JPH06295546A - Spring head for supporting magnetic head and method of manufacturing spring arm - Google Patents

Abstract

PURPOSE:To provide the spring arm for supporting a magnetic head designed to deal with an increase in the required number of pieces of signal lines of the magnetic head by integrally forming a metallic planar member and plural wiring patterns via an insulating layer. CONSTITUTION:An insulating layer 2 is formed on the metallic planar member 1 having a trapezoidal shape longer in a longitudinal direction. The plural wiring patterns 3 are then formed adjacently to each other in the longitudinal direction on the insulating layer 2. The movement of the magnetic head in the ending state of connection is made free by forming the wiring pattern 3 on the insulating layer 2 in such a manner and a good vibration-damping characteristic is obtd. by the insulating layer 2. The wiring patterns are formable on both surfaces if the insulating layers are formed on both surfaces of the member 1 and, therefore, the dealing with an increase, if any, in the number of wirings is possible. The insulating layer 2 is preferably formed of a resin film by an electrodeposition method, anodic-oxidation method, chemical conversion treatment or printing method.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improved magnetic head supporting spring arm and an improved method of manufacturing a magnetic head supporting spring arm. In particular, the present invention relates to an improvement that can increase the number of signal wirings without hindering the movement of the magnetic head and simplify the manufacturing process.

[0002]

2. Description of the Related Art A magnetic head, which is a main component of a magnetic storage device, is attached to a magnetic head supporting spring arm via a gimbal spring connected to the magnetic head supporting spring arm. The attitude of the magnetic head is preferably parallel to the surface of the magnetic medium facing the magnetic head.
For this reason, the magnetic head is supported by a gimbal spring so as to be able to freely tilt forward, backward, leftward and rightward, and is elastically pressed against the magnetic medium by the spring arm. And
Conventionally, a signal line for recording and reproducing a signal by a magnetic head has been conventionally passed through an insulating tube and wired along a magnetic head supporting spring arm.

[0003]

By the way, there is a constant demand for improvement of storage density in the magnetic storage technology, and the signal frequency to be handled is increased, the recording / reproducing method is improved, and the like, and it is attached to the spring arm. The number of signal lines of the magnetic head has also increased from 2 to 4 or more. On the one hand, the increase in the number of signal lines not only involves the problem of wiring space and wiring work, but on the other hand, it adversely affects the free movement of the magnetic head due to the rigidity of the wiring. Could give you. Further, it is necessary to increase the mechanical resonance frequency of the spring arm in response to the increase in the signal frequency and also increase the vibration damping effect of the resonance system. And
There is a demand for solving these technical problems and, at the same time, cheap manufacturing cost.

An object of the present invention is to eliminate these drawbacks. It accommodates an increasing number of signal lines of the magnetic head, does not hinder the free movement of the magnetic head, has a vibration damping effect, and (EN) Provided are a spring arm for supporting a magnetic head and a method for manufacturing a spring arm, which can achieve a low manufacturing cost by simplifying the manufacturing process.

[0005]

The above object is to form an insulating layer (2) on a vertically elongated trapezoidal metal plate member (1),
This is achieved by a magnetic head supporting spring arm manufactured by forming a plurality of wiring patterns (3) vertically adjacent to each other on the insulating layer (2).

In the above-mentioned method of manufacturing a spring arm for supporting a magnetic head, an insulating layer (2) is formed on a vertically elongated trapezoidal metal plate-shaped member (1), and the insulating layer (2) is vertically A method of manufacturing a spring arm for supporting a magnetic head, wherein a plurality of wiring patterns (3) are formed so as to be adjacent to each other in the direction.

When the insulating layer (2) is made of a resin film and is formed by a printing method, a highly accurate vibration damping effect can be obtained.

If the insulating layer (2) is made of a resin film and is formed by an electrodeposition method, a highly accurate vibration damping effect can be obtained.

