JPH06248162A - Electrical and electronic equipment - Google Patents
Electrical and electronic equipmentInfo
- Publication number
- JPH06248162A JPH06248162A JP6414993A JP6414993A JPH06248162A JP H06248162 A JPH06248162 A JP H06248162A JP 6414993 A JP6414993 A JP 6414993A JP 6414993 A JP6414993 A JP 6414993A JP H06248162 A JPH06248162 A JP H06248162A
- Authority
- JP
- Japan
- Prior art keywords
- polyacetal resin
- molded product
- rubber
- formic acid
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229930182556 Polyacetal Natural products 0.000 claims abstract description 41
- 229920006324 polyoxymethylene Polymers 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 229920001971 elastomer Polymers 0.000 claims abstract description 30
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims abstract description 23
- 235000019253 formic acid Nutrition 0.000 claims abstract description 23
- -1 isocyanate compound Chemical class 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 10
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 10
- 239000012948 isocyanate Substances 0.000 claims abstract description 10
- 229910052788 barium Inorganic materials 0.000 claims abstract description 4
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 4
- 239000000194 fatty acid Substances 0.000 claims abstract description 4
- 229930195729 fatty acid Natural products 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 3
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 3
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 2
- 150000004665 fatty acids Chemical class 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 8
- 238000000465 moulding Methods 0.000 abstract description 8
- 150000002739 metals Chemical class 0.000 abstract description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 abstract 1
- 150000004679 hydroxides Chemical class 0.000 abstract 1
- 150000002736 metal compounds Chemical class 0.000 abstract 1
- 238000010186 staining Methods 0.000 abstract 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 24
- 239000000047 product Substances 0.000 description 20
- 150000001875 compounds Chemical class 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 4
- 230000000740 bleeding effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000002386 leaching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- 229920005177 Duracon® POM Polymers 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 210000000416 exudates and transudate Anatomy 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 125000005704 oxymethylene group Chemical group [H]C([H])([*:2])O[*:1] 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- 229920004943 Delrin® Polymers 0.000 description 1
- SHBUUTHKGIVMJT-UHFFFAOYSA-N Hydroxystearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OO SHBUUTHKGIVMJT-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- UKMSUNONTOPOIO-UHFFFAOYSA-M behenate Chemical compound CCCCCCCCCCCCCCCCCCCCCC([O-])=O UKMSUNONTOPOIO-UHFFFAOYSA-M 0.000 description 1
- 229940116224 behenate Drugs 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- POULHZVOKOAJMA-UHFFFAOYSA-M dodecanoate Chemical compound CCCCCCCCCCCC([O-])=O POULHZVOKOAJMA-UHFFFAOYSA-M 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- IPCSVZSSVZVIGE-UHFFFAOYSA-M hexadecanoate Chemical compound CCCCCCCCCCCCCCCC([O-])=O IPCSVZSSVZVIGE-UHFFFAOYSA-M 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 229940072106 hydroxystearate Drugs 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 229940070765 laurate Drugs 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- GMDNUWQNDQDBNQ-UHFFFAOYSA-L magnesium;diformate Chemical compound [Mg+2].[O-]C=O.[O-]C=O GMDNUWQNDQDBNQ-UHFFFAOYSA-L 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 229940114926 stearate Drugs 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、ゴム浸み出し物による
汚染が改善された電気・電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric / electronic device in which contamination by a rubber exudate is improved.
