JPH0628786Y2 - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPH0628786Y2 JPH0628786Y2 JP1988119331U JP11933188U JPH0628786Y2 JP H0628786 Y2 JPH0628786 Y2 JP H0628786Y2 JP 1988119331 U JP1988119331 U JP 1988119331U JP 11933188 U JP11933188 U JP 11933188U JP H0628786 Y2 JPH0628786 Y2 JP H0628786Y2
- Authority
- JP
- Japan
- Prior art keywords
- nut
- external connection
- terminal
- external
- outer enclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 239000011810 insulating material Substances 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 238000000465 moulding Methods 0.000 description 23
- 238000005192 partition Methods 0.000 description 12
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000009795 derivation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
【考案の詳細な説明】 産業上の利用分野 本考案は、電子部品に係り、詳しくは、被接続電極がビ
ス止めによって接続される外部接続端子を有する電子部
品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly to an electronic component having an external connection terminal to which a connected electrode is connected by a screw.
従来例及び解決すべき課題 例えば自動車用イグナイタ又はアクチュエータ制御回路
等の電子部品は、絶縁性の樹脂材料により形成されたケ
ースと、このケースから導出された複数の端子部材とを
有する。各端子部材にはビスにより外部導線が接続され
る。また、ケース内には半導体装置、抵抗又はコンデン
サ等の電子素子が配置され、これらの電子素子は端子部
材に電気的に接続されている。以下、この状態を第８図
および第９図に示す自動車イグナイタ用ハイブリッドＩ
Ｃについて説明する。Conventional Examples and Problems to be Solved For example, an electronic component such as an automobile igniter or an actuator control circuit has a case formed of an insulating resin material and a plurality of terminal members led out from the case. An external conductor is connected to each terminal member with a screw. Further, electronic elements such as a semiconductor device, a resistor or a capacitor are arranged in the case, and these electronic elements are electrically connected to the terminal member. Hereinafter, this state is shown in FIGS. 8 and 9 as a hybrid I for an automobile igniter.
C will be described.
このハイブリッドＩＣは合成樹脂製のケースとなる外囲
体（２）を有する。図示の例では外囲体（２）には５個
の板状の端子部材（１）が埋設されている。各端子部材
（１）の一端は外囲体（２）の外壁（側面）から導出さ
れ、更に外囲体（２）に対面するよう略９０°の角度で
折曲げられた外部接続端子（１ａ）を形成する。各外部
接続端子（１ａ）にはネジ孔（３）が形成され、外部導
線（被接続電極）（４）はビス（５）によりネジ孔
（３）に接続される。This hybrid IC has an outer enclosure (2) which is a case made of synthetic resin. In the illustrated example, five plate-shaped terminal members (1) are embedded in the outer enclosure (2). One end of each terminal member (1) is led out from the outer wall (side surface) of the outer enclosure (2) and further bent at an angle of approximately 90 ° so as to face the outer enclosure (2). ) Is formed. A screw hole (3) is formed in each external connection terminal (1a), and the external conducting wire (electrode to be connected) (4) is connected to the screw hole (3) by a screw (5).
外囲体（２）は成形金型を用いて周知のインサート樹脂
成形法により形成される。つまり、上型と下型とから成
る成形金型を用意し、端子部材（１）を成形金具の成形
空所内に配置する。次に成形金型内の成形空所内に流動
化した封止用樹脂を注入して固化させると外囲体（２）
が形成される。この樹脂成形法では端子部材（１）の本
数が多いと、成形金型への端子部材（１）の装着に手間
がかかる。電子部品の高密度実装化に伴って端子部材
（１）の本数は増加する傾向にあ、端子部材（１）の成
形金型への装着時間は更に生産性を向上する上で無視で
きない問題になっている。端子部材（１）を短時間で成
形金型に装着するため、第３図に示すように複数本の端
子部材（１）が連結部によって一体に成形された外部端
子集合体を使用して形成する製造方法がある。この製造
方法では、外囲体（２）を成形した後に外部端子集合体
の連結部を切断して複数の端子部材（１）に分離する。The outer envelope (2) is formed by a known insert resin molding method using a molding die. That is, a molding die including an upper die and a lower die is prepared, and the terminal member (1) is placed in the molding space of the molding fitting. Next, when the fluidized sealing resin is injected into the molding cavity in the molding die and solidified, the envelope (2)
Is formed. In this resin molding method, when the number of terminal members (1) is large, it takes time and effort to mount the terminal members (1) on the molding die. The number of terminal members (1) tends to increase with the high-density mounting of electronic components, and the mounting time of the terminal members (1) in the molding die is a problem that cannot be ignored in order to further improve productivity. Has become. In order to mount the terminal member (1) on the molding die in a short time, as shown in FIG. 3, a plurality of terminal members (1) are formed by using an external terminal assembly integrally molded by a connecting portion. There is a manufacturing method. In this manufacturing method, after molding the outer enclosure (2), the connecting portion of the outer terminal assembly is cut to separate it into a plurality of terminal members (1).
