JPH06277863A - Processing method for laminated substrate - Google Patents
Processing method for laminated substrateInfo
- Publication number
- JPH06277863A JPH06277863A JP5069851A JP6985193A JPH06277863A JP H06277863 A JPH06277863 A JP H06277863A JP 5069851 A JP5069851 A JP 5069851A JP 6985193 A JP6985193 A JP 6985193A JP H06277863 A JPH06277863 A JP H06277863A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- circuit board
- processing
- laser beam
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、絶縁層と導電層とを積
層して形成した回路基板（積層基板）に溝や穴を形成す
る積層基板の加工方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a laminated board in which grooves and holes are formed in a circuit board (laminated board) formed by laminating an insulating layer and a conductive layer.
【０００２】[0002]
【従来の技術】回路基板には、絶縁層と銅箔等の導電層
とを積層したものがある。このような回路基板、例えば
フレキシブル基板には、その実装密度を高めるために、
又、回路基板を折り曲げて装置内部に実装すために、回
路基板を折り曲げる溝を形成したり、又、多層の基板で
はスルーホールを形成する必要がある。2. Description of the Related Art There are circuit boards in which an insulating layer and a conductive layer such as a copper foil are laminated. In order to increase the mounting density of such a circuit board, for example, a flexible board,
Further, in order to bend and mount the circuit board inside the device, it is necessary to form a groove for bending the circuit board, or to form a through hole in a multilayer board.
【０００３】このように回路基板に溝や穴を形成する場
合は、機械的な工具を用いて回路基板の導電層を残して
絶縁層のみを除去加工している。例えば、図５(a) に示
すように絶縁層１及び銅箔２から形成される回路基板３
に溝等を形成する場合、機械的な工具４を絶縁層１側か
ら切り込んでこの絶縁層１のみを除去加工している。こ
のように絶縁層１を除去して同図(c) に示すように絶縁
層１と銅箔２との界面を精度高く加工界面とすることに
より、加工歩留まりを低くしている。When forming a groove or a hole in the circuit board as described above, a mechanical tool is used to remove only the insulating layer while leaving the conductive layer of the circuit board. For example, as shown in FIG. 5 (a), a circuit board 3 formed of an insulating layer 1 and a copper foil 2
In the case of forming a groove or the like, the mechanical tool 4 is cut from the insulating layer 1 side and only this insulating layer 1 is removed. In this way, the insulating layer 1 is removed and the interface between the insulating layer 1 and the copper foil 2 is made into a highly accurately processed interface as shown in FIG. 3C, whereby the processing yield is lowered.
【０００４】しかしながら、工具４による切り込み量が
大きいと、同図(b) に示すように工具４が銅箔２を切り
込み、銅箔２の部分に損傷５を与えてしまい、実用が困
難となる。具体的に銅箔２の部分の厚みが小さくこと、
絶縁層１の平面度が必ずしも良いとはいえないことか
ら、機械的な工具４での加工では銅箔２のみを残すこと
は困難である。However, if the amount of cut by the tool 4 is large, the tool 4 cuts the copper foil 2 as shown in FIG. 2B, causing damage 5 to the copper foil 2 part, which makes practical use difficult. . Specifically, the thickness of the copper foil 2 is small,
Since the flatness of the insulating layer 1 is not necessarily good, it is difficult to leave only the copper foil 2 by mechanical processing with the tool 4.
【０００５】一方、レーザビームのみを回路基板３に照
射して加工することも可能であるが、この場合、比較的
厚い絶縁層１を加工すると、加工溝側壁部分の形状精度
が低くなり、又、熱影響を及ぼす層が小さく、加工速度
が遅くなる。On the other hand, it is possible to irradiate only the laser beam onto the circuit board 3 for processing, but in this case, if the relatively thick insulating layer 1 is processed, the shape accuracy of the side wall of the processed groove becomes low, and The heat-affected layer is small and the processing speed is slow.
【０００６】[0006]
【発明が解決しようとする課題】以上のように機械的な
工具４での加工では、銅箔２のみを残して絶縁層１のみ
を除去加工することは困難である。そこで本発明は、高
い精度で導電層のみを残して絶縁層のみを除去加工でき
る積層基板の加工方法を提供することを目的とする。As described above, in the processing with the mechanical tool 4, it is difficult to remove only the insulating layer 1 while leaving only the copper foil 2. Therefore, it is an object of the present invention to provide a method of processing a laminated substrate, which is capable of removing only an insulating layer while leaving only a conductive layer with high accuracy.