【0002】[0002]
【従来の技術及び発明が解決しようとする課題】電気・
電子機器、例えばオーディオ、ビデオ等の機構部品は、
音声信号、映像信号を高密度に記録した磁気テープから
各信号を効率良く取り出すためにステレオ、ビデオセッ
トには不可欠な部品であるが、特に、その中心的な位置
を占める磁気ヘッドと呼ばれる部品は外部からの汚染
(ほこり等)に弱く、一旦汚染されてしまうと磁気テー
プとの電磁気変換効率が低下するのみならず、テープを
駆動する際の大きな抵抗にもなるなど実用上支障をきた
すようになる。こうした電磁気変換関連部品は環境から
の汚染を防ぐために無塵室等、高度に清浄化された環境
の中で製造、組み立てられるのが普通である。しかし、
このような環境下で製造されたオーディオ、ビデオ機構
部品も、出荷後、船舶による輸送の際など、ポリエチレ
ン等のフィルムで包装された密閉状態で高温高湿雰囲気
に曝されると、埃など環境からの汚染が無いにもかかわ
らず実用上の動作に支障をきたすことが多い。これはオ
ーディオ、ビデオ機構部品に使用されているゴムローラ
ー中の添加剤がゴム表面にブリードし、磁気テープを媒
介として磁気ヘッドを汚染するためである。このゴム添
加剤による磁気ヘッドの汚染を防止する対策としては、
一時的に高温高湿雰囲気に曝されたオーディオ、ビデオ
機構部品中のゴム表面の洗浄が行われ、ある程度の効果
を得ている。しかし、この対策は恒久的なものでないば
かりでなく、莫大な労働力を必要とするものであり、ゴ
ムのブリードの根本的な改善が望まれていた。2. Description of the Related Art Electricity ・
Electronic equipment, such as audio and video mechanical parts,
In order to efficiently extract each signal from a magnetic tape on which audio signals and video signals are recorded at high density, it is an essential part for stereo and video sets, but especially the part called the magnetic head that occupies its central position is It is vulnerable to external contamination (dust, etc.), and once it is contaminated, it not only lowers the electromagnetic conversion efficiency with the magnetic tape, but also causes a large resistance when driving the tape, causing practical problems. Become. Such electromagnetic conversion related parts are usually manufactured and assembled in a highly clean environment such as a dust-free room to prevent pollution from the environment. But,
Audio and video mechanical parts manufactured under such an environment will also be exposed to dust, etc. when exposed to a high temperature and high humidity atmosphere in a sealed state wrapped with a film such as polyethylene after shipping and transportation by ship. In many cases, the operation is impaired in practice even though there is no contamination from the. This is because the additive in the rubber roller used for audio and video mechanical parts bleeds to the rubber surface and contaminates the magnetic head through the magnetic tape. As a measure to prevent the contamination of the magnetic head by this rubber additive,
The rubber surface in the audio and video mechanical parts exposed to the high temperature and high humidity atmosphere was cleaned temporarily, and some effects were obtained. However, this measure is not only permanent, but also requires a huge labor force, and a fundamental improvement of the rubber bleed has been desired.
【0003】[0003]
【課題を解決するための手段】本発明者等は、上記の如
き問題点を解決すべく、ゴムのブリードについて詳細な
検討を行った結果、ゴムのブリードに関して、オーディ
オ、ビデオ機構部品の構成材質が大きく関係しているこ
とを見出した。即ち、従来、オーディオ、ビデオ機構部
品の材料として、シャーシ(基盤)、ギヤ、レバー、カ
ム、プーリー、軸受け等の部品を中心に使用されてきた
ポリアセタール樹脂成形品が比較的高温高湿中でローラ
ー、ベルト等ゴム部品のブリードを引き起こしているこ
とが明らかとなり、その原因を検討した結果、ポリアセ
タール樹脂成形品に含まれているギ酸が高湿度中の水分
を媒体として放出され、それがゴムに付着、浸透し、そ
れらがゴム中の水に難溶性の酸化マグネシウムと反応す
ることで水に易溶性のギ酸マグネシウムを生成するた
め、これがゴム表面にブリードし、テープを媒介として
磁気ヘッドを汚染していることが明らかとなった。ポリ
アセタール樹脂には、ポリアセタールホモポリマー、ポ
リアセタールコポリマー等があり、これらはいずれも各
種安定剤添加により熱安定性が改善されているものの、
成形加工時に多少の熱分解を起こすことは避け難く、こ
のため成形品の内部にはその分解生成物であるホルムア
ルデヒド、ギ酸が含有されている。ホルムアルデヒドは
成形品が数十℃以上に加熱されたときガスとなって大幅
に減少せしめることができるが、ギ酸は百数十℃の高温
で加熱処理しても熱水中で処理してもさほど減少せしめ
ることはできない。本発明者等はこの点について更に検
討した結果、ポリアセタール樹脂に酸化防止剤とイソシ
アネート化合物及び/又は特定の金属含有化合物を配合
することによって、このギ酸の量をある一定値以下とす
ることができ、ゴムのブリードをほとんどなくすことが
できることを見出した。本発明は、以上のような知見に
基づいてなされたもので、少なくとも一部がポリアセタ
ール樹脂成形品及びゴム部品から構成された電気・電子
機器において、上記ポリアセタール樹脂成形品としてギ
酸発生量が成形品表面積1cm2 あたり 1.0マイクログラ
ム以下であるポリアセタール樹脂を用いたことを特徴と
する電気・電子機器に関するものである。本発明の電気
・電子機器は、使用するポリアセタール樹脂成形品から
のギ酸発生量が極めて少ないので、通常の条件下では勿
論のこと、船舶による輸送の際など、ポリエチレン等の
フィルムで包装された密閉状態で高温高湿雰囲気に曝さ
れてゴムのブリードがなく、製品の信頼性が顕著に向上