ところで、この種の外部端子構造を有する電子部品で
は、端子部材（１）を少しでも薄く形成する必要があ
る。即ち、端子部材（１）を肉薄に形成すると、上記の
外部接続端子集合体の分離を容易に行える。通常、外部
端子集合体を容易に切断するために外部端子集合体の肉
厚を0.8mm以下とすることが望ましい。By the way, in an electronic component having this type of external terminal structure, the terminal member (1) needs to be formed as thin as possible. That is, if the terminal member (1) is formed thin, the external connection terminal assembly can be easily separated. Usually, in order to easily cut the external terminal assembly, it is desirable that the thickness of the external terminal assembly be 0.8 mm or less.
また、端子部材（１）の肉薄化により端子部材（１）の
熱容量が減少する。即ち、第８図に示すようにリード細
線（６）が半田（７）を介して端子部材（１）に接続さ
れることが多い。半田付けの際に、端子部材（１）が肉
厚で熱容量が大きいと端子部材（１）が短時間で加熱さ
れず、半田付け作業に手間がかかる。したがって、端子
部材（１）は少しでも肉薄として熱容量を減少すること
が望ましい。Further, the heat capacity of the terminal member (1) is reduced due to the thinning of the terminal member (1). That is, as shown in FIG. 8, the thin lead wire (6) is often connected to the terminal member (1) through the solder (7). When soldering, if the terminal member (1) is thick and has a large heat capacity, the terminal member (1) is not heated in a short time, and the soldering work is troublesome. Therefore, it is desirable to reduce the heat capacity by making the terminal member (1) as thin as possible.
以上の理由から肉薄の端子部材（１）が強く要求されて
きている。しかし、従来の外部接続端子構造では、端子
部材（１）を単に薄くするとネジ孔（３）の長さも短く
なり、外部導線（４）を端子部材（１）に確実に取付け
ることができない。端子部材（１）の肉厚は最低でも
１．０mmは必要であり、このため、端子部材（１）を充
分に肉薄化することができなかった。For the above reasons, a thin terminal member (1) is strongly required. However, in the conventional external connection terminal structure, if the terminal member (1) is simply thinned, the length of the screw hole (3) also becomes short, and the external conductor wire (4) cannot be reliably attached to the terminal member (1). The terminal member (1) needs to have a thickness of at least 1.0 mm, so that the terminal member (1) cannot be sufficiently thinned.
そこで、本考案は薄肉の外部接続端子を有し且つ組立の
容易な電子部品を提供することを目的とする。Therefore, an object of the present invention is to provide an electronic component having a thin external connection terminal and easy to assemble.
課題を解決するための手段 本考案による電子部品は外囲体と、外囲体に取り付けた
放熱板と、放熱板に固着した回路基板と、回路基板上の
電子部品に電気的に接続され且つ外囲体から導出された
複数の外部接続端子とを備えている、外部接続端子の他
端を折曲げて折曲げ部を形成され、折曲げ部に貫通孔が
形成される。貫通孔に挿入するビスにより外部接続端子
の他端に外部導線が連結される。複数のナット部及びナ
ット部を互いに連結するリブを有する絶縁性材料から成
るナット部結合体は外部接続端子と放熱板の間に挟持さ
れる。複数の外部接続端子の各々の折曲げられた他端と
外囲体との間に形成した凹部内にナット部が配置され
る。外部導線を接続し且つ外部接続端子の貫通孔に挿通
したビスはナット部に連結される。An electronic component according to the present invention includes an outer casing, a heat dissipation plate attached to the outer casing, a circuit board fixed to the heat dissipation plate, and electrically connected to the electronic component on the circuit board. The other end of the external connection terminal, which has a plurality of external connection terminals led out from the outer body, is bent to form a bent portion, and a through hole is formed in the bent portion. The external conductor is connected to the other end of the external connection terminal by a screw inserted into the through hole. A nut part combination body made of an insulating material having a plurality of nut parts and ribs connecting the nut parts to each other is sandwiched between the external connection terminal and the heat dissipation plate. A nut portion is arranged in a recess formed between the outer end of the plurality of external connection terminals that is bent and the outer enclosure. The screw that connects the external conductor and is inserted into the through hole of the external connection terminal is connected to the nut portion.
作用 外部導線の外部接続端子への電気的接続と固定、外部接
続端子間及び外部接続端子と放熱板の絶縁、複数ナット
部の取付けの容易性を同時に達成でき、また外部接続端
子と放熱板との間に挟持することによりナット部の脱落
を防止することができる。Function Electrical connection and fixing of external conductors to external connection terminals, insulation between external connection terminals and between external connection terminals and heat sinks, and ease of mounting multiple nut parts can be achieved at the same time. It is possible to prevent the nut portion from falling off by sandwiching the nut portion.
実施例 以下、本考案の実施例を第１図〜第５図について説明す
る。ここでは、電子部品として自動車用イグナイタに使
用される電力用ハイブリッドＩＣを示す。Embodiment An embodiment of the present invention will be described below with reference to FIGS. Here, a power hybrid IC used as an electronic component in an automobile igniter is shown.
