JPH06291169A - Characteristic inspecting apparatus for tab semiconductor device - Google Patents

Abstract

PURPOSE:To improve the reliability of the characteristic inspection of a TAB semiconductor device, by keeping the flatness of the insulation film of a TAB tape good always. CONSTITUTION:In a characteristic inspecting apparatus, an insulation film 1 of a TAB tape 5 is pressed with the under surface of an upper pressing body 7, and the under surface of the insulation film 1 is pressed with lower pressing bodies 8. Thereby, the flatness of the insulation film 1 is secured, and in this state, probes 9 are contacted respectively with pad parts 4b to be inspected of leads 4 laid on the under surface of the insulation film 1. Further, the ends of the lower parts of air cylinders 12 which are fixed on the side surfaces of the upper pressing body 7 respectively are extended in a bent way just under the upper pressing body 7 respectively, and piston members 13 are protruded from the ends of the lower parts of the air cylinders 12 respectively, and further, the lower pressing bodies 8 are coupled directly to the upper ends of the respective piston members 13. By the compressed air fed to the air cylinders 12, the piston members 13 are protruded upward, and thereby, the lower pressing bodies 8 are pressed respectively on the under surface of the insulation film 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is directed to a TAB [Tape Automated] having conductive pattern leads formed on an insulating film.
Bonding] relates to a TAB type semiconductor device characteristic inspection device in which a semiconductor pellet is connected to a tape.

[0002]

2. Description of the Related Art An example of a TAB tape which is an intermediate structure for manufacturing a TAB type semiconductor device is shown in FIGS.
The B tape (5) has a large number of leads (4) formed by etching a metal foil on one surface of a long insulating film (1). The insulating film (1) has a through hole (2) at substantially the center and film feed holes (3) at both ends. The lead (4) of the insulating film (1) has an inner lead portion (4a) extending into the through hole (2) and an inspection pad portion (4b) arranged in a line near both end portions of the insulating film (1). Have. The semiconductor pellet (6) is arranged in the through hole (2) of the insulating film (1), and the bump electrode (not shown) of this semiconductor pellet (6) and the inner lead portion (4a) of the lead (4) are It is connected by thermocompression bonding.

The characteristic inspection of the TAB type semiconductor device of FIG.
This is performed using a characteristic inspection device as shown in FIGS. 7 and 8. The characteristic inspection apparatus shown in the figure has a pair of upper and lower pressing bodies (7) and (8 ') and a lower pressing body (hereinafter, referred to as lower pressing body) (8') and an upper pressing body (hereinafter, upper pressing body). Is called]
A cylinder (15) that moves up and down with respect to (7), and a TAB
A characteristic inspection section (10) for inspecting a characteristic by contacting a lead (4) of a tape (5) with a needle (9). The TAB tape (5) is held horizontally with the lead (4) facing downward by a transporting means (not shown), and is intermittently fed to the inspection position where the characteristic inspection device is arranged.

The width of the flat lower surface of the upper pressing body (7) is slightly larger than the width of the insulating film (1), and a recess (11) for accommodating the semiconductor pellet (6) is formed in the approximate center of the lower surface. To be done. A pair of cylinders (15) is vertically fixed to both side surfaces of the upper pressing body (7), and a lower pressing body (8 ') is fixed to a lower end of a piston rod (16) protruding downward from the cylinder (15). It A pair of lower pressing bodies (8 ') are arranged below both side surfaces of the lower surface of the upper pressing body (7), and flat upper surfaces of the lower pressing bodies (8') are parallel to the lower surface of the upper pressing body (7). When the piston rod (16) is raised by the cylinder (15), the lower pressing body (8 ') approaches and rises parallel to the upper pressing body (7), and the piston rod (16) is lowered by the cylinder (15). Then, the lower pressing body (8 ') separates and descends from the upper pressing body (7) in parallel.

When a portion of the TAB tape (5) to be inspected having a predetermined area is carried into the inspection position, the upper pressing body (7)
Lowers to a fixed position and presses the portion to be inspected of the insulating film (1) with the semiconductor pellet (4) housed in the recess (11). After that, the lower pressing body (8 ') is raised by the cylinder (15) to press both sides of the insulating film (1) against the upper pressing body (7). At this time, the lower pressing body (8 ') presses both sides of the insulating film (1) as shown by the chain double-dashed line in FIG. This pressing secures the flatness of the insulating film (1) in the vicinity of the inspection pad portion (4b). Next, the entire pressing body (7) (8 ') descends,
The inspection pad section (4b) of the insulating film (1) and the measuring needle (9) of the characteristic inspection section (10) that directly faces the insulating film (1) come into contact with each other, and TA
The characteristic inspection of the B type semiconductor device is performed.