したものである。Means for Solving the Problems The inventors of the present invention have made detailed studies on the rubber bleed in order to solve the above problems, and as a result, regarding the rubber bleed, the constituent materials of audio and video mechanical parts are Have been found to have a great relationship. In other words, polyacetal resin moldings that have been used as materials for audio and video mechanical parts in the past mainly for chassis (base), gears, levers, cams, pulleys, bearings, etc. , It has been clarified that it causes bleeding of rubber parts such as belts, and as a result of investigating the cause, the formic acid contained in the polyacetal resin molded product is released as water in high humidity, which adheres to the rubber. As it permeates and reacts with magnesium oxide, which is sparingly soluble in water in rubber, to produce magnesium formate, which is easily soluble in water, this causes bleeding on the rubber surface and contaminates the magnetic head through the tape. It became clear. Polyacetal resins include polyacetal homopolymers, polyacetal copolymers, etc., all of which have improved thermal stability by the addition of various stabilizers,
It is inevitable that some thermal decomposition will occur during the molding process. Therefore, the decomposition products formaldehyde and formic acid are contained inside the molded product. Formaldehyde can become a gas when a molded product is heated to several tens of degrees Celsius or higher, and can be greatly reduced, but formic acid can be heat treated at a high temperature of hundreds of tens of degrees Celsius or treated in hot water. It cannot be reduced. As a result of further study on this point, the present inventors have made it possible to reduce the amount of this formic acid to a certain value or less by blending a polyacetal resin with an antioxidant and an isocyanate compound and / or a specific metal-containing compound. Found that the rubber bleed can be almost eliminated. The present invention has been made based on the above knowledge, and in an electric / electronic device at least a part of which is composed of a polyacetal resin molded product and a rubber component, the polyacetal resin molded product has a formic acid generation amount of a molded product. The present invention relates to an electric / electronic device characterized by using a polyacetal resin having a surface area of 1.0 microgram or less per 1 cm 2 . Since the electric / electronic device of the present invention has an extremely small amount of formic acid generated from the polyacetal resin molded product used, not only under normal conditions, but also in shipping by ship, etc. In this state, it is exposed to a high temperature and high humidity atmosphere, and there is no rubber bleeding, and the product reliability is remarkably improved.
【0004】以下本発明についての詳細な説明を行う。The present invention will be described in detail below.
【0005】本発明において、ポリアセタール樹脂と
は、オキシメチレン基(-CH2O-)を主たる構成単位とす
る高分子化合物で、ポリアセタールホモポリマー(例え
ば、米国デュポン社製“デルリン”)、オキシメチレン
基以外に他の構成単位を少量含有するポリアセタールコ
ポリマー(例えば、ポリプラスチックス社製“ジュラコ
ン”)、ターポリマー、ブロックコポリマーのいずれに
てもよく、又、分子が線状のみならず分岐、架橋構造を
有するものであってもよい。又、その重合度等に関して
も特に制限はない。In the present invention, the polyacetal resin is a polymer compound having an oxymethylene group (--CH 2 O--) as a main constituent unit, and is a polyacetal homopolymer (for example, "Delrin" manufactured by DuPont, USA) and oxymethylene. In addition to the group, it may be a polyacetal copolymer containing a small amount of other constitutional unit (for example, "Duracon" manufactured by Polyplastics Co., Ltd.), a terpolymer, or a block copolymer, and the molecule is not only linear but also branched and crosslinked. It may have a structure. Further, there is no particular limitation on the degree of polymerization or the like.
