JPH06270980A - Packaging material - Google Patents

Abstract

PURPOSE:To obtain a packaging material of an electronic part, which protects the packaged electronic parts from being damaged and can be downsized. CONSTITUTION:A molded material 11 of thin plate has an accommodation part 14 where an electronic part 13 is accommodated, and a base 12 is attached on the bottom. As the molded material 11 does not shrink and is guarded from outside by the base 12 which is larger than the molded material 11, the electronic part 13 placed in the accommodation part 14 is not damaged by an external force. In addition, as there is no need to provide an allowance in thickness like corrugated board, a packaging material can be reduced in size.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packing tool used for packing electronic parts and the like.

[0002]

2. Description of the Related Art A conventional packing device will be described below.
The conventional packing has a structure as shown in FIG. That is, a plurality of corrugated cardboard papers 1 were stuck together, and the holes 4 into which the electronic parts 3 were inserted were formed in the corrugated cardboard 2 stuck together.

[0003]

However, since the corrugated cardboard 2 is flexible in such a conventional packing tool, the external force is directly applied to the electronic component 3 during transportation depending on the strength of the external force. However, there is a problem that the electronic component 3 is damaged. In order to solve this problem, for example, it is conceivable to increase the thickness A of the corrugated cardboard 2, but if the thickness A of the corrugated cardboard 2 is increased, the packaging itself becomes large.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a packing device which does not damage the packaged product and is compact.

[0005]

In order to achieve this object, a packing tool of the present invention is provided with a thin plate-shaped molding material having a concave storage part for storing a packaged product and a bottom surface of the molding material. A base material, and the external dimensions of the base material are larger than the external dimensions of the molding material.

[0006]

According to this structure, since the storage portion for the packaged product is formed of the molding material, it does not expand and contract, and the effect of the guard and the reinforcing body can be obtained by making the substrate larger than the molding material. It will be. Therefore, even if an external force is applied to the packaged item stored in the storage section made of this molding material, the packaged item will not be damaged by this external force. In addition, since the molding material does not expand and contract, it is not necessary to have a sufficient thickness as in the case of corrugated board, and the packing tool can be downsized.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a main part of a packing tool according to an embodiment of the present invention, and FIG. 2 is a perspective view of the entire packing tool. Further, FIG. 3 is an exploded view of the packing tool as viewed from below in FIG. Further, FIG. 4 is a cross-sectional view of a main part of the packing tool.

In FIGS. 1 and 2, 11 is a thickness of 0.7.
It is a molding material formed by vacuum resin molding using a conductive PP sheet material of mm. Reference numeral 12 is a base material mounted on the bottom surface of the molding material 11, and the material is a conductive damper plate material having a thickness of 5 mm.

The storage part 14 of the packing tool has a concave shape so that an electronic component (used as an example of the packing product) 13 can be inserted and stored therein. In addition, this insertion portion 14
5 are provided in the lateral direction and 4 in the longitudinal direction of one molding material 11, and eventually 20 (= 5 × 4) electronic components 13 can be stored in one packing tool. .

Here, the relationship between the molding material 11 and the base material 12 is that the vertical dimension B of the base material 12 is larger than the vertical dimension b of the molding material 11 by about 1 cm in FIG. Similarly, the lateral dimension C of the base material 12 is larger than the lateral dimension c of the molded product 11 by about 1 cm. That is, the base material 12 is about 1 cm larger than the molding material 11.
The reason is that it is growing in all directions. Therefore, the external force applied to the packing tool is first guarded and absorbed by the base material 12, so that the electronic component 1 housed in the housing portion 14 of the molding material 11 can be stored.
3 is protected. Further, the outer surface of the convex portion 15 provided on the outer bottom portion 26 of the storage portion 14 in which the electronic component 13 is stored is fitted into the hole 16 provided in the base material 12 and integrated with the molding material 11. As shown in FIG. 4, the leg 17 of the electronic component 13 (or the convex portion of the electronic component 13) is put on the inner surface of the convex portion 15.

A convex portion 18 is formed in the storage portion 14 so that the electronic components 13a and 13b of two sizes can be stored therein without floating. That is,
In the large electronic component 13a, the insertion portion 14 is fully inserted, whereas in the small electronic component 13b, one end surface abuts on the insertion portion 14 end surface and the other end surface abuts on the convex portion 18. It will be fixed.