[0006]

When the piston rod (16) is raised in the cylinder (15) to bring the lower pressing body (8 ') closer to the upper pressing body (7), the piston is moved in the cylinder (15). When the rod (16) swings, the lower pressing body (8 ')
Leans. Even if the inclination angle of the lower pressing body (8 ') is small, the inclination amount of the tip portion of the lower pressing body (8') that directly presses the insulating film (1) is the piston rod ( It may increase in proportion to the distance L from 16) and the parallelism with the upper pressing body (7) may deteriorate to such an extent that it cannot be ignored.

That is, when the insulating film (1) is pressed against the upper pressing body (7) while the lower pressing body (8 ') is tilted in a direction not parallel to the upper pressing body (7), the insulating film (1) is added to the insulating film (1). The pressing force varies in the width direction and the longitudinal direction of the insulating film (1), and both sides of the insulating film (1) become wavy, so that the flatness thereof is impaired. As a result, the contact pressure of the needle (9) facing the inspection pad portion (4b) of the insulating film (1) may vary, and accurate characteristic inspection may not be possible.

Therefore, an object of the present invention is to maintain a good flatness of an insulating film held by a pair of upper and lower pressing members during a characteristic inspection and to perform an accurate characteristic inspection. To provide.

[0009]

According to the present invention, an insulating film of a TAB type semiconductor device in which a lead is connected to a semiconductor pellet arranged in a through hole of a long insulating film having a lead on one surface thereof is held substantially horizontally. In a characteristic inspection device that performs characteristic inspection by externally contacting a characteristic inspection needle to the inspection pad portion of the lead in a state where the insulating film is partially held by the parallel pressing surfaces of a pair of upper and lower pressing bodies, The above object is achieved by directly connecting one of the pressing bodies to the tip of the piston member of the cylinder for vertically projecting the piston member toward the pressing surface of the other pressing body.

[0010]

When one of the pair of upper and lower pressing bodies, for example, the lower pressing body is directly connected to the piston member of the cylinder that projects the piston member toward the pressing surface of the upper pressing body, the vertical stroke amount of the piston member by the cylinder is increased. By setting a small value, it is possible to reduce the tilt amount of the lower pressing body due to the shaft runout of the piston member to such an extent that there is no problem,
The pair of upper and lower pressing bodies have good parallelism and hold the insulating film of the TAB tape so that the flatness of the insulating film during the characteristic inspection is always good and the characteristic inspection is accurate.

[0011]

1 to 4 show an embodiment of a characteristic inspection apparatus according to the present invention. The same or corresponding portions as those of the characteristic inspection apparatus of FIG. 7 of this embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

The characteristic inspection apparatus of the first embodiment shown in FIGS. 1 to 3 comprises a cylinder vertically fixed to both side surfaces of an upper pressing body (7), such as an air cylinder (12). A lower pressing body (8) is directly connected to the upper end of a piston member (13) which is vertically driven toward the lower surface of (7). The air cylinder (12) is, for example, a fixed cylinder (12
a), horizontal cylinder (12b) and vertical cylinder (12c)
The fixed cylindrical portion (12a) is vertically fixed to the side surface of the upper pressing body (7) in the shape of a cylinder. The horizontal tubular portion (12b) extends below the upper pressing body (7) from the lower end of the fixed tubular portion (12a), and the vertical tubular portion (12c) extends directly above from the tip of this horizontal tubular portion (12b). . A piston member (13) is vertically movably fitted into the vertical tubular portion (12c), and a lower pressing body (8) is fixed to the upper end of the piston member (13) protruding from the vertical tubular portion (12).

The vertical cylinder portion (12) of the air cylinder (12) is
As shown in FIG. 2, the TAB tape (5) is wide in the longitudinal direction, and three columnar piston members (13) are fitted in, for example, one horizontal row. Three piston members (13)
The lower pressing body (8) is fixed to the upper end of each. The piston member (13) is vertically driven by the air cylinder (12) in a direction perpendicular to the lower surface of the upper pressing body (7). The upper surface of the lower pressing body (8) is parallel to the lower surface of the upper pressing body (7), and the lower pressing body (8) moves up and down while maintaining the parallelism of both surfaces.

As shown by the solid line in FIG. 3, the piston member (13) retracts into the vertical cylinder portion (12c) of the air cylinder (12) to the lower limit position, and the lower pressing body (8) and the upper pressing body (7) are moved. ) Face each other at a predetermined interval which is slightly larger than the thickness of the TAB tape (5), the TAB is attached to the lower surface of the upper pressing body (7).
The tape (5) is loaded. Thereafter, as shown by the chain line in FIG. 3, the piston member (13) is lifted by the compressed air supplied to the air cylinder (12), the lower pressing body (8) is lifted, and both sides of the insulating film (1) are lifted. Part upper pressing body (7)
Press on. This state is maintained, and the needle (9) of the characteristic inspection section (10) comes into contact with the inspection pad section (4b) of the lead (4) of the insulating film (1) to perform the characteristic inspection.