【０００７】[0007]
【課題を解決するための手段と作用】本発明は、複数層
を積層して形成された積層基板に対し、先ず機械加工工
程で機械的な加工を施して溝や穴等を形成し、次にレー
ザ加工工程において機械的に加工された部分にレーザビ
ームを照射して所望の層、例えば絶縁層を除去加工して
導電層のみを残す。According to the present invention, a laminated substrate formed by laminating a plurality of layers is first mechanically processed in a machining process to form grooves, holes, etc. In the laser processing step, the portion mechanically processed is irradiated with a laser beam to remove a desired layer, for example, an insulating layer, and leave only the conductive layer.
【０００８】このレーザビームを照射したとき、そのレ
ーザ反射光の光量に応じてレーザビームの照射を調整す
る。例えば、導電層が現れると、そのレーザ反射光の光
量が大きくなり、このときにレーザビームの照射を停止
する。これにより、積層基板に対する加工量を制御し、
絶縁層を除去加工して導電層のみを残す。When this laser beam is irradiated, the irradiation of the laser beam is adjusted according to the light quantity of the laser reflected light. For example, when the conductive layer appears, the amount of laser reflected light increases, and at this time, the laser beam irradiation is stopped. This controls the processing amount for the laminated substrate,
The insulating layer is removed to leave only the conductive layer.
【０００９】[0009]
【実施例】以下、本発明の一実施例について図面を参照
して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【００１０】本発明における積層基板の加工方法は、回
路基板１に対して機械的な加工を施す機械加工工程と、
この機械的に加工された部分にレーザビームを照射して
所望の層を除去加工するレーザ加工工程とから成ってい
る。The laminated substrate processing method according to the present invention comprises a mechanical processing step of mechanically processing the circuit board 1.
A laser processing step of irradiating a laser beam to the mechanically processed portion to remove a desired layer is performed.
【００１１】先ず、機械加工工程では、図５(a) に示す
ように機械的な工具４を絶縁層１側から銅箔２に向かっ
て切り込み、絶縁層１に所要の溝幅に応じた加工幅の切
り込み溝を形成する。この場合、加工深さは、工具４が
銅箔２に達しないように絶縁層１の厚み以下に切り込み
量が制限される。First, in the machining step, as shown in FIG. 5 (a), a mechanical tool 4 is cut from the insulating layer 1 side toward the copper foil 2, and the insulating layer 1 is machined according to the required groove width. Form a notch with a width. In this case, the cutting depth is limited to the thickness of the insulating layer 1 or less so that the tool 4 does not reach the copper foil 2.
【００１２】又、絶縁層１の加工残りの厚みは、場所に
よってばらつきがあってもよい。このような加工によ
り、加工部分の絶縁層１の厚みは、回路基板３の場所に
よって薄いところや厚みのあるところが生じる。すなわ
ち、機械的な工具４による加工では、絶縁層１の厚みや
回路基板３全体のその具合、回路基板３の保持具合など
により加工深さが変わってもよい加工条件を使用する。
次にレーザ加工工程に移る。Further, the thickness of the insulating layer 1 remaining after processing may vary depending on the location. By such processing, the thickness of the insulating layer 1 at the processed portion may be thin or thick depending on the location of the circuit board 3. That is, in the processing with the mechanical tool 4, processing conditions are used in which the processing depth may change depending on the thickness of the insulating layer 1, the degree of the entire circuit board 3, the degree of holding the circuit board 3, and the like.
Next, the laser processing process is performed.
【００１３】このレーザ加工工程では、図１に示すレー
ザ加工装置により機械的に加工された溝の底に残る絶縁
層１部分にレーザビームを照射して絶縁層１を除去加工
して銅箔２のみを残す。ここで、レーザ加工装置の構成
を説明する。In this laser processing step, the insulating layer 1 remaining on the bottom of the groove mechanically processed by the laser processing apparatus shown in FIG. Leave only. Here, the configuration of the laser processing apparatus will be described.
【００１４】テーブル１０上には、回路基板３が載置さ
れている。一方、テーブル１０の上方には、パルスレー
ザ発振器１１が配置されている。このパルスレーザ発振
器１１は、回路基板３の絶縁層１が例えばガラス繊維、
有機物、セラミック等の電気絶縁層で形成されることが
多いため、その材料に合わせたレーザ光線の波長を吸収
するものが用いられている。例えば、ＣＯ2 レーザやエ
キシマレーザ等の遠赤外レーザや紫外線レーザが使用さ
れている。又、エネルギー密度の高い可視、赤外線など
のレーザが使用される。一方、レーザビームの照射にあ
たっては、溝の側壁のレーザビームによる熱影響などに
よる損傷を軽減するためにパルスレーザが使用される。A circuit board 3 is placed on the table 10. On the other hand, a pulse laser oscillator 11 is arranged above the table 10. In the pulse laser oscillator 11, the insulating layer 1 of the circuit board 3 is made of, for example, glass fiber,
Since it is often formed of an electrically insulating layer such as an organic material or ceramic, a material that absorbs the wavelength of a laser beam that matches the material is used. For example, a far infrared laser such as a CO 2 laser or an excimer laser or an ultraviolet laser is used. Further, a visible or infrared laser having a high energy density is used. On the other hand, in irradiating the laser beam, a pulse laser is used in order to reduce the damage on the sidewall of the groove due to the thermal effect of the laser beam.
