JPH06314677A - Cleaning apparatus - Google Patents

Abstract

PURPOSE:To restrain a watermark from being produced safely and with good efficiency in the cleaning treatment of a semiconductor wafer by installing a conveyance means by which the wafer is pulled up from a treatment tank which cleans the wafer at the end by keeping a state that a pattern face is tilted by a prescribed angle with reference to the horizontal direction. CONSTITUTION:A cleaning apparatus is provided with a plurality of cleaning tanks 2 to 4 in which cleaning liquids 6 to 8 are housed and with a drying device 5 which dries a semiconductor wafer which has been cleaned sequentially by the plurality of treatment tanks 2 to 4. The cleaning apparatus is provided with conveyance means 11, 21 which pull up the semiconductor wafer from the cleaning tank 4 which cleans the semiconductor wafer at the end in a cleaning process by keeping a state that a pattern face is tilted by a prescribed angle with reference to the horizontal direction. For example, bottom parts of one pair of U-shaped chucks 30, 31 in a conveyance part 21 are formed to be a rectlinear shape which is tilted by 20 deg. with reference to the horizontal direction, and a carrier 11 is supported in a tilted state. As a result, a semiconductor wafer is conveyed in a tilted state.

Description

Detailed Description of the Invention

[0001]

[Table of Contents] The present invention will be described in the following order. Industrial Application Conventional Technology (FIGS. 10 and 11) Problems to be Solved by the Invention (FIGS. 10 and 11) Means for Solving the Problems (FIGS. 1 to 9) Operation (FIGS. 1 to 9) ) Example (1) 1st Example (FIGS. 1-5) (2) 2nd Example (FIGS. 6-8) (3) Other Example (FIG. 9) Effect of invention

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus, and is particularly suitable for application to a semiconductor wafer cleaning apparatus.

[0003]

2. Description of the Related Art Conventionally, in the manufacture of semiconductor devices, a step of cleaning a semiconductor wafer has been provided in order to remove organic and inorganic contamination on the surface of the semiconductor wafer which has been received in the preceding steps and during handling. For example, a cleaning device 1 as shown in FIG. 10 is used as the cleaning means. That is, the cleaning apparatus 1 includes the first to third processing tanks 2, 3, 4 and the drying apparatus 5, and the cleaning solution 6 is a mixed solution of sulfuric acid and hydrogen peroxide solution for the semiconductor wafer to be cleaned.
(Hereinafter, referred to as a chemical solution) In a first treatment tank 2 into which a chemical solution has been injected, a chemical reaction is used to decompose and remove contaminants adhering to the surface, and then pure water 4 is used in a second treatment tank 3. The chemical solution 6 is washed away, and the chemical solution 6 is finally washed away using pure water 8 in the third treatment tank 4 and then dried by the drying device 5.

In this case, in the semiconductor wafer 10, a predetermined number (for example, about 25) of semiconductor wafers 10 are stored in a rectangular parallelepiped-shaped carrier 11 having no bottom, and each lot is used as a cleaning process. Has been done. Therefore, in the carrier 11, a plurality of grooves 11C for supporting the peripheral side portions of the semiconductor wafer 10 are formed inside the pair of opposed side walls 11A and 11B at equal intervals in parallel, and the grooves 11C are formed near the bottom of the grooves 11C. A pair of rod-shaped wafer support members 12A and 12B are arranged perpendicularly to the groove 11C, so that the semiconductor wafer 10 can be inserted and inserted between the pair of opposed grooves 11C.

Further, in this type of cleaning device 1 (FIG. 10),
The carrier 11 is manually transported between the first to third processing tanks 2 to 4 and the drying device 5. Therefore, in the carrier 11, brim-shaped gripping portions 11D and 11E are formed at the outer upper ends of the pair of side walls 11A and 11B in which the groove 11C is formed, which facilitates the support during transportation.

[0006]

By the way, in such a cleaning apparatus 1, a spin dryer is usually used as the drying apparatus 5. Spin dryer is semiconductor wafer 1
By rotating 0 at a high speed, water drops adhering to the surface of the semiconductor wafer 10 are blown off by a centrifugal force, whereby each semiconductor wafer 10 can be dried.