Furthermore, when the insulating layer (2) is formed by an anodic oxidation method, wire bonding can be used for connecting wiring.

Furthermore, when the above-mentioned insulating layer (2) is formed by a chemical conversion treatment method, wire bonding can be used for connecting wiring.

When the insulating layer (2) and the wiring pattern (3) are formed on both front and back surfaces of the metal plate member (1), the number of wirings can be further increased and the insulating layer ( When 2) is an insulating film, the vibration damping performance can be further improved.

The wiring pattern (3) can be formed by a printing method.

Then, the wiring pattern (3) is formed by a printing method, and further formed by a printing method and then formed by a plating method so that a wiring having a low resistance can be obtained.

[0014]

As described above, the magnetic head supporting spring arm and the method for manufacturing the magnetic head supporting spring arm according to the present invention form the insulating layer 2 on the vertically long trapezoidal metal plate member 1, and Since a plurality of wiring patterns 3 are formed vertically adjacent to each other on the insulating layer 2 and the metal plate member 1 and the plurality of wiring patterns 3 are integrated, the magnetic head Even if the number of wires increases, the wiring space does not become a problem. Further, when the magnetic head moves, this wiring portion moves together with the spring arm, so that the free movement of the magnetic head is not hindered. Further, the insulating layer has a function of supporting the wiring portion and damping the spring arm when it is made of a resin film, and a necessary braking force can be obtained by adjusting the thickness of the resin film. As described above, since it is possible to make a mass-production method such as multi-piece production or automation, and a manufacturing method with a small number of steps, a low manufacturing cost is possible.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A magnetic head supporting spring arm and a method of manufacturing a magnetic head supporting spring arm according to the present invention will be described below in more detail with respect to four embodiments in the order of manufacturing steps with reference to the drawings.

First Embodiment See FIG. 1 FIG. 1 is a diagram showing a state in which a step of forming an insulating layer of a spring arm for supporting a magnetic head is completed. In the figure, 1
Is a metal plate-shaped member, and in the first embodiment is a metal plate-shaped member made of stainless SUS316 material (thickness 75 μm), has a trapezoid shape elongated in the vertical direction, and is formed by a normal photoetching process. ing. 2 is an insulating layer, which is a polyimide paste (Mitsui Petrochemical Co., Ltd. N
E-4000), and is produced by the screen printing method. Then, the polyimide paste is 200 ° C.,
It is heated and cured for 15 minutes. The insulating layer material may be epoxy resin or acrylic resin other than polyimide paste. Reference numeral 5 denotes a round hole for fixing the spring arm, which is punched at the same time as the outer shape of the metal plate member 1 is removed by a photo etching process.

2 and 3, FIG. 2 is a front view showing a state after the wiring pattern forming process is completed, that is, the magnetic head supporting spring arm, and FIG. 3 is a sectional view taken along line XY of FIG. Is. In the figure, 3 is a wiring pattern. In the wiring pattern 3, first, a silver paste is used as a conductor paste, and the wiring pattern base 31 is created by a screen printing method. In this example, the number of wirings is 4, the width is 400 μm, the pitch is 600 μm, and the thickness is about 20 μm. Next, in order to improve conductivity, the wiring pattern base 31
An electroless plating layer is formed on top. This electroless plating layer 3
2.33 forms a nickel plating layer 32 with a thickness of about 3 μm (Nimden SX manufactured by Uemura Kogyo Co., Ltd. is plated for 15 minutes)
Then, further, a gold plating layer 33 having a thickness of about 0.5 μm is formed (degussa ELG-511 is subjected to displacement plating for 30 minutes) to manufacture. The electroless plating layers 32 and 33 do not deposit on the surface of the insulating layer 2, and silver acts as a catalyst to selectively deposit only on the wiring pattern base 31.