【0006】又、ギ酸発生量の測定法について説明する
と、ポリアセタール樹脂成形品を場合により切断し、そ
の表面積を測定した後、その成形品の適当量(表面積30
〜60cm2 程度) を1mlの純水に直接浸らないようにして
密閉容器(容量100ml)に入れ、60℃に168 時間放置す
る。この密閉容器中の水を100ml に希釈し、この溶液の
ギ酸濃度(μg)をイオンクロマトグラフ(横河ヒューレ
ット・パッカード社製IC500 、有機酸用カラム、0.1m
M 過塩素酸水溶液をキャリアとして)で測定し、成形品
表面積あたりのギ酸発生量(μg/cm2)を求めた。本発
明に使用するポリアセタール樹脂は、上記の通り、ギ酸
発生量が成形品表面積1cm2 あたり 1.0マイクログラム
以下であることを要する。好ましくはギ酸発生量が成形
品表面積1cm2 あたり 1.0マイクログラム以下であり、
且つ樹脂分1グラムあたり 5.0マイクログラム以下のポ
リアセタール樹脂成形品を用いる場合である。本発明に
おけるギ酸発生量の数値規定は、通常の安定剤、離型剤
等公知の添加剤を含有するポリアセタール樹脂組成物を
用いた成形品については勿論、無機充填剤あるいは他の
ポリマーを含有する組成物の成形品においても、その成
形品表面の大部分がポリアセタール樹脂である限り適用
可能である。ここで、一般に市販されているポリアセタ
ール樹脂は、その成形品からのギ酸発生量が表面積1cm
2 あたり 1.4マイクログラム以上であり、成形条件を変
化せしめても1.4 マイクログラム未満のものは得られ
ず、本発明に使用に要する上記値を満足するものはな
い。しかし、例えば、酸化防止剤とイソシアネート化合
物及び/又は特定の金属含有化合物とを配合することに
より、上記値を満足するポリアセタール樹脂とすること
ができる。ここで用いられる酸化防止剤としては、2,2'
−メチレンビス(4−メチル−6−t−ブチルフェノー
ル)、ペンタエリスリトールテトラキス〔3−(3,5 −
ジ−t−ブチル−4−ヒドロキシフェニル)プロピオネ
ート〕、N,N',N" −トリス〔4−t−ブチル−3−ヒド
ロキシ−2,6 −ジメチルトリル)イソシアヌレート等が
例示される。かかる酸化防止剤の配合量は、ポリアセタ
ール樹脂を基準として0.01〜5重量%、好ましくは0.05
〜3重量%である。0.01重量%より少ないと本発明の目
的であるギ酸発生量を下げることは出来ず、又、5重量
%を越えると成形性の悪化を招き好ましくない。又、イ
ソシアネート化合物としては、1,6 −ヘキサメチレンジ
イソシアネート、イソホロンジイソシアネート、4,4'−
メチレンビス(フェニルイソシアネート)、2,2 −ジフ
ェニルプロパン−4,4'−ジイソシアネート等及びこれら
の二量体、三量体が例示されるが、さらにはイソシアネ
ート基(-NCO)が何らかの形で保護されている化合物も
有効である。かかるイソシアネート化合物の配合量は、
ポリアセタール樹脂を基準として0.01〜10重量%、好ま
しくは0.03〜5重量%である。0.01重量%より少ないと
本発明の目的であるギ酸発生量を下げることは出来ず、
又、10重量%を越えると成形性の悪化を招き好ましくな
い。又、特定の金属含有化合物としては、Li,Na,K,Mg,C
a,Ba及びZnから選ばれた1種以上の金属の水酸化物、炭
酸塩又は炭素数6以上の脂肪酸塩であり、特に好ましい
金属としてはMg,Ca,Ba,Znが挙げられ、又、特に好まし
い脂肪酸塩としてはラウリン酸塩、パルミチン酸塩、ス
テアリン酸塩、ベヘン酸塩、ヒドロキシステアリン酸塩
が挙げられる。かかる特定の金属含有化合物の配合量
は、ポリアセタール樹脂を基準として金属分が1×10-4
〜1モル%、好ましくは5×10-4〜0.1 モル%である。
金属分として1×10-4モル%よりも少ないと、本発明の
目的であるギ酸発生量を下げることは出来ず、又、1モ
ル%を越えると成形性の悪化を招き好ましくない。The method for measuring the amount of generated formic acid will be explained. After cutting a polyacetal resin molded product as the case may be and measuring its surface area, an appropriate amount of the molded product (surface area 30
Approximately 60 cm 2 ) is placed in a closed container (capacity 100 ml) so as not to be soaked directly in 1 ml of pure water and left at 60 ° C for 168 hours. The water in this closed container was diluted to 100 ml, and the formic acid concentration (μg) of this solution was measured by ion chromatography (IC500 manufactured by Yokogawa Hewlett-Packard, column for organic acid, 0.1 m).
M aqueous solution of perchloric acid was used as a carrier) to determine the amount of formic acid generated per surface area of the molded product (μg / cm 2 ). As described above, the polyacetal resin used in the present invention requires that the amount of formic acid generated is 1.0 microgram or less per 1 cm 2 of the surface area of the molded product. Preferably, the amount of formic acid generated is 1.0 microgram or less per 1 cm 2 of surface area of the molded article,
In addition, this is the case of using a polyacetal resin molded product having 5.0 micrograms or less per gram of resin content. Numerical regulation of the amount of formic acid generated in the present invention, as well as a molded article using a polyacetal resin composition containing a known additive such as a normal stabilizer, a release agent, of course, contains an inorganic filler or other polymer It can be applied to a molded article of the composition as long as the majority of the surface of the molded article is a polyacetal resin. Here, in general commercially available polyacetal resin, the amount of formic acid generated from the molded product has a surface area of 1 cm.
