JPH0625635A - Non-halogen adhesive composition - Google Patents
Non-halogen adhesive compositionInfo
- Publication number
- JPH0625635A JPH0625635A JP18083292A JP18083292A JPH0625635A JP H0625635 A JPH0625635 A JP H0625635A JP 18083292 A JP18083292 A JP 18083292A JP 18083292 A JP18083292 A JP 18083292A JP H0625635 A JPH0625635 A JP H0625635A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- polycarbonate resin
- solvent
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 29
- 239000000203 mixture Substances 0.000 title claims abstract description 14
- 229910052736 halogen Inorganic materials 0.000 title claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 20
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 18
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 16
- 125000003118 aryl group Chemical group 0.000 claims abstract description 15
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims abstract description 7
- 150000002367 halogens Chemical class 0.000 claims abstract description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 30
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 12
- -1 aliphatic cyclic ether compound Chemical class 0.000 claims description 7
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 150000008282 halocarbons Chemical class 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 229920000402 bisphenol A polycarbonate polymer Polymers 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 230000002087 whitening effect Effects 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 2
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000012696 Interfacial polycondensation Methods 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000012074 organic phase Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 1
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 1
- BKTRENAPTCBBFA-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-phenylphenyl)propan-2-yl]-2-phenylphenol Chemical compound C=1C=C(O)C(C=2C=CC=CC=2)=CC=1C(C)(C)C(C=1)=CC=C(O)C=1C1=CC=CC=C1 BKTRENAPTCBBFA-UHFFFAOYSA-N 0.000 description 1
- IJWIRZQYWANBMP-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-propan-2-ylphenyl)propan-2-yl]-2-propan-2-ylphenol Chemical compound C1=C(O)C(C(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)C)=C1 IJWIRZQYWANBMP-UHFFFAOYSA-N 0.000 description 1
- CYYZDBDROVLTJU-UHFFFAOYSA-N 4-n-Butylphenol Chemical compound CCCCC1=CC=C(O)C=C1 CYYZDBDROVLTJU-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000011978 dissolution method Methods 0.000 description 1
- GRWZHXKQBITJKP-UHFFFAOYSA-L dithionite(2-) Chemical compound [O-]S(=O)S([O-])=O GRWZHXKQBITJKP-UHFFFAOYSA-L 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
(57)【要約】
【目的】 熱転写フィルム等の耐熱性フィルムの接着に
有効な、ハロゲン系溶媒を使用しない芳香族ポリカーボ
ネート樹脂系接着剤を提供する。
【構成】 特定の芳香族炭化水素溶媒に、特定の分子量
を有する非晶性芳香族ポリカーボネート樹脂を溶解して
なる非ハロゲン系接着剤組成物。(57) [Abstract] [PROBLEMS] To provide an aromatic polycarbonate resin-based adhesive agent that is effective for adhering a heat-resistant film such as a heat transfer film and does not use a halogen-based solvent. A halogen-free adhesive composition obtained by dissolving an amorphous aromatic polycarbonate resin having a specific molecular weight in a specific aromatic hydrocarbon solvent.
Description
【0001】[0001]
【産業上の利用分野】本発明は、接着剤組成物に関する
ものであり、更に詳しくは、熱転写フィルム等の耐熱性
フィルムの接着に適した、ハロゲン系溶媒を使用しない
芳香族ポリカーボネート樹脂系接着剤組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive composition, and more specifically, an aromatic polycarbonate resin adhesive which does not use a halogen solvent and is suitable for adhering a heat resistant film such as a thermal transfer film. It relates to a composition.
