3 , MFR = 1.2 g / 10 min.
, Product name: Nisseki N Polymer L6200, manufactured by Nippon Petrochemical Co., Ltd.] D2: ethylene-glycidyl methacrylate copolymer [density = 0.928 g / cm 3 , MFR = 3 g / 10 min.,
Product name: Nisseki Lexpearl RA3050 manufactured by Nippon Petrochemical Co., Ltd.]
【0045】(ペレット調製装置および条件) ブレンダー:タンブラー 押出機 :[65mmФ同方向二軸押出機、スクリュ
ーL/D=30、サイドフィード供給部付] 押出温度 :230℃(シリンダー温度230℃、ダイ
温度210℃) ガラスバルーン:サイドフィーダーにより供給(Pellet preparation device and conditions) Blender: Tumbler Extruder: [65 mmφ, same direction twin-screw extruder, screw L / D = 30, with side feed supply section] Extrusion temperature: 230 ° C. (cylinder temperature 230 ° C., die Temperature 210 ℃) Glass balloon: Supplied by side feeder
【0046】(物性試験方法) 密度 : JIS K6758 準拠 MFR : 〃 〃 引張破壊強さ: 〃 〃 引張破壊伸び: 〃 〃 曲げ弾性率 : ASTM D790 〃アイソ゛ット 衝撃値:JIS K7110 〃(Physical property test method) Density: According to JIS K6758 MFR: 〃 〃 Tensile fracture strength: 〃 〃 Tensile fracture elongation: 〃 〃 Bending elastic modulus: ASTM D790 〃 Iso impact value: JIS K7110 〃
【0047】(実施例1〜5) (A)成分としてポリプロピレンを用いて表1に示した
組成物について試験を行った。試験結果を表1に示す。(Examples 1 to 5) The compositions shown in Table 1 were tested using polypropylene as the component (A). The test results are shown in Table 1.
【0048】(比較例1) (B)成分を用いなかった他は実施例1と同様に試験し
た。試験結果を表1に示す。アイゾット衝撃強さが著し
く劣る。Comparative Example 1 A test was conducted in the same manner as in Example 1 except that the component (B) was not used. The test results are shown in Table 1. Izod impact strength is extremely poor.
【0049】(比較例2) (B)成分を用いなかった他は実施例4と同様に試験し
た。試験結果を表1に示す。アイゾット衝撃強さが不十
分である。Comparative Example 2 The same test as in Example 4 was conducted except that the component (B) was not used. The test results are shown in Table 1. Izod impact strength is insufficient.
【0050】(比較例3) (A)成分が40重量%、(B)成分が60重量%と、
本発明の範囲を逸脱した他は実施例1と同様に試験し
た。試験結果を表1に示す。引張強さ、曲げ弾性率が著
しく劣る。(Comparative Example 3) The component (A) was 40% by weight and the component (B) was 60% by weight.
The same test as in Example 1 was carried out except that the scope of the present invention was exceeded. The test results are shown in Table 1. The tensile strength and flexural modulus are extremely poor.
【0051】(比較例4) (C)成分を用いなかった他は実施例1と同様に試験し
た。試験結果を表1に示す。引張強さ、曲げ弾性率が著
しく劣る他、軽量化の初期の目的も達成できなかった。Comparative Example 4 The same test as in Example 1 was carried out except that the component (C) was not used. The test results are shown in Table 1. The tensile strength and flexural modulus were remarkably poor, and the initial purpose of weight reduction could not be achieved.
【0052】[0052]
【表1】 [Table 1]
【0053】(実施例6) (A)成分として高密度ポリエチレンを用いて表2に示
した組成物について試験を行った。試験結果を表2に示
す。Example 6 The composition shown in Table 2 was tested using high density polyethylene as the component (A). The test results are shown in Table 2.
【0054】(比較例5) (B)成分を用いなかった他は実施例6と同様に試験し
た。試験結果を表2に示す。引張強さ、アイゾット衝撃
強さ等が劣っている。Comparative Example 5 A test was conducted in the same manner as in Example 6 except that the component (B) was not used. The test results are shown in Table 2. Poor tensile strength and Izod impact strength.