It is 1.4 micrograms or more per 2 and even if the molding conditions are changed, a weight of less than 1.4 micrograms cannot be obtained, and none satisfy the above value required for use in the present invention. However, for example, by blending an antioxidant with an isocyanate compound and / or a specific metal-containing compound, a polyacetal resin satisfying the above values can be obtained. As the antioxidant used here, 2,2 '
-Methylenebis (4-methyl-6-t-butylphenol), pentaerythritol tetrakis [3- (3,5-
Examples thereof include di-t-butyl-4-hydroxyphenyl) propionate], N, N ′, N ″ -tris [4-t-butyl-3-hydroxy-2,6-dimethyltolyl) isocyanurate and the like. The content of the antioxidant is 0.01 to 5% by weight, preferably 0.05, based on the polyacetal resin.
~ 3% by weight. If it is less than 0.01% by weight, the amount of formic acid generated, which is the object of the present invention, cannot be lowered, and if it exceeds 5% by weight, moldability is deteriorated, which is not preferable. Further, as the isocyanate compound, 1,6-hexamethylene diisocyanate, isophorone diisocyanate, 4,4'-
Examples include methylenebis (phenylisocyanate), 2,2-diphenylpropane-4,4'-diisocyanate, and dimers and trimers thereof, but the isocyanate group (-NCO) may be protected in some way. The compounds described above are also effective. The amount of the isocyanate compound blended is
It is 0.01 to 10% by weight, preferably 0.03 to 5% by weight, based on the polyacetal resin. If less than 0.01% by weight, the amount of formic acid generated, which is the object of the present invention, cannot be reduced,
Further, if it exceeds 10% by weight, moldability is deteriorated, which is not preferable. In addition, specific metal-containing compounds include Li, Na, K, Mg, C
It is a hydroxide, carbonate or fatty acid salt of 6 or more carbon atoms of at least one metal selected from a, Ba and Zn, and particularly preferable metals include Mg, Ca, Ba and Zn, and Particularly preferred fatty acid salts include laurate, palmitate, stearate, behenate and hydroxystearate. The compounding amount of such a specific metal-containing compound is such that the metal content is 1 × 10 −4 based on the polyacetal resin.
˜1 mol%, preferably 5 × 10 −4 to 0.1 mol%.
If the metal content is less than 1 × 10 −4 mol%, the amount of formic acid generated, which is the object of the present invention, cannot be lowered, and if it exceeds 1 mol%, moldability is deteriorated, which is not preferable.
【0007】本発明に用いるポリアセタール樹脂には、
更に公知の各種添加剤を配合し得る。例えば、各種の着
色剤、離型剤、核剤、帯電防止剤、その他の界面活性
剤、各種ポリマー等である。また、本発明の目的とする
成形品の性能を大幅に低下させない範囲内であるなら
ば、公知の無機、有機、金属等の繊維状、板状、粉粒状
等の充填剤を1種または2種以上複合させて配合するこ
とも可能である。このような無機充填剤の例としては、
ガラス繊維、チタン酸カリウム繊維、ガラスビーズ、タ
ルク、マイカ、白マイカ、ウォラストナイト、炭酸カル
シウム等が挙げられるが、何等これらに限定されるもの
ではない。又、本発明のポリアセタール樹脂成形品の調
製は、従来の樹脂成形品調製法として一般に用いられる
公知の方法により容易に調製される。例えば、各成分を
混合後、一軸または、二軸の押出機により、練り込み押
出してペレット調製し、そのペレットを所定量混合(希
釈)して成形に供し、成形後に目的組成の成形品を得る
方法等、何れも使用できる。又、かかる成形品に用いら
れる組成物の調製において、基体であるポリアセタール
樹脂の一部または全部を粉砕し、これをその他の成分を
混合した後、押出等を行うことは、添加物の分散性を良
くする上で好ましい方法である。The polyacetal resin used in the present invention includes
Further, various known additives may be added. For example, various colorants, release agents, nucleating agents, antistatic agents, other surfactants, various polymers and the like. Further, as long as the performance of the molded article intended by the present invention is not significantly reduced, one or two known fillers such as fibrous, plate-like, and granular fillers such as inorganic, organic, and metallic materials can be used. It is also possible to mix and blend more than one species. Examples of such inorganic fillers include:
Examples thereof include glass fibers, potassium titanate fibers, glass beads, talc, mica, white mica, wollastonite, and calcium carbonate, but are not limited thereto. The polyacetal resin molded article of the present invention can be easily prepared by a known method generally used as a conventional resin molded article preparation method. For example, after mixing the components, a uniaxial or biaxial extruder is kneaded and extruded to prepare pellets, and the pellets are mixed (diluted) in a predetermined amount and subjected to molding to obtain a molded product having a desired composition after molding. Any method can be used. Further, in the preparation of the composition used for such a molded article, it is necessary to pulverize a part or all of the polyacetal resin which is the substrate, mix this with other components, and then carry out extrusion or the like to improve the dispersibility of the additive. This is a preferable method for improving the quality.