本実施例のハイブリッドＩＣは、絶縁材からなる外囲体
（２４）と、外囲体（２４）に取付けられた放熱板（４
９）と、外囲体（２４）から両端が導出された端子部材
（２１）とを有する。板状の５本の端子部材（２１）の
外囲体（２４）の外壁（側面）から導出された部分は外
部接続端子（２２）となっている。外部接続端子（２
２）は、外囲体（２４）の側面側から順に導出部（２２
ａ）と、導出部（２２ａ）に対して略直角に折曲げられ
た折曲部（２２ｂ）とを有している。折曲部（２２ｂ）
には貫通孔（２２ｃ）が形成されている。外囲体（２
４）の側面にはその一部が突出して成る隔壁部（４０）
が形成されている。隔壁分（４０）は隣合う導出分（２
２ａ）の間に位置する。貫通孔（２２ｃ）には従来のよ
うに内ネジが形成されない、このため、ネジ加工に必要
な板厚寸法を見込むことなく、例えば約0.8mmの薄いア
ルミニウム板材で端子部材（２１）全体を成形すること
ができる。The hybrid IC of this embodiment includes an outer enclosure (24) made of an insulating material and a heat dissipation plate (4) attached to the outer enclosure (24).
9) and a terminal member (21) whose both ends are led out from the outer enclosure (24). The portion of the five plate-shaped terminal members (21) derived from the outer wall (side surface) of the outer enclosure (24) serves as an external connection terminal (22). External connection terminal (2
2) is a lead-out portion (22
a) and a bent portion (22b) bent substantially at right angles to the lead-out portion (22a). Bent part (22b)
A through hole (22c) is formed in the. Outer body (2
A partition part (40) formed by projecting a part of it on the side surface of 4).
Are formed. The partition part (40) is adjacent to the derived part (2
Located between 2a). Inner threads are not formed in the through holes (22c) as in the conventional case. Therefore, the entire terminal member (21) is molded with a thin aluminum plate material of, for example, about 0.8 mm without considering the plate thickness dimension required for screw processing. can do.
第３図に示す外部端子集合体（３０）は板厚約0.8mmの
アルミニウム板材からプレス成形される。この外部端子
集合（３０）は連結部（２１ｃ）により５本の端子部材
（２１）が一体に連結されたものである。各端子部材
（２１）にはそれぞれ幅狭部（２１ａ）と幅広部（２１
ｂ）が形成されている。幅広部（２１ｂ）の先端はビス
（５６）の挿通する貫通孔（２２ｃ）を有し、この貫通
孔（２２ｃ）を有した部分は後にほぼ直角に折曲げられ
る。The external terminal assembly (30) shown in FIG. 3 is press-molded from an aluminum plate having a plate thickness of about 0.8 mm. The external terminal set (30) is composed of five terminal members (21) integrally connected by a connecting portion (21c). Each terminal member (21) has a narrow portion (21a) and a wide portion (21a).
b) is formed. The tip of the wide portion (21b) has a through hole (22c) through which the screw (56) is inserted, and the portion having the through hole (22c) is later bent at a substantially right angle.
また、第４図に示すように、外囲体（２４）は上型（３
２）と下型（３３）とから成る成形金型（３４）によっ
て通常の樹脂成形で形成される。外部端子集合体（３
０）は成形空所（３６）を貫通するように下型（３３）
の溝部（３５）に嵌合させて成形金型（３４）に装着す
る。外部端子集合体（３０）は５本の端子部材（２１）
が連結部（２１ｃ）により連なって一体化しているた
め、従来のように個別に分離した複数の端子部材（２
１）を成形金型（３４）に個々に装着する場合に比べて
成形金型（３４）への装着が容易に行える。後に、外部
端子集合体（３０）を挟持するように上型（３２）と下
型（３３）を型締めし、外囲体（２４）に対応した成形
空所（３６）を成形金型（３４）内に形成する。続い
て、ライナ（３７）及びゲート（３８）から成形空所
（３６）に流動化した封止用樹脂を押圧注入して固化さ
せる。封止用樹脂の固化後、上型（３２）と下型（３
３）との離型により外囲体（２４）が得られる。この外
囲体（２４）の側面からは端子部材（２１）の幅広部
（２１ｂ）の先端側が直線状に導出されている。この後
の工程で、外部接続端子（２２）は外囲体（２４）の側
面に対向させてほぼ直角に折曲げられ、導出部（２２
ａ）と貫通孔（２２ｃ）を有する折曲部（２２ｂ）が形
成される。また、第５図に示すように端子部材（２１）
の幅狭部（２１ａ）および連結部（２１ｃ）は外囲体
（２４）の内壁から内側に導出している。なお、５本の
端子部材（２１）のうち両側に位置する２本の幅狭部
（２１ａ）は外囲体（２４）に埋設されている。Further, as shown in FIG. 4, the outer enclosure (24) has an upper mold (3
It is formed by ordinary resin molding by a molding die (34) composed of 2) and a lower die (33). External terminal assembly (3
0) is a lower mold (33) so as to penetrate the molding cavity (36).
