JPH06291230A - Manufacture of composite semiconductor device - Google Patents

Abstract

PURPOSE:To provide a method of manufacturing a composite semiconductor device wherein main terminals and signal terminals are accurately positioned even if they are increased in number and which can be easily assembled. CONSTITUTION:The intermediate spots of main terminals 3 and 4 and a signal terminal 5 are previously soldered to a printed board 16, whereby a special positioning jig can be dispensed with, and the lower ends of them can be precisely positioned to a chip mounting board 9. Therefore, a composite semiconductor device of this constitution is not increased in assembling man-hours even if it is enhanced in the number of terminals.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a composite semiconductor device, and more particularly to a method for manufacturing a composite semiconductor device with improved positioning processing of terminals led to the outside.

[0002]

5 and 6 of a composite semiconductor device of this type.
Shown in. In these figures, although not shown inside the composite semiconductor device 1, six semiconductor pellets of the switching element are encapsulated by the resin encapsulation portion 2. And
A total of 6 sets of DC side main terminals 3 and AC side main terminals 4 and signal terminals 5 of each switching element are led out from the resin sealing portion 2 to the outside of the composite semiconductor device 1. In the figure, 6 is a heat dissipation plate, 7 is a mounting hole opened at both ends of the heat dissipation plate 6, and 8 is an insulating case fixed on the heat dissipation plate 6 and having both openings.

Next, FIG. 7 shows the internal structure of the composite semiconductor device having the above-mentioned structure. In the figure, the chip mounting board 9 is soldered onto the heat sink 6. The chip mounting board 9 has conductor layers 10 formed on both surfaces of a ceramic or aluminum nitride plate. The lower surface is soldered to the heat dissipation plate 6, a conductor pattern 11 of a predetermined circuit is formed on the upper surface, and the semiconductor chip 12 is soldered on the pattern 11. Next, wire bonding is performed between the upper electrode of the semiconductor chip 12 and the conductor pattern 11 (not shown). Next, the chip mounting board 9, the DC side main terminal 3, the AC side main terminal 4 and the signal terminal 5 are positioned and soldered on the heat sink 6 at predetermined positions by a positioning jig (not shown). Next, the insulating case 13 having openings at both ends is covered, and the gel coating agent 14 and the sealing resin 15 are sequentially filled inside the case 13 to complete the composite semiconductor device 1.

[0004]

By the way, in the conventional method of manufacturing a composite semiconductor device as described above, when the numbers of the DC side main terminals 3, the AC side main terminals 4 and the signal terminals 5 are increased, the accuracy is improved. It is difficult to position with a jig, and there is a problem to be solved that the number of assembling steps increases.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and even if the number of both main terminals and signal terminals is large, the positioning of each terminal can be accurately performed, and It is an object of the present invention to provide a method for manufacturing a composite semiconductor device which is easy to assemble.

[0006]

According to a method of manufacturing a composite semiconductor device of the present invention, a semiconductor chip, a main terminal and a signal terminal are soldered on an radiating plate via an insulator, and the radiating plate is provided on an outer peripheral portion of the radiating plate. In a method for manufacturing a composite semiconductor device, in which an insulating case having openings at both ends is arranged, and the lower portions of the semiconductor chip, main terminals and signal terminals are resin-sealed, the main terminals and signal terminals are soldered onto the heat sink. Previously, the intermediate parts of the terminals are previously soldered to the printed circuit board, and then the assembly of the printed circuit board and the terminals is mounted on the heat dissipation plate, and the lower ends of the terminals are soldered. It is a feature.

[0007]

The method of manufacturing a composite semiconductor device of the present invention does not require a special jig for positioning because the intermediate portions of both the main terminals and the signal terminals are pre-soldered on the printed circuit board. The lower ends of the terminals can be accurately positioned on the heat sink to be soldered. Therefore, the number of assembling steps does not increase even if the number of terminals increases.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view for explaining a method of manufacturing a composite semiconductor device according to the present invention, and FIG. 2 is a plan view thereof. In these drawings, a through hole 17a for a signal terminal and a through hole 18a for a main terminal are provided on a printed circuit board 16 having a plate thickness of about 2 mm.
Are formed. Further, these through holes 17a, 18
Independent small holes 17b and 18b are provided near a. Also, these through holes 17a, 18a and the small hole 1
A conductor pattern 19 for forming a predetermined circuit is formed so as to surround 7b and 18b. The signal terminal 5 having the same potential as the main terminal 3 is connected by the conductor pattern 19. Next, the order of assembling each of the above parts will be described.
First, as shown in FIG. 3, the main terminal 3 and the signal terminals 5a,
5b is inserted into each of the main terminal through hole 18a and the signal terminal through hole 17a of the printed circuit board 16. Signal terminal 5
Of the a and 5b, the signal terminal 5a has the same potential as that of the main terminal 3, so that only the printed board 16 needs to be connected via the conductor pattern 19.