【0002】[0002]
【従来の技術】従来、2,2−ビス(4−ヒドロキシフ
ェニル)プロパン[通称ビスフェノールA]にホスゲン
やジフェニルカーボネートを反応させて得られるビスフ
ェノールAポリカーボネート樹脂は透明性、耐熱性、機
械的特性、寸法安定性が優れているがゆえにエンジニア
リングプラスチックとして多くの分野に広く使用されて
いる。またこの芳香族ポリカーボネート樹脂をハロゲン
化炭化水素系の溶媒に溶解して熱転写フィルム等の耐熱
性フィルムの接着剤として利用することも行なわれてい
る。ところが近年ハロゲン化炭化水素系の溶媒は環境衛
生上の問題、装置の腐食の問題からその使用が制限され
てきており、ハロゲン化炭化水素系溶媒を使用しない接
着剤の開発が望まれている。なお熱転写フィルム等の耐
熱性フィルムの材料はポリエチレンテレフタレート樹脂
やビスフェノールAポリカーボネート樹脂等が多く使用
される。2. Description of the Related Art Conventionally, a bisphenol A polycarbonate resin obtained by reacting 2,2-bis (4-hydroxyphenyl) propane [commonly known as bisphenol A] with phosgene or diphenyl carbonate is transparent, heat resistant, mechanically It is widely used in many fields as an engineering plastic due to its excellent dimensional stability. It is also practiced to dissolve this aromatic polycarbonate resin in a halogenated hydrocarbon solvent and use it as an adhesive for heat-resistant films such as thermal transfer films. However, in recent years, the use of halogenated hydrocarbon solvents has been restricted due to environmental hygiene problems and equipment corrosion problems, and the development of adhesives that do not use halogenated hydrocarbon solvents is desired. In addition, polyethylene terephthalate resin, bisphenol A polycarbonate resin, and the like are often used as materials for heat-resistant films such as thermal transfer films.
【0003】[0003]
【発明が解決しようとする課題】本発明は、熱転写フィ
ルム等の耐熱性フィルムの接着に有効で、かつハロゲン
化炭化水素系溶媒を使用しない芳香族ポリカーボネート
樹脂系接着剤を提供することを目的とするものである。SUMMARY OF THE INVENTION It is an object of the present invention to provide an aromatic polycarbonate resin adhesive which is effective in adhering a heat resistant film such as a heat transfer film and which does not use a halogenated hydrocarbon solvent. To do.
【0004】本発明者は、上記目的を達成せんとして鋭
意検討を重ねた結果、特定の分子量を有する非晶性の芳
香族ポリカーボネート樹脂を、特定の非ハロゲン系溶媒
に溶解すれば、接着剤として用いた場合に良好な接着性
能を示すことを見出し、本発明に到達した。The present inventor, as a result of extensive studies aimed at achieving the above object, has found that if an amorphous aromatic polycarbonate resin having a specific molecular weight is dissolved in a specific non-halogen solvent, it will be used as an adhesive. It has been found that when used, it exhibits good adhesion performance, and has reached the present invention.
【0005】[0005]
【課題を解決するための手段】本発明は、 (A)炭素数6
〜12の芳香族炭化水素100重量部、 (B)炭素数3〜
6の脂肪族環状エーテル化合物0〜100重量部及び
(C)酢酸、メチルイソブチルケトン、n-ブタノールから
選ばれた少なくとも一種0〜2重量部よりなる溶媒に、
0.7g を塩化メチレン100mlに溶解し20℃で測定
した比粘度が0.12〜1.04の非晶性芳香族ポリカ
ーボネート樹脂を1〜50重量%溶解してなる非ハロゲ
ン系接着剤組成物に係るものである。The present invention provides (A) 6 carbon atoms.
~ 12 aromatic hydrocarbons 100 parts by weight, (B) carbon number 3 ~
0 to 100 parts by weight of the aliphatic cyclic ether compound of 6 and
(C) at least one solvent selected from acetic acid, methyl isobutyl ketone, and n-butanol in a solvent consisting of 0 to 2 parts by weight,
A non-halogen adhesive composition comprising 0.7 g of methylene chloride dissolved in 100 ml of methylene chloride and 1 to 50% by weight of an amorphous aromatic polycarbonate resin having a specific viscosity of 0.12 to 1.04 measured at 20 ° C. It is related to.