It is fitted in the groove portion (35) of (1) and mounted in the molding die (34). The external terminal assembly (30) has five terminal members (21).
Are connected and integrated by a connecting portion (21c), a plurality of terminal members (2
It can be easily mounted on the molding die (34) as compared with the case where 1) is individually mounted on the molding die (34). After that, the upper mold (32) and the lower mold (33) are clamped so as to sandwich the external terminal assembly (30), and a molding cavity (36) corresponding to the outer enclosure (24) is formed in the molding die ( 34). Subsequently, the fluidized sealing resin is pressed and injected from the liner (37) and the gate (38) into the molding space (36) to be solidified. After solidifying the sealing resin, the upper mold (32) and the lower mold (3
An outer envelope (24) is obtained by releasing from 3). The tip end side of the wide portion (21b) of the terminal member (21) is led out linearly from the side surface of the outer enclosure (24). In the subsequent step, the external connection terminal (22) is bent at a substantially right angle so as to face the side surface of the outer enclosure (24), and the lead-out portion (22
A bent portion (22b) having a) and a through hole (22c) is formed. Further, as shown in FIG. 5, the terminal member (21)
The narrow portion (21a) and the connecting portion (21c) are led inward from the inner wall of the outer enclosure (24). Two narrow portions (21a) located on both sides of the five terminal members (21) are embedded in the outer enclosure (24).
また、第２図において、外囲体（２４）は、肉厚部（２
４ａ）および肉厚部（２４ａ）に一体に形成された環状
の肉薄部（２４ｂ）をそれぞれ有する。肉厚部（２４
ａ）の肉薄部（２４ｂ）側とは反対側の外囲体（２４）
の第一の側面には、端子部材（２１）に対応する数の５
個の凹部（３９）が設けられている。これらの凹部（３
９）は導出部（２２ａ）の導出方向および折曲部（２２
ｂ）の折曲げ方向（一方の主面側）に開口している。ま
た、凹部（３９）の両側には外囲体（２４）の一部から
成る隔壁部（４０）が形成されている。隔壁部（４０）
は第５図のように肉厚が突出方向に２段階に変化し、凹
部（３９）側から順に肉厚部（４０ａ）と肉薄部（４０
ｂ）を有する。各端子部材（２１）は隣合う隔壁部（４
０）の間から導出されている。なお、隔壁部（４０）の
うち両端に位置する２つの隔壁部（４０）は肉薄部（４
０ｂ）を有していない。外部接続端子（２２）は隔壁部
（４０）の肉厚部（４０ａ）と肉薄部（４０ｂ）の境界
部分の延長線上近傍で外囲体（２４）の凹部（３９）の
設けられた側面に対して直角に折曲げられている。In addition, in FIG. 2, the outer envelope (24) has a thick portion (2
4a) and an annular thin portion (24b) integrally formed with the thick portion (24a). Thick part (24
Enclosure (24) on the side opposite to the thin portion (24b) side of a)
The first side surface of the has a number of 5 corresponding to the terminal member (21).
Individual recesses (39) are provided. These recesses (3
9) is a derivation direction of the derivation part (22a) and a bent part (22)
It is opened in the bending direction of b) (on one main surface side). Further, partition walls (40) which are parts of the outer enclosure (24) are formed on both sides of the recess (39). Partition part (40)
As shown in FIG. 5, the wall thickness changes in two steps in the protruding direction, and the wall thickness portion (40a) and the wall thickness portion (40) are sequentially arranged from the concave portion (39) side.
b). Each terminal member (21) has an adjacent partition wall (4
0). The two partition walls (40) located at both ends of the partition wall (40) are thin (4
0b). The external connection terminal (22) is provided on a side surface of the outer enclosure (24) provided with the recess (39) near an extension line of a boundary portion between the thick portion (40a) and the thin portion (40b) of the partition wall portion (40). It is bent at a right angle.
即ち、第１図および第２図において、折曲部（２２ｂ）
と外囲体（２４）の側面との間には間隙（収容部）（４
１）が形成される。間隙（４１）は外部接続端子（２
２）の導出部（２２ａ）および折曲部（２２ｂ）と、隔
壁部（４０）の肉厚部（４０ａ）および凹部（３９）に
より囲まれている。間隙（４１）内には後述のようにビ
ス（５６）の挿通するナット部が収容される。That is, in FIG. 1 and FIG. 2, the bent portion (22b)
A space (accommodating portion) (4
1) is formed. The gap (41) is the external connection terminal (2
It is surrounded by the lead-out part (22a) and the bent part (22b) of 2) and the thick part (40a) and the concave part (39) of the partition wall part (40). A nut portion, through which a screw (56) is inserted, is accommodated in the gap (41) as described later.
