JPH06326240A - Film applying method - Google Patents
Film applying methodInfo
- Publication number
- JPH06326240A JPH06326240A JP5114421A JP11442193A JPH06326240A JP H06326240 A JPH06326240 A JP H06326240A JP 5114421 A JP5114421 A JP 5114421A JP 11442193 A JP11442193 A JP 11442193A JP H06326240 A JPH06326240 A JP H06326240A
- Authority
- JP
- Japan
- Prior art keywords
- film
- lead frame
- adhesive
- sticking
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000000853 adhesive Substances 0.000 claims abstract description 39
- 230000001070 adhesive effect Effects 0.000 claims abstract description 38
- 238000003825 pressing Methods 0.000 claims abstract description 18
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 11
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 11
- 229920002614 Polyether block amide Polymers 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 4
- 150000003949 imides Chemical class 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 description 22
- 238000004080 punching Methods 0.000 description 19
- 238000010438 heat treatment Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】
【目的】高温で貼り付ける耐熱性熱可塑性接着剤を持つ
フィルムを高品質にリードフレームに貼り付けるフィル
ム貼り付け方法の提供。
【構成】金型で接着剤付きフィルムもしくは接着剤から
なるフィルムを所定の大きさに打ち抜き、当該フィルム
を前記金型の直下に設置されたリードフレームに前記金
型のパンチとヒータープレートとで挟んで貼り付ける方
法であって、前記ヒータープレートが弾性体により支持
され、該弾性体の押圧力を用いて前記リードフレームに
前記フィルムを貼り付けることを特徴とするリードフレ
ームへのフィルム貼り付け方法。
(57) [Summary] [Purpose] To provide a method of attaching a film having a heat-resistant thermoplastic adhesive which is attached at high temperature to a lead frame with high quality. [Structure] A film with an adhesive or a film made of an adhesive is punched out to a predetermined size by a mold, and the film is sandwiched between a punch of the mold and a heater plate in a lead frame installed directly under the mold. The method for attaching a film to a lead frame, wherein the heater plate is supported by an elastic body, and the film is attached to the lead frame by using the pressing force of the elastic body.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、リードフレームに特に
高品質にフィルムを貼り付けるフィルム貼り付け方法に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film sticking method for sticking a film to a lead frame with particularly high quality.
【０００２】[0002]
【従来の技術】集積回路の高密度実装技術の発展によ
り、チップ面積に対応する入出力ピン数が増加し、基板
上に搭載されるチップ数の減少と基板の小型化が図ら
れ、高密度の実装が実現されている。基板の実装方法に
は、従来のリード型、表面実装型、等が考えられる。チ
ップ面積に対応する入出力ピン数の増加と基板の実装を
考慮し、近年、各種高信頼性、高品質リードフレームの
開発が行われている。2. Description of the Related Art With the development of high-density packaging technology for integrated circuits, the number of input / output pins corresponding to the chip area is increased, the number of chips mounted on the board is reduced, and the board is downsized. Has been implemented. A conventional lead type, surface mount type, or the like can be considered as a method of mounting the substrate. In consideration of the increase in the number of input / output pins corresponding to the chip area and the mounting of the board, various types of high reliability and high quality lead frames have been developed in recent years.
【０００３】ＩＣあるいはＬＳＩを搭載するリードフレ
ームでは、従来からリード先端部の段差やシフトを防止
するため、フィルムを短冊上に打ち抜きまたは切断し、
リード先端部に貼り付けることが多く行われている。こ
のようなフィルムを貼り付ける方法として図４に示すよ
うな貼り付け装置を用いて、フィルム１を所定形状に切
断または打ち抜いてから、その直下に設置された被貼り
付け材２に貼り付ける方法がある。この装置において
は、一般に被貼り付け材２を加熱するための固定された
ヒータプレート３と、フィルム１を短冊状に打ち抜く打
ち抜きパンチ４または搬送治具とでフィルム１を被貼り
付け材２に押し付ける方法がよく用いられている。In a lead frame on which an IC or an LSI is mounted, a film is conventionally punched or cut on a strip in order to prevent a step or shift of the lead tip.
It is often attached to the tip of the lead. As a method of sticking such a film, a method of cutting or punching the film 1 into a predetermined shape using a sticking apparatus as shown in FIG. is there. In this apparatus, generally, a fixed heater plate 3 for heating the adherend 2 and a punching punch 4 for punching the film 1 into a strip or a transport jig press the film 1 against the adherend 2. The method is often used.