【0008】次に、本発明の電気・電子機器のもう一つ
の構成部材であるゴム部品とは、ゴムローラ等として各
種の電気・電子機器に用いられているもので、その材質
は問わない。この種のゴム部品には、加硫剤、安定剤そ
の他の添加剤が添加されており、前述の通り、これら添
加剤がゴム表面にブリードし、磁気テープを媒介として
磁気ヘッドを汚染することがあるが、本発明によりこの
問題が解決された。Next, the rubber component, which is another component of the electric / electronic device of the present invention, is used in various electric / electronic devices as a rubber roller or the like, and its material is not limited. Vulcanizing agents, stabilizers, and other additives are added to this type of rubber component, and as described above, these additives may bleed to the rubber surface and contaminate the magnetic head through the magnetic tape. However, the present invention has solved this problem.
【0009】本発明における、少なくとも一部がポリア
セタール樹脂成形品及びゴム部品から構成された電気・
電子機器とは、具体的には各種オーディオ機器、ビデオ
機器、OA機器が挙げられ、更に詳しくは、カセットテ
ープレコーダー等のオーディオ機器、VTR、8mmビデ
オ、ビデオカメラ等のビデオ機器、又はコピー機、ファ
クシミリ、プリンター、ワードプロセッサー等のOA機
器であり、更にはモーター、発条等の駆動力で動く玩
具、電話機、コンピュータ等に付随するキーボード等に
も適用することができる。具体的な部品としては、シャ
ーシ(基盤)、ギヤー、レバー、カムプーリー、軸受け
等の部品に有用である。According to the present invention, at least a part of an electric / electrical member composed of a polyacetal resin molded product and a rubber part.
Specific examples of the electronic device include various audio devices, video devices, and OA devices. More specifically, audio devices such as cassette tape recorders, VTRs, 8 mm video, video devices such as video cameras, and copiers, The present invention can be applied to office automation equipment such as facsimiles, printers, word processors, etc., and also to motors, toys that are driven by driving force such as springs, telephones, keyboards attached to computers, etc. As specific parts, it is useful for parts such as chassis (base), gears, levers, cam pulleys, bearings and the like.
【0010】[0010]
【実施例】以下、実施例により、本発明を具体的に説明
するが、本発明はこれに限定されるものではない。 実施例1〜9及び比較例1〜3 ポリアセタール樹脂(ポリプラスチックス(株)製、商
品名「ジュラコン」)に、酸化防止剤とイソシアネート
化合物又は特定の金属含有化合物を表1に示す割合で混
合した後、二軸押出機により溶融混練し、ペレット状の
組成物を調製した。次いでこのペレットを用いて、射出
成形により、音声画像再生機構部用基盤を成形し、以下
の評価を行った。結果を表1に示す。また、比較のた
め、イソシアネート化合物、特定の金属含有化合物未添
加のもの、あるいは通常ポリアセタールの熱安定剤とし
て公知の化合物を添加したものについて、同様の基盤を
成形し評価した。 評価項目 <ギ酸発生量>ギ酸発生量は、前述の如く、ポリアセタ
ール樹脂成形品としてASTM引張試験片タイプIVを切断
し、その総表面積51cm2 (樹脂重量10g)分の樹脂サン
プルを1mlの純水に直接浸らないようにして密閉容器
(容量100ml)に入れ、60℃に168 時間放置後、この密閉
容器中の水を100ml に希釈し、この溶液のギ酸濃度をイ
オンクロマトグラフ(横河ヒューレット・パッカード
(株)製IC500 、有機酸用カラム、0.1mM 過塩素酸水
溶液をキャリアとして)で測定することにより求めた。 <ゴム部品の浸み出し試験>ゴム部品としては、クロロ
プレンゴム円筒状に成形したローラーを使用し、それを
ポリアセタール樹脂で成形された音声画像再生機構部用
基盤に組み込み、ポリエチレン袋で包装した状態で60℃
/90%RH雰囲気中に1週間放置後、ゴム表面に浸み出
したものを顕微鏡観察し、その度合いを目視で下記の如
く10段階にランク付けした。実用的には4以下、より好
ましくは3以下である。尚、この試験は3回行ない、表
にはその平均値を示した。 1 3 5 7 10 ←───────────────────────→ 浸み出し無 僅かに有 有 かなり有 非常に多い 又、使用した酸化防止剤、イソシアネート化合物及び特
定の金属含有化合物は以下の通りである。 1.酸化防止剤 a)2,2'−メチレンビス(4−メチル−6−t−ブチル
フェノール) b)ペンタエリスリトールテトラキス〔3−(3,5 −ジ
−t−ブチル−4−ヒドロキシフェニル)プロピオネー
ト〕 2.イソシアネート化合物 c)イソホロンジイソシアネートの三量体 d)4,4'−メチレンビス(フェニルイソシアネート) 3.特定の金属含有化合物 e)水酸化マグネシウム f)炭酸カルシウム 4.その他の熱安定剤 g)メラミンEXAMPLES The present invention will now be specifically described with reference to examples, but the present invention is not limited thereto. Examples 1 to 9 and Comparative Examples 1 to 3 Polyacetal resin (manufactured by Polyplastics Co., Ltd., trade name "Duracon") was mixed with an antioxidant and an isocyanate compound or a specific metal-containing compound at a ratio shown in Table 1. After that, the mixture was melt-kneaded by a twin-screw extruder to prepare a pelletized composition. Next, the pellets were used to mold a substrate for an audio image reproducing mechanism by injection molding, and the