On the other hand, in the semiconductor wafer 10, if there are minute irregularities on the surface, for example, when a pattern is formed on the pattern surface, the drying operation using a spin dryer will cause minute irregularities accumulated in the concave portions. Water droplets may not be removed completely. In this case, an oxide film (watermark) is formed on the semiconductor wafer 10 by the water droplets,
As a result, there is a problem that a pattern defect such as a pattern omission occurs during the subsequent wiring process.

As one method for solving this problem, there has been proposed a method of applying a highly volatile organic solvent such as isopropyl alcohol to the surface of the semiconductor wafer 10 in the step of drying the semiconductor wafer 10. There is. This is a method utilizing the fact that the organic solvent wraps the water droplets and evaporates, by which the minute water droplets adhering to the surface of the semiconductor wafer 10 can be reliably removed.

However, in such a method, there is a safety problem such as the danger of explosion because an organic solvent is used.

The present invention has been made in consideration of the above points, and is intended to realize a cleaning apparatus capable of safely and efficiently suppressing the generation of a watermark during a cleaning process of a semiconductor wafer.

[0011]

In order to solve the above problems, according to the present invention, a plurality of processing tanks 2 to 4 containing cleaning liquids 6 to 8 and semiconductor wafers sequentially cleaned by the plurality of processing tanks 2 to 4 are used. In the cleaning device having the drying device 5 for drying the semiconductor wafer 10,
Transfer means 11 and 21 are provided to lift the semiconductor wafer 10 from the processing bath 4 for cleaning 0 while keeping the pattern surface inclined at a predetermined angle with respect to the horizontal direction.

Further, in the present invention, the conveying means 11, 2
1, a plurality of semiconductor wafers 10 are housed in parallel and in parallel, and horizontal rib-shaped projections 11C and 11D are formed on the outer sides of a pair of side walls 11A and 11B facing the peripheral side surfaces of the housed semiconductor wafers 10, respectively. Semiconductor wafer 1
No. 0 carrier 11 and each projection 11C, 11D of the carrier 11 so that the pattern surface of the semiconductor wafer 10 housed in the carrier 11 is inclined at a predetermined angle with respect to the horizontal direction, and the carrier is held while maintaining this state. 1
1 and the supporting means 21 for pulling up.

Further, in the present invention, the conveying means 21
Is a flange-shaped protrusion 44D and 44E that accommodates a plurality of semiconductor wafers 10 in parallel and in parallel and that is inclined outward at a predetermined angle with respect to the horizontal direction to the outside of a pair of side walls facing the peripheral side surfaces of the accommodated semiconductor wafers 10. The carrier 44 of the semiconductor wafer 10 on which the protrusions are formed and the protrusions 44D and 44
Each of the protrusions 44D and 44E is supported so that E becomes horizontal, and the carrier 4 is held while maintaining this state.
4 and supporting means 41 for pulling up.

Further, in the present invention, in a cleaning apparatus having a plurality of processing tanks 2 to 4 containing the cleaning liquids 6 to 8 and a drying device 5 for drying the semiconductor wafer 10 sequentially cleaned in the plurality of processing tanks 2 to 4, The carriers 11 and 44 for storing the plurality of semiconductor wafers 10 in parallel and in parallel and the cleaning liquid 8 in the processing tank 4 for cleaning the semiconductor wafers 10 at the end of the cleaning process were immersed and placed. Support means 50, 51 for supporting the carriers 11, 44 in the cleaning liquid 8 such that the pattern surface of the semiconductor wafer 10 is inclined at a predetermined angle with respect to the horizontal direction are provided.
The supporting means was pulled up so as to move in parallel upward.