【0006】本発明の接着剤組成物で使用する溶媒は、
(A)炭素数6〜12の非ハロゲン化芳香族炭化水素であ
り、特にベンゼン、トルエン、キシレン等の低沸点の芳
香族炭化水素が好ましい。また、かかる芳香族炭化水素
には同量以下の量の (B)炭素数3〜6の脂肪族環状エー
テル化合物を混合してもよい、即ち上記芳香族炭化水素
100重量部に上記脂肪族環状エーテルを100重量部
以下混合してもよく、更に (C)酢酸、メチルイソブチル
ケトン、n-ブタノールから選ばれた少なくとも一種を2
重量部以下の量で混合してもよい。 (B)炭素数3〜6の
脂肪族環状エーテル化合物としてはテトラヒドロフラ
ン、ジオキサン、トリオキサン等が好ましい。The solvent used in the adhesive composition of the present invention is
(A) A non-halogenated aromatic hydrocarbon having 6 to 12 carbon atoms, particularly low-boiling point aromatic hydrocarbons such as benzene, toluene and xylene. Further, the aromatic hydrocarbon may be mixed with an equal amount or less of (B) an aliphatic cyclic ether compound having 3 to 6 carbon atoms, that is, 100 parts by weight of the aromatic hydrocarbon is mixed with the aliphatic cyclic compound. 100 parts by weight or less of ether may be mixed, and at least one selected from the group consisting of (C) acetic acid, methyl isobutyl ketone, and n-butanol.
You may mix in the quantity below a weight part. As the aliphatic cyclic ether compound having 3 to 6 carbon atoms (B), tetrahydrofuran, dioxane, trioxane and the like are preferable.
【0007】本発明で使用するポリカーボネート樹脂
は、非晶性の芳香族ポリカーボネート樹脂であり、下記
に示す二価フェノールにカーボネート前駆物質を反応さ
せて得られる。通常はホスゲンを用いた界面重縮合又は
ジフェニルカーボネートを用いたエステル交換法により
得られる。The polycarbonate resin used in the present invention is an amorphous aromatic polycarbonate resin, which is obtained by reacting the following dihydric phenol with a carbonate precursor. Usually, it is obtained by an interfacial polycondensation using phosgene or a transesterification method using diphenyl carbonate.
【0008】ここで使用する二価フェノールとしては、
例えば1,1−ビス(4−ヒドロキシフェニル)エタ
ン、1,1−ビス(4−ヒドロキシフェニル)−1−フ
ェニルエタン、2,2−ビス(3−メチル−4−ヒドロ
キシフェニル)プロパン、1,1−ビス(4−ヒドロキ
シフェニル)シクロヘキサン、2,2−ビス(3−フェ
ニル−4−ヒドロキシフェニル)プロパン、2,2−ビ
ス(3−イソプロピル−4−ヒドロキシフェニル)プロ
パン、2,2−ビス(4−ヒドロキシフェニル)ブタ
ン、2,2−ビス(3,5−ジメチル−4−ヒドロキシ
フェニル)プロパン等があげられる。なかでも1,1−
ビス(4−ヒドロキシフェニル)シクロヘキサン[通称
ビスフェノールZ]及び1,1−ビス(4−ヒドロキシ
フェニル)−1−フェニルエタン[通称ビスフェノール
AP]が特に好ましい。これらの二価フェノールは一種単
独で使用しても又は二種以上を併用しても差支えない。
また、結晶性を発現しない範囲の量であれば、2,2−
ビス(4−ヒドロキシフェニル)プロパン[通称ビスフ
ェノールA]のように結晶性芳香族ポリカーボネート樹
脂を与える二価フェノールを共重合してもよい。共重合
方法は、二種以上の二価フェノールを同時に用いるか、
別々に合成したオリゴマーを混合して重合する等の通常
の方法を用いることができる。As the dihydric phenol used here,
For example, 1,1-bis (4-hydroxyphenyl) ethane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, 2,2-bis (3-methyl-4-hydroxyphenyl) propane, 1, 1-bis (4-hydroxyphenyl) cyclohexane, 2,2-bis (3-phenyl-4-hydroxyphenyl) propane, 2,2-bis (3-isopropyl-4-hydroxyphenyl) propane, 2,2-bis Examples include (4-hydroxyphenyl) butane and 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) propane. Among them 1,1-
Bis (4-hydroxyphenyl) cyclohexane [common name bisphenol Z] and 1,1-bis (4-hydroxyphenyl) -1-phenylethane [common name bisphenol]
AP] is particularly preferred. These dihydric phenols may be used alone or in combination of two or more.