The shape of each terminal will be described with reference to FIG. That is, although FIG. 4 shows the shape of the main terminal 3, the main terminal 3 is integrally formed with a branch portion 32 branched from the base portion 31. In addition, this branching unit 32
Are formed on the other signal terminals 5 in the same manner as above.
In addition, a bulge 34 is formed slightly above the center of the base 31 so that the amount of protrusion from the surface gradually increases toward the bottom of the base 31. Further, a bent leg portion 33 is formed at one end of the base portion 31. Next, the assembling order of the present invention will be described using each terminal and the printed circuit board configured as described above.

First, the main terminals 3 and 4 and the signal terminal 5 are inserted into the printed circuit board 16. That is, from the rear surface side of the printed circuit board 16, both main terminals 3 and 4 and the signal terminal 5
Insert the tip of the. In this case, both main terminals 3,
Since the branch portion 32 is formed in the signal line 4 and the signal terminal 5, the tip portion of the branch portion 32 is also inserted into the through holes 17b and 18b. When these insertions are completed, each base 3
Since the bulging portion 34 formed in No. 1 has a wedge shape, the bulging portion 32 enters the respective through holes 17a, 18a and serves as a temporary fixing. Therefore, the terminals 3, 4, and 5 do not fall off the printed circuit board 16 before soldering.

Thus, the terminals 3, 4, 5 inserted into the printed circuit board 16 have the conductor pattern 1 as shown in FIG.
9 is soldered with solder 20. On the other hand, the semiconductor chip 12 is previously mounted on the chip mounting board 9 in the same manner as the conventional one.
Is soldered to the predetermined position of the semiconductor chip 12
Although not shown, the electrodes on the upper surface of the and the conductor pattern 10 are wired by wire bonding. Next, as shown in FIG. 1, the assembly of the printed circuit board 16 and the terminals 3, 4 and 5 is bent by a plurality of positioning pins 21 so that the bent leg portions 33 of both main terminals 3 and 4 and one signal terminal 5 are bent. The bent leg portion 53 is placed at a predetermined position on the chip mounting board 9. After making the above preparations,
The heat radiating plate 6 is placed on a heat plate (not shown) to heat the heat radiating plate 6.
And the chip mounting board 9 and the chip mounting board 9 and the bent leg portions 33, 53 of the terminals 3, 4, 5 are soldered. Needless to say, the solder used in each soldering process has a different melting temperature depending on the application. Further, since the steps after the above-mentioned steps are the same as the conventional ones, detailed description thereof will be omitted.

[0013]

As described above, according to the method for manufacturing the composite semiconductor device of the present invention, the intermediate portion of each terminal is soldered to the printed board before the lower end of each terminal is soldered to the heat sink. Therefore, the following effects are obtained. (1) It is possible to accurately and easily align the terminals with the chip mounting board. (2) Even in the case of a composite semiconductor device that uses a large number of terminals, in order to solder it to the printed circuit board in advance,
Since the positioning is already performed in that state, it is possible to assemble without using a special jig and without increasing the number of assembling steps. (3) The signal terminal having the same potential as the main terminal may be simply soldered to the printed circuit board, and the signal terminal itself can be shortened, which has the advantage of facilitating material removal.

[Brief description of drawings]

FIG. 1 is a partial front view for explaining a method for manufacturing a composite semiconductor device of the present invention.

FIG. 2 is a plan view of a printed circuit board used in the above manufacturing method.

FIG. 3 is a cross-sectional view showing a state in which each terminal is inserted into a printed circuit board in the above manufacturing method.

FIG. 4 is a partially enlarged cross-sectional view of a state in which the printed board is inserted.

FIG. 5 is a plan view for explaining how many terminals are led out of a composite semiconductor device of this type.

6 is a cross-sectional view similar to FIG. 5 described above.

FIG. 7 is a cross-sectional view showing an internal structure of the composite semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Composite semiconductor device 2 Resin sealing part 3 DC side main terminal 4 AC side main terminal 5 Signal terminal 6 Heat sink 7 Mounting hole 8 Insulation case 9 Chip mounting board 10 Conductor layer 11 Conductor pattern 12 Semiconductor chip 13 Insulation case 14 Gel-like Coating agent 15 Resin sealing part 16 Printed circuit board 17a Through hole for signal terminal 17b Through hole 18a Through hole for main terminal 18b Through hole 19 Conductor pattern 20 Solder 21 Positioning pin 31 Base part 32 Branch part 33, 53 Bending leg part 34 Bulge

Claims (1)

[Claims] 1. A semiconductor chip, a main terminal and a signal terminal are soldered on a heat dissipation plate via an insulator, and an insulating case having openings at both ends is arranged on an outer peripheral portion of the heat dissipation plate. And a method for manufacturing a composite semiconductor device in which the lower portion of the signal terminal is resin-sealed, before the main terminal and the signal terminal are soldered on the heat sink, an intermediate portion of these terminals is previously soldered to the printed board. Then, the assembly of the printed board and the terminals is mounted on the heat dissipation plate, and the lower ends of the terminals are soldered.