JPH06279673A - Nonhalogenous flame-retardant polyamide molding material - Google Patents
Nonhalogenous flame-retardant polyamide molding materialInfo
- Publication number
- JPH06279673A JPH06279673A JP5346985A JP34698593A JPH06279673A JP H06279673 A JPH06279673 A JP H06279673A JP 5346985 A JP5346985 A JP 5346985A JP 34698593 A JP34698593 A JP 34698593A JP H06279673 A JPH06279673 A JP H06279673A
- Authority
- JP
- Japan
- Prior art keywords
- magnesium hydroxide
- polyamide
- weight
- flame
- molding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004952 Polyamide Substances 0.000 title claims abstract description 31
- 229920002647 polyamide Polymers 0.000 title claims abstract description 31
- 239000012778 molding material Substances 0.000 title claims abstract description 25
- 239000003063 flame retardant Substances 0.000 title abstract description 10
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title abstract description 5
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims abstract description 33
- 239000000347 magnesium hydroxide Substances 0.000 claims abstract description 33
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims abstract description 33
- 239000003365 glass fiber Substances 0.000 claims abstract description 16
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 15
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 15
- 229920000642 polymer Polymers 0.000 claims abstract description 12
- 125000003118 aryl group Chemical group 0.000 claims description 14
- XWUCFAJNVTZRLE-UHFFFAOYSA-N 7-thiabicyclo[2.2.1]hepta-1,3,5-triene Chemical compound C1=C(S2)C=CC2=C1 XWUCFAJNVTZRLE-UHFFFAOYSA-N 0.000 abstract description 5
- 238000013329 compounding Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 239000004615 ingredient Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 9
- 229920000412 polyarylene Polymers 0.000 description 6
- 239000012779 reinforcing material Substances 0.000 description 6
- 229920002292 Nylon 6 Polymers 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 239000004760 aramid Substances 0.000 description 3
- -1 biphenyl ethers Chemical class 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 150000007974 melamines Chemical class 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 229920001601 polyetherimide Polymers 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 3
- CNPURSDMOWDNOQ-UHFFFAOYSA-N 4-methoxy-7h-pyrrolo[2,3-d]pyrimidin-2-amine Chemical compound COC1=NC(N)=NC2=C1C=CN2 CNPURSDMOWDNOQ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 150000002896 organic halogen compounds Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- XBTRYWRVOBZSGM-UHFFFAOYSA-N (4-methylphenyl)methanediamine Chemical class CC1=CC=C(C(N)N)C=C1 XBTRYWRVOBZSGM-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 description 1
- RLEQVGMLDNITBW-UHFFFAOYSA-N 2,4,4-trimethylhexanedioic acid Chemical compound OC(=O)C(C)CC(C)(C)CC(O)=O RLEQVGMLDNITBW-UHFFFAOYSA-N 0.000 description 1
- QUBNFZFTFXTLKH-UHFFFAOYSA-N 2-aminododecanoic acid Chemical compound CCCCCCCCCCC(N)C(O)=O QUBNFZFTFXTLKH-UHFFFAOYSA-N 0.000 description 1
- HASUJDLTAYUWCO-UHFFFAOYSA-N 2-aminoundecanoic acid Chemical compound CCCCCCCCCC(N)C(O)=O HASUJDLTAYUWCO-UHFFFAOYSA-N 0.000 description 1
- FZZMTSNZRBFGGU-UHFFFAOYSA-N 2-chloro-7-fluoroquinazolin-4-amine Chemical compound FC1=CC=C2C(N)=NC(Cl)=NC2=C1 FZZMTSNZRBFGGU-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004956 Amodel Substances 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- HNBNCTSBZBISGN-UHFFFAOYSA-N NC(C(C)(C1CCCCC1)C1CCCCC1)N Chemical class NC(C(C)(C1CCCCC1)C1CCCCC1)N HNBNCTSBZBISGN-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920013632 Ryton Polymers 0.000 description 1
- 239000004736 Ryton® Substances 0.000 description 1
- 229920004738 ULTEM® Polymers 0.000 description 1
- 229920006097 Ultramide® Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 229920006020 amorphous polyamide Polymers 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 150000004074 biphenyls Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- AVKNGPAMCBSNSO-UHFFFAOYSA-N cyclohexylmethanamine Chemical compound NCC1CCCCC1 AVKNGPAMCBSNSO-UHFFFAOYSA-N 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- KEIQPMUPONZJJH-UHFFFAOYSA-N dicyclohexylmethanediamine Chemical class C1CCCCC1C(N)(N)C1CCCCC1 KEIQPMUPONZJJH-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920006017 homo-polyamide Polymers 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229920006114 semi-crystalline semi-aromatic polyamide Polymers 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009757 thermoplastic moulding Methods 0.000 description 1
- 229920006345 thermoplastic polyamide Polymers 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はポリアミド10乃至60
重量%、熱可塑性芳香族重合体2乃至30重量%、難燃
性付与成分としての水酸化マグネシュウム10乃至50
重量%およびガラス繊維10乃至50重量%を含んでな
る無ハロゲン、耐炎性熱可塑性ポリアミド成形材料に関
する。This invention relates to polyamides 10 to 60.
% By weight, thermoplastic aromatic polymer 2 to 30% by weight, magnesium hydroxide 10 to 50 as a flame retardancy-imparting component
It relates to a halogen-free, flame-resistant thermoplastic polyamide molding composition which comprises 10% by weight and 10 to 50% by weight of glass fibers.