In addition, if the amount is within the range where the crystallinity is not expressed, 2,2-
A dihydric phenol that gives a crystalline aromatic polycarbonate resin such as bis (4-hydroxyphenyl) propane [commonly called bisphenol A] may be copolymerized. The copolymerization method uses two or more dihydric phenols at the same time,
An ordinary method such as mixing and polymerizing separately synthesized oligomers can be used.
【0009】非晶性の芳香族ポリカ−ボネ−ト樹脂を使
用せず、2,2−ビス(4−ヒドロキシフェニル)プロ
パン[通称ビスフェノールA]からなるような結晶性芳
香族ポリカーボネート樹脂を主成分とした接着剤組成物
では、接着面に白化現象がおこり、透明性を損ない好ま
しくない。A crystalline aromatic polycarbonate resin composed of 2,2-bis (4-hydroxyphenyl) propane [commonly called bisphenol A] is used as a main component without using an amorphous aromatic polycarbonate resin. In the adhesive composition described above, a whitening phenomenon occurs on the adhesive surface and the transparency is impaired, which is not preferable.
【0010】本発明で使用する非晶性の芳香族ポリカ−
ボネ−ト樹脂の分子量は、ポリマー0.7g を100ml
の塩化メチレンに溶解し、20℃で測定して得られる比
粘度で示して0.12〜1.04であり、0.23〜
0.90が好ましい。比粘度が0.12未満のものを使
用したのでは接着強度が弱く、1.04より高いもので
は溶媒に溶け難く、作業性が悪くなるので適当でない。
また、芳香族ポリカ−ボネ−ト樹脂には安定剤、耐候剤
等の添加剤を、接着性を損なわない範囲で添加すること
ができる。Amorphous aromatic polycarbonate used in the present invention
The molecular weight of the bonnet resin is 0.7 g of polymer to 100 ml.
Dissolved in methylene chloride and measured at 20 ° C. to give a specific viscosity of 0.12 to 1.04, and 0.23 to
0.90 is preferred. If the specific viscosity is less than 0.12, the adhesive strength is weak, and if the specific viscosity is higher than 1.04, it is difficult to dissolve in the solvent and the workability is deteriorated.
Further, additives such as a stabilizer and a weathering agent can be added to the aromatic polycarbonate resin within a range that does not impair the adhesiveness.
【0011】ホスゲンを用いた界面重縮合反応は、通常
酸結合剤の水溶液及び溶媒の存在下に行う。酸結合剤と
しては例えばピリジン、水酸化ナトリウム、水酸化カリ
ウム等アルカリ金属水酸化物等が用いられる。溶媒とし
ては例えば塩化メチレン、クロロベンゼン等のハロゲン
化炭化水素が用いられる。また、反応促進のために例え
ば第三級アミン、第四級アンモニウム塩等の触媒を用い
ることができ、分子量調節剤として例えばフェノール、
p-tert−ブチルフェノール等の末端停止剤を用いること
が望ましい。更に、予め脱気した溶媒を用いたり、水溶
液に少量のハイドロサルファイト等の酸化防止剤を添加
し、窒素ガス雰囲気中でホスゲン化してもよい。The interfacial polycondensation reaction using phosgene is usually carried out in the presence of an aqueous solution of an acid binder and a solvent. As the acid binder, for example, an alkali metal hydroxide such as pyridine, sodium hydroxide or potassium hydroxide is used. As the solvent, for example, a halogenated hydrocarbon such as methylene chloride or chlorobenzene is used. Further, for the purpose of accelerating the reaction, for example, a tertiary amine, a catalyst such as a quaternary ammonium salt can be used, and as a molecular weight regulator, for example, phenol,
It is desirable to use a terminating agent such as p-tert-butylphenol. Further, phosgenation may be carried out in a nitrogen gas atmosphere by using a solvent that has been degassed in advance or by adding a small amount of an antioxidant such as hydrosulfite to the aqueous solution.