In this way, since the wiring pattern 3 is fixed by the insulating layer 2, the wires from the magnetic head and the body not shown are connected to the terminal portion 35 (see FIG. 5).
It is easy to connect to. Further, the movement of the magnetic head is free in the state where the connection is completed, and there is no fear of being restricted by the movement of the magnetic head by the wiring of the conventional technique.

It has been experimentally confirmed that the insulating layer 2 can obtain good vibration damping characteristics. The damping characteristics can be adjusted by changing the plate thickness used in the screen printing method or the flow characteristics of the polyimide paste, or by changing the thickness of the insulating layer by performing printing a plurality of times. If it is desired to obtain stronger vibration damping characteristics, it is possible to print an insulating layer on both surfaces of the metal plate member 1.

When the insulating layers are formed on both sides of the metal plate-shaped member 1, wiring patterns can be formed on both sides, so that the number of wirings can be increased.

Second Embodiment See FIG. 1 In FIG. 1, reference numeral 1 denotes a metal plate-shaped member, and in the second embodiment, a metal plate-shaped member made of 42 alloy material (Ni 42%, balance Fe) in the vertical direction. It has a long trapezoidal shape,
It is created by a normal photo-etching process. Two
Is an insulating layer formed by using an electrodeposition method, and a partial plating mask (for example, a silicon rubber / glass epoxy resin structure) is used as an electrodeposition mask to mask the periphery, and an electrodeposition resin (acrylic resin, For example, an acrylic melamine resin has been electrodeposited using Aaron ED-4000) manufactured by Toagosei. The thickness is about 25 μm. Reference numeral 5 denotes a round hole for fixing the spring arm, which is punched at the same time as the outer shape of the metal plate member 1 is removed by a photo etching process.

The electrodeposition may be whole surface electrodeposition instead of partial electrodeposition.

The electrodeposition resin may be butadiene resin or the like.

Since the wiring pattern is formed by the same method as in the first embodiment, the details will be omitted.

Third Embodiment See FIG. 4 FIG. 4 is a sectional view corresponding to FIG. 3, showing a state in which the step of forming the wiring pattern of the magnetic head supporting spring arm has been completed. In the figure, reference numeral 1 denotes a metal plate-shaped member, and in the third embodiment, a metal plate-shaped member made of an aluminum material, which has a trapezoid shape elongated in the vertical direction, and is formed by a normal photoetching process. . Reference numeral 2 is an insulating layer formed by using an anodic oxidation method, and using a 15% sulfuric acid aqueous solution, a DC current density of 1.0 to 20
Electric current of 1.2 A / dm ^{2 is applied} for 10 minutes to form an anodic oxide film having a thickness of about 3 μm. After that, a sealing treatment was performed by leaving it in steam at 100 ° C. for 5 minutes.

The anodic oxidation method and the sealing treatment are shown as full surface treatment in the figure, but may be partial treatment.

Since the wiring pattern is formed by the same method as in the first embodiment, the details will be omitted.

FIG. 5 is a diagram showing a state in which the step of forming the surface layer insulation after forming the wiring pattern 3 is completed. In the figure, 35 is a terminal portion of the wiring pattern 3. 4 is surface insulation,
It is formed so as to cover the entire surface layer except the terminal portion 35 and its vicinity. The surface insulation 4 protects the wiring pattern when the magnetic head supporting spring arm is pressed.

In this embodiment, the insulating layer 2 has little vibration damping effect, but there is no softening of the resin that occurs when the resin is used when wire-bonding the signal line from the magnetic head or the main body to the wiring pattern. It is advantageous.

Fourth Embodiment See FIG. 4 In FIG. 4, 1 is a metal plate-shaped member, and in the fourth embodiment, it is a metal plate-shaped member made of 42 alloy material (Ni 42%, balance Fe), in the vertical direction. It has a long trapezoidal shape,
It is created by a normal photo-etching process. Two
Is an insulating layer formed by a chemical conversion treatment method, and is left in a phosphate chemical conversion treatment liquid at 93 ° C. for 5 minutes to form a chemical conversion treatment film having a thickness of about 1 μm.