【０００４】前記したフィルム貼り付け方法において
は、フィルム貼付けに打ち抜きパンチ４が利用されるこ
とから、このパンチの力をそのまま作用させた場合に
は、貼り付け時の押圧は、少なくともフィルム１を所定
形状に打ち抜くのに必要な打ち抜き力以上となる。ここ
で、フィルム１を所定形状に打ち抜くのに必要な打ち抜
き力は、フィルム１の材質や厚さなどによって異なる
が、リードフレームにフィルム１を貼り付けるのに適正
な押圧力に比べ遙に大きい。In the film sticking method described above, the punching punch 4 is used for sticking the film. Therefore, when the force of the punch is applied as it is, at least the film 1 is pressed at the time of sticking. It exceeds the punching force required to punch into a shape. Here, the punching force required to punch the film 1 into a predetermined shape varies depending on the material and thickness of the film 1, but is much larger than the appropriate pressing force for sticking the film 1 on the lead frame.
【０００５】フィルム貼り付け時に、必要以上の押圧が
被貼り付け材に加えられた場合、フィルムに塗布されて
いる接着剤層が薄くなるばかりか、フィルム基材も圧縮
変形する。このような状態において、押圧を開放すると
フィルムの復元力によって接着面に微小な剥がれを生
じ、そのため充分な接着力が得られないという問題が発
生する。When a film is pasted with more pressure than necessary, the adhesive layer applied to the film is not only thinned, but also the film substrate is compressed and deformed. In such a state, when the pressure is released, the adhesive force causes minute peeling due to the restoring force of the film, which causes a problem that sufficient adhesive force cannot be obtained.
【０００６】[0006]
【発明が解決しようとする課題】ところで、上述の貼り
付け装置において、適正押圧を得るために、前記したフ
ィルム打ち抜きパンチ４の下死点の位置をスペーサ９等
により微調整（１０μｍ以下の調整）を行う必要がある
が、この調整が困難な上に、フィルム１、接着剤層およ
び被貼り付け材２の僅かな厚さのばらつきによっても押
圧が変動する問題が残る。By the way, in the above-mentioned pasting device, in order to obtain proper pressure, the position of the bottom dead center of the film punching punch 4 is finely adjusted by the spacer 9 or the like (adjustment of 10 μm or less). However, in addition to the difficulty of this adjustment, there remains a problem that the pressure varies due to slight variations in the thickness of the film 1, the adhesive layer, and the material to be adhered 2.
【０００７】特に、最近になって、ダイパッドの無いリ
ードフレームでリードの先端部にフィルムを貼り付け、
このフィルムの接着剤でＬＳＩチップを固着するＬＳＩ
パッケージが採用され、剥がれ等の無い高品質なフィル
ム貼り付けが要求されるようになっている。Particularly, recently, a lead frame without a die pad is used to attach a film to the tip of the lead.
LSI to fix LSI chip with adhesive of this film
Packaging has been adopted, and high quality film sticking without peeling has been demanded.
【０００８】これらの場合、前記接着剤もアクリル系等
の熱硬化型接着剤ではなく、耐熱性があり、また不純物
を含まないポリエーテルアミド等の熱可塑性接着剤を用
いる。これらの熱可塑性接着剤は熱硬化性接着剤に比べ
ると、貼り付け温度が著しく高くなるのが、一般的であ
り、そのためにヒーター取付部材の熱膨張の影響が大き
く、前記スペーサ５等での下死点調整で均一な貼り付け
状態を得ることは極めて難しくなっている。In these cases, the adhesive is not a thermosetting adhesive such as an acrylic adhesive, but a thermoplastic adhesive such as polyetheramide which has heat resistance and does not contain impurities. These thermoplastic adhesives generally have a significantly higher attachment temperature than thermosetting adhesives, and as a result, the thermal expansion of the heater mounting member has a large effect, so that the spacer 5 is It is extremely difficult to obtain a uniform attachment state by adjusting the bottom dead center.
【０００９】本発明の目的は、上記従来技術の問題点を
解消し、高温で貼り付ける耐熱性熱可塑性接着剤を持つ
フィルムを高品質にリードフレームに貼り付けるフィル
ム貼り付け方法を提供することにある。An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a film sticking method for sticking a film having a heat-resistant thermoplastic adhesive which is stuck at high temperature to a lead frame in high quality. is there.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成するため
に、本発明に従えば、金型で接着剤付きフィルムもしく
は接着剤からなるフィルムを所定の大きさに打ち抜き、
当該フィルムを前記金型の直下に設置されたリードフレ
ームに前記金型のパンチとヒータープレートとで挟んで
貼り付ける方法であって、前記ヒータープレートが弾性
体により支持され、該弾性体の押圧力を用いて前記リー
ドフレームに前記フィルムを貼り付けることを特徴とす
るリードフレームへのフィルム貼り付け方法が提供され
る。In order to achieve the above object, according to the present invention, a film with an adhesive or a film made of an adhesive is punched into a predetermined size by a die,
A method in which the film is attached to a lead frame installed directly below the mold by sandwiching it with a punch of the mold and a heater plate, wherein the heater plate is supported by an elastic body, and the pressing force of the elastic body is applied. There is provided a method for attaching a film to a lead frame, the method including attaching the film to the lead frame by using.
