JPH06244560A - Manufacture of multilayered board - Google Patents

Abstract

PURPOSE:To form wiring and via-fill in a printing process by surely connecting the wiring with via-conductor. CONSTITUTION:By printing conductive paste on the upper surface of a constant shape board 23 of a green sheet, wiring 24 is former, and the board 23 is turned into a constant shape board 25, which is mounted on the upper surface of a metal mold 26. Holes are formed in a constant shape board 28 wherein a green sheet 21 is formed on the surface of a film 20. The board 28 is stacked on the constant shape board 25 mounted on the metal mold. The film is peeled, and a two-layered laminated sheet 30 is formed by thermocompression bonding. The formed laminated sheet is taken out from the metal mold, and wiring 31 and via-fill are formed on the upper surface by printing. Said laminated sheet is mounted on the upper surface of the metal mold. Holes are formed in the constant shape board 28 wherein a green sheet is formed on the upper surface of a film, and the board is stacked on the laminated sheet mounted on the metal mold. The film is peeled, and a three-layered laminated sheet is formed by thermocompression bonding. By repeating the same process, a multilayered boad is manufactured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a green sheet multilayer substrate.

[0002]

2. Description of the Related Art As shown in FIG. 2, a conventional method for manufacturing a green sheet multi-layer substrate is a green sheet 2 formed on a top surface of a film 1 by a doctor blade method.
In the finishing (A) and punching steps, a substantially rectangular standard substrate 4 is manufactured. At this time, the guide hole 5 is provided at the same time (B). Next, the standard substrate 4 is punched to form the holes 6 (C), and the holes 6 are filled with a conductor paste by printing in the via filling process to form the via conductors 7 (D). Then, a conductor paste is printed on the surface of the green sheet to form the wiring 8 (E). In this way, how many kinds (three kinds in F)
The standard substrate 4 is prepared, and each film 1 is peeled off. Then, by aligning the guide holes 5 of the standard substrate 4 with the guide pins 10 of the mold 9 and superposing (G) on the mold 9, and thermocompression bonding, a green sheet multilayer substrate is manufactured. However, when the standard substrate 4 is overlaid on the mold 9, the green sheet 2 is thin (thickness 100 to 200 μm) and is flexible, so expansion and contraction occur, and there is a problem that the wiring 8 and the via conductor 7 are displaced or disconnected. there were.

[0003]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art. The wiring and the via conductor are surely connected, and the wiring and the via conductor are simultaneously formed in one printing process. The purpose is to do.

[0004]

In order to solve the above problems, in the present invention, a forming step of forming a green sheet on a sheet-like film surface, and the sheet-like green sheet is die-cut into a plurality of substantially quadrangular shapes. A blanking step of forming guide holes, a first printing step of printing a conductor pattern on the green sheet surface of the blanked first green sheet, a peeling step of peeling the printed green sheet film, and a blanking step. Punching process to make holes in the second green sheet with punch pins,
The green sheet that has gone through the peeling step is placed on the mold with the printing surface facing upwards, and the green sheet that has undergone the punching step is placed on the mold with the film surface facing upwards to form the green sheet film. A first thermocompression bonding step of peeling and thermocompression bonding to form a laminated sheet; a second printing step of printing a conductor pattern on the formed laminated sheet and filling a conductor into the punching holes; and a second printed Third placing step of placing the laminated sheet on the mold, and blanking 3
A punching step of making a hole in the first green sheet with a punch pin, a fourth placing step of placing the punched green sheet on the die with the film surface facing upward, and a film of the green sheet placed on the die And a second thermocompression bonding step of peeling and thermocompression-bonding to form a laminated sheet, and a third printing step of printing a conductor pattern on the formed laminated sheet and filling the punching holes with a conductor. To form a substrate and to form a multi-layer substrate having four or more layers, the above steps are repeated, and finally sintering is performed at a high temperature.

