JPH0632090A - Ic card - Google Patents

Abstract

PURPOSE:To improve a manufacturing accuracy by preventing deformation of a card body due to heating without impairing operability at the time of adhering the body to a board for supporting an IC chip and to improve durability of the card by increasing an adhesive strength. CONSTITUTION:A coating sheet 21 made of the same vinyl chloride ((CH2CHCl) X) as that of a card body 11 is provided at a collar 16a of a board, heated to be melted, adhered to the body 11 in a short time thereby to adhere an IC module to the body 11. Thus, an adhesive strength is increased without deformation of the body 11 due to heating.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card having an improved adhesive material for mounting the IC module on the card body.

[0002]

2. Description of the Related Art In the case of IC cards, the I
When mounting an IC module with a C chip,
Conventionally, a hot melt type adhesive sheet is used for 100 to 1
It is attached by heating and pressing at a temperature of 20 ° C for about 15 seconds, or by using a liquid adhesive and waiting for it to solidify by drying, so that the
Adhesion was performed between the main body and the IC chip via an adhesive.

[0003]

[Problems to be Solved by the Invention] Conventional IC card IC
The module has been adhered to the card body using various adhesives.

For this reason, in the case of using a hot-melt type adhesive sheet, it is necessary to heat and pressure bond for a certain period of time, so that the card body made of vinyl chloride resin or the like may be deformed by heat. Moreover, even if the heating time or the pressure is still insufficient, there is a problem that the adhesive strength is insufficient and peeling occurs due to aging, which makes it unusable.

On the other hand, when the liquid adhesive is used, the heating operation is not necessary, but the liquid adhesive is liable to bleed around the bonded portion at the time of manufacturing, and the bleeding may cause defective products. While it is inferior in workability and manufacturing accuracy, it also has a problem that it takes time until the liquid adhesive dries and cures, which makes it unsuitable for mass production.

Therefore, the present invention solves the above problems by preventing deformation of the card main body due to heating when the IC module is bonded to the card main body, and further reduces operability and manufacturing accuracy. It is an object of the present invention to provide an IC card having high durability and eventually reliability by preventing peeling after adhesion without causing damage.

[0007]

In order to solve the above problems, the present invention provides a card body, a recess formed in the card body, an IC component embedded in the recess, and I
Bonding of external terminals electrically connected to the C component, a substrate supporting the IC component and the external terminal, and a material which can be melt-bonded to the card body material by heating and the recess of the substrate. A melting means for melting and adhering to the surface is provided.

In order to solve the above problems, the present invention provides
In "Claim 1", the card body and the melting means are vinyl chloride.

In order to solve the above problems, the present invention provides
A card body, a recess formed in the card body, an IC component embedded in the recess, an external terminal electrically connected to the IC component, the IC component and the external terminal And a substrate made of a material which can be melt-bonded by heating to the card body material and which is melt-bonded to the recess.

[0010]

The present invention is constructed as described above, and by heating and melting and melting and adhering the melting means or the substrate to the card body, thermal deformation does not occur in the card body, so that the manufacturing accuracy is high. The IC module is securely fixed to the card body without impairing workability, and its durability and eventually reliability are improved.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS.

In the figure, 11 is an IC card, and the vinyl chloride resin ((CH ₂ CHCL) _X ) of this IC card 11 is shown.
The card body 12 made of is formed with a recessed portion 13 having a two-step depth of an IC chip housing portion 13a and an adhesive portion 13b which is the periphery of the recessed portion. The IC module 14 is fixed in the recess 13.

The IC module 14 has a substrate 16 made of a material in which glass fibers are hardened with BT resin, which is an epoxy resin, so as to have heat resistance, and an LSI, etc. which is an IC component attached to the back surface of the substrate 16. IC chip 1
7 and a contact pattern 18, which is an external terminal provided on the surface of the substrate 16 and electrically connected to the IC chip 17, and further includes the IC chip 17 and the IC chip 17.
The wiring connecting the contact pattern 18 and the contact pattern 18 is sealed with a mold resin 20.