following evaluations were performed. The results are shown in Table 1. For comparison, the same substrate was molded and evaluated for an isocyanate compound, a compound to which a specific metal-containing compound was not added, or a compound to which a compound known as a heat stabilizer of polyacetal was added was molded. Evaluation items <Amount of formic acid generated> As described above, the amount of formic acid generated was obtained by cutting ASTM tensile test piece type IV as a polyacetal resin molded product, and using 1 ml of pure water of a resin sample having a total surface area of 51 cm 2 (resin weight 10 g). Put the solution in a closed container (capacity 100 ml) so that it is not directly immersed in the solution, leave it at 60 ° C for 168 hours, and dilute the water in this closed container to 100 ml. It was determined by measuring with IC500 manufactured by Packard, column for organic acid, 0.1 mM perchloric acid aqueous solution as a carrier). <Rubbing parts leaching test> As the rubber parts, a roller molded into a chloroprene rubber cylinder is used, and it is embedded in a sound-acoustic image reproduction mechanism base formed of polyacetal resin and packaged in a polyethylene bag. At 60 ℃
After being left in a / 90% RH atmosphere for 1 week, the exudate on the rubber surface was observed under a microscope, and the degree was visually ranked into the following 10 stages. Practically 4 or less, more preferably 3 or less. This test was performed 3 times, and the average value is shown in the table. 1 3 5 7 10 ← ──────────────────────────────── →→ No exudation Slightly Yes Yes Very much Antioxidant used The isocyanate compound and the specific metal-containing compound are as follows. 1. Antioxidant a) 2,2'-methylenebis (4-methyl-6-t-butylphenol) b) Pentaerythritol tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] 1. Isocyanate compound c) Trimer of isophorone diisocyanate d) 4,4'-methylenebis (phenylisocyanate) 3. Specific metal-containing compound e) Magnesium hydroxide f) Calcium carbonate 4. Other heat stabilizers g) Melamine
【0011】[0011]
【表1】 [Table 1]
【0012】[0012]
【発明の効果】表に示した結果から、ギ酸発生量の少な
いポリアセタール樹脂成形品を用いた場合、ゴムの浸み
出しにほとんど影響していないことが明らかである。
尚、ギ酸発生量測定時に希釈水溶液の一部を用いてJIS-
K1020 、2Lホルムアルデヒドの項に従ってホルムアルデ
ヒドの定量を行ったところいずれの試料においてもギ酸
発生量の約10〜20倍量のホルムアルデヒドが検出され
た。しかし、成形品を120 ℃で1週間大気乾燥してホル
ムアルデヒド発生量を減らした成形品を用いた場合もゴ
ムの浸み出しは発生したし、また、分解すると全てホル
ムアルデヒドとなる低分子量のパラホルム用いてもゴム
の浸み出しは発生しなかったことからホルムアルデヒド
発生量自身はゴムの浸み出し減少に何等影響をしていな
いことが確認された。本発明によると以上のようにゴム
部品の浸み出し問題を根本的に解決することができる。
本発明の電気・電子機器は、上記の如き優れた効果を有
するが故に、オーディオ、ビデオ、OA関係部品等のシ
ャーシ、ギヤー、レバー、カム、プーリー、軸受け等に
好適に使用される。From the results shown in the table, it is clear that when a polyacetal resin molded product with a small amount of formic acid is used, it has little effect on the leaching of rubber.
In addition, JIS-
When formaldehyde was quantified in accordance with K1020 and 2L formaldehyde, the amount of formaldehyde was detected about 10 to 20 times that of formic acid in all samples. However, when the molded product was air-dried at 120 ° C for 1 week to reduce the amount of formaldehyde generated, leaching of rubber occurred, and when decomposed, all the formaldehyde was converted to formaldehyde. However, since the exudation of rubber did not occur, it was confirmed that the formaldehyde generation amount itself had no effect on the reduction of exudation of rubber. According to the present invention, it is possible to fundamentally solve the seepage problem of rubber parts as described above.