Further, in the present invention, in a cleaning apparatus having a plurality of processing tanks 2 to 4 for containing the cleaning liquids 6 to 8 and a drying device 5 for drying the semiconductor wafer 10 sequentially cleaned in the plurality of processing tanks 2 to 4, Supporting means 21, 41, 50 for supporting the semiconductor wafer so that the pattern surface is inclined at a predetermined angle with respect to the horizontal direction in the cleaning liquid 8 in the processing tank 4 for cleaning the semiconductor wafer 10 at the end of the cleaning step.
And 51 for supporting the semiconductor wafer 10 on the supporting means 21, 4
The cleaning liquid in the processing tank was discharged while maintaining the state in which 1, 50 and 51 were supported.

[0016]

In the final step of the cleaning process, the semiconductor wafer 10 is pulled up from the processing tank 4 for cleaning the semiconductor wafer 10 while maintaining the state in which the pattern surface of the semiconductor wafer 10 is inclined at a predetermined angle with respect to the vertical direction. It is possible to suppress the generation of watermarks. Therefore, it is possible to realize a cleaning device capable of safely and efficiently suppressing the generation of watermarks during the cleaning process of the semiconductor wafer 10.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

(1) First Embodiment In FIG. 1 in which parts corresponding to those in FIGS. 10 and 11 are designated by the same reference numerals, 20 denotes a semiconductor wafer cleaning apparatus as a whole, and the semiconductor wafer 10 (FIG. 11). 11 (FIG. 11) for housing the carrier 11 and a carrier unit 21 for sequentially carrying the carrier 11 between the first to third processing tanks 2 to 4 and the drying device 5 in accordance with a pre-programmed cleaning procedure. A transfer means 21 for the semiconductor wafer 10 is provided. In this case, in the carrying section 21, first, the carrier 1
1 is transferred to the first processing tank 2, the carrier 11 is lowered, and the carrier 11 is immersed in the chemical solution 6 injected into the first processing tank 2. The wafer 10 (hereinafter, simply referred to as a semiconductor wafer 10) is cleaned with the chemical liquid 6.

After a lapse of a predetermined time, the carrier section 21 pulls up the carrier 11 from the chemical solution 6 and carries the carrier 11 onto the second processing tank 3, and then lowers the carrier 11 to carry it. The semiconductor wafer 10 is washed with the pure water 7 and the chemical solution 6 is washed away by immersing the semiconductor wafer 10 in the pure water 7 poured into the second processing bath 3. Further, in the transport unit 21, after a predetermined time has elapsed, the carrier 11 is transferred to the second processing tank 3
By pulling the carrier 11 from the inside and transporting the carrier 11 onto the third processing tank 4, and then lowering the carrier 11 and immersing the carrier 11 in pure water 8 injected into the third processing tank 4, The semiconductor wafer 10 is washed with pure water 8 to finally wash away the chemical liquid 6.

After this, the transport section 21 pulls up the carrier 11 from the inside of the third processing tank 4 after a lapse of a predetermined time, and then transports the carrier 11 to a predetermined position in the drying device 5 and places it. The semiconductor wafer 10 is dried.

In practice, the transport section 21 has a pair of chucks 30 and 31 formed in a U-shape as shown in FIGS.
And holding the bottom sides 30A and 31A of the respective chucks 30 and 31 so that the upper side surfaces of the respective bottom side portions 30A and 31A come into contact with the lower side surfaces of the different grip portions 11C or 11D (FIG. 8) of the carrier 11, respectively. It is designed to be supportive.

In this case, each of the chucks 30 and 31 has a first and a second chuck mounting portion 32 and 33 mounted on the lower surface thereof, and the first and the second chuck mounting portion 32 and 33 have a predetermined shape. The vertical and horizontal directions of FIG. 1 and the vertical direction of FIG. 1 are maintained so that the respective chucks 30 and 31 maintain a relative positional relationship by a driving mechanism (not shown).
It is possible to freely move in the direction from the back side to the front side of the paper surface of FIG. 1 and in the direction from the front side to the back side of the paper surface of FIG. It can be sequentially transported.