It is conceivable that the lower pressing body (8) may tilt due to the shaft runout of the piston member (13) pushed up by the air cylinder (12), but there is almost no shaft runout because the rising stroke of the piston member (13) is small. Moreover, since the lower pressing body (8) is directly connected to the upper end of the piston member (13), the axial runout amount of the piston member (13) and the lower pressing body (8).
The amount of inclination of is almost the same. Therefore, the lower pressing body (8) and the upper pressing body (7) hold the both sides of the insulating film (1) with good parallelism, and close the both sides of the insulating film (1) where the inspection pad portions (4b) are arranged. Ensure flatness. Further, the adjustment of the surface pressure applied to both sides of the insulating film (1) held between the lower pressing body (8) and the upper pressing body (7) is simple and accurate by adjusting the compressed air pressure of the air cylinder (12). To be done. Therefore, the inspection pad portion (4b) of the lead (4)
Since the needle (9) of the characteristic inspection unit (10) can be contacted with a uniform contact pressure, the characteristic inspection of the TAB type semiconductor device can always be performed accurately.

As shown in FIG. 2, when the piston member (13) of the air cylinder (12) is divided into a plurality of parts, the lower pressing body (8) corresponds to the plurality of piston members (13).
May be divided into a plurality of parts, and each divided lower pressing body (8) may be directly connected to the upper end of each piston member (13) to be independently driven up and down.

In the second embodiment shown in FIG. 4, the lower pressing body (8) and the piston member (13) are connected via an elastic member (14). The elastic member (14) supports the lower pressing body (8) with good parallelism with the upper pressing body (7) by means of a leaf spring, a spring, rubber, or the like, and from the outside applied to the upper surface of the lower pressing body (8). The lower pressing body (8) is supported by an eccentric force so as to be swingable in any of front, rear, left and right directions.

In the case of the embodiment of FIG. 4, the piston member (13)
When the lower pressing body (8) is pressed against the insulating film (1) by raising, the elasticity of the elastic member (14) causes the lower pressing body (8) to move.
Closely adheres to the lower surface of the insulating film (1) to ensure the flatness of the insulating film (1). Further, if the piston member (13) swings and the lower pressing body (8) tries to tilt, the elastic member (14) absorbs the eccentric force applied to the upper surface of the lower pressing body (8), and The pressing body (8) follows the insulating film (1) without tilting and normally presses the insulating film (1).

The present invention can also be applied to an apparatus in which the characteristic inspection apparatus of the above embodiment is turned upside down.

[0020]

According to the present invention, it is easy to always maintain good parallelism between the pair of upper and lower pressing bodies that partially hold the insulating film of the TAB tape. Ensures flatness, and TAB
The reliability of the characteristic inspection of the semiconductor device can be improved.

If an elastic member is interposed between the piston member of the cylinder and the pressing body directly connected to the piston member, the pressing body can be pressed against the insulating film by following the surface of the insulating film. The flatness of the film can be secured more reliably, and the reliability of the characteristic inspection is further improved.

When an air cylinder is used as the cylinder, the pressing force and the surface pressure on the insulating film by the pressing body can be accurately and easily adjusted by adjusting the air pressure of the air cylinder.
This facilitates equipment adjustment when switching tape types.

[Brief description of drawings]

FIG. 1 is a side view including a partial cross section showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is an enlarged cross-sectional view showing a main part of the apparatus shown in FIG.

FIG. 4 is a sectional view of a main part showing another embodiment of the present invention.

FIG. 5 is a partial plan view of a TAB tape which is an intermediate structure of a TAB semiconductor device.

6 is a sectional view taken along line BB of FIG.

FIG. 7 is a side view including a partial cross section of a conventional characteristic inspection device.

8 is a sectional view taken along the line CC of FIG.

[Explanation of symbols]

 1 Insulating film 4 Lead 4b Inspection pad 6 Semiconductor pellet 7 Pressing body 8 Pressing body 9 Measuring needle 12 Cylinder (air cylinder) 13 Piston member 14 Elastic member

Claims (3)

[Claims] 1. A semiconductor pellet arranged in a through hole of a long insulating film having a lead on one surface and the insulating film of a TAB type semiconductor device to which the lead is connected are held substantially horizontally, and the insulating film is partially retained. In a characteristic inspection device that performs characteristic inspection by externally contacting a characteristic inspection needle to the inspection pad portion of the lead in a state of being held by parallel pressing surfaces of a pair of upper and lower pressing bodies, one of the pair of pressing bodies Is directly connected to the tip of the piston member of the cylinder for vertically projecting the piston member toward the pressing surface of the other pressing body.
AB type semiconductor device characteristic inspection device. 2. The characteristic inspection device for a TAB type semiconductor device according to claim 1, wherein the piston rod of the cylinder and the pressing body directly connected to the cylinder rod are connected via an elastic member. 3. The cylinder is an air cylinder.
Alternatively, a TAB type semiconductor device characteristic inspection apparatus according to the item 2.