【0002】[0002]
【従来の技術】大量のポリアミド、特にガラス繊維強化
ポリアミドは首尾よく成形材料として、例えば機械組み
立て、電気工学、および家庭用電気器具工学で使用され
る。これらへの応用のために燃焼試験例えばUL94
(Underwriter Laboratories
USA)に準拠する試験の工業的要求に耐えるようポ
リアミドを耐炎性にする必要性がしばしば生ずる。この
目的のために色々の難燃剤が用いられる。しかしそれら
の各々には特定の欠点がある。既知の難燃剤は赤リン、
有機ハロゲン化合物あるいはメラミン塩からなる。BACKGROUND OF THE INVENTION Large quantities of polyamides, especially glass fiber reinforced polyamides, have been successfully used as molding materials, for example in mechanical assembly, electrical engineering, and domestic appliance engineering. For application to these combustion tests such as UL94
(Underwriter Laboratories
There is often a need to make polyamides flame resistant in order to withstand the industrial requirements of tests according to USA). Various flame retardants are used for this purpose. However, each of them has certain drawbacks. The known flame retardant is red phosphorus,
It consists of organic halogen compounds or melamine salts.
【0003】赤リンは主にガラス繊維強化ポリアミド6
6(例えばドイツ特許出願公開第3713746号およ
び欧州特許出願公開第299444号明細書を参照のこ
と)に使用される。リンの固有の赤褐色のため、これで
処理されるポリアミドは暗色で供給できるにすぎない。
さらに、それらは熱と湿気との影響をうけてホスフィン
と燐酸塩を形成する傾向がある。ホスフィンは毒物学的
に疑問のよちがあり、また電機器具の銅含有接触装置を
腐食する。かくして形成される腐食膜は電機絶縁性があ
り、従って通電時発熱し、極端な場合には電機器具の絶
縁破壊に至る。次の有機ハロゲン化合物がポリアミド用
難燃剤として使用されている: − 三酸化アンチモンと組み合わせた臭素化ビフェニル
およびビフェニルエーテル、 − 塩素化環状脂肪族炭化水素、 − 臭素化スチレンオリゴマー、 − 臭素化芳香核を有するポリスチレン 亜鉛塩あるは酸化鉄はさらに共力剤として使用される。Red phosphorus is mainly glass fiber reinforced polyamide 6
6 (see for example DE 37 13 746 and EP 299 444). Due to the inherent reddish brown color of phosphorus, the polyamides treated with it can only be supplied in a dark color.
Furthermore, they tend to form phosphines and phosphates under the influence of heat and moisture. Phosphine is toxicologically questionable and corrodes copper-containing contact devices in electrical equipment. The corroded film thus formed has electrical insulating properties, and therefore generates heat when energized, resulting in dielectric breakdown of electrical equipment in extreme cases. The following organohalogen compounds have been used as flame retardants for polyamides: brominated biphenyls and biphenyl ethers in combination with antimony trioxide, chlorinated cycloaliphatic hydrocarbons, brominated styrene oligomers, brominated aromatic nuclei. Polystyrene zinc salt with or iron oxide is further used as synergist.
【0004】大抵のハロゲンベース難燃剤は通常のポリ
アミドの加工温度で分解を始める。この分解のさい、食
ガスが発生し、電気器具および装置の電気接触部を破壊
する。Most halogen-based flame retardants begin to decompose at the processing temperatures of conventional polyamides. During this decomposition, food gas is generated, which destroys the electrical contacts of appliances and devices.
【0005】メラミン塩は非強化ポリアミドの難燃剤と
して有用であることが明らかとなったばかりである。こ
れらで処理されたポリアミドは淡い固有の色と良好な電
気的性質をもっている。しかし、メラミン塩の比較的低
い分解温度は欠点である。Melamine salts have just become clear to be useful as flame retardants for unreinforced polyamides. Polyamides treated with these have a light intrinsic color and good electrical properties. However, the relatively low decomposition temperature of melamine salts is a drawback.
【0006】ポリアミドに使用されるもう1つの難燃剤
は水酸化マグネシウムである。水酸化マグネシウムの熱
可塑性物質用難燃剤としての使用は知られて久しい(P
lastics and Rubber Proces
sing Applications 6(198
6)、169ー175頁)。熱可塑性物質が耐炎性にな
るように、即ち、例えばUL94に準拠してClass
V0燃焼試験に耐えるように水酸化マグネシウムの用
いられる濃度は関係する熱可塑性物質の固有の耐炎性に
よって決まる。若しこれがポリオレフィンのように非常
に低ければ水酸化マグネシウムの高濃度が必要である。
例えばポリオレフィンでは、必要量は少なくとも60重
量%で、一方EPDMラバーでの必要濃度は少なくとも
70重量%である。脂肪族ポリアミドおよびポリアミド
6,66,610,11または12等のコポリアミドも
また非常に低い固有の耐炎性をもつにすぎない。従って
これまで、同様にそれらを耐炎性にするのに非常に高濃
度の水酸化マグネシウムが必要である。例えば少なくと
もポリアミド6には55重量%が必要であつた。Another flame retardant used in polyamides is magnesium hydroxide. The use of magnesium hydroxide as a flame retardant for thermoplastics has long been known (P
plastics and Rubber Procedures
sing Applications 6 (198
6) 169-175). In order for the thermoplastic to be flame resistant, ie Class according to eg UL94
The concentration of magnesium hydroxide used to withstand the V0 flammability test depends on the inherent flame resistance of the thermoplastic involved. If it is very low, like polyolefins, a high concentration of magnesium hydroxide is needed.
For example, for polyolefins, the required amount is at least 60% by weight, while for EPDM rubber the required concentration is at least 70% by weight. Aliphatic polyamides and copolyamides such as polyamides 6,66, 610, 11 or 12 also have very low intrinsic flame resistance. Thus, so far, very high concentrations of magnesium hydroxide are required to make them flame resistant as well. For example, at least 55% by weight was required for polyamide 6.