外囲体（２４）の肉厚部（２４ａ）の一方の主面の延長
上にある肉薄部（２４ｂ）の一方の主面には環状の凸状
（４３）が形成されている。同様に肉薄部（２４ｂ）の
他方の主面には凹部（４４）が環状に形成されている。
端子部材（２１）及び連結部（２１ｃ）を第５図の破線
（２１ｄ）で示す部分で切断すると、５本の端子部材
（２１）が互いに分離され、５本の端子部材（２１）と
外囲体（２４）から成る中間組立体（４５）が完成す
る。本実施例では個別の複数のナットの代わりに、複数
のナット部（６１）を横方向にリブ（連結体）（６２）
で結合して一体に成形したナット部結合体（６０）を用
いる。ナット部結合体（６０）は、合成樹脂又はセラミ
ック等の絶縁材料で形成されている。ナット部結合体
（６０）を中間組立体（４５）に配置するときは、第１
図に示すように外囲体（２４）の肉厚部（２４ａ）及び
肉薄部（２４ｂ）の一方の主面を上向にして中間組立体
（４５）を保持し、中間組立体（４５）の間隙（４１）
にナット部（６１）を配置する。ナット部結合体（６
０）の取付けの際はそのリブ（６２）に形成された孔
（６２ａ）に外囲体（２４）に形成された円柱状の凸部
（６３）に嵌合させる。これにより、ナット部結合体
（６０）を外囲体（２４）に対して仮固定することがで
きる。間隙（４１）内に収容されたナット部（６１）の
ネジ穴（６１ａ）は折曲部（２１ｂ）の貫通孔（２２
ｃ）と略同軸となる。このとき、ナット部（６１）の下
面は外部接続端子（２２）の導出部（２２ａ）に当接
し、両側面は隔壁部（４０）の肉厚部（４０ａ）の壁面
に隣接する。本実施例では外囲体（２４）の側面と折曲
部（２２ｂ）の対向する間隔Ｌ１はナット部（６１）の
厚みＬ２にほぼ等しく、隔壁部（４０）の肉厚部（４０
ａ）の対向する間隔Ｌ３はナット部（６１）の辺長Ｌ４
にほぼ等しい。An annular convex portion (43) is formed on one main surface of the thin portion (24b) which is an extension of one main surface of the thick portion (24a) of the outer enclosure (24). Similarly, a concave portion (44) is formed in an annular shape on the other main surface of the thin portion (24b).
When the terminal member (21) and the connecting portion (21c) are cut at the portion shown by the broken line (21d) in FIG. 5, the five terminal members (21) are separated from each other and the five terminal members (21) and the outside. The intermediate assembly (45) consisting of the enclosure (24) is completed. In this embodiment, instead of the individual nuts, a plurality of nut portions (61) are laterally ribbed (connecting body) (62).
A nut part coupling body (60) that is integrally molded by being coupled with is used. The nut part coupling body (60) is made of an insulating material such as synthetic resin or ceramic. When placing the nut assembly (60) in the intermediate assembly (45), the first
As shown in the figure, the intermediate assembly (45) is held with one main surface of the thick portion (24a) and the thin portion (24b) of the outer enclosure (24) facing upward, and the intermediate assembly (45). Gap (41)
The nut part (61) is arranged in the. Nut part combination (6
0) is attached to the hole (62a) formed in the rib (62) with the cylindrical projection (63) formed in the outer enclosure (24). Thereby, the nut part combination body (60) can be temporarily fixed to the outer enclosure body (24). The screw hole (61a) of the nut portion (61) housed in the gap (41) is a through hole (22) of the bent portion (21b).
It is almost coaxial with c). At this time, the lower surface of the nut part (61) contacts the lead-out part (22a) of the external connection terminal (22), and both side faces are adjacent to the wall surface of the thick part (40a) of the partition part (40). In this embodiment, the distance L 1 between the side surface of the outer enclosure (24) and the bent portion (22b) is substantially equal to the thickness L 2 of the nut portion (61) and the thick portion (40) of the partition wall portion (40).
The interval L 3 facing each other in a) is the side length L 4 of the nut part (61).
Is almost equal to.
また、放熱板（４９）の一方の主面側には回路基板（２
６）、（２７）が固着してあり、放熱板（４９）には外
囲体（２４）の肉薄部（２４ｂ）に設けられた環状の凸
部（４３）に対応する環状の凹部（５０）が形成されて
いる。放熱板（４９）は一方の主面側、つまり凹部（５
０）の設けられた側を上にして配置した後、凹部（５
０）とその周辺部分に接着用樹脂が塗布される。In addition, the circuit board (2
6) and (27) are fixed, and the heat sink (49) has an annular recess (50) corresponding to the annular projection (43) provided in the thin portion (24b) of the outer enclosure (24). ) Has been formed. The heat radiating plate (49) is located on one main surface side, that is, the concave portion (5
(0) is placed with the side on which it is provided facing upward, and then the recess (5
0) and its peripheral portion are coated with an adhesive resin.