【００１１】ここで、前記接着剤は耐熱性熱可塑性接着
剤であることが好ましく、この耐熱性熱可塑性接着剤は
ポリエーテルアミドイミド、ポリエーテルアミド、ある
いはポリイミドであるのが好ましい。Here, the adhesive is preferably a heat-resistant thermoplastic adhesive, and the heat-resistant thermoplastic adhesive is preferably polyetheramideimide, polyetheramide, or polyimide.
【００１２】[0012]
【作用】本発明のフィルム貼り付け方法は、接着剤を有
するフィルムを打ち抜き金型のパンチとヒータプレート
とで挟んでリードフレームに貼り付ける際に、ヒーター
プレートを弾性体により支持し、この弾性体によってヒ
ータープレート上のリードフレームを前記フィルムに押
し付けて前記フィルムを前記リードフレームに貼り付け
ている。このため、リードフレームとフィルムとの間に
種々の変動が発生しても常に均一な押圧を簡単に得るこ
とができる。また、前記接着剤がポリエーテルアミドイ
ミド、ポリエーテルアミド、あるいはポリイミドなどの
高温貼り付けが必要な耐熱性熱可塑性接着剤である場
合、特に、ヒートプレート支持部材等の熱膨張による寸
法変動の影響を除去できるので有効となる。According to the film sticking method of the present invention, when the film having the adhesive is sandwiched between the punch of the punching die and the heater plate and stuck to the lead frame, the heater plate is supported by the elastic body, and this elastic body is used. The lead frame on the heater plate is pressed against the film by the so as to attach the film to the lead frame. Therefore, even if various fluctuations occur between the lead frame and the film, uniform pressing can always be easily obtained. Further, when the adhesive is a heat-resistant thermoplastic adhesive such as polyether amide imide, polyether amide, or polyimide that needs to be attached at high temperature, in particular, the influence of dimensional fluctuation due to thermal expansion of the heat plate support member or the like. Can be removed, which is effective.
【００１３】[0013]
【実施態様】以下に本発明に係るフィルム貼り付け方法
を添付の図面に示す好適実施例に基づいて詳細に説明す
る。図１に本発明のフィルム貼り付け方法を実施する貼
り付け装置の部分断面図を示し、該貼り付け装置のフィ
ルム貼り付け方法の工程をａ）、ｂ）、ｃ）に分けて説
明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The film sticking method according to the present invention will be described below in detail with reference to the preferred embodiments shown in the accompanying drawings. FIG. 1 shows a partial cross-sectional view of a sticking apparatus for carrying out the film sticking method of the present invention, and the steps of the film sticking method of the sticking apparatus will be described separately for a), b) and c).
【００１４】同図に示すフィルム貼り付け装置は、被貼
り付け材２の加熱を行うヒートプレート３とヒータ（図
示せず）と、フィルム１を短冊状に打抜く打ち抜きパン
チ４およびその移動機構４１と、ダイ（金型）５と、前
記ヒートプレート３を支持する弾性体、例えばエアシリ
ンダ６とで構成されるが、本発明のフィルム貼り付け方
法は、このフィルム貼り付け装置を用いて、被貼り付け
材２に適度な押圧力でフィルム１を押し付けることによ
り両者を貼り合わせる方法である。搬送機構４１を構成
するシリンダ４２の力でパンチ４と金型５とにより打ち
抜かれたフィルム１は、図示しない吸着手段によって、
前記シリンダ４２によって下降させられるパンチ４の先
端に付着されたまま、加熱機構を構成するヒートプレー
ト３上の所定位置に設置された被貼り付け材であるリー
ドフレーム２のフィルム１の貼り付け位置の直上に運ば
れる。The film sticking apparatus shown in FIG. 1 includes a heat plate 3 for heating the material to be stuck 2, a heater (not shown), a punching punch 4 for punching the film 1 into strips, and a moving mechanism 41 therefor. And a die (mold) 5 and an elastic body that supports the heat plate 3, for example, an air cylinder 6, and the film sticking method of the present invention uses the film sticking device to cut the In this method, the film 1 is pressed against the bonding material 2 with an appropriate pressing force to bond the both. The film 1 punched by the punch 4 and the die 5 by the force of the cylinder 42 that constitutes the transport mechanism 41 is
While being attached to the tip of the punch 4 which is lowered by the cylinder 42, the attachment position of the film 1 of the lead frame 2, which is the attachment target material, is placed at a predetermined position on the heat plate 3 that constitutes the heating mechanism. Carried directly above.