【0012】本発明の接着剤組成物は、上記非晶性の芳
香族ポリカーボネート樹脂を上記溶媒に溶解して調製す
る。溶解方法は溶媒を撹拌しながら樹脂を添加する等の
通常の方法が用いられる。溶解量は上記樹脂濃度が1〜
50重量%となる量である。樹脂濃度が1重量%未満で
は充分な接着効果が得られず、50重量%より多くなる
と溶媒への溶解に時間がかかり且つ溶液粘度も大きくな
りすぎて取扱い上適当でない。本発明の接着剤組成物に
よる接着方法は、接着する物体の表面に溶液を塗布した
後圧着する等の通常の方法が用いられる。The adhesive composition of the present invention is prepared by dissolving the above amorphous aromatic polycarbonate resin in the above solvent. As a dissolution method, a usual method such as adding a resin while stirring a solvent is used. The amount of dissolution is 1 to the above resin concentration
The amount is 50% by weight. When the resin concentration is less than 1% by weight, a sufficient adhesive effect cannot be obtained, and when it exceeds 50% by weight, it takes time to dissolve in a solvent and the solution viscosity becomes too large, which is not suitable for handling. As the method for adhering with the adhesive composition of the present invention, a usual method such as applying a solution to the surface of an object to be adhered and then performing pressure bonding is used.
【0013】[0013]
【実施例】以下に実施例をあげて本発明を更に説明す
る。なお、実施例中の部及び%は夫々重量部及び重量%
である。 比粘度:ポリマー0.7g を100mlの塩化メチレンに
溶解し、20℃で測定した。 引張り接着強度:ASTM D−897に準じて測定し、10
0kg/cm2 以上を合格とした。EXAMPLES The present invention will be further described with reference to the following examples. In the examples, parts and% are parts by weight and% by weight, respectively.
Is. Specific viscosity: 0.7 g of polymer was dissolved in 100 ml of methylene chloride and measured at 20 ° C. Tensile adhesive strength: measured according to ASTM D-897, 10
A grade of 0 kg / cm 2 or more was accepted.
【0014】[0014]
【合成例1】ホスゲン吹込管、還流冷却器付き反応槽に
イオン交換水346.4部および48.5%の水酸化ナ
トリウム水溶液58.38部を仕込み、ビスフェノール
Z42.34部を溶解させた後、塩化メチレン169.
7部を加えて激しく撹拌しながら25℃でホスゲン1
9.5部を約40分を要して吹込み反応させた。次いで
内温を30℃に昇温し、p-tert−ブチルフェノール0.
727部を加えて乳化した後トリエチルアミン0.05
部を加えて2時間撹拌を続けて反応を終了した。[Synthesis Example 1] 346.4 parts of ion-exchanged water and 58.38 parts of 48.5% sodium hydroxide aqueous solution were charged into a reaction tank equipped with a phosgene blow-in tube and a reflux condenser, and after dissolving 42.34 parts of bisphenol Z. , Methylene chloride 169.
Add 7 parts of phosgene 1 at 25 ° C with vigorous stirring.
About 9.5 parts was required for about 40 minutes to carry out a reaction by blowing. Then, the internal temperature was raised to 30 ° C., and p-tert-butylphenol 0.
After adding 727 parts and emulsifying, triethylamine 0.05
Part of the mixture was added and stirring was continued for 2 hours to complete the reaction.