その後、第２図に示すように、外囲体（２４）の肉厚部
（２４ａ）及び肉薄部（２４ｂ）の他方の主面側を上向
きにして、かつ外囲体（２４）の肉薄部（２４ｂ）に設
けられ凸部（４３）を放熱板（４９）の凹部（５０）に
嵌合させて、中間組立体（４５）を放熱板（４９）の一
方の主面上に重ねて配置する。このとき、リブ（６２）
はナット部（６１）が形成された一方の主面側が外囲体
（２４）に当接し、他方の主面側が放熱板（４９）に当
接して外囲体（２４）と放熱板（４９）に挟まれて固定
される。なお、リブ（６２）が邪魔にならないように、
放熱板（４９）の先端にはリブ（６２）の厚さ寸法分を
薄くして段付加工してある。また、ナット部結合体（６
０）は外囲体（２４）に軽く固定されているだけである
が、上記作業中に外囲体（２４）から離脱することはな
い。Then, as shown in FIG. 2, the other main surface side of the thick portion (24a) and the thin portion (24b) of the outer enclosure (24) is directed upward, and the thin portion of the outer enclosure (24) is made upward. The convex portion (43) provided on (24b) is fitted into the concave portion (50) of the heat sink (49), and the intermediate assembly (45) is placed on one main surface of the heat sink (49) in an overlapping manner. To do. At this time, the rib (62)
The one main surface side on which the nut portion (61) is formed is in contact with the outer enclosure (24), and the other main surface side is in contact with the heat dissipation plate (49) so that the outer enclosure (24) and the heat dissipation plate (49). ) It is sandwiched and fixed. Make sure that the rib (62) does not get in the way.
The tip of the heat sink (49) is stepped by thinning the rib (62) by the thickness dimension. In addition, the nut unit combination (6
0) is only lightly fixed to the outer enclosure (24), but does not separate from the outer enclosure (24) during the above work.
次いで、回路基板（２６）、（２７）上に固着されたパ
ワートランジスタ等の電子素子と端子部材（２１）の幅
狭部（２１ａ）とをリード細線（５１）及び半田（５
２）によって電気的に接続する。本実施例では端子部材
（２１）が肉薄に形成され熱容量が小さいため、短時間
でリード細線（５１）を半田付けすることができる。ま
た、本実施例では両端の２本の端子部材（２１）が外囲
体（２４）内に埋設されかつ連結部（２１ｃ）の残部が
配線電極とされているため、ハイブリッドＩＣの横幅を
減少して装置の小形化を計ることができるし、複雑な配
線にも容易に対応できる。Next, an electronic element such as a power transistor fixed on the circuit boards (26) and (27) and the narrow portion (21a) of the terminal member (21) are connected to the lead wire (51) and the solder (5).
2) to connect electrically. In this embodiment, since the terminal member (21) is formed thin and has a small heat capacity, the lead thin wire (51) can be soldered in a short time. Further, in this embodiment, since the two terminal members (21) at both ends are embedded in the outer enclosure (24) and the remaining portion of the connecting portion (21c) is a wiring electrode, the width of the hybrid IC is reduced. The size of the device can be reduced and complex wiring can be easily handled.
続いて、第２図に示すように外囲体（２４）の肉薄部
（２４ｂ）にシリコン樹脂（５３）を注入して、カバー
（２５）を外囲体（２４）の凹部（４４）に嵌合する
と、電力用ハイブリッドＩＣが完成する。外囲体（２
４）の内側に導出された端子部材（２１）、回路基板
（２６）、（２７）及びリード細線（５１）はシリコン
樹脂（５３）により封止されている。Subsequently, as shown in FIG. 2, the silicone resin (53) is injected into the thin portion (24b) of the outer envelope (24) to put the cover (25) into the recess (44) of the outer envelope (24). When mated, the hybrid electric power IC is completed. Outer body (2
The terminal member (21), the circuit boards (26) and (27), and the lead thin wire (51) led out to the inside of 4) are sealed with a silicone resin (53).
本実施例による電力ハイブリッドＩＣは以下の効果を有
する。The power hybrid IC according to this embodiment has the following effects.
（１）端子部材（２１）を肉薄に形成できるため、外囲
体（２４）の樹脂成形後に外部端子集合体（３０）を容
易に切断できる。したがって、外囲体（２４）を樹脂成
形する場合、複数の端子部材（２１）が一体となった外
部端子集合体（３０）を使用でき組立作業が簡略化す
る。また、肉薄のため、端子部材（２１）の熱容量が減
少し半田付け作業が容易となり、電力用ハイブリッドＩ
Ｃの生産性を向上することができる。(1) Since the terminal member (21) can be made thin, the external terminal assembly (30) can be easily cut after the outer enclosure (24) is molded with resin. Therefore, when the outer enclosure (24) is resin-molded, the outer terminal assembly (30) in which the plurality of terminal members (21) are integrated can be used, and the assembling work is simplified. Further, since the terminal member (21) is thin, the heat capacity of the terminal member (21) is reduced and the soldering work is facilitated.
The productivity of C can be improved.