【0055】[0055]
【表2】 [Table 2]
【0056】[0056]
【発明の効果】本発明の無機微小中空体含有樹脂組成物
は、(A)ポリプロピレン系重合体および/または密度
が0.94 g/cm3以上のポリエチレンと、(B)特定の
エチレン(共)重合体またはゴムの特定組成から成る重
合体成分に、特定量の(C)無機微小中空体を配合した
組成物、または該組成物中に特定の官能基を特定量含有
した組成物であって、寸法安定性、成形加工性等を低下
させずに、成形品の軽量化を計ると共に、高剛性、耐熱
性、耐摩耗性等を付与した、耐衝撃性、特に低温下にお
ける耐衝撃性等にすぐれた組成物である。本発明の無機
微小中空体含有樹脂組成物は、電気電子部品、建築用資
材、自動車部品等に広く有効に利用できるので産業上の
利用価値が高い。Industrial Applicability The resin composition containing an inorganic micro hollow body of the present invention comprises (A) a polypropylene polymer and / or polyethylene having a density of 0.94 g / cm 3 or more, and (B) a specific ethylene ) A composition in which a specific amount of (C) the inorganic microhollow body is mixed with a polymer component having a specific composition of a polymer or rubber, or a composition containing a specific amount of a specific functional group in the composition. Therefore, the weight of molded products is reduced without deteriorating dimensional stability and molding processability, and high rigidity, heat resistance, wear resistance, etc. are added. Impact resistance, especially impact resistance at low temperature It is an excellent composition. INDUSTRIAL APPLICABILITY The resin composition containing an inorganic microhollow body of the present invention can be widely and effectively used for electric and electronic parts, building materials, automobile parts and the like, and thus has high industrial utility value.
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C08L 23/16 LCY Continuation of front page (51) Int.Cl. 5 Identification code Office reference number FI Technical display area C08L 23/16 LCY
Claims (2)
カル重合法による低密度ポリエチレンまたはエチレン・
αーオレフィン共重合体、(B2)エチレンービニルエス
テル共重合体、(B3)エチレンーα,βー不飽和カルボ
ン酸アルキルエステル共重合体、(B4)ゴム、 上記(A)+(B)100重量部と、 (C)無機微小中空体5〜100重量部を含む無機微小
中空体含有樹脂組成物。1. (A) Polypropylene polymer and / or polyethylene having a density of 0.94 g / cm 3 or more 50 to 98% by weight, (B) at least one selected from the following (B1) to (B4) 2-50% by weight of ethylene (co) polymer or rubber, and (B1) low-density polyethylene or ethylene by high-pressure radical polymerization with a density of 0.86 to less than 0.94 g / cm 3.
α-olefin copolymer, (B2) ethylene-vinyl ester copolymer, (B3) ethylene-α, β-unsaturated carboxylic acid alkyl ester copolymer, (B4) rubber, 100 parts by weight of (A) + (B) above And (C) 5 to 100 parts by weight of the inorganic microhollow body, an inorganic microhollow body-containing resin composition.
たは密度が0.94 g/cm3以上のポリエチレン (B)下記(B1)〜(B4)から選ばれた少なくとも1種
のエチレン(共)重合体またはゴム(B1)密度が0.8
6〜0.94 g/cm3未満の高圧ラジカル重合法による低
密度ポリエチレンまたはエチレン・αーオレフィン共重
合体、(B2)エチレンービニルエステル共重合体、(B
3)エチレンーα,βー不飽和カルボン酸アルキルエス
テル共重合体、(B4)ゴム、 上記(A)+(B)100重量部と、 (C)無機微小中空体5〜100重量部を含む組成物で
あって、(A)+(B)成分中の、(A)成分の含有量
が50〜98重量%、(B)成分の含有量が2〜50重
量%であり、かつ全重合体成分中に、下記a〜fから選
択された少なくとも1種の官能基を、全重合体1g当り
10-3g当量以下を含有していることを特徴とする無機
微小中空体含有樹脂組成物。 a:カルボン酸基または酸無水基 b:エポキシ基 c:ヒドロキシル基 d:アミノ基 e:アルケニル環状イミノエーテル基 f:シラン基2. A polypropylene-based polymer and / or a polyethylene having a density of 0.94 g / cm 3 or more. (B) At least one ethylene (co) selected from the following (B1) to (B4). Polymer or rubber (B1) density 0.8
Low density polyethylene or ethylene / α-olefin copolymer by high pressure radical polymerization of 6 to less than 0.94 g / cm 3 , (B2) ethylene-vinyl ester copolymer, (B
3) Ethylene-α, β-unsaturated carboxylic acid alkyl ester copolymer, (B4) rubber, (A) + (B) 100 parts by weight, and (C) inorganic microhollow body 5-100 parts by weight The content of the component (A) in the components (A) + (B) is 50 to 98% by weight, the content of the component (B) is 2 to 50% by weight, and the total polymer An inorganic microhollow body-containing resin composition, wherein the component contains at least one functional group selected from a to f below in an amount of 10 -3 g equivalent or less per 1 g of the total polymer. a: carboxylic acid group or acid anhydride group b: epoxy group c: hydroxyl group d: amino group e: alkenyl cyclic iminoether group f: silane group