【0007】しかし、水酸化マグネシウムをかように高
濃度に組み入れることの必要性は多少の欠点は甘受しな
ければならぬことを意味する。However, the need for such high concentrations of magnesium hydroxide means that some drawbacks must be accepted.
【0008】かくして水酸化マグネシウムの混入は通常
計量した水酸化マグネシウムを2軸押出し機中のポリア
ミド溶融物に添加して行なわれるが、水酸化マグネシウ
ムの必要濃度が高くなればなるほど益々困難になる。そ
のうえ混合は水酸化マグネシウムの濃度が増すにつれて
不経済になる。これは高濃度水酸化マグネシウムのポリ
アミド溶融物中での満足すべき拡散は低押出し速度がも
ちいられるときのみ可能だからである。数ある要因の中
で、これは水酸化マグネシウム粒子がポリアミド溶融物
により充分に湿潤しないことに関連する。この理由のた
めに、大量の不飽和金属石鹸が配合バッチに添加された
り(特開昭53−12943号公報)、オレイン酸アル
カリ金属塩で被覆した水酸化マグネシウムが用いられた
り(欧州特許第52868号明細書)、あるいはさらな
る機能が無水マレイン酸によって付与されているマレイ
ン化ポリオレフィンがバッチに添加されている(欧州特
許第335165号明細書)。しかしこれらの措置は何
れもポリアミドの工業的性質を劣化させた。Thus, the mixing of magnesium hydroxide is usually carried out by adding the measured amount of magnesium hydroxide to the polyamide melt in the twin-screw extruder, but it becomes more difficult as the required concentration of magnesium hydroxide increases. Moreover, mixing becomes uneconomical as the concentration of magnesium hydroxide increases. This is because satisfactory diffusion of concentrated magnesium hydroxide in the polyamide melt is possible only when low extrusion rates are used. Among other factors, this is related to the fact that the magnesium hydroxide particles do not wet well with the polyamide melt. For this reason, a large amount of unsaturated metal soap is added to the compounding batch (Japanese Patent Laid-Open No. 53-12943), or magnesium hydroxide coated with an alkali metal salt of oleic acid is used (European Patent No. 52868). , Or maleated polyolefins whose further function is imparted by maleic anhydride are added to the batch (EP 335165). However, both of these measures deteriorated the industrial properties of polyamide.
【0009】そのうえ、高濃度の水酸化マグネシウムは
ポリアミドー水酸化マグネシウム複合体製造時に付加的
に繊維状強化材料、例えばガラス繊維を混入すると複合
体の機械的性質の改良と熱時寸法安定性向上の可能性を
制限する。In addition, when a high concentration of magnesium hydroxide is mixed with a fibrous reinforcing material such as glass fiber during the production of the polyamide-magnesium hydroxide composite, the mechanical properties of the composite are improved and the dimensional stability under heat is improved. Limit the possibilities.
【0010】[0010]
【発明が解決しようとする課題】これらの理由のため
に、本発明の基本的目的はポリアミドおよびできる限り
低濃度の水酸化マグネシウムからなる無ハロゲン、耐炎
性成形材料を開発することであった。For these reasons, the basic object of the present invention was to develop a halogen-free, flame-resistant molding material consisting of polyamide and magnesium hydroxide in the lowest possible concentration.
【0011】[0011]
【課題を解決するための手段】この目的はポリアミドに
水酸化マグネシウムおよび随意ガラス繊維のほか熱可塑
性芳香族重合体を混入して達成された。This object has been achieved by incorporating in polyamide a magnesium hydroxide and optionally glass fibers as well as a thermoplastic aromatic polymer.
【0012】従って本発明は無ハロゲン、耐炎性熱可塑
性成形材料であつて、 A)ポリアミド10乃至60重量%、好ましくは20乃
至45重量%、 B)熱可塑性芳香族重合体2乃至30重量%、好ましく
は5乃至25重量%、 C)水酸化マグネシウム10乃至50重量%、好ましく
は20乃至40重量%および D)ガラス繊維5乃至50重量%、好ましくは10乃至
30重量%かつA乃至D成分の総計は100重量%を含
んでなる材料に関する。Accordingly, the present invention provides a halogen-free, flame-resistant thermoplastic molding material comprising: A) 10 to 60% by weight of polyamide, preferably 20 to 45% by weight, and B) 2 to 30% by weight of thermoplastic aromatic polymer. , Preferably 5 to 25% by weight, C) 10 to 50% by weight of magnesium hydroxide, preferably 20 to 40% by weight and D) 5 to 50% by weight of glass fiber, preferably 10 to 30% by weight and components A to D Refers to materials comprising 100% by weight.
【0013】本発明による成形材料は上記赤リンあるい
はハロゲン含有難燃剤の欠点を示すことなく耐炎性であ
る。The molding compositions according to the invention are flame-resistant without the disadvantages of the red phosphorus- or halogen-containing flame retardants mentioned above.