【００１５】このパルスレーザ発振器１１から出力され
るレーザビームの光路上には、ダイクロイックミラー１
２が配置され、このミラー１２の反射光路上にスリット
板１３、集光レンズ１４が配置されている。The dichroic mirror 1 is provided on the optical path of the laser beam output from the pulse laser oscillator 11.
2 is arranged, and the slit plate 13 and the condenser lens 14 are arranged on the reflection optical path of the mirror 12.
【００１６】又、ダイクロイックミラー１２のレーザビ
ーム透過光路上には、光検出器１５が配置されている。
この光検出器１５は、回路基板３の溝からの反射レーザ
光を受光し、この受光量に応じた信号をパルスレーザ発
振器１１に送る機能を有している。A photodetector 15 is arranged on the laser beam transmission optical path of the dichroic mirror 12.
The photodetector 15 has a function of receiving the reflected laser light from the groove of the circuit board 3 and sending a signal corresponding to the received light amount to the pulse laser oscillator 11.
【００１７】しかるに、このパルスレーザ発振器１１に
は、光検出器１５からの受光量信号を受け、この受光量
が銅箔２からの受光量となったことを判断してパルスレ
ーザの発振を停止する機能が備えられている。かかる構
成であれば、機械加工工程において機械的な工具４によ
り溝が施された回路基板１がテーブル１０上に載置され
る。However, the pulse laser oscillator 11 receives the received light amount signal from the photodetector 15, judges that this received light amount is the received light amount from the copper foil 2, and stops the oscillation of the pulse laser. The function to do is provided. With such a configuration, the circuit board 1 grooved by the mechanical tool 4 is placed on the table 10 in the machining process.
【００１８】この状態に、パルスレーザ発振器１１から
パルスレーザビームが出力されると、このレーザビーム
は、ダイクロイックミラー１２により反射してスリット
板１３に到達し、このスリット板１３で所定幅に絞られ
て集光レンズ１４により集光される。これにより、レー
ザビームは、回路基板１の溝に残る絶縁層１に照射され
る。このレーザビーム照射により溝に残る絶縁層１は、
その熱により除去される。そして、溝に残る絶縁層１が
除去されると、この溝底面に銅箔２が現れる。このよう
に銅箔２が現れると、例えばＣＯ2 レーザ光線の波長に
対する銅箔２の表面からの反射率が大きいため、銅箔２
にはレーザ光線のエネルギー吸収による温度上昇は少な
い。一方、絶縁物に対するＣＯ2 レーザ光線の吸収は大
きい。これにより、溝の底面に残る絶縁層１はきれいに
選択除去される。なお、エキシマレーザでの加工では、
絶縁層１が有機物の場合、紫外線の有機物分解作用によ
って温度上昇を抑えて銅箔２表面の絶縁層１が除去され
る。In this state, when a pulse laser beam is output from the pulse laser oscillator 11, the laser beam is reflected by the dichroic mirror 12 and reaches the slit plate 13, and the slit plate 13 narrows the laser beam to a predetermined width. And is condensed by the condenser lens 14. As a result, the laser beam is applied to the insulating layer 1 remaining in the groove of the circuit board 1. The insulating layer 1 left in the groove by this laser beam irradiation is
It is removed by the heat. Then, when the insulating layer 1 remaining in the groove is removed, the copper foil 2 appears on the bottom surface of the groove. When the copper foil 2 appears in this way, for example, the reflectance from the surface of the copper foil 2 with respect to the wavelength of the CO 2 laser beam is large, and therefore the copper foil 2
The temperature rise due to the absorption of laser beam energy is small. On the other hand, the absorption of the CO 2 laser beam by the insulator is large. As a result, the insulating layer 1 remaining on the bottom surface of the groove is selectively removed cleanly. In addition, in processing with an excimer laser,
When the insulating layer 1 is an organic material, the insulating layer 1 on the surface of the copper foil 2 is removed by suppressing the temperature rise due to the organic substance decomposition action of ultraviolet rays.