In the case of the embodiment, the bottom portions 30A and 31A of the chucks 30 and 31 are formed in a straight line inclined by about 20 [°] with respect to the horizontal direction indicated by the arrow a (FIGS. 1 and 3). ing. Therefore, in the transport unit 21,
As can be seen from FIG. 1, the carrier 11 is supported in a state of being inclined by about 20 [°] with respect to the horizontal direction. As a result, as shown in FIG. 4, each semiconductor wafer 10 housed in the carrier 11 is vertically supported. It is designed so that it is always inclined by about 20 ° with respect to the direction.

Further, in this case, in the carrying section 21, the carrier 11 is supported so that the pattern surface of each semiconductor wafer 10 housed in the carrier 11 is always directed upward. 2-4
When the semiconductor wafer 10 is pulled up from the cleaning surface, the cleaning liquid composed of the chemical liquid 6 and the pure water 7, 8 attached to the surface of the pattern of each semiconductor wafer 10 slides down smoothly along the inclination of the pattern surface. It is designed to make it difficult to remain.

In the case of this embodiment, the third processing tank 4 is made of quartz as a base material and has a capacity of about 30 [liters] and a resistivity of 17.5 to 18.0 [MΩ · c].
m) of ultrapure water is supplied at a rate of 25 [liters] per minute so as to upflow from the bottom of the tank.

In the above structure, the transfer section 21 sequentially transfers the carrier 11 of the semiconductor wafer 10 in accordance with the cleaning processing procedure, and the carrier 11 is transferred to the first to third processing tanks 2 to 4.
The semiconductor wafer 10 is washed by immersing it in the chemical solution 6 or pure water 7 and 8 contained in the semiconductor wafer 10, and then the carrier 11 is conveyed to a predetermined position of the drying device 5 to dry the semiconductor wafer 10. . At this time, the transport unit 2
In 1, the Caria 11 is set to 20 in the horizontal direction.
In order to convey the semiconductor wafers in an inclined state of about [°], the semiconductor wafers 10 are conveyed in a state of holding an inclination angle of 20 ° with respect to the vertical direction.

In this case, as is apparent from FIG. 5, the semiconductor wafer 10 is dried by the tilted state when the semiconductor wafer 10 is pulled up from the last processing tank (the third processing tank 4 in this embodiment) of the cleaning operation. The occurrence rate of watermarks after processing is different, for example, when the tilt angle θ is in the range of 10 to 30 (°) with respect to the vertical direction with the pattern surface facing upward, the occurrence of watermarks is the highest. Experiments have confirmed that the rate is low. This is because when the semiconductor wafer 10 is pulled out from the cleaning liquid, the semiconductor wafer 10 is moved by 10 to 30 [°].
Draining is best when pulling up with a slight tilt,
Therefore, it is considered that more water can be removed from the surface of the semiconductor wafer 10 at the stage of pulling up from the processing tank.

Therefore, in this cleaning device 20, each semiconductor wafer 10 housed in the carrier 11 is pulled up from the third processing tank 4 with the pattern surface inclined upward by about 20 [°] with respect to the vertical direction. Therefore, it is considered that the watermark generation can be efficiently suppressed by such a simple method.

According to the above configuration, in the cleaning device 5 for the semiconductor wafer 10 including the first to third processing baths 2 to 3 and the drying device 4, in addition to the respective processing baths 2 to 3 and the drying device 4. A carrier unit 21 having a pair of U-shaped chucks 30 and 31 is provided, and the carrier 11 is supported in such a manner that the grips 11C and 11D of the carrier 11 of the semiconductor wafer 10 are hooked by the chucks 30 and 31, respectively. At the same time as the conveyance, the bottom portions 30A and 31A of the chucks 30 and 31 are formed so as to be inclined by about 20 [°] with respect to the horizontal direction.
The semiconductor wafers 10 housed in the wafer can be pulled up from the third processing tank 4 while keeping the pattern surface inclined upward by about 20 [°] with respect to the vertical direction, thus efficiently generating watermarks. Can be suppressed.

Therefore, the yield of the semiconductor wafer 10 can be reduced, and as a result, the semiconductor wafer 10 without pattern defects can be stably obtained. In addition, since it is possible to efficiently and easily suppress the generation of watermarks without requiring the use of an organic solvent, it is possible to improve the safety of the cleaning work, and at the same time, using the cleaning device currently in use It can be implemented simply by modifying it.