（２）第２図に示すように、外部導線（５５）の孔及び
外部接続端子（２２）の折曲げ部（２２ｂ）の貫通孔
（２２ｃ）に挿通したビス（５６）をナット部（６１）
によって固定するため、外部導線（５５）を外部接続端
子（２２）に確実に固定できる。また、締付け時にビス
（５６）の先端部分は凹部（３９）に突出し、ビス（５
６）の先端を凹部（３９）内に突出させた状態でビス
（５６）を強力に締結することができる。(2) As shown in FIG. 2, the screw (56) inserted through the hole of the external conductor (55) and the through hole (22c) of the bent portion (22b) of the external connection terminal (22) is inserted into the nut portion (61). )
The external conductor wire (55) can be securely fixed to the external connection terminal (22) by fixing the external conductor wire (55). When tightening, the tip of the screw (56) projects into the recess (39),
The screw (56) can be strongly fastened with the tip of 6) protruding into the recess (39).
（３）複数のナット部（６１）が結合されたナット部結
合体（６０）を用いるので個別のナット部を扱うよりも
間隙（４１）へのナット部の配置が容易に行える。(3) Since the nut part combination body (60) in which a plurality of nut parts (61) are combined is used, the nut parts can be arranged in the gap (41) more easily than when handling individual nut parts.
（４）リブ（６２）が外囲体（２４）に固定されている
ので中間組立体（４５）の取扱い性が良い。(4) Since the ribs (62) are fixed to the outer enclosure (24), the intermediate assembly (45) is easy to handle.
（５）リブ（６２）が外囲体（２４）と放熱板（４９）
の間に挟まれ、ナット部結合体（６０）が確実に固定さ
れ、ナット部（６１）が間隙（４１）から脱落しないよ
うに保持されているため外部導線（５５）のビス止めを
容易に行える。(5) The rib (62) has an outer casing (24) and a heat sink (49).
Since the nut part combination body (60) is securely fixed and the nut part (61) is held so as not to fall out of the gap (41), the external conductor wire (55) is easily screwed. You can do it.
（６）ナット部結合体（６０）が絶縁性材料から形成さ
れているので、放熱板（４９）をナット部結合体（６
０）の固定用部材として使用できる。(6) Since the nut part combination body (60) is formed of an insulating material, the heat dissipation plate (49) is attached to the nut part combination body (6).
It can be used as a fixing member for 0).
（７）ナット部結合体（６０）が絶縁性材料から形成さ
れているので、放熱板（４９）との絶縁が確実に達成さ
れている。また、外部接続端子（２２）間の電気的短絡
も防止されている。(7) Since the nut assembly (60) is made of an insulating material, insulation with the heat sink (49) is reliably achieved. Moreover, an electrical short circuit between the external connection terminals (22) is also prevented.
変形例 第６図ではリブ（６２）の横幅がナット部（６１）の厚
みより大きいナット部結合体（６０）を使用している。
また、リブ（６２）は放熱板（４９）と外囲体（２４）
に挟持されておらず、外囲体（２４）に固着されてい
る。また、第７図ではナット部（６１）がリブ（６２）
に対して並行に配置されたナット部結合体（６０）を使
用している。この場合、ビス（５６）は外部接続端子
（２２）の導出部（２２ａ）に設けられた孔（２２ｃ）
とリブ（６２）及びナット部（６１）に形成されたネジ
穴に挿入されて取付けられる。実施例ではナット部結合
体（６０）を１つのみ使用した例を示したがナット部結
合体（６０）を複数個使用してもよい。更には、リブ
（６２）を形成せずに個別のナット部を使用してもよ
い。この場合、ナット部の配置に手間がかかるが、ナッ
ト部が絶縁材料から成るので、実施例と同様に放熱板
（４９）をナット部の固定用部材として使用できる。も
ちろん、ナット部を外囲体（２４）等に接着剤で固着し
て固定してもよい。また、第１図に示すナット部結合体
（６０）においてナット部（６１）を複数に分離せずに
一体化させてもよい。Modified Example In FIG. 6, a nut part assembly (60) is used in which the lateral width of the rib (62) is larger than the thickness of the nut part (61).
Further, the ribs (62) are provided on the heat sink (49) and the outer enclosure (24).
It is not sandwiched between the two and is fixed to the outer enclosure (24). Further, in FIG. 7, the nut portion (61) has a rib (62).
A nut part coupling body (60) arranged in parallel with respect to is used. In this case, the screw (56) is a hole (22c) provided in the lead-out portion (22a) of the external connection terminal (22).
Then, the ribs (62) and the nut portion (61) are inserted into and attached to the screw holes formed in the nut portion (61). In the embodiment, the example in which only one nut part coupling body (60) is used is shown, but a plurality of nut part coupling bodies (60) may be used. Furthermore, a separate nut portion may be used without forming the rib (62). In this case, it takes a lot of time to dispose the nut portion, but since the nut portion is made of an insulating material, the heat dissipation plate (49) can be used as a member for fixing the nut portion as in the embodiment. Of course, the nut portion may be fixed to the outer enclosure (24) or the like by being fixed with an adhesive. Further, in the nut part combined body (60) shown in FIG. 1, the nut part (61) may be integrated without being separated into a plurality of parts.