【0014】本発明による成形材料のポリアミドは部分
結晶性ポリアミドとアモルファスポリアミドとからなり
ジアミンとジカルボン酸および/あるいは少なくとも5
員環ラクタムあるいは対応するアミノ酸から出発して既
知縮重合法で製造される。適当な出発原料はアジピン
酸、2,2,4ーおよび2,4,4ートリメチルアジピ
ン酸、アゼライン酸、セバシン酸、デカンジカルボン
酸、ドデカンジカルボン酸、イソフタル酸、テレフタル
酸のごとき脂肪族および芳香族ジカルボン酸、ヘキサメ
チレンジアミン、2,2,4ーおよび2,4,4ートリ
メチルヘキサメチレンジアミン、ジアミノージシクロヘ
キシルメタン異性体およびジアミノージシクロヘキシル
プロパン異性体、イソフォロンジアミン、キシレンジア
ミン異性体、ビスアミノメチルシクロヘキサンのごとき
脂肪族および芳香族ジアミンおよびアミノカプロン酸、
アミノウンデカン酸、アミノラウリン酸、あるいは対応
するラクタムのごときアミノカルボン酸からなる。複数
の上記モノマーから形成されるコポリアミドもまた含ま
れる。The polyamide of the molding material according to the invention comprises a partially crystalline polyamide and an amorphous polyamide, a diamine and a dicarboxylic acid and / or at least 5
It is prepared by a known polycondensation method starting from a membered lactam or the corresponding amino acid. Suitable starting materials are aliphatic and aromatic such as adipic acid, 2,2,4- and 2,4,4-trimethyladipic acid, azelaic acid, sebacic acid, decanedicarboxylic acid, dodecanedicarboxylic acid, isophthalic acid, terephthalic acid. Group dicarboxylic acids, hexamethylenediamine, 2,2,4- and 2,4,4-trimethylhexamethylenediamine, diamino-dicyclohexylmethane isomers and diamino-dicyclohexylpropane isomers, isophoronediamine, xylenediamine isomers, bis Aliphatic and aromatic diamines such as aminomethylcyclohexane and aminocaproic acid,
It consists of aminoundecanoic acid, aminolauric acid, or the corresponding aminocarboxylic acids such as lactams. Also included are copolyamides formed from a plurality of the above monomers.
【0015】本発明の意味における熱可塑性芳香族重合
体は、例えばポリーpーフェニレンサルファイド、ポリ
アリーレンエーテル、芳香族ポリスルフォンおよび芳香
族ポリエーテルイミドからなる。この型の熱可塑性芳香
族重合体は商業的に次の商品名で入取できる。例えば、 ポリフェニレンサルファイド:Ryton(商標)、F
ortron(商標)(Philips Petrol
eum/Hoechst) ポリアリーレンエーテル: PPOとPPE(GEと
BASF) ポリスルフォン: Ultrason(商標)
SとUltrason(商標) E(BASF) ポリエーテルイミド: Ultem(商標)(G
E) 芳香族ポリアミド: Amodel(商標)
(AMOCO)、Ultramid 6T(BASF) 何れの型の水酸化マグネシウムも本発明による耐炎性成
形材料に適する。しかし、フレーク状粒子で、比表面積
10ー12 m2/gの水酸化マグネシウムが特に好適
である。最後に、水酸化マグネシウムはそのポリアミド
/ポリアリーレンサルファイドマトリックスとの結合性
を改良するため前処理をしてもよい。Thermoplastic aromatic polymers within the meaning of the invention consist, for example, of poly-p-phenylene sulfides, polyarylene ethers, aromatic polysulfones and aromatic polyetherimides. This type of thermoplastic aromatic polymer is commercially available under the following trade names: For example, polyphenylene sulfide: Ryton ™, F
ortron ™ (Philips Petrol)
eum / Hoechst) Polyarylene ether: PPO and PPE (GE and BASF) Polysulfone: Ultrason ™
S and Ultrason ™ E (BASF) Polyetherimide: Ultem ™ (G
E) Aromatic Polyamide: Amodel ™
Both (AMOCO) and Ultramid 6T (BASF) magnesium hydroxide are suitable for the flame-resistant molding material according to the invention. However, flake-like particles, magnesium hydroxide having a specific surface area of 10 over 12 m 2 / g are particularly preferred. Finally, the magnesium hydroxide may be pretreated to improve its bond with the polyamide / polyarylene sulfide matrix.
【0016】適当な型の水酸化マグネシウムは商業的
に、例えばBergheimのMartinswerk
製のMagnifin H 10、東京協和製のKis
umaE5あるいはLeobenのVeitsche
Nagnesitwerke製のAnkermagなど
の商品名の下で入手できる。Suitable types of magnesium hydroxide are commercially available, for example from Martinswerk of Bergheim.
Magnifin H 10 manufactured by Tokyo, Kis manufactured by Tokyo Kyowa
umaE5 or Leoven's Veitsche
It is available under trade names such as Ankermag from Nagnesitwerke.
【0017】本発明による成形材料は付加的な繊維状強
化材料および/あるいは無機フィラーを含んでいてもよ
い。ガラス繊維のほか、適当な強化材料は炭素繊維、ア
ラミド繊維、無機繊維およびウイスカーからなる。適当
な無機フィラーは、例えば炭酸カルシウム、白雲石、硫
酸カルシウム、マイカ、タルクおよびカオリンからな
る。繊維状強化材料と無機フィラーは機械的性質を改良
するために表面処理を受けてもよい。The molding composition according to the invention may contain additional fibrous reinforcing materials and / or inorganic fillers. Besides glass fibers, suitable reinforcing materials consist of carbon fibers, aramid fibers, inorganic fibers and whiskers. Suitable inorganic fillers consist, for example, of calcium carbonate, dolomite, calcium sulfate, mica, talc and kaolin. The fibrous reinforcing material and the inorganic filler may be surface treated to improve their mechanical properties.
【0018】さらに、本発明による耐炎性成形材料はそ
れらの工学的性質を改良するため他の添加物を含んでい
てもよい。この型の添加物は顔料、熱ーおよび 耐候性
安定剤、離型剤、流れ促進剤からなる。Furthermore, the flame-resistant molding materials according to the invention may contain other additives in order to improve their engineering properties. Additives of this type consist of pigments, heat and weathering stabilizers, release agents, flow promoters.