(2) Second Embodiment FIG. 6, in which parts corresponding to those in FIG. 1 are designated by the same reference numerals, shows a second embodiment of the semiconductor wafer cleaning apparatus 40 according to the present invention, and each of the transfer parts 41. It is formed in the same manner as the cleaning device 20 shown in FIG. 1 except that the shapes of the chucks 42 and 43 and the side wall of the carrier 44 are formed with protrusions for hooking the respective chucks 42 and 43. That is, in the cleaning device 40, as shown in FIG. 7, the bottom portions 42A and 43A of the chucks 42 and 43 attached to the chuck attaching portions 32 and 33 do not have an inclination with respect to the horizontal direction (that is, the horizontal direction). Formed).

In the carrier 44, the carrier 1
Gripping portions 44B and 4 of the housing 44A formed in the same manner as 1
Collar-shaped chuck hooking portions 44D and 45E, which are inclined about 20 [°] with respect to the horizontal direction, are formed on the lower side of 4C so as to face each other. In this case, in the transport section 41, the bottom side portions 42A and 4 of the respective chucks 42 and 43 are
The upper side surface of 3A is supported so as to abut the lower side surfaces of the chuck hooking portions 44A and 45A, respectively.

Further, in this case, in the carrying section 41, the carrier 44 is carried so that the pattern surface of the semiconductor wafer 10 housed in the carrier 44 is always directed upward.

In the above-described structure, in the cleaning device 40, the upper surfaces of the bottom portions 42A and 43A of the chucks 42 and 43 are the carrier catching portions 44 of the carrier 44, respectively.
The carrier 4 is brought into contact with the lower side surfaces of D and 44E.
In order to support 4, the carrier 44 is conveyed in a state of being inclined by about 20 [°] with respect to the horizontal direction, as can be seen from FIG.

Therefore, in the cleaning device 40, the carrier 4
Each of the semiconductor wafers 10 stored in 4 can be pulled out from the third processing bath 4 in a state where the pattern surface has an inclination angle of about 20 [°] with respect to the vertical direction, and as a result, the same as in the first embodiment. It is considered that the generation of watermarks can be suppressed efficiently.

According to the above construction, the chucks 42 and 43 of the transport unit 41 are formed so that the bottom portions 44A and 44B are not inclined with respect to the horizontal direction, and the carrier 44 is also provided.
In the outer surface of the side wall of the semiconductor wafer 10 facing the peripheral side portion of the semiconductor wafer 10, collar-shaped chuck hooking portions 44D and 44E inclined by about 20 [°] with respect to the horizontal direction are formed.
The transport unit 41 is the bottom portion 42A of the chucks 42 and 43.
And 43A so that the upper surface of each of the chucks 44A and 44B is brought into contact with the lower surface of each of the chuck hooking portions 44A and 44B to support the carrier 44. The cleaning apparatus can be pulled up from the third processing tank in a state of being inclined by about 20 [°] with respect to the vertical direction, and thus a cleaning device capable of easily and effectively suppressing the generation of watermarks can be realized.

(3) Other Embodiments In the above first embodiment, the chucks 30 and 3 are used.
The bottom part 30A and 31A of 1 is 20 with respect to the horizontal direction.
Although the case where it is formed so as to be inclined by about [°] has been described, the present invention is not limited to this, and the chucks 30 and 3 are not limited to this.
The tilt angle θ of the bottom portions 30A and 31A of 1 may be other values.

Further, in the above-mentioned second embodiment, the side wall of the carrier 44 having the groove formed inside is horizontally oriented.
The case where the chuck catching portions 44D and 44E are formed so as to be inclined by about 20 [°] has been described, but the present invention is not limited to this, and the tilting state of the chuck catching portions 44D and 44E of the carrier 44 is described. Other angles may also be used.