【００１５】図１ａ）は被貼り付け材であるリードフレ
ーム２が金型５の下部に搬送された状態である。このと
き、ヒートプレート３は、その支持体であるエアシリン
ダ６により下げられ、リードフレーム２と２〜５ｍｍ程
度隔てられている。このヒートプレート３とリードフレ
ーム２との間隙が加熱条件を緩和する。すなわち、リー
ドフレーム２が高い貼り付け温度に加熱される時間を最
小限にすることができ、リードフレーム２の加熱変形、
酸化等の悪影響を防止することができる。FIG. 1a) shows a state in which the lead frame 2 as the material to be adhered is conveyed to the lower part of the mold 5. At this time, the heat plate 3 is lowered by the air cylinder 6 that is a support thereof, and is separated from the lead frame 2 by about 2 to 5 mm. The gap between the heat plate 3 and the lead frame 2 relaxes the heating condition. That is, the time when the lead frame 2 is heated to a high attachment temperature can be minimized, and the lead frame 2 is deformed by heating.
It is possible to prevent adverse effects such as oxidation.
【００１６】図１ｂ）は、ヒートプレート３が上昇し、
リードフレーム２を加熱し始めた状態を示す。その直
後、パンチ４が下降し、フィルム１の打ち抜きが開始さ
れる。In FIG. 1b), the heat plate 3 is raised,
The state where the lead frame 2 has begun to be heated is shown. Immediately thereafter, the punch 4 descends and the punching of the film 1 is started.
【００１７】図１ｃ）は打ち抜き後、パンチ４がリード
フレーム２に接した位置で停止し、その後エアシリンダ
６によりヒートプレート３がフィルム１とリードフレー
ム２に押圧を加えている状態である。したがって、フィ
ルム１とリードフレーム２との貼り付け押圧は、エアシ
リンダ６により発生しており、金型パンチ４の力は貼り
付けには全く関与しない。こうして本発明のフィルム貼
り付け方法が達成される。FIG. 1c) shows a state in which, after punching, the punch 4 is stopped at a position in contact with the lead frame 2, and then the heat plate 3 is pressing the film 1 and the lead frame 2 by the air cylinder 6. Therefore, the pressing force for sticking the film 1 and the lead frame 2 is generated by the air cylinder 6, and the force of the die punch 4 does not participate in the sticking at all. Thus, the film sticking method of the present invention is achieved.
【００１８】本発明のフィルム貼り付け方法を実施する
フィルム貼り付け装置について具体的に説明する。ま
ず、リードフレーム２が連なった短冊状リードフレーム
がフィルム貼り付け装置２０に供給されると、フィルム
貼付け装置２０の位置決め機構によりリードフレーム２
を位置合わせして設置し、送られてきた接着剤付きのフ
ィルム１を各ピース毎に打抜機構により所定形状に打ち
抜いて所定位置に搬送し、加熱手段を備えた押し付け機
構により加熱されたリードフレーム２を打ち抜かれたフ
ィルム１に押し付けて、フィルム１のリードフレーム２
への貼り付けを行う。A film sticking apparatus for carrying out the film sticking method of the present invention will be specifically described. First, when a strip-shaped lead frame in which the lead frames 2 are connected is supplied to the film attaching apparatus 20, the lead frame 2 is moved by the positioning mechanism of the film attaching apparatus 20.
Are aligned and installed, and the sent film 1 with an adhesive is punched into a predetermined shape by a punching mechanism for each piece and conveyed to a predetermined position, and a lead heated by a pressing mechanism equipped with a heating means. By pressing the frame 2 against the punched film 1, the lead frame 2 of the film 1 is pressed.
Paste to.
【００１９】図面に示すフィルム貼付け装置２０はフィ
ルム送り込み機構と（図示せず）と、フィルム１を所定
形状に打ち抜く打抜機構と、打ち抜かれたフィルム１を
被貼り付け材であるリードフレーム２近傍まで搬送する
搬送機構と、リードフレーム２を所定位置に設置する位
置決め機構（図示せず）と、リードフレーム２を加熱す
るヒートプレートと、搬送されたフィルムに加熱された
リードフレーム２を押し付ける押し付け機構とを有す
る。A film sticking device 20 shown in the drawings has a film feeding mechanism (not shown), a punching mechanism for punching the film 1 into a predetermined shape, and a lead frame 2 which is a material to be pasted with the punched film 1. Transporting mechanism that transports the lead frame 2 to a predetermined position, a positioning mechanism (not shown) that sets the lead frame 2 at a predetermined position, a heat plate that heats the lead frame 2, and a pressing mechanism that presses the heated lead frame 2 against the transported film. Have and.