【0019】本発明による耐炎性成形材料は、一般に最
初ポリアミドとポリアリーレンサルファイドの混合物を
押出し機あるいはニーダ中で溶融し、その後一定量の水
酸化マグネシウム、随意にガラス繊維および随意に他の
強化材料およびフィラーおよび/あるいはさらに添加物
をせん断力を用いて均一に分散されているこれら溶融物
に添加して形成される。The flame-resistant molding composition according to the invention generally comprises first melting a mixture of polyamide and polyarylene sulfide in an extruder or a kneader and then a certain amount of magnesium hydroxide, optionally glass fibers and optionally other reinforcing materials. And fillers and / or further additives are added to these melts which are evenly dispersed using shear forces.
【0020】本発明による耐炎性成形材料の成形品への
加工は通常射出成形によって行なわれ、成形品は押し出
しによって部品に加工される。Processing of the flame-resistant molding material according to the present invention into a molded product is usually carried out by injection molding, and the molded product is processed into a part by extrusion.
【0021】本発明は、本発明による成形材料の成形品
製造のための利用および本発明による成形材料から製造
される成形品に関する。The invention relates to the use of the molding compositions according to the invention for the production of moldings and the moldings produced from the molding compositions according to the invention.
【0022】[0022]
【実施例】次の諸例は、ポリアミド 6、ガラス繊維お
よび水酸化マグネシウムからなる成形材料の耐炎性がポ
リーpーフェニレンサルファイドによって決定的に改良
されること、および例えばポリーpーフェニレンサルフ
ァイドを用いることによって水酸化マグネシウムの濃度
が低くとも耐炎性の成形材料を得ることは可能であるこ
とを示す。EXAMPLES The following examples show that the flame resistance of molding compounds composed of polyamide 6, glass fibers and magnesium hydroxide is decisively improved by poly-p-phenylene sulfide, and that poly-p-phenylene sulfide is used, for example. Thus, it is possible to obtain a flame-resistant molding material even if the concentration of magnesium hydroxide is low.
【0023】次の出発原料が実施例で使用された: − ポリアミド 6:Durethane(商標) B
31F(BayerAG;相対粘度 3Pa.s 1%
mークレゾール溶液中) − ポリーpーフェニレンサルファイド:鎖状ポリフェ
ニレンサルファイド、相対粘度εrel=65 Pa.s
(1000s-1) − ガラス繊維:Bayer Glas 7919、平
均直径11μm;平均長さ4.5mm − 水酸化マグネシウム:Magnifin H 10
(Martinswerk)、加熱減量(1100℃)
40%。The following starting materials were used in the examples: Polyamide 6: Durethane ™ B
31F (Bayer AG; relative viscosity 3 Pa.s 1%
m-cresol solution) -poly-p-phenylene sulfide: chain polyphenylene sulfide, relative viscosity ε rel = 65 Pa.s. s
(1000s -1 ) -Glass fiber: Bayer Glas 7919, average diameter 11 μm; average length 4.5 mm-Magnesium hydroxide: Magnifin H 10
(Martinswerk), heating loss (1100 ° C)
40%.
【0024】実施例中の成形材料はポリアミド6とポリ
ーpーフェニレンサルファイドの混合物を2軸押出し機
(Werner and Pfleiderer製ZS
K32)中溶融し、その後溶融物に一定量のガラス繊維
と水酸化マグネシウムを添加して作られた。一定長さの
円形押出し棒はこの方法で作成した成形材料から押し出
された;この押出し棒はその後粒状化された。1.6m
m厚みのASTM試験片は約300℃の溶融温度で粒状
材料から射出成形された。UL94に準拠した燃焼試験
はこの試験片を用いて行なわれた。The molding material used in the examples is a twin-screw extruder (ZS manufactured by Werner and Pfleiderer) which is a mixture of polyamide 6 and poly-p-phenylene sulfide.
K32) melted and then made by adding a certain amount of glass fiber and magnesium hydroxide to the melt. A length of circular extruded rod was extruded from the molding material made in this way; the extruded rod was then granulated. 1.6m
m thick ASTM specimens were injection molded from granular material at a melting temperature of about 300 ° C. The flammability test according to UL94 was performed using this test piece.
【0025】実施例で用いた成形材料の組成および燃焼
試験の結果を次表に示した。The composition of the molding material used in the examples and the result of the combustion test are shown in the following table.
【0026】[0026]
【表1】 [Table 1]
【0027】n.w.=燃焼試験に耐えず C* =比較例 本発明の主なる特徴および態様は以下の通りである。Nw = does not endure combustion test C * = comparative example The main features and aspects of the present invention are as follows.
【0028】1.A)ポリアミド10乃至60重量%、 B)熱可塑性芳香族重合体2乃至30重量%、 C)水酸化マグネシウム10乃至50重量%および D)ガラス繊維5乃至50重量%を含んでなり、ここで
A乃至D成分の総計が100重量%である、無ハロゲ
ン、耐炎性ポリアミド成形材料。1. Comprising A) 10 to 60% by weight of polyamide, B) 2 to 30% by weight of thermoplastic aromatic polymer, C) 10 to 50% by weight of magnesium hydroxide and D) 5 to 50% by weight of glass fiber, wherein A halogen-free, flame-resistant polyamide molding material in which the total of components A to D is 100% by weight.
【0029】2.A)ポリアミド20乃至45重量%、 B)熱可塑性芳香族重合体5乃至25重量%、 C)水酸化マグネシウム20乃至40重量%および D)ガラス繊維10乃至30重量%を含有することを特
徴とする上記1の成形材料。2. A) 20 to 45% by weight of polyamide, B) 5 to 25% by weight of thermoplastic aromatic polymer, C) 20 to 40% by weight of magnesium hydroxide, and D) 10 to 30% by weight of glass fiber. 1. The molding material according to 1 above.