【００１９】又、この絶縁層１の選択除去により銅箔２
が現れると、絶縁層１の反射率よりも銅箔２の反射率の
方が大きいので、レーザビーム照射による反射レーザ光
の光量は大きくなる。Further, by selectively removing the insulating layer 1, the copper foil 2 is removed.
When appears, the reflectance of the copper foil 2 is larger than the reflectance of the insulating layer 1, so that the amount of reflected laser light due to laser beam irradiation is large.
【００２０】この反射レーザ光は、集光レンズ１４、ス
リット板１３及びダイクロイックミラー１２を通って光
検出器１５に入射する。この光検出器１５は、反射レー
ザ光を受光し、この受光量に応じた信号をパルスレーザ
発振器１１に送る。The reflected laser light passes through the condenser lens 14, the slit plate 13 and the dichroic mirror 12 and enters the photodetector 15. The photodetector 15 receives the reflected laser light and sends a signal corresponding to the received light amount to the pulse laser oscillator 11.
【００２１】このパルスレーザ発振器１１は、光検出器
１５からの受光量信号を受け、この受光量が銅箔２から
の受光量となったことを判断すると、パルスレーザの発
振を停止する。この結果、図２に示すように回路基板３
の溝底部に残る絶縁層１のみが除去され、銅箔２のみが
残るように除去加工される。The pulse laser oscillator 11 receives the received light amount signal from the photodetector 15 and stops the oscillation of the pulse laser when it judges that the received light amount becomes the received light amount from the copper foil 2. As a result, as shown in FIG.
Is removed so that only the insulating layer 1 remaining at the bottom of the groove is removed and only the copper foil 2 remains.
【００２２】このように上記一実施例においては、回路
基板３に対して機械的な加工を施して溝や穴等を形成
し、次に機械的に加工された溝等にレーザビームを照射
するようにしたので、絶縁層１と銅箔２との界面を高精
度な加工界面とすることができる。As described above, in the above-described embodiment, the circuit board 3 is mechanically processed to form grooves, holes and the like, and then the mechanically processed grooves and the like are irradiated with a laser beam. Since it did in this way, the interface of the insulating layer 1 and the copper foil 2 can be made into a highly accurate processing interface.
【００２３】又、レーザ反射光の光量が大きくなったと
きにレーザビームの照射を停止するので、加工量を制御
でき、溝の底面に残る絶縁層１のみを除去でき、かつ銅
箔２に損傷を与えずに、絶縁層１を除去加工して銅箔２
のみを残すことができる。そのうえ、レーザビーム照射
による加工速度も速くできる。従って、回路基板を折り
曲げるための溝を形成したり、多層の基板に対してスル
ーホールを形成する場合に有効である。なお、本発明は
上記一実施例に限定されるものでなくその要旨を変更し
ない範囲で変形してもよい。例えば、パルスレーザ発振
器１１は、光検出器１５からの受光量信号を受け、反射
レーザ光の光量に応じてパルスレーザ発振を制御するよ
うにしてもよい。Further, since the irradiation of the laser beam is stopped when the amount of the laser reflected light becomes large, the processing amount can be controlled, only the insulating layer 1 remaining on the bottom surface of the groove can be removed, and the copper foil 2 can be damaged. Without applying the insulation layer 1 to remove copper foil 2
You can leave only. In addition, the processing speed by laser beam irradiation can be increased. Therefore, it is effective when forming a groove for bending a circuit board or forming a through hole in a multilayer board. The present invention is not limited to the above-mentioned embodiment, and may be modified within the scope of the invention. For example, the pulse laser oscillator 11 may receive the received light amount signal from the photodetector 15 and control the pulse laser oscillation according to the light amount of the reflected laser light.
【００２４】又、上記一実施例では、溝の加工の場合に
ついて説明したが、穴あけ加工にも同様に適用できる。
すなわち、銅箔２を残して穴あけ加工する場合、絶縁層
１にドリルにより予め穴を開ける。この際、当然ながら
ドリルは絶縁層１から銅箔２に向かい、銅箔２まで達し
ない程度の深さの穴を開ける。この後、パルスのレーザ
ビームを照射することで、穴の底面に残る絶縁層１を除
去し、銅箔２が現れるように加工できる。Further, in the above-mentioned one embodiment, the case of processing the groove has been described, but the same can be applied to the drilling processing.