【００２０】接着剤付きのフィルム１は、耐熱性熱可塑
性接着剤、例えば、ポリエーテルアミドイミド、ポリエ
ーテルアミド、またはポリイミドなどを塗布したフィル
ムである。The adhesive-attached film 1 is a film coated with a heat-resistant thermoplastic adhesive such as polyether amide imide, polyether amide, or polyimide.
【００２１】フィルム１の送り込み機構は、図示しない
が、リール、フィルム送りローラおよびステッピングモ
ータなどから構成される。前記リールに巻回された前記
接着剤を有する接着剤付きフィルム、例えば、幅１６．
５ｍｍのポリイミドフィルム１を打抜機構を構成する金
型５の上面に送り込む。送り込む長さは、前記ステッピ
ングモータで駆動されるフィルム送りローラにより、一
定寸法にコントロールされる。打抜機構は、図示例で
は、打抜き金型５、この金型５に嵌合してフィルム１を
打ち抜くパンチ４、パンチ４を駆動するシリンダ４２な
どからなる。Although not shown, the feeding mechanism of the film 1 is composed of a reel, a film feeding roller, a stepping motor and the like. A film with an adhesive having the adhesive wound around the reel, for example, width 16.
The 5 mm polyimide film 1 is fed into the upper surface of the die 5 that constitutes the punching mechanism. The feeding length is controlled to a fixed size by the film feeding roller driven by the stepping motor. In the illustrated example, the punching mechanism includes a punching die 5, a punch 4 that is fitted into the die 5 to punch the film 1, a cylinder 42 that drives the punch 4, and the like.
【００２２】打抜機構のシリンダ４２の力でパンチ４と
金型５とにより打ち抜かれたフィルム１は、搬送機構４
１をも構成するシリンダ４２によって下降させられるパ
ンチ４の先端に吸着手段により付着されたまま、ヒート
プレート３上の所定位置に設置されたリードフレーム２
のフィルム貼り付け位置の直上に運ばれる。The film 1 punched by the punch 4 and the die 5 by the force of the cylinder 42 of the punching mechanism is transferred to the transport mechanism 4
The lead frame 2 installed at a predetermined position on the heat plate 3 while being attached to the tip of the punch 4 lowered by the cylinder 42 that also constitutes 1 by the suction means.
It is carried directly above the film sticking position.
【００２３】パンチ４には、フィルム吸着手段として例
えば図示しない真空吸引孔が設けられている。まず、打
ち抜かれたフィルム１片は吸引孔で吸引され、パンチ４
の先端面に付着した状態でリードフレーム２の直上まで
運ばれ、その後、後述する押し付け機構によって、前記
パンチ４の先端面に付着している前記フィルム１に加熱
されたリードフレーム２が押し付けられて貼り付けられ
る。The punch 4 is provided with, for example, a vacuum suction hole (not shown) as a film suction means. First, the punched film piece is sucked by the suction hole,
The lead frame 2 is conveyed to a position directly above the lead frame 2 in a state of being attached to the front end surface of the punch 4, and then the heated lead frame 2 is pressed against the film 1 attached to the front end surface of the punch 4 by a pressing mechanism described later. It can be pasted.
【００２４】リードフレーム２は、そのスプロケットホ
ールなどを、ヒートプレート３上に設けられている位置
決め機構により、ヒートプレート３上にクリアランスを
持った状態で設置される。The lead frame 2 is installed with a sprocket hole or the like on the heat plate 3 with a clearance by a positioning mechanism provided on the heat plate 3.
【００２５】次に、リードフレーム２は、そのスプロケ
ットホールなどと金型５に設けられている、位置決め機
構を構成する位置決めピン（図示せず）とを貼り付け直
前に、パンチ４の下降とともに合わせることにより、金
型５、特に、金型５に嵌合しているパンチ４と高精度に
位置合わせされる。Next, in the lead frame 2, the sprocket hole and the like are aligned with the positioning pins (not shown) provided in the die 5 and constituting the positioning mechanism as the punch 4 descends immediately before the attachment. As a result, the mold 5 and the punch 4 fitted in the mold 5 are aligned with high precision.
【００２６】前記加熱機構は、ヒートプレート３とこれ
を加熱するヒーターブロック（図示せず）で構成され
る。前記ヒートプレート３とヒーターブロックは断熱板
（図示せず）を介してヒータ取付板８に取り付けられ、
このヒータ取付板８にはスライダ（図示せず）が取り付
けられ、上下方向に移動可能な構造となっている。ま
た、前記ヒートプレート３はその下部のエアシリンダ６
によって下方より支持されている。前記エアシリンダ６
は図示しない制御機構により上下に移動可能に構成され
ている。The heating mechanism comprises a heat plate 3 and a heater block (not shown) for heating the heat plate 3. The heat plate 3 and the heater block are mounted on the heater mounting plate 8 via a heat insulating plate (not shown),
A slider (not shown) is attached to the heater attachment plate 8 so that the heater attachment plate 8 is vertically movable. In addition, the heat plate 3 has an air cylinder 6 below it.