【0030】3.熱可塑性芳香族重合体がポリアリーレ
ンスリファイド、ポリアリーレンエーテル、ポリスルフ
ォン、ポリエーテルイミドあるいは芳香族ポリアミドで
あることを特徴とする上記1の成形材料。3. 2. The molding material as described in 1 above, wherein the thermoplastic aromatic polymer is polyarylene refined, polyarylene ether, polysulfone, polyetherimide or aromatic polyamide.
【0031】4.熱可塑性芳香族重合体がポリーpーフ
ェニレンサルファイドであることを特徴とする上記3の
成形材料。4. 3. The molding material as described in 3 above, wherein the thermoplastic aromatic polymer is poly-p-phenylene sulfide.
【0032】5.ポリアミドが部分結晶脂肪族ホモポリ
アミドあるいはコポリアミドであることを特徴とする上
記1乃至4の成形材料。5. The molding material according to any one of the above 1 to 4, wherein the polyamide is a partially crystalline aliphatic homopolyamide or copolyamide.
【0033】6.それらが付加的に他の繊維状強化材料
を含有するがその濃度とC)および随意にD)成分の濃
度の総和が成形材料の総量に基ずいて80重量%以下で
あることを特徴とする上記1乃至5の成形材料。6. Characterized in that they additionally contain other fibrous reinforcing materials, but the sum of their concentrations and of the C) and optionally D) components is not more than 80% by weight, based on the total amount of molding compound. The molding material described in 1 to 5 above.
【0034】7.それらが付加的に他の無機フィラーを
含有するがその濃度とC)および随意にD)成分の濃度
の総和が成形材料の総量に基ずいて80重量%以下であ
ることを特徴とする上記1乃至6の成形材料。7. 1 above, characterized in that they additionally contain other inorganic fillers, but their concentration and the sum of the concentrations of C) and optionally D) are below 80% by weight, based on the total amount of molding compound. To 6 molding materials.
【0035】8.上記1乃至7の成形材料の成形体への
利用。8. Use of the molding material according to any one of 1 to 7 as a molded body.
【0036】9.上記1乃至7の成形材料から製造した
成形体。9. A molded body produced from the molding material according to any one of 1 to 7 above.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C08L 71:12 81:06 79:08) (31)優先権主張番号 P4323676.6 (32)優先日 1993年7月15日 (33)優先権主張国 ドイツ(DE) (72)発明者 アジズ・エル・サエド ドイツ連邦共和国51375レーフエルクーゼ ン・ザールラウテルナーシユトラーセ39─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Internal reference number FI technical display location C08L 71:12 81:06 79:08) (31) Priority claim number P43236766.6 (32) Priority Date July 15, 1993 (33) Priority country Germany (DE) (72) Inventor Aziz El Saed Germany 51375 Lef Erkusen Saar Lauterner Siyutraße 39
Claims (3)
A乃至D成分の総計が100重量%である、無ハロゲ
ン、耐焔性ポリアミド成形材料。1. A) 10 to 60% by weight of polyamide, B) 2 to 30% by weight of thermoplastic aromatic polymer, C) 10 to 50% by weight of magnesium hydroxide, and D) 5 to 50% by weight of glass fiber. Wherein the total of components A to D is 100% by weight, a halogen-free, flame-resistant polyamide molding material.
用途。2. Use of the molding material according to claim 1 for producing a molded body.
体。3. A molded body produced from the molding material according to claim 1.
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19934300261 DE4300261A1 (en) | 1993-01-07 | 1993-01-07 | Halogen-free, fire resistant polyamide moulding materials |
DE4300451 | 1993-01-11 | ||
DE19934309965 DE4309965A1 (en) | 1993-01-11 | 1993-03-26 | Halogen-free, fire resistant polyamide moulding materials |
DE4323676.6 | 1993-07-15 | ||
DE4300261.7 | 1993-07-15 | ||
DE4309965.3 | 1993-07-15 | ||
DE4300451.2 | 1993-07-15 | ||
DE19934323676 DE4323676A1 (en) | 1993-07-15 | 1993-07-15 | Flameproofed polyamide moulding compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06279673A true JPH06279673A (en) | 1994-10-04 |
Family
ID=27435673
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5346976A Pending JPH06234913A (en) | 1993-01-07 | 1993-12-27 | Flame-retardant polyamide molding composition |
JP5346985A Pending JPH06279673A (en) | 1993-01-07 | 1993-12-27 | Nonhalogenous flame-retardant polyamide molding material |
JP5346987A Pending JPH06240135A (en) | 1993-01-07 | 1993-12-27 | Highly flame-retardant polyamide molding composition |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5346976A Pending JPH06234913A (en) | 1993-01-07 | 1993-12-27 | Flame-retardant polyamide molding composition |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5346987A Pending JPH06240135A (en) | 1993-01-07 | 1993-12-27 | Highly flame-retardant polyamide molding composition |
Country Status (5)
Country | Link |
---|---|
US (2) | US5416143A (en) |
EP (3) | EP0605861A3 (en) |
JP (3) | JPH06234913A (en) |
DE (1) | DE59309061D1 (en) |
ES (1) | ES2121924T3 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6361848B1 (en) | 1994-12-19 | 2002-03-26 | Mitsubishi Denki Kabushiki Kaisha | Organic and inorganic complex compound and switch using same |
KR100440682B1 (en) * | 2000-12-19 | 2004-07-19 | 주식회사 중앙창호 | Insulating bar |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0675165A1 (en) * | 1994-03-25 | 1995-10-04 | General Electric Company | Extrudable thermoplastic composition comprising a compatibilized polyphenylene ether polyamide resin blend |