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14974993A JPH06340782A (en) | 1993-05-31 | 1993-05-31 | Resin composition containing hollow inorganic microspheres |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14974993A JPH06340782A (en) | 1993-05-31 | 1993-05-31 | Resin composition containing hollow inorganic microspheres |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06340782A true JPH06340782A (en) | 1994-12-13 |
Family
ID=15481925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14974993A Pending JPH06340782A (en) | 1993-05-31 | 1993-05-31 | Resin composition containing hollow inorganic microspheres |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06340782A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0977927A (en) * | 1995-09-11 | 1997-03-25 | Sanbitsuku Kk | Molding resin composition |
WO1997049765A1 (en) * | 1996-06-24 | 1997-12-31 | Idemitsu Petrochemical Co., Ltd. | Propylene resin composition and automobile trim member |
WO2006041434A1 (en) * | 2004-09-21 | 2006-04-20 | Advanced Elastomer System, L.P. | Modification of thermolastic vulcanizates with particulate fillers |
JP2007517128A (en) * | 2003-12-30 | 2007-06-28 | スリーエム イノベイティブ プロパティズ カンパニー | Filling composite |
JP2011183877A (en) * | 2010-03-05 | 2011-09-22 | Bridgestone Corp | Tire |
JP2013166817A (en) * | 2012-02-14 | 2013-08-29 | Sumitomo Chemical Co Ltd | Glass particle hollow sphere powder-containing polypropylene resin composition and its injection-molded product |
KR20160104652A (en) * | 2013-12-30 | 2016-09-05 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Polyolefin composition including hollow glass microspheres and method of using the same |
JP2018030954A (en) * | 2016-08-25 | 2018-03-01 | パナソニックIpマネジメント株式会社 | Polyolefin resin composition, polyolefin resin molded body using the same, and cleaner using the same |
JP2020500113A (en) * | 2016-11-17 | 2020-01-09 | スリーエム イノベイティブ プロパティズ カンパニー | Composition comprising polymer and hollow ceramic microspheres, and method for producing three-dimensional article |
CN114672093A (en) * | 2022-03-30 | 2022-06-28 | 金发科技股份有限公司 | Resin material with low density and high sound insulation, and preparation method and application thereof |
-
1993
- 1993-05-31 JP JP14974993A patent/JPH06340782A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0977927A (en) * | 1995-09-11 | 1997-03-25 | Sanbitsuku Kk | Molding resin composition |
WO1997049765A1 (en) * | 1996-06-24 | 1997-12-31 | Idemitsu Petrochemical Co., Ltd. | Propylene resin composition and automobile trim member |
US6034165A (en) * | 1996-06-24 | 2000-03-07 | Idemitsu Petrochemical Co., Ltd. | Propylene resin composition and automobile trim member |
JP2007517128A (en) * | 2003-12-30 | 2007-06-28 | スリーエム イノベイティブ プロパティズ カンパニー | Filling composite |
WO2006041434A1 (en) * | 2004-09-21 | 2006-04-20 | Advanced Elastomer System, L.P. | Modification of thermolastic vulcanizates with particulate fillers |
JP2011183877A (en) * | 2010-03-05 | 2011-09-22 | Bridgestone Corp | Tire |
JP2013166817A (en) * | 2012-02-14 | 2013-08-29 | Sumitomo Chemical Co Ltd | Glass particle hollow sphere powder-containing polypropylene resin composition and its injection-molded product |
KR20160104652A (en) * | 2013-12-30 | 2016-09-05 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Polyolefin composition including hollow glass microspheres and method of using the same |
JP2017501283A (en) * | 2013-12-30 | 2017-01-12 | スリーエム イノベイティブ プロパティズ カンパニー | Polyolefin composition containing hollow glass microspheres and methods of use thereof |
US10385193B2 (en) | 2013-12-30 | 2019-08-20 | 3M Innovative Properties Company | Polyolefin composition including hollow glass microspheres and method of using the same |
JP2018030954A (en) * | 2016-08-25 | 2018-03-01 | パナソニックIpマネジメント株式会社 | Polyolefin resin composition, polyolefin resin molded body using the same, and cleaner using the same |
JP2020500113A (en) * | 2016-11-17 | 2020-01-09 | スリーエム イノベイティブ プロパティズ カンパニー | Composition comprising polymer and hollow ceramic microspheres, and method for producing three-dimensional article |
CN114672093A (en) * | 2022-03-30 | 2022-06-28 | 金发科技股份有限公司 | Resin material with low density and high sound insulation, and preparation method and application thereof |
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