Supported from below. The air cylinder 6
Is configured to be movable up and down by a control mechanism (not shown).
【００２７】前記エアシリンダ６は、その上部に取り付
けられているヒートプレート３を位置合わせされたリー
ドフレーム２に押し付けて、加熱するとともに、加熱さ
れたリードフレーム２をパンチ４の先端のフィルム１に
適正な貼り付け圧で押し付ける押し付け機構として機能
するが、被貼り付け材の僅かな厚さのばらつきによる変
動に応じて、任意の押圧を発生させる機構となってい
る。従って、フィルム基材、接着剤、リードフレーム２
の厚さの変動、あるいはヒートプレート３の支持部材等
の熱膨張による寸法変動などが生じても、これらに起因
する押圧力の変動をエアシリンダ６の押圧力の調整で除
去できるので、常に均一な押圧力でフィルム１とリード
フレーム２を貼り合わせることができる。また、上下移
動が可能なため、ヒートプレート３の位置を調整できる
ため、リードフレーム２に不要な長時間の加熱時間を軽
減することができる。The air cylinder 6 is heated by pressing the heat plate 3 attached to the upper part thereof onto the aligned lead frame 2 and heating the heated lead frame 2 to the film 1 at the tip of the punch 4. Although it functions as a pressing mechanism that presses with an appropriate bonding pressure, it is a mechanism that generates an arbitrary pressing force in response to fluctuations due to slight variations in the thickness of the material to be bonded. Therefore, the film substrate, the adhesive, the lead frame 2
Even if the thickness of the heat plate 3 changes or the dimension of the support member of the heat plate 3 changes due to thermal expansion, the change in the pressing force caused by these changes can be removed by adjusting the pressing force of the air cylinder 6, so that it is always uniform. The film 1 and the lead frame 2 can be attached to each other with a sufficient pressing force. Further, since it is possible to move up and down, the position of the heat plate 3 can be adjusted, so that it is possible to reduce a long heating time which is unnecessary for the lead frame 2.
【００２８】本発明に用いられる、ヒートプレート３を
支持する弾性体をエアシリンダ６で構成したが、本発明
はエアシリンダ６に限定されるわけではなく、他の弾性
体や流体圧部材で構成しても良い。本実施例では、接着
剤として耐熱性熱可塑性接着剤を用いたが、本発明はこ
れに限定されず、熱硬化型接着剤を用いて貼り付け工程
を行ってもよい。Although the elastic body for supporting the heat plate 3 used in the present invention is constituted by the air cylinder 6, the present invention is not limited to the air cylinder 6, and is constituted by another elastic body or a fluid pressure member. You may. In this embodiment, the heat-resistant thermoplastic adhesive is used as the adhesive, but the present invention is not limited to this, and the thermosetting adhesive may be used in the attaching step.
【００２９】図２および図３は、本発明のフィルム貼り
付け方法を用いて、フィルム１を貼り付けたリードフレ
ーム２を示す。図２は、４０ピンのＤＩＰ（デュアル
インライン パッケージ：Ｄｕａｌ Ｉｎｌｉｎｅ Ｐ
ａｃｋａｇｅ）用のリードフレームであり、図３は４０
ピンのＳＯＪ（スモール アウトライン Ｊ−ベンドパ
ッケージ：Ｓｍａｌｌ Ｏｕｔｌｉｎｅ Ｊ−ｂｅｎｄ
Ｐａｃｋａｇｅ）である。2 and 3 show a lead frame 2 to which a film 1 is attached by using the film attaching method of the present invention. Figure 2 shows a 40-pin DIP (dual
In-line package: Dual Inline P
lead frame for the package), FIG.
Pin SOJ (Small Outline J-bend package: Small Outline J-bend)
Package).
【００３０】また、図２は０．１５ｍｍ厚さの４２Ｎｉ
−Ｆｅ合金リードフレーム２のインナーリード固定用の
フィルム貼り付けに本発明の方法を適用した例である。
用いた接着剤は、ポリイミドフィルム厚さ５０μｍの片
側に約２０μｍの厚さでコートされているアクリル系の
熱硬化型接着剤である。貼り付け温度は、１７０℃であ
ったが、高速に均一な貼り付けが達成されていた。Further, FIG. 2 shows that the thickness of 42 Ni is 0.15 mm.