JP3812958B2 (en) * | 1994-10-11 | 2006-08-23 | 日本ジーイープラスチックス株式会社 | Thermoplastic resin composition |
JP3556007B2 (en) * | 1995-03-10 | 2004-08-18 | 日本ジーイープラスチックス株式会社 | Polyamide resin composition |
US5916970A (en) * | 1995-06-07 | 1999-06-29 | General Electric Company | Compatibilized blends of polyphenylene ether and polyphthalamide |
US5760132A (en) * | 1995-06-07 | 1998-06-02 | General Electric Company | Compositions of poly(phenylene ether) and polyamide resins, which exhibit improved beard growth reduction |
DE19525873A1 (en) * | 1995-07-15 | 1997-01-16 | Buna Sow Leuna Olefinverb Gmbh | Flame-retardant thermoplastic polyamide molding compounds |
US5714550A (en) | 1995-10-10 | 1998-02-03 | General Electric Company | Flame retardant polyamide-polyphenylene ether compositions |
US5872187A (en) * | 1996-03-11 | 1999-02-16 | General Electric Company | Polyamide resin composition |
US5886096A (en) * | 1996-09-06 | 1999-03-23 | Unitika Ltd. | Polyamide resin composition, and fibers, films and molded articles using the same |
AT405410B (en) * | 1997-05-21 | 1999-08-25 | Chemie Linz Gmbh | INTUMESCENT SEALING AND COVER PROFILES |
US6348122B1 (en) | 1998-01-08 | 2002-02-19 | Compression Polymers Group | Fire retarding polypropylene composition |
EP1083203A1 (en) * | 1999-01-18 | 2001-03-14 | Mitsubishi Denki Kabushiki Kaisha | Switch |
JP2000230118A (en) * | 1999-02-10 | 2000-08-22 | Kuraray Co Ltd | Flame retardant polyamide composition |
US7022404B2 (en) * | 2002-11-01 | 2006-04-04 | World Properties, Inc. | Circuit substrate material, circuits comprising the same, and method of manufacture thereof |
JP4544853B2 (en) * | 2003-12-11 | 2010-09-15 | 株式会社イノアックコーポレーション | Method for producing flame retardant sealing material |
GB2455917B (en) | 2006-08-08 | 2011-08-17 | World Properties Inc | Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
FR2915484B1 (en) * | 2007-04-27 | 2012-10-12 | Rhodia Operations | POLYAMIDE MATERIAL HAVING BARRIER PROPERTIES WITH HIGH FLUIDS. |
US8519273B2 (en) * | 2008-04-10 | 2013-08-27 | Sankar Paul | Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
FR2935144B1 (en) * | 2008-08-25 | 2011-12-16 | Rhodia Operations | USE OF A NOVOLAQUE RESIN FOR INCREASING THE ACID RESISTANCE OF A POLYAMIDE COMPOSITION |
CN102108208B (en) * | 2009-12-29 | 2013-03-20 | 合肥杰事杰新材料股份有限公司 | High-strength flame-retardant polyamide composite material and preparation method |
CN102634196A (en) * | 2012-04-27 | 2012-08-15 | 常熟市发东塑业有限公司 | Preparation method of inflaming-retarding nylon alloy material |
CN102850790A (en) * | 2012-04-27 | 2013-01-02 | 常熟市发东塑业有限公司 | Flame-retarding nylon alloy material |
CN102702736A (en) * | 2012-05-31 | 2012-10-03 | 东莞市帝信光电科技有限公司 | A plastic heat sink for LED light bulbs and production method thereof |
EP3029102A1 (en) | 2014-12-05 | 2016-06-08 | Lanxess Elastomers B.V. | Vulcanizable rubber composition |
EP3133103A1 (en) | 2015-08-21 | 2017-02-22 | LANXESS Deutschland GmbH | Polyamide compositions |
CN106009657A (en) * | 2016-06-24 | 2016-10-12 | 宁波汇邦尼龙科技有限公司 | Flame-retardant and high-heat-resistant contactor nylon material |
CN107286643A (en) * | 2017-07-20 | 2017-10-24 | 沈阳化工大学 | A kind of PA6 flame retardant plastics |
DE102019132294A1 (en) | 2019-11-28 | 2021-06-02 | Carl Freudenberg Kg | Flame retardant polymer composition |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1514081A (en) * | 1975-05-30 | 1978-06-14 | Kyowa Chem Ind Co Ltd | Particulate magnesium hydroxide |
US4508867A (en) * | 1983-11-07 | 1985-04-02 | Polysar Limited | Polymer compositions comprising polyamides, carboxylated (meth)acrylonitrile-butadiene rubber, and nonpolymeric additives |
US4619962A (en) * | 1983-11-07 | 1986-10-28 | Polysar Limited | Thermoplastic polymer compositions |
US4621123A (en) * | 1984-12-20 | 1986-11-04 | Sumitomo Chemical Company, Limited | Phosphinylmethyl polypenols and polyglycidyl ethers thereof |
DE3610595A1 (en) * | 1985-12-06 | 1987-06-11 | Bayer Ag | REINFORCED POLYAMIDES WITH IMPROVED FLOW BEHAVIOR |
US5194458A (en) * | 1987-09-11 | 1993-03-16 | J. M. Huber Corporation | Surface modified fillers and compositions containing the same |
DE3713746A1 (en) * | 1987-04-24 | 1988-11-17 | Basf Ag | FIRE PROTECTED, RED PHOSPHORUS-CONTAINING THERMOPLASTIC MOLDS BASED ON POLYESTERS OR POLYAMIDS |
DE3723688A1 (en) * | 1987-07-17 | 1989-01-26 | Basf Ag | Partly aromatic copolyamides having a reduced triamine content |
DE3810519C1 (en) * | 1988-03-28 | 1989-10-12 | Ems-Inventa Ag, Zuerich, Ch | |
US5021497A (en) * | 1988-06-17 | 1991-06-04 | Ube Industries, Ltd. | Polyarylene sulfide resin composition |