The chemical conversion treatment may be a partial treatment instead of the entire treatment.

Since the wiring pattern is formed by the same method as in the first embodiment, the details will be omitted.

In this embodiment, as in the third embodiment, the damping effect of the insulating layer 2 is small, but resin is used when wire-bonding the signal line from the magnetic head or the main body to the wiring pattern. It is advantageous in that there is no softening of the resin that sometimes occurs.

[0034]

As described above, in the magnetic head supporting spring arm and the method of manufacturing the spring arm according to the present invention, the vertically long trapezoidal metal plate-shaped member and the plurality of wiring patterns are provided via the insulating layer. Since they are integrated, the wiring space does not become a problem even if the number of wirings of the magnetic head increases. Further, when the magnetic head moves, this wiring portion moves together with the spring arm, so that the free movement of the magnetic head is not hindered. Further, the insulating layer has a function of supporting the wiring portion and damping the spring arm when it is made of a resin film, and a necessary braking force can be obtained by adjusting the thickness of the resin film. Thus, it is possible to provide the spring arm for supporting the magnetic head, which corresponds to the increase in the required number of signal lines of the magnetic head. In addition, since the manufacturing method can be easily performed and the number of steps is small, the manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is a diagram showing a state after a process of forming an insulating layer of a magnetic head supporting spring arm according to first and second embodiments is completed.

FIG. 2 is a front view showing a state after the wiring pattern forming process according to the first and second embodiments is completed, that is, a magnetic head supporting spring arm.

FIG. 3 is an XY cross-sectional view of a magnetic head supporting spring arm according to the first and second embodiments.

FIG. 4 is a sectional view of a spring arm for supporting a magnetic head according to third and fourth embodiments.

FIG. 5 is a diagram showing a state after finishing a forming process of a surface layer insulation according to a third example.

[Explanation of symbols]

 1 Metal Plate Member 2 Insulation Layer 3 Wiring Pattern 4 Surface Insulation 5 Round Hole for Fixing 31 Wiring Pattern Base 32 Electroless Plating Layer (Nickel Plating Layer) 33 Electroless Plating Layer (Gold Plating Layer) 35 Terminal Section

Claims (9)

[Claims] 1. An insulating layer (2) is formed on a vertically long trapezoidal metal plate member (1), and a plurality of wirings are vertically adjacent to each other on the insulating layer (2). A spring arm for supporting a magnetic head, which is manufactured by forming a pattern (3). 2. An insulating layer (2) is formed on a vertically elongated trapezoidal metal plate member (1), and a plurality of wirings are vertically adjacent to each other on the insulating layer (2). A method of manufacturing a spring arm for supporting a magnetic head, comprising forming a pattern (3). 3. The method of manufacturing a spring arm for supporting a magnetic head according to claim 2, wherein the insulating layer (2) is made of a resin film and is formed by a printing method. 4. The method of manufacturing a spring arm for supporting a magnetic head according to claim 2, wherein the insulating layer (2) is made of a resin film and is formed by an electrodeposition method. 5. The method of manufacturing a spring arm for supporting a magnetic head according to claim 2, wherein the insulating layer (2) is formed by an anodic oxidation method. 6. The method of manufacturing a spring arm for supporting a magnetic head according to claim 2, wherein the insulating layer (2) is formed by a chemical conversion treatment method. 7. The magnetic head supporting apparatus according to claim 1, wherein the insulating layer (2) and the wiring pattern (3) are formed on both front and back surfaces of the metal plate member (1). Spring arm. 8. The method according to claim 2, 3, 4, 5, or 6, wherein the wiring pattern (3) is formed by a printing method. 9. The wiring pattern (3) is formed by a printing method, further formed by a printing method and then formed by a plating method.
6. A method of manufacturing a spring arm for supporting a magnetic head according to 6 or 7.