This is an example in which the method of the present invention is applied to the sticking of the film for fixing the inner lead of the —Fe alloy lead frame 2.
The adhesive used was an acrylic thermosetting adhesive with a polyimide film thickness of 50 μm coated on one side with a thickness of about 20 μm. The sticking temperature was 170 ° C., but uniform sticking was achieved at high speed.
【００３１】図３はダイパッドが無くフィルム１の接着
剤でＬＳＩチップを固定するリードオンチップ（ＬＯ
Ｃ）構造用のリードフレーム２に適用した例である。リ
ードフレーム２は厚さ０．２５ｍｍの４２Ｎｉ−Ｆｅ合
金製である。接着剤には、ポリエーテルアミドイミドを
使用し、厚さ５０μｍのポリイミドフィルムの両側にそ
れぞれ２０μｍの厚さでコートされている。貼り付け温
度は３４０℃と高温であるが、熱膨張による各部材の変
形の影響も無く安定した高品質な貼り付けが可能となっ
た。FIG. 3 shows a lead-on-chip (LO) which does not have a die pad and which is fixed to the LSI chip by the adhesive agent of the film 1.
C) This is an example applied to the structural lead frame 2. The lead frame 2 is made of 42Ni—Fe alloy having a thickness of 0.25 mm. Polyetheramide imide is used as the adhesive, and a polyimide film having a thickness of 50 μm is coated on both sides with a thickness of 20 μm. Although the attachment temperature is as high as 340 ° C., stable and high-quality attachment is possible without the influence of deformation of each member due to thermal expansion.
【００３２】[0032]
【発明の効果】本発明の方法によれば、フィルム貼り付
け押圧が任意の値に設定でき、最適な押圧が簡易に得ら
れるとともに、種々の接着剤に対しても対応が容易とな
り、フィルム基材、接着剤、リードフレームの加工精度
等に起因する寸法のばらつき、特に厚さの変動、あるい
はヒートプレート支持部材等々の熱膨張による寸法変動
等が生じても、これらに対し、安定したフィルム貼り付
けが可能となり、貼り付け不良を無くすあるいは軽減す
ることができる。従って、本発明法によれば、高い信頼
性の得られるフィルム貼り付けが可能となる。According to the method of the present invention, the film sticking pressure can be set to an arbitrary value, an optimum pressure can be easily obtained, and various adhesives can be easily dealt with. Even if there are dimensional variations due to the processing accuracy of materials, adhesives, lead frames, etc., especially variations in thickness, or dimensional variations due to thermal expansion of heat plate support members, etc., stable film attachment against these It is possible to attach and it is possible to eliminate or reduce the attachment failure. Therefore, according to the method of the present invention, it is possible to attach a film with high reliability.
【図１】 （ａ）、（ｂ）および（ｃ）は、本発明に係
るフィルム貼り付け方法の各工程を説明するフィルム貼
り付け装置の構成図である。FIG. 1A, FIG. 1B and FIG. 1C are configuration diagrams of a film sticking apparatus for explaining each step of the film sticking method according to the present invention.
【図２】 本発明に係るフィルム貼り付け方法を実施し
たリードフレームの一形状例を示す平面図である。FIG. 2 is a plan view showing an example of the shape of a lead frame that has been subjected to the film bonding method according to the present invention.
【図３】 本発明に係るフィルム貼り付け方法を実施し
たリードフレームの他の形状例を示す平面図である。FIG. 3 is a plan view showing another example of the shape of a lead frame which has been subjected to the film bonding method according to the present invention.
【図４】 従来のフィルム貼り付け方法を示すフィルム
貼り付け装置の構成図である。FIG. 4 is a configuration diagram of a film sticking apparatus showing a conventional film sticking method.
１ フィルム ２ リードフレーム ３ ヒートプレート ４ パンチ ４１ 移動機構 ４２ シリンダ ５ 金型（ダイ） ６ エアシリンダ ８ ヒータ取付板 ９ スペーサ ２０ フィルム貼り付け装置 1 Film 2 Lead Frame 3 Heat Plate 4 Punch 41 Moving Mechanism 42 Cylinder 5 Mold (Die) 6 Air Cylinder 8 Heater Mounting Plate 9 Spacer 20 Film Sticking Device
───────────────────────────────────────────────────── フロントページの続き (72)発明者 高 坂 博 之 茨城県日立市助川町３丁目１番１号 日立 電線株式会社電線工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroyuki Takazaka 3-1-1 Sukegawa-cho, Hitachi-shi, Ibaraki Hitachi Cable Co., Ltd.