DE3925792A1 (en) * | 1989-08-04 | 1991-02-07 | Bayer Ag | FLAME-RETARDED, NON-DRIPING POLYAMIDE MOLDS |
DE3925791A1 (en) * | 1989-08-04 | 1991-02-07 | Bayer Ag | FLAME-RETARDED, NON-DRIPING POLYAMIDE MOLDS |
DE3934710A1 (en) * | 1989-10-18 | 1991-04-25 | Bayer Ag | IMPROVED METHOD FOR PRODUCING SEMI-FINISHED PRODUCTS / COMPOSITES |
GB8927041D0 (en) * | 1989-11-30 | 1990-01-31 | Bip Chemicals Ltd | Polyamide compositions |
JPH04142365A (en) * | 1990-10-02 | 1992-05-15 | Sumitomo Chem Co Ltd | Stabilized thermoplastic composition |
DE4102104A1 (en) * | 1991-01-25 | 1992-07-30 | Bayer Ag | FLAME-RETARDED, NON-DRIPING POLYAMIDE MOLDS |
BE1005676A3 (en) * | 1992-02-05 | 1993-12-14 | Solvay | Compositions of phenylene polysulphide. |
JP3071550B2 (en) * | 1992-03-16 | 2000-07-31 | 協和化学工業株式会社 | Flame retardant polyamide resin composition and flame retardant |
FR2695395B1 (en) * | 1992-05-22 | 1994-10-28 | Atochem Elf Sa | Polyamide based flame retardant thermoplastic compositions. |
DE4221925A1 (en) * | 1992-07-03 | 1994-01-05 | Bayer Ag | Flame retardant polyamide molding compounds |
-
1993
- 1993-12-27 JP JP5346976A patent/JPH06234913A/en active Pending
- 1993-12-27 JP JP5346985A patent/JPH06279673A/en active Pending
- 1993-12-27 EP EP93120911A patent/EP0605861A3/en not_active Withdrawn
- 1993-12-27 ES ES93120912T patent/ES2121924T3/en not_active Expired - Lifetime
- 1993-12-27 US US08/172,942 patent/US5416143A/en not_active Expired - Fee Related
- 1993-12-27 EP EP93120912A patent/EP0605862B1/en not_active Expired - Lifetime
- 1993-12-27 JP JP5346987A patent/JPH06240135A/en active Pending
- 1993-12-27 US US08/172,944 patent/US5378750A/en not_active Expired - Lifetime
- 1993-12-27 EP EP93120913A patent/EP0605863A3/en not_active Withdrawn
- 1993-12-27 DE DE59309061T patent/DE59309061D1/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6361848B1 (en) | 1994-12-19 | 2002-03-26 | Mitsubishi Denki Kabushiki Kaisha | Organic and inorganic complex compound and switch using same |
US6414067B2 (en) | 1994-12-19 | 2002-07-02 | Mitsubishi Denki Kabushiki Kaisha | Organic and inorganic complex compound and switch using same |
KR100440682B1 (en) * | 2000-12-19 | 2004-07-19 | 주식회사 중앙창호 | Insulating bar |
Also Published As
Publication number | Publication date |
---|---|
EP0605862A3 (en) | 1995-05-17 |
EP0605861A2 (en) | 1994-07-13 |
EP0605862B1 (en) | 1998-10-14 |
EP0605863A2 (en) | 1994-07-13 |
EP0605862A2 (en) | 1994-07-13 |
US5416143A (en) | 1995-05-16 |
ES2121924T3 (en) | 1998-12-16 |
EP0605863A3 (en) | 1995-05-17 |
US5378750A (en) | 1995-01-03 |
EP0605861A3 (en) | 1995-05-17 |
DE59309061D1 (en) | 1998-11-19 |
JPH06234913A (en) | 1994-08-23 |
JPH06240135A (en) | 1994-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH06279673A (en) | Nonhalogenous flame-retardant polyamide molding material | |
KR960012459B1 (en) | Fire-retardant polyamide composition having a good heat resistance | |
JP3068164B2 (en) | Flameproof thermoplastic molding material | |
CA2200576C (en) | Flameproof, glass fibre-reinforced polyamide resin compound with melamine or melem phosphoric acid reaction products as flame retardants | |
CA2036253C (en) | Thermoplastic resin composition | |
Weil et al. | Current practice and recent commercial developments in flame retardancy of polyamides | |
EP1232217B1 (en) | Flame-retardant thermoplastic composition with improved properties | |
JPH10273589A (en) | Flame-retardant polyamide composition | |
KR101118360B1 (en) | Flame retardant polyamide compound | |
TWI414559B (en) | Process for preparing a flame retardant polyamide compound | |
JP2005535754A (en) | Polyamide molding composition and electrical and electronic components having improved thermal stability molded therefrom | |
EP1060215B1 (en) | High-melting polyamide composition for electronic applications | |
JPH1067932A (en) | Flame-retardant high-temperature polyphthalamides having improved heat stability | |
JP3366675B2 (en) | Composition based on polyphenylene sulfide | |
US5389712A (en) | Difficultly flammable polyamide moulding materials | |
EP1629047A1 (en) | Flame retardant polyamide composition | |
JPH0551529A (en) | Resin composition for reflow soldering | |
US4525513A (en) | Flame retardant polyamide composition | |
JPH1121447A (en) | Flame-retardant polyamide resin composition and its production | |
EP0929600A1 (en) | Color stable flame retarded polyamide resin | |
JP2003096295A (en) | Polyamide composition | |
JP2002309083A (en) | Polyamide composition | |
JP4519663B2 (en) | Flame retardant polyamide composition and use thereof | |
JPH11100498A (en) | Flame-retardant polyamide resin composition | |
JP2000265055A (en) | Polyamide composition |