考案の効果 以上のように、本考案の電子部品によれば、生産性の良
好な電子部品を提供できる。従来のように外部接続端子
の貫通孔にネジ切り加工を要しないので、端子部材の薄
肉化が可能である。端子部材の薄肉化によって外囲体の
成形工程を簡略化でき、コスト低減を実現できると共
に、端子部材の熱容量を減少することができる。Effect of the Invention As described above, according to the electronic component of the present invention, an electronic component with good productivity can be provided. Since the through hole of the external connection terminal does not need to be threaded as in the conventional case, the terminal member can be thinned. By thinning the terminal member, the molding process of the outer casing can be simplified, the cost can be reduced, and the heat capacity of the terminal member can be reduced.
第１図〜第７図は、本考案による電子部品の実施例を示
し、第１図は電力用ハイブリッドＩＣの分解斜視図、第
２図は組立側面断面図、第３図は外部端子集合体の平面
図、第４図は外部端子集合体を装着した成形型の断面
図、第５図は離型後の外囲体の平面図、第６図は本考案
の変形例を示す部分的断面図、第７図は本考案の他の変
形例を示す部分的断面図、第８図および第９図は従来例
の側面断面図および正面図を示す。 ２１……端子部材、２１ｃ……連結部、２２ａ……導出
部、２２ｂ……折曲げ部、２２ｃ……貫通孔、２４……
外囲体、３０……外部端子集合体、４０……隔壁部、４
１……間隙（収容部）、４９……放熱板、６０……ナッ
ト部結合体、６１……ナット部、６２……リブ（連結
体）、６１ａ……ネジ穴。1 to 7 show an embodiment of an electronic component according to the present invention. FIG. 1 is an exploded perspective view of a power hybrid IC, FIG. 2 is an assembled side sectional view, and FIG. 3 is an external terminal assembly. FIG. 4 is a cross-sectional view of a molding die having an external terminal assembly attached thereto, FIG. 5 is a plan view of the envelope after release, and FIG. 6 is a partial cross-sectional view showing a modified example of the present invention. FIG. 7 is a partial sectional view showing another modification of the present invention, and FIGS. 8 and 9 are a side sectional view and a front view of a conventional example. 21 ... Terminal member, 21c ... Coupling part, 22a ... Leading part, 22b ... Bent part, 22c ... Through hole, 24 ...
Enclosure, 30 ... External terminal assembly, 40 ... Partition part, 4
1 ... Gap (accommodation part), 49 ... Radiating plate, 60 ... Nut part coupling body, 61 ... Nut part, 62 ... Rib (connecting body), 61a ... Screw hole.
Claims (1)
と、該放熱板に固着した回路基板と、該回路基板上の電
子部品に電気的に接続され且つ前記外囲体から導出され
た複数の外部接続端子とを含み、該外部接続端子の他端
を折曲げて折曲げ部を形成し且つ該折曲げ部に貫通孔を
形成し、該貫通孔に挿入するビスにより前記外部接続端
子の他端に外部導線を連結する電子部品において、 複数のナット部及び該ナット部を互いに連結するリブを
有する絶縁性材料から成るナット部結合体を前記外部接
続端子と前記放熱板の間に挟持し、 複数の前記外部接続端子の各々の折曲げられた他端と前
記外囲体との間に形成した凹部内に前記ナット部を配置
し、 前記外部導線を接続し且つ前記外部接続端子の貫通孔に
挿通したビスを前記ナット部に連結することを特徴とす
る電子部品。1. An outer envelope, a radiator plate attached to the envelope, a circuit board fixed to the radiator plate, electrically connected to an electronic component on the circuit board, and from the envelope body. A plurality of external connection terminals that are led out, the other end of the external connection terminal is bent to form a bent portion, a through hole is formed in the bent portion, and a screw inserted into the through hole In an electronic component that connects an external conductor to the other end of the external connection terminal, a nut part combination body made of an insulating material having a plurality of nut parts and ribs connecting the nut parts to each other is provided between the external connection terminal and the heat dissipation plate. The nut portion is disposed in a recess formed between the outer end of the outer enclosure and the bent other end of each of the plurality of external connection terminals, the external lead wire is connected, and the external connection terminal is connected. Connect the screw inserted in the through hole of to the nut part. Electronic components, characterized in that.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988119331U JPH0628786Y2 (en) | 1988-09-13 | 1988-09-13 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988119331U JPH0628786Y2 (en) | 1988-09-13 | 1988-09-13 | Electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0241375U JPH0241375U (en) | 1990-03-22 |
| JPH0628786Y2 true JPH0628786Y2 (en) | 1994-08-03 |
Family
ID=31364469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988119331U Expired - Lifetime JPH0628786Y2 (en) | 1988-09-13 | 1988-09-13 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0628786Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5855783Y2 (en) * | 1979-03-15 | 1983-12-21 | 富士電機株式会社 | Cases such as electrical equipment |
-
1988
- 1988-09-13 JP JP1988119331U patent/JPH0628786Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0241375U (en) | 1990-03-22 |
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