Next, as shown in FIG. 3, the thickness dimension d of the base material 12 is made slightly larger than the height e of the convex portion 15 (FIG. 3). This is because the shock during transportation is absorbed by the base material 12 and the shock is not directly applied to the molding material 11 and the electronic component 13.
Further, reference numeral 19 shown in FIG. 2 denotes a convex portion provided on the front surface side of the molding material 11, and when the packing including the molding material 11 and the base material 12 is stacked in the upward direction, the movement in the left and right directions is prevented. It is a stopper to prevent it. This stopper 19
Is fixed by being inserted into a hole 20 (FIG. 3) provided in the base material 12 of another packing tool to be stacked thereon. Next, 25 in FIG. 1 is a convex portion provided on the bottom surface 26 of the storage portion 14 and having a height of about 1 mm. This convex portion 25 is an electronic component 1.
Even if the thickness dimension d of the base material 12 is made as small as possible, the tips of the legs 17 of the electronic component 13 may have the protrusions 15
It is provided so as not to come into contact with the inner bottom surface of the. In addition, this allows the side surface 14a (FIG. 4) of the storage portion 14 to be stored.
Since the closest outer bottom surface 26 directly contacts the base material 12, the deformation of the insertion portion 14 due to the external force is reduced.

Further, reference numeral 24 in FIG. 1 is a recess for a handle provided in the molding material 11 to facilitate the taking in and out of the electronic component 13.

Further, reference numeral 21 in FIG. 2 is a handle portion used when loading and unloading the packing device. Reference numeral 22 denotes an inscription stamped on the molding material 11, which is used for organizing packing tools and the like. Further, as shown in FIG. 4, a concave portion 13d is formed on the base material 12 so that a convex shape (for example, a mini pin jack 13c or the like) of the electronic components 13 stacked in the lower stage fits therein.

The operation of the packing device constructed as described below will be described below. One electronic component 13 is inserted into each of the storage portions 14 of the packing tool illustrated in FIGS. 1 and 2.
Then, the packing in which the electronic component 13 is stored is the convex portion 1
9 are fitted into the holes 20 of the base material 12 of the upper packing tool and stacked.

As described above, according to the present embodiment, the thin molded material 1 having the storage portion 14 for storing the electronic component 13 is provided.
A base material 12 is attached to the bottom surface of 1. Forming material 1 here
Since 1 does not expand and contract, the electronic component 13 inserted into the storage portion 14 is not damaged by an external force. Further, unlike the conventional corrugated board 2, it is not necessary to allow the thickness A to have a margin, and the packing tool can be downsized.

Further, the outer dimension of the base material 12 is the molding material 1
Since it is larger than the outer size of No. 1, it is protected by the base material 12 even if an impact by an external force is applied.

Furthermore, since the hole 16 is provided in the base material 12 and the convex portion 15 of the molding material 11 is fitted into the hole 16, it is easy to remove the molding tool of a thin molding material and the packing tool. It is also possible to reduce the overall thickness.

[0019]

As described above, the packing tool of the present invention is composed of a thin-walled molding material having a storage part for storing the packaged goods and a base material mounted on the bottom surface of the molding material. Here, the molding material does not expand and contract, and since the base material is made larger than the molding material to protect external force, the packaged product inserted in the storage part molded with this molding material will be damaged by external force. There is no. Further, since the molding material has hardness, it is not necessary to have a margin in thickness as in the case of molding with a flexible member, and the packing tool can be downsized.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part of a packing device according to an embodiment of the present invention.

FIG. 2 is a perspective view of the same.

FIG. 3 is an exploded perspective view seen from the lower surface side.

FIG. 4 is a sectional view of the same main part.

FIG. 5 is a perspective view of a conventional packing tool.

[Explanation of symbols]

 11 Molding Material 12 Base Material 13 Electronic Component 14 Storage Section 15 Convex Section 16 Hole 26 Bottom Surface

Claims (2)

[Claims] 1. A thin plate-shaped molding material having a concave storage portion for storing a packaged product, and a base material mounted on the bottom surface of the molding material, wherein the outer shape of the base material is larger than the outer dimensions of the molding material. Packing tool with larger dimensions. 2. The packing device according to claim 1, wherein a hole is provided in the base material, and a convex portion of an outer bottom portion of the molding material is fitted into the hole.