JPH0632694Y2 - Cooling structure - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for cooling a heating element such as a CPU and a power IC.

[0002]

2. Description of the Related Art In recent years, a C built into a large computer
A heating element such as a PU and a power IC has been increased in speed and output, and the amount of generated heat tends to increase.

On the other hand, the overall size of the cooling structure for cooling the heating element is desired to be as small as possible due to the design of the housing, and the cooling performance for the heating element is desired to be high.

In the conventional cooling structure, as shown in FIG. 4, the fins 42 are machined by using a member 41 such as copper and aluminum having high heat conductivity to form a heat radiating portion 43 for heat radiation. Wide the surface area of the part 43,
A power IC 44 is attached to the heat dissipation portion 43. In the case of mass production, the fins 41 can be formed by using a die-casting technique after manufacturing a die.

By the way, the fin 4 having such a cooling structure.
When 2 is formed by machining or the like, there is a limit to the cutting technique, and the thickness d of the fin 42 cannot be 0.7 mm or less at present. Further, in the fin formation by the die-cast forming technique, the space between the fins 42 cannot be 2.0 mm or less when manufacturing the mold. Therefore, the power IC 44
In order for the cooling structure to cope with the increase in the amount of heat generation, it is necessary to enlarge the entire cooling structure.

[0006]

However, increasing the size of the cooling structure poses a problem in designing the housing of electronic equipment which tends to be miniaturized.

The present invention has been made to solve the above problems, and an object thereof is to provide a cooling structure which is small and has a high heat dissipation capability.

[0008]

In order to achieve the above-mentioned object, a cooling structure of the present invention is provided with a heat radiation column mounted on a heating element requiring cooling, and is inserted into the heat radiation column so as to maintain a predetermined interval. And radiating the heat radiation column in a direction orthogonal to its axis and fixing the heat radiation column by plastic deformation of the heat radiation column.

Further, the heat radiating plate of the above cooling structure has its edges bent in substantially parallel to the direction in which the cooling air is blown.

[0010]

According to this invention, after the radiation plate is inserted into the radiation column alone, the radiation column is fixed by axially pressing and expanding the radiation column to plastically deform the radiation column.

Therefore, by using a thin heat dissipation plate and further by narrowing the distance between the heat dissipation plates and stacking them on the heat dissipation column, the number of heat dissipation plates per unit height is increased and the heat dissipation efficiency is improved.

In addition, when cooling air is blown to the heat sink by bending the edges of the heat sink, the cooling air does not diffuse and it is possible to blow the cooling air to the entire heat sink. The cooling capacity for the body can be further improved.

As a result, the cooling capacity can be improved without enlarging the cooling structure itself.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing the structure of the cooling structure of this embodiment.

In the figure, reference numeral 1 is a columnar heat dissipation column. An aluminum material is used as the material of the heat dissipation column 1. The heat dissipation pillar 1 has a hole 2 in the center as a heat dissipation plate.
The ring-shaped fins 3 having are inserted and fixed, and the heat dissipation portion 4 is formed. The fin 3 has a collar 5 formed by drawing the hole 2 of the fin 3 so that the fin 3 can be stacked while maintaining a predetermined distance on the heat dissipation column 1. Further, the heat radiating section 4 is mounted on a heat generating element requiring cooling, for example, a power IC 6 or the like. The heat dissipation part 4 is
It is fixed by a male screw 7 provided on the power IC 6.

Next, the procedure for forming this cooling structure will be described.

As shown in FIG. 2 (a), first, a disc-shaped fin 3 having a hole 2 in the center is formed by using an aluminum plate (thickness: 0.5 mm) having good heat conductivity.
Further, by drawing, for example, a color 5 with a height of t = 1.0 mm
To form.

Next, as shown in FIG. 1B, the fins 3 are sequentially inserted from the holes 2 into the columnar heat radiation column 1 made of the same material, and the heat radiation column 1 is predetermined. Stack at intervals. At this time, since the holes 2 of the fins 3 and the heat radiation columns 1 are provided with a very small gap, the fins 3 can be smoothly inserted, and the collars 5 are stacked at regular intervals at the height t.

From this state, as shown in FIG.
The radiating pillar 1 is pressed in the axial direction by a press device (not shown), and the radiating pillar 1 is expanded in a direction orthogonal to the axial direction, and plastically deformed (upset) so that the expansion rate becomes approximately 5%.
Let At this time, the diameter of the hole 2 of the fin 3 is set so as to be in close contact with the heat dissipation column 1 according to the expansion coefficient of the heat dissipation column 1.

Then, the fins 3 are fixed in close contact with the heat dissipation columns 1. The reason why the expansion coefficient of the heat dissipation column 1 is set to about 5% is that it is convenient for the fin 3 to be closely fixed by plastically deforming the material aluminum while leaving elasticity.