【0015】反応終了後有機相を分離し、塩化メチレン
で希釈して水洗した後塩酸にて中和し、水洗を繰返し
て、水相の導電率がイオン交換水と略等しくなったとこ
ろで有機相を分離し、塩化メチレンを蒸発させながら粉
砕してパウダ−を得た。このパウダ−の比粘度は0.3
64であった。After completion of the reaction, the organic phase is separated, diluted with methylene chloride, washed with water, neutralized with hydrochloric acid, and repeatedly washed with water. When the conductivity of the aqueous phase becomes almost equal to that of ion-exchanged water, the organic phase is separated. Was separated and pulverized while evaporating methylene chloride to obtain a powder. The specific viscosity of this powder is 0.3.
It was 64.
【0016】[0016]
【合成例2】合成例1で使用した装置にイオン交換水2
3800部、48.5%の水酸化ナトリウム水溶液27
38.4部を仕込み、ビスフェノールAP3566.1部
を溶解させた。次いで塩化メチレン16700部を仕込
み、合成例1と同様にしてホスゲン1400部を約45
分かけて吹込んだ。次いでp-tert−ブチルフェノールを
129.1部及び48.5%水酸化ナトリウム水溶液5
06.8部を加え、合成例1と同様にしてパウダーを得
た。このパウダーの比粘度は0.234であった。[Synthesis example 2] Ion-exchanged water 2 was added to the apparatus used in synthesis example 1.
3800 parts, 48.5% sodium hydroxide aqueous solution 27
38.4 parts were charged and bisphenol AP3566.1 parts was dissolved. Then, 16700 parts of methylene chloride was charged, and 1400 parts of phosgene was added to about 45 in the same manner as in Synthesis Example 1.
It took a minute to blow. Then, 129.1 parts of p-tert-butylphenol and a 48.5% aqueous sodium hydroxide solution 5
Powder was obtained in the same manner as in Synthesis Example 1 by adding 06.8 parts. The specific viscosity of this powder was 0.234.
【0017】[0017]
【実施例1】厚さ0.5mmのポリエチレンテレフタレー
トフィルム[帝人(株)製]を20mm×100mmに切断
し、端部5mm部分に合成例1で合成したポリカーボネー
トをトルエンに25%溶解した溶液を塗布し、重ね合わ
せて荷重12kg/cm2 で7日間接着した。接着試験片に
は白化も発泡も見られず、引張り接着強度は合格であっ
た。Example 1 A polyethylene terephthalate film [manufactured by Teijin Ltd.] having a thickness of 0.5 mm was cut into 20 mm × 100 mm, and a solution prepared by dissolving 25% of the polycarbonate synthesized in Synthesis Example 1 in toluene was cut into a 5 mm edge portion. They were applied, overlapped and adhered under a load of 12 kg / cm 2 for 7 days. No whitening or foaming was observed in the adhesive test piece, and the tensile adhesive strength was acceptable.
【0018】[0018]
【実施例2】厚さ0.5mmのビスフェノールAポリカー
ボネートフィルム[帝人化成(株)製]を用い、合成例
2で合成したポリカーボネートを、トルエン100部/
テトラヒドロフラン80部/酢酸1部の混合溶液に25
%溶解した溶液を実施例1と同様に塗布し、接着した。
接着試験片には白化も発泡も見られず、引張り接着強度
は合格であった。Example 2 Using a 0.5 mm thick bisphenol A polycarbonate film [manufactured by Teijin Chemicals Ltd.], the polycarbonate synthesized in Synthesis Example 2 was mixed with 100 parts of toluene /
25 parts in a mixed solution of 80 parts of tetrahydrofuran / 1 part of acetic acid
% Solution was applied and adhered as in Example 1.
No whitening or foaming was observed in the adhesive test piece, and the tensile adhesive strength was acceptable.
【0019】[0019]
【比較例1】実施例1に用いたと同一のフィルムにトル
エンを塗布して実施例1と同様に評価したが、この場合
の接着強度は不合格で有った。Comparative Example 1 Toluene was applied to the same film as used in Example 1 and evaluated in the same manner as in Example 1, but the adhesive strength in this case was unacceptable.