Further, in the above-described first and second embodiments, the bottom portions 30A and 31A of the chucks 30 and 31 are formed so as to be inclined by about 20 [°] with respect to the horizontal direction, or the side walls of the carrier 44 are horizontal. By forming the chuck hooking portions 44D and 44E which are inclined by about 20 [°] with respect to the direction, the pattern surface of the semiconductor wafer 10 housed in the carrier 11 or 44 at the time of transportation is vertically upward. The case of tilting about 20 [°] has been described, but the present invention is not limited to this, and as shown in FIG. 9, for example, the carrier 11 or 44 of the semiconductor wafer 10 is placed in a basket 50 with good drainage. Degree of slope 51
And place the basket 50 in the third treatment tank 4 with pure water 8
When each semiconductor wafer 10 housed in the carrier 11 or 44 is washed with pure water 8 by immersing in the carrier 11 or 44, and when the carrier 11 or 44 is taken out from the third processing tank 4, the basket 50 and the vertical direction are taken together. It may be pulled up to.

In this case, the carrier 11 or 44 is placed on the sludge 51 so that the pattern surface of each of the semiconductor wafers 10 housed therein faces upward, whereby the same effect as in the first and second embodiments is obtained. Can be obtained.

Further, in this case, the basket 50 and the slats 51 may be integrally formed, that is, the point is that the pattern surface of the semiconductor wafer 10 faces upward in the third processing tank 4.
While the carrier 11 or 44 is placed on a predetermined support means that supports the carrier 11 or 44 so as to be inclined by about [°], the third means while maintaining the support means in this state
If the support means is pulled up from the processing tank 4, various other shapes and configurations can be applied to the support means.

Further, in the above-described first and second embodiments, the bottom portions 30A and 31A of the chucks 30 and 31 are formed so as to be inclined by about 20 [°] with respect to the horizontal direction, or the side walls of the carrier 44 are horizontally arranged. By forming the chuck hooking portions 44D and 44E which are inclined by about 20 [°] with respect to the direction, the pattern surface of the semiconductor wafer 10 housed in the carrier 11 or 44 at the time of transportation is vertically upward. The case of tilting about 20 [°] has been described, but the present invention is not limited to this, and as shown in FIG. 9, for example, the carrier 11 or 44 of the semiconductor wafer 10 is placed in a basket 50 with good drainage. Degree of slope 51
And place the basket 50 in the third treatment tank 4 with pure water 8
Each semiconductor wafer 10 stored in the carrier 11 or 44 may be washed with pure water 8 by immersing in the carrier 11 or 44, and the pure water 8 may be withdrawn from the third processing tank 4 after the washing is completed.

In this case, the carrier 11 or 44 is placed on the sludge 51 so that the pattern surface of each of the semiconductor wafers 10 housed therein is inclined upward by about 20 [°] with respect to the vertical direction. The same effects as those of the first and second embodiments can be obtained.

Further, in the above embodiment, the transport section 2
1 and 41 support the carriers 11 or 44 by hooking the chucks 30 and 31 or 42 and 43 to the grips 11C or 11D of the carriers 11 or 44, or the chuck hooks 44D and 44E. However, the present invention is not limited to this,
In short, if the semiconductor wafer 10 housed in the carrier 11 or 44 is supported in a state of being inclined by about 20 [°] with respect to the vertical direction, various other means may be used as the supporting means of the carrier 11 or 44. Applicable.

[0045]

As described above, according to the present invention, when the semiconductor wafer is pulled out from the last processing bath in the cleaning step, the semiconductor wafer is kept in a state in which the pattern surface is inclined upward by a predetermined angle with respect to the vertical direction. However, since it is pulled out from the last processing tank, the rate of generation of watermarks can be reduced, and thus the cleaning apparatus capable of safely and efficiently suppressing the generation of watermarks during the cleaning processing of semiconductor wafers. Can be realized.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing a first embodiment of a semiconductor wafer cleaning apparatus according to the present invention.

FIG. 2 is a schematic front view showing a check of the transport unit according to the first embodiment.

FIG. 3 is a schematic side view showing a check of the transport unit according to the first embodiment.