Further, a coating sheet 21 made of vinyl chloride ((CH ₂ CHCL) _X ) which is a fusion means is coated on the outer peripheral edge 16 a of the substrate 16 with an adhesive 22. There is.

The coating sheet 21 is attached to the adhesive 2
The substrate 1 is used during the heat treatment for coating with 2.
Since 6 has heat resistance and is not deformed by heat, sufficient temperature, pressure and time can be applied, and a sufficient adhesive force can be obtained.

At the time of fixing the IC module 14 to the recess 13, the IC chip 17 is inserted into the chip storage portion 13a of the recess 13 and the coating sheet of the IC module 14 is attached to the adhesion portion 13b of the recess 13. 21 is polymerized, and about 140 by the heating head 23 from the IC module 14 side.
Heat at a temperature of [° C.] for about 3 [seconds]. This will
The melting sheet 21 is melted and melt-bonded to the recess bonding portion 13b, and the IC module 14 is fixed to the card body 11.

With this configuration, the IC module 1
4 is attached to the card body 11, the heating time is significantly shortened compared to the conventional one, which is suitable for mass production, and the card body 11 is not deformed by heating. Can be prevented and manufacturing accuracy is improved. Moreover, the workability during manufacturing is not impaired, and the adhesive strength deteriorates due to aging like an adhesive, and IC module
It is excellent in durability and reliability is improved without causing peeling of the resin.

It should be noted that the present invention is not limited to the above-mentioned one embodiment, and modifications can be made without departing from the spirit of the invention, and the material thereof is not limited, and for example, it is attached to a substrate. The melting means may not be the same as the material of the card body as long as it can be melt-bonded by heating, but if it is the same material, the adhesive force is further improved and the reliability is further improved.

The structure of the IC module is also optional, and for example, the substrate itself of the IC module is a material such as vinyl chloride ((CH ₂ CHCL) _X ) which can be melt-bonded by heating. Alternatively, the substrate may be directly heated and melt-bonded to the card body. In this way, since no adhesive is used between the card body and the IC module, there is no risk of peeling due to its deterioration.

An ultrasonic heating device may be used as a device for heating and melting the melting means and the substrate.

[0021]

As described above, according to the present invention, since the time required for heating and melting the melting means or the substrate is short, the card body is not deformed by heating and defective products are not produced, thus improving the manufacturing accuracy. To be done. Further, unlike the conventional case, bleeding of an adhesive or the like does not occur, and workability is improved. In addition, since the adhesive strength of the portion melt-bonded by heating is not deteriorated due to aging, peeling does not occur.
The durability of the C-card and thus the reliability can be improved.

[Brief description of drawings]

FIG. 1 is a partial sectional view showing an IC card according to an embodiment of the present invention.

FIG. 2 is a sectional view showing an IC module according to an embodiment of the present invention.

FIG. 3 is a plan view showing an IC module according to an embodiment of the present invention.

[Explanation of symbols]

 11 ... IC card 12 ... Card main body 13 ... Recessed portion 14 ... IC module 16 ... Substrate 17 ... IC chip 21 ... Coating sheet

Claims (3)

[Claims] 1. A card main body, a recess formed in the card main body, an IC component buried in the recess, and the I part.
Bonding of external terminals electrically connected to the C component, a substrate that supports the IC component and the external terminal, and a material that can be melt-bonded to the card body material by heating to the recess of the substrate. An IC card, characterized in that it is provided with a fusing means for fusing and adhering to the surface. 2. The IC card according to claim 1, wherein the card body and the melting means are made of vinyl chloride.
De. 3. A card main body, a recess formed in the card main body, an IC component embedded in the recess, and the I part.
An external terminal electrically connected to the C component, and a substrate that supports the IC component and the external terminal and that is made of a material that can be melt-bonded by heating to the card body material and that is melt-bonded to the recess. IC card characterized by having
De.