In this cooling structure, since the thickness of the fins 3 and the space between the fins 3 are narrowed and the number of fins 3 stacked on the heat dissipation column 1 per unit height is increased, the same size as the conventional one (small size It is possible to increase the amount of heat radiation as it is.

As described above, according to this embodiment, since the fin 3 can be machined by itself, by using a thin plate material of, for example, 0.5 mm or less and drawing the collar 5 portion to a height of, for example, 1.0 mm or less. More fins 3 can be stacked on the heat dissipation column 1 than in the conventional case. Therefore, it is possible to release more heat than before without changing the size of the entire cooling structure (while keeping the size small).

The material of the heat dissipation plate used in this embodiment was an aluminum material, but a copper material or the like may be used as long as it has good thermal conductivity. Further, the outer shape of the heat dissipation plate may be rectangular or elliptical in addition to the disk shape of this embodiment, and the invention is not limited to the outer shape.

Next, an application example of this cooling structure will be described with reference to FIG.

When the amount of heat generated by the heating element further increases, it is necessary to blow cooling air from the outside to cool the heating element together with this cooling structure. In this case, the heat radiation column 1 at the central portion has ventilation resistance. Therefore, the cooling air is dispersed to the side of the heat radiating pillar 1, and the cooling air does not reach the fin portion at the rear of the heat radiating pillar 1. In this case, the cooling efficiency of the radiator plate by the cooling air is poor.

In order to improve this, it is conceivable to use a duct or the like that covers the entire cooling structure in a tunnel shape, but this is not a good method because the number of constituent parts increases.

Therefore, in the cooling structure of this application example, as shown in the figure, a rectangular fin 31 having a rectangular shape, for example, is used, and the edge of this fin 31, for example, is substantially parallel to the blowing direction of the cooling air. Then, the opposite side edges are bent upward or downward so that the cross-section thereof is substantially L-shaped to form the blower guide 32, and a plurality of fins 31 are laminated in the same manner as in the above embodiment, The fins 31 are fixed by pressurizing and thermally deforming the heat dissipation columns 1, and the fins 31 themselves have a function as a ventilation duct.

In this cooling structure, when the cooling air is blown from the front of the ventilation duct formed by the plurality of fins 31, the cooling air is dispersed laterally by the heat dissipation columns 1 in the fins 31, but it is dispersed. The cooling air is guided by the air blowing guide 32, is collected on the surface of the fin 31, and is sent from the heat dissipation column 1 to the fin portion at the rear portion.

According to the cooling structure of this application example, the heat dissipation column 1
A duct is newly added by using a technique of fixing the fins 31 by plastically deforming the heat dissipation column 1 after stacking the single fins 31 on the above, and a technique of improving the cooling efficiency by improving the shape of the fins 31 themselves. It is possible to adapt the cooling capacity to an increase in the amount of heat generated by the heating element without adding such parts.

As a result, it becomes possible to cope with a heating element which generates a large amount of heat with a small cooling structure.

Further, when this cooling structure is continuously provided, the blower guide 32 prevents the cooling air from diffusing, so that stable cooling air can be blown to the cooling structure on the leeward side.

[0033]

As described above, according to the cooling structure of the present invention, a single radiator plate is inserted into the radiator column and the radiator column is plastically deformed to fix the radiator plate. It is possible to increase the number of heat dissipation plates per unit height and improve heat dissipation performance. Further, by providing the heat dissipation plate of this cooling structure with its edge bent, the cooling efficiency of the heat dissipation plate can be improved.

As a result, the cooling capacity can be improved without enlarging the cooling structure itself.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of an embodiment according to the present invention.

2A, 2B, and 2C are cross-sectional views showing a procedure for forming a cooling structure of the present invention.

FIG. 3 is a perspective view showing an application example of the cooling structure according to the present invention.

FIG. 4 is a sectional view showing a conventional cooling structure.

[Explanation of symbols]

1 ... Heat dissipation column, 2 ... Hole, 3, 31 ... Fin, 4 ... Heat dissipation part,
5 ... Color, 6 ... Power IC.

Claims (2)

[Scope of utility model registration request] 1. A heat dissipation column mounted on a heating element requiring cooling, and a heat dissipation column which is inserted into the heat dissipation column so as to maintain a predetermined distance and expands the heat dissipation column in a direction orthogonal to the axis thereof. A cooling structure comprising: a heat dissipation plate fixed by plastic deformation of a column. 2. The cooling structure according to claim 1, wherein an edge portion of the heat radiating plate is bent substantially parallel to a direction in which the cooling air is blown.