Since the electric / electronic device of the present invention has the above-mentioned excellent effects, it is suitably used for chassis such as audio, video and OA-related parts, gears, levers, cams, pulleys, bearings and the like.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 G11B 33/12 303 Z ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location G11B 33/12 303 Z
Claims (5)
形品及びゴム部品から構成された電気・電子機器におい
て、上記ポリアセタール樹脂成形品としてギ酸発生量が
成形品表面積1cm2 あたり 1.0マイクログラム以下であ
るポリアセタール樹脂を用いたことを特徴とする電気・
電子機器。1. An electric / electronic device comprising at least a part of a polyacetal resin molded product and a rubber part, wherein the polyacetal resin molded product has a generation amount of formic acid of 1.0 microgram or less per 1 cm 2 of the surface area of the molded product. Electricity characterized by using
Electronics.
生量が成形品表面積1cm2 あたり 1.0マイクログラム以
下であり、且つ樹脂分1グラムあたり 5.0マイクログラ
ム以下であるポリアセタール樹脂を用いた請求項1記載
の電気・電子機器。2. The electricity according to claim 1, wherein the polyacetal resin molded product is a polyacetal resin having a generation amount of formic acid of 1.0 microgram or less per 1 cm 2 of surface area of the molded product and 5.0 microgram or less per 1 gram of resin content. ·Electronics.
とイソシアネート化合物を含有するものである請求項1
又は2記載の電気・電子機器。3. The polyacetal resin molded article contains an antioxidant and an isocyanate compound.
Alternatively, the electric / electronic device described in 2.
とLi,Na,K,Mg,Ca,Ba及びZnから選ばれた1種以上の金属
の水酸化物、炭酸塩又は炭素数6以上の脂肪酸塩を含有
するものである請求項1又は2記載の電気・電子機器。4. A polyacetal resin molded article is an antioxidant and a hydroxide, carbonate or fatty acid having 6 or more carbon atoms of at least one metal selected from Li, Na, K, Mg, Ca, Ba and Zn. The electric / electronic device according to claim 1, which contains a salt.
オ機器又はOA機器である請求項1〜4の何れか1項記
載の電気・電子機器。5. The electric / electronic device according to claim 1, wherein the electric / electronic device is an audio device, a video device or an OA device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP06414993A JP3467284B2 (en) | 1992-12-28 | 1993-03-23 | Electrical and electronic equipment |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34904892 | 1992-12-28 | ||
JP4-349048 | 1992-12-28 | ||
JP06414993A JP3467284B2 (en) | 1992-12-28 | 1993-03-23 | Electrical and electronic equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06248162A true JPH06248162A (en) | 1994-09-06 |
JP3467284B2 JP3467284B2 (en) | 2003-11-17 |
Family
ID=26405274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP06414993A Expired - Fee Related JP3467284B2 (en) | 1992-12-28 | 1993-03-23 | Electrical and electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3467284B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008066053A1 (en) * | 2006-11-27 | 2008-06-05 | Polyplastics Co., Ltd. | Polyacetal resin composition and molded article thereof |
WO2008078572A1 (en) * | 2006-12-25 | 2008-07-03 | Polyplastics Co., Ltd. | Polyacetal resin composition and molded article thereof |
EP2067821A1 (en) * | 2006-09-26 | 2009-06-10 | Polyplastics Co., Ltd. | Polyacetal resin composition |
-
1993
- 1993-03-23 JP JP06414993A patent/JP3467284B2/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2067821A1 (en) * | 2006-09-26 | 2009-06-10 | Polyplastics Co., Ltd. | Polyacetal resin composition |
EP2067821A4 (en) * | 2006-09-26 | 2011-10-26 | Polyplastics Co | Polyacetal resin composition |
EP2067821B1 (en) * | 2006-09-26 | 2014-03-12 | Polyplastics Co., Ltd. | Polyacetal resin composition |
WO2008066053A1 (en) * | 2006-11-27 | 2008-06-05 | Polyplastics Co., Ltd. | Polyacetal resin composition and molded article thereof |
JP2008127556A (en) * | 2006-11-27 | 2008-06-05 | Polyplastics Co | Polyacetal resin composition and molded article thereof |
WO2008078572A1 (en) * | 2006-12-25 | 2008-07-03 | Polyplastics Co., Ltd. | Polyacetal resin composition and molded article thereof |
JP2008156489A (en) * | 2006-12-25 | 2008-07-10 | Polyplastics Co | Polyacetal resin composition and molded article thereof |
EP2098569A1 (en) * | 2006-12-25 | 2009-09-09 | Polyplastics Co., Ltd. | Polyacetal resin composition and molded article thereof |
EP2098569A4 (en) * | 2006-12-25 | 2011-11-09 | Polyplastics Co | Polyacetal resin composition and molded article thereof |
Also Published As
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