That is, when the copper foil 2 is left to be drilled, the insulating layer 1 is drilled in advance. At this time, the drill naturally goes from the insulating layer 1 to the copper foil 2 and makes a hole having a depth that does not reach the copper foil 2. After that, by irradiating a pulsed laser beam, the insulating layer 1 remaining on the bottom surface of the hole can be removed, and the copper foil 2 can be processed so as to appear.
【００２５】又、図３に示すように各絶縁層２０、２１
により銅箔２２を挟んだ回路基板２３に対し、両絶縁層
２０、２１側から溝又は穴２４、２５を形成する場合に
も適用できる。Further, as shown in FIG. 3, each insulating layer 20, 21
It is also applicable to the case where the grooves or holes 24 and 25 are formed from the both insulating layers 20 and 21 side in the circuit board 23 sandwiching the copper foil 22 by.
【００２６】さらに、図４に示すように絶縁層３０、３
１及び銅箔３２、３３により形成される多層の回路基板
３４に対して貫通する溝又は穴３５を形成する場合にも
適用でき、銅箔３３までの加工を精度高く、かつ高速で
行える。Further, as shown in FIG. 4, insulating layers 30 and 3 are formed.
It can also be applied to the case of forming a groove or hole 35 penetrating through a multilayer circuit board 34 formed by 1 and the copper foils 32 and 33, and the processing up to the copper foil 33 can be performed with high accuracy and at high speed.
【００２７】[0027]
【発明の効果】以上詳記したように本発明によれば、高
い精度で導電層のみを残して絶縁層のみを除去加工でき
る積層基板の加工方法を提供できる。As described above in detail, according to the present invention, it is possible to provide a method of processing a laminated substrate, which is capable of removing only the insulating layer while leaving only the conductive layer with high accuracy.
【図１】本発明に係わる積層基板の加工方法に適用した
レーザ加工装置の構成図。FIG. 1 is a configuration diagram of a laser processing apparatus applied to a method for processing a laminated substrate according to the present invention.
【図２】同加工方法により形成した溝を示す図。FIG. 2 is a view showing a groove formed by the same processing method.
【図３】同加工方法により形成する溝又は穴の他の例を
示す図。FIG. 3 is a view showing another example of grooves or holes formed by the same processing method.
【図４】同加工方法により形成する溝又は穴の他の例を
示す図。FIG. 4 is a view showing another example of grooves or holes formed by the same processing method.
【図５】従来の加工方法を説明するための図。FIG. 5 is a diagram for explaining a conventional processing method.
【符号の説明】 １…絶縁層、２…銅箔、３…回路基板、１０…テーブ
ル、１１…パルスレーザ発振器、１２…ダイクロイック
ミラー、１３…スリット板、１４…集光レンズ、１５…
光検出器。[Explanation of Codes] 1 ... Insulating layer, 2 ... Copper foil, 3 ... Circuit board, 10 ... Table, 11 ... Pulse laser oscillator, 12 ... Dichroic mirror, 13 ... Slit plate, 14 ... Condensing lens, 15 ...
Photo detector.
Claims (2)
対して機械的な加工を施す機械加工工程と、この機械的
に加工された部分にレーザビームを照射して所望の層を
除去加工するレーザ加工工程とから成ることを特徴とす
る積層基板の加工方法。1. A mechanical processing step of mechanically processing a laminated substrate formed by laminating a plurality of layers, and irradiating a laser beam to the mechanically processed portion to remove a desired layer. A method for processing a laminated substrate, which comprises a laser processing step for processing.
を照射したときに、そのレーザ反射光の光量に応じて前
記レーザビームの照射を調整し、積層基板に対する加工
量を制御するレーザ加工工程であることを特徴とする請
求項１記載の積層基板の加工方法。2. A laser processing step for controlling a processing amount for a laminated substrate by adjusting irradiation of the laser beam according to a light amount of the laser reflected light when the mechanically processed portion is irradiated with the laser beam. The method for processing a laminated substrate according to claim 1, wherein
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5069851A JPH06277863A (en) | 1993-03-29 | 1993-03-29 | Processing method for laminated substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5069851A JPH06277863A (en) | 1993-03-29 | 1993-03-29 | Processing method for laminated substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06277863A true JPH06277863A (en) | 1994-10-04 |
Family
ID=13414735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5069851A Pending JPH06277863A (en) | 1993-03-29 | 1993-03-29 | Processing method for laminated substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06277863A (en) |
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-
1993
- 1993-03-29 JP JP5069851A patent/JPH06277863A/en active Pending
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| US6441337B1 (en) | 1997-12-12 | 2002-08-27 | Matsushita Electric Industrial Co., Ltd. | Laser machining method, laser machining device and control method of laser machining |
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