Claims (3)
からなるフィルムを所定の大きさに打ち抜き、当該フィ
ルムを前記金型の直下に設置されたリードフレームに前
記金型のパンチとヒータープレートとで挟んで貼り付け
る方法であって、前記ヒータープレートが弾性体により
支持され、該弾性体の押圧力を用いて前記リードフレー
ムに前記フィルムを貼り付けることを特徴とするリード
フレームへのフィルム貼り付け方法。1. A die with a film having an adhesive or a film made of an adhesive is punched to a predetermined size by a die, and the film is punched and a heater plate on a lead frame installed directly under the die. A method of sticking a film to a lead frame, wherein the heater plate is supported by an elastic body, and the pressing force of the elastic body is used to stick the film to the lead frame. Method.
る請求項１に記載のフィルム貼り付け方法。2. The film sticking method according to claim 1, wherein the adhesive is a heat resistant thermoplastic adhesive.
ルアミドイミド、ポリエーテルアミド、あるいはポリイ
ミドである請求項２に記載のフィルム貼り付け方法。3. The film sticking method according to claim 2, wherein the heat-resistant thermoplastic adhesive is polyether amide imide, polyether amide, or polyimide.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5114421A JP2720753B2 (en) | 1993-05-17 | 1993-05-17 | Film pasting method |
| GB9409535A GB2277894B (en) | 1993-05-14 | 1994-05-12 | Method and apparatus for sticking an insulating film to a lead frame |
| SG1996007580A SG48170A1 (en) | 1993-05-14 | 1994-05-12 | Method and apparatus for sticking an insulating film to a lead frame |
| MYPI94001203A MY118422A (en) | 1993-05-14 | 1994-05-13 | Method and apparatus for sticking an insulating film to a lead frame. |
| KR1019940010448A KR100187580B1 (en) | 1993-05-14 | 1994-05-13 | Method for sticking an insulating film to a lead frame |
| US08/242,544 US5635009A (en) | 1993-05-14 | 1994-05-13 | Method for sticking an insulating film to a lead frame |
| US09/326,898 USRE37323E1 (en) | 1993-05-14 | 1999-06-03 | Method for sticking an insulating film to a lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5114421A JP2720753B2 (en) | 1993-05-17 | 1993-05-17 | Film pasting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06326240A true JPH06326240A (en) | 1994-11-25 |
| JP2720753B2 JP2720753B2 (en) | 1998-03-04 |
Family
ID=14637294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5114421A Expired - Lifetime JP2720753B2 (en) | 1993-05-14 | 1993-05-17 | Film pasting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2720753B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6717242B2 (en) | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US6825249B1 (en) | 1994-12-26 | 2004-11-30 | Hitachi Chemical Co., Ltd. | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device |
| US6855579B2 (en) | 1995-07-06 | 2005-02-15 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US20160351533A1 (en) * | 2015-05-29 | 2016-12-01 | Infineon Technologies Ag | Method for Producing an Integral Join and Automatic Placement Machine |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038825A (en) * | 1983-08-11 | 1985-02-28 | Sumitomo Metal Mining Co Ltd | Tape adhering device |
| JPH03228A (en) * | 1989-05-29 | 1991-01-07 | Hitachi Cable Ltd | film pasting device |
| JPH031564A (en) * | 1989-05-29 | 1991-01-08 | Hitachi Cable Ltd | Method for adhering film to lead frame |
-
1993
- 1993-05-17 JP JP5114421A patent/JP2720753B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038825A (en) * | 1983-08-11 | 1985-02-28 | Sumitomo Metal Mining Co Ltd | Tape adhering device |
| JPH03228A (en) * | 1989-05-29 | 1991-01-07 | Hitachi Cable Ltd | film pasting device |
| JPH031564A (en) * | 1989-05-29 | 1991-01-08 | Hitachi Cable Ltd | Method for adhering film to lead frame |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6825249B1 (en) | 1994-12-26 | 2004-11-30 | Hitachi Chemical Co., Ltd. | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device |
| US6717242B2 (en) | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US6855579B2 (en) | 1995-07-06 | 2005-02-15 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US7012320B2 (en) | 1995-07-06 | 2006-03-14 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US7057265B2 (en) | 1995-07-06 | 2006-06-06 | Hitachi Chemical Co., Ltd. | Semiconductor device and process for fabrication thereof |
| US7078094B2 (en) | 1995-07-06 | 2006-07-18 | Hitachi Chemical Co., Ltd. | Semiconductor device and process for fabrication thereof |
| US7387914B2 (en) | 1995-07-06 | 2008-06-17 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US20160351533A1 (en) * | 2015-05-29 | 2016-12-01 | Infineon Technologies Ag | Method for Producing an Integral Join and Automatic Placement Machine |
| US11081464B2 (en) * | 2015-05-29 | 2021-08-03 | Infineon Technologies Ag | Method for producing an integral join and automatic placement machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2720753B2 (en) | 1998-03-04 |
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