【0020】[0020]
【比較例2】実施例2において、合成例2で合成したポ
リカーボネートの変わりにビスフェノールAポリカーボ
ネート[帝人化成(株)製パンライト L−1225]を
使用し、その他は全て実施例2と同様にして試験した。
このものは接着面が白化し外観が悪く実用的ではなかっ
た。Comparative Example 2 In Example 2, bisphenol A polycarbonate [Panlite L-1225 manufactured by Teijin Kasei Co., Ltd.] was used in place of the polycarbonate synthesized in Synthesis Example 2, and otherwise the same as in Example 2. Tested.
This product was not practical because the adhesive surface was white and the appearance was poor.
【0021】[0021]
【比較例3】実施例1に用いたと同一のフィルムに、実
施例2に用いたと同一の接着剤組成物を使用して、実施
例1と同様に試験した。このものは接着面が白化し外観
が悪く実用的ではなかった。Comparative Example 3 The same adhesive composition as used in Example 2 was used in the same film as used in Example 1 and tested in the same manner as in Example 1. This product was not practical because the adhesive surface was white and the appearance was poor.
【0022】[0022]
【発明の効果】本発明の非ハロゲン系接着剤組成物は、
有害なハロゲン化溶媒を使用することなく、フィルムの
接着強度、接着面の透明性にも優れ、且つ耐熱性のポリ
カーボネート樹脂を使用しているので熱転写フィルム等
の耐熱フィルムの接着に好適に利用できる。The non-halogen adhesive composition of the present invention comprises
Since it uses a heat-resistant polycarbonate resin that has excellent adhesive strength of the film and transparency of the adhesive surface without using a harmful halogenated solvent, it can be suitably used for adhesion of heat-resistant films such as thermal transfer films. .
Claims (1)
00重量部、 (B)炭素数3〜6の脂肪族環状エーテル
化合物0〜100重量部及び (C)酢酸、メチルイソブチ
ルケトン、n-ブタノールから選ばれた少なくとも一種0
〜2重量部よりなる溶媒に、0.7g を塩化メチレン1
00mlに溶解し20℃で測定した比粘度が0.12〜
1.04の非晶性芳香族ポリカーボネート樹脂を1〜5
0重量%溶解してなる非ハロゲン系接着剤組成物。1. (A) Aromatic hydrocarbon 1 having 6 to 12 carbon atoms
00 parts by weight, (B) 0 to 100 parts by weight of an aliphatic cyclic ether compound having 3 to 6 carbon atoms, and (C) at least one selected from acetic acid, methyl isobutyl ketone and n-butanol 0
~ 2 parts by weight of solvent in 0.7 g of methylene chloride
It has a specific viscosity of 0.12
1 to 5 of 1.04 amorphous aromatic polycarbonate resin
A non-halogen adhesive composition in which 0% by weight is dissolved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18083292A JPH0625635A (en) | 1992-07-08 | 1992-07-08 | Non-halogen adhesive composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18083292A JPH0625635A (en) | 1992-07-08 | 1992-07-08 | Non-halogen adhesive composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0625635A true JPH0625635A (en) | 1994-02-01 |
Family
ID=16090142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18083292A Pending JPH0625635A (en) | 1992-07-08 | 1992-07-08 | Non-halogen adhesive composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0625635A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8128075B2 (en) | 2008-02-12 | 2012-03-06 | Tokai Rubber Industries, Ltd. | Fluid-filled cylindrical vibration-damping device |
WO2013165193A1 (en) * | 2012-05-04 | 2013-11-07 | 에스케이이노베이션 주식회사 | Hot-melt adhesive composition having low viscosity |
-
1992
- 1992-07-08 JP JP18083292A patent/JPH0625635A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8128075B2 (en) | 2008-02-12 | 2012-03-06 | Tokai Rubber Industries, Ltd. | Fluid-filled cylindrical vibration-damping device |
WO2013165193A1 (en) * | 2012-05-04 | 2013-11-07 | 에스케이이노베이션 주식회사 | Hot-melt adhesive composition having low viscosity |
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