FIG. 4 is a conceptual schematic diagram for explaining a tilted state of a semiconductor wafer housed in the carrier due to tilting of the carrier.

FIG. 5 is a characteristic curve diagram for explaining the relationship between the pulling angle of the carrier and the rate of occurrence of watermarks.

FIG. 6 is a schematic plan view showing a second embodiment of the semiconductor wafer cleaning apparatus according to the present invention.

FIG. 7 is a schematic side view showing a check of the transport section according to the second embodiment.

FIG. 8 is a schematic side view showing a carrier according to a second embodiment.

FIG. 9 is a schematic diagram for explaining another embodiment.

FIG. 10 is a schematic plan view showing a conventional semiconductor wafer cleaning apparatus.

FIG. 11 is a schematic perspective view showing a carrier of a semiconductor wafer.

[Explanation of symbols]

1, 20, 40 ... Cleaning device, 2-4 ... Processing tank, 5 ...
... Drying device, 6 ... Chemical liquid, 7, 8 ... Pure water, 10 ... Semiconductor wafer, 11, 44 ... Carrier, 11C, 11D
...... Gripping section, 21, 41 …… Transporting section, 30, 31, 4
2, 43 ... Check, 30A, 31A, 42A, 43
A: bottom part, 44D, 44E: check hooking part, θ: tilt angle.

Claims (5)

[Claims] 1. A cleaning apparatus having a plurality of processing tanks containing a cleaning liquid and a drying device for drying semiconductor wafers sequentially cleaned by the plurality of processing tanks, wherein the semiconductor wafer is cleaned at the end of the cleaning step. A cleaning apparatus comprising: a transfer unit that lifts the semiconductor wafer from the processing tank while holding the pattern surface inclined at a predetermined angle with respect to the horizontal direction. 2. The transfer means stores a plurality of the semiconductor wafers in parallel and in parallel, and horizontal rib-shaped projections are formed on the outer sides of a pair of side walls facing the peripheral side surfaces of the stored semiconductor wafers. While supporting the respective projections of the carrier such that the carrier of the semiconductor wafer and the pattern surface of the semiconductor wafer housed in the carrier are inclined at a predetermined angle with respect to the horizontal direction, while maintaining this state. The cleaning means according to claim 1, further comprising a support means for pulling up the carrier. 3. The transfer means stores a plurality of semiconductor wafers in parallel and in parallel, and inclines a predetermined angle with respect to the horizontal direction on the outside of a pair of side walls facing the peripheral side surfaces of the stored semiconductor wafers. The semiconductor wafer carrier is provided with a brim-shaped protrusion, and each of the protrusions is supported so that the protrusion is horizontal, and supporting means for pulling up the carrier while maintaining this state. The cleaning means according to claim 1, wherein: 4. A cleaning apparatus having a plurality of processing tanks containing a cleaning liquid and a drying device for drying semiconductor wafers sequentially cleaned in the plurality of processing tanks, wherein the plurality of semiconductor wafers are stored in parallel and in parallel. The carrier of the semiconductor wafer and the carrier which is immersed in the cleaning liquid in the processing bath for cleaning the semiconductor wafer at the end of the cleaning step and placed on the carrier are arranged at a predetermined angle with respect to the horizontal direction of the pattern surface of the semiconductor wafer. A cleaning apparatus comprising: a supporting unit that supports the cleaning liquid so as to incline, and pulls up the supporting unit so that the supporting unit moves upward in parallel. 5. A cleaning apparatus having a plurality of processing tanks containing a cleaning liquid and a drying device for drying semiconductor wafers sequentially cleaned in the plurality of processing tanks, wherein the processing for cleaning the semiconductor wafer is the last step of the cleaning step. In the processing tank, there is provided a supporting means for supporting the semiconductor wafer in the cleaning liquid in the tank so that the pattern surface is inclined at a predetermined angle with respect to the horizontal direction, while maintaining the state in which the semiconductor wafer is supported by the supporting means. The cleaning device is configured to discharge the cleaning liquid.