[0005]

According to the above construction, the conductor paste is printed on the green sheet standard substrate to form the wiring, the second standard substrate is punched and placed on the die, and then the film is peeled off. Thermocompression bonding. Next, the two-layer laminated sheet formed by thermocompression bonding is taken out from the mold and printed on the upper surface to form wiring and via fill. This laminated sheet is placed on the upper surface of the mold, the third standard substrate is punched and placed on the mold, and the film is peeled and thermocompression bonded to form a three-layer laminated sheet. The formed laminated sheet is taken out from the mold, wiring is formed on the upper surface by printing, and the holes are filled with a conductor to form a via fill. Repeat the above steps 4
Make more than a layered substrate.

[0006]

Embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the manufacturing method of the green sheet multilayer substrate, the green sheet 21 is formed on the upper surface of the sheet-shaped film 20 in the forming step. Next, as shown in FIG. 1, in the blanking step, the sheet-shaped green sheet 21 is die-cut into a substantially quadrangular shape and guide holes 22 are provided to form a standard substrate 23 (A). Next, in a printing process, a conductor paste is printed on the upper surface of the fixed-sized substrate 23 to form the wiring 24 (B). Then, in the peeling step, the film is peeled (B), and in the next placing step, the guide hole 22 of the standard substrate 25 is placed on the upper surface of the die 26 in alignment with the guide pins 27 of the die 26. On the other hand, in the punching process, the via fill hole 28 is formed in the standard substrate 23.
Is punched to form a standard substrate 29 (C).
Next, in the mounting step, the guide hole 22 of the standard substrate 29 is inserted into the mold 2
The guide pins 27 of No. 6 are aligned with the upper surface of the standard substrate 25 previously placed (D). Then, in the thermocompression bonding process, the film 21 of the standard substrate 29 is peeled off and thermocompression bonded to form a two-layer laminated sheet 30. Further, in the printing step, the laminated sheet 30 is taken out from the mold 26, the conductor paste is printed from the upper surface to form the wiring 31, and the holes 28 are filled with the conductor paste to simultaneously form the via fill 32. The via fill 32 is connected to the wiring 24 of the standard substrate 23 (E). The process up to here is the first stacking process. The laminated sheet 30 created in the first laminating step is applied to the mold 26.
Place it on the upper surface of. On the other hand, in the punching process, the standard substrate 2
A hole 28 for via fill is punched in 3 with a punch pin to form a standard substrate 29 (C), and the guide hole 22 of the standard substrate 29 thus prepared is aligned with the guide pin 27 of the die 26 and superposed on the upper surface of the laminated sheet 30. . Then, the film 20 of the standard substrate 29 is peeled off and thermocompression bonded to form a three-layer laminated sheet. The laminated sheet is taken out of the mold, and a conductor paste is printed on the upper surface to form wiring, and the holes are filled with the conductor paste to form a via fill. The three-layer substrate is formed by the steps up to here. This is the second stacking step. The manufacturing process of a four-layer substrate or a multilayer substrate of four or more layers may be repeated by the same method as described above, and a description thereof will be omitted. When the lamination is completed, sintering is performed at a high temperature.

[0007]

As described above, in the present invention, since the green sheet is placed on the mold and then the film is peeled off, the green sheet does not extend as in the conventional case, and the wiring and the bare conductor are not formed. Securely connected. Further, since the wiring and the via fill are formed in one printing process, the conventional two processes can be reduced to one process, which is a great effect.

[Brief description of drawings]

FIG. 1 is a process drawing showing an embodiment of a method for manufacturing a multilayer substrate of the present invention.

FIG. 2 is a process drawing of a conventional method for manufacturing a multilayer substrate.

[Explanation of symbols]

 1 film 2 green sheet 3 sheet form 4 standard board 5 guide hole 6 hole 7 via conductor 8 wiring 9 mold 10 guide pin 20 film 21 green sheet 22 guide hole 23 standard substrate 24 wiring 25 standard substrate 26 mold 27 guide pin 28 Hole 29 Standard board 30 Laminated sheet 31 Wiring 32 Via fill

Claims (1)

[Claims] 1. A forming step of forming a green sheet on a sheet-like film surface, a blanking step of forming a guide hole while die-cutting the sheet-like green sheet into a plurality of substantially square shapes, and one blanked sheet. The first printing step of printing a conductor pattern on the green sheet surface of the green sheet of the eye, the peeling step of peeling the film of the printed green sheet, and the punching of punching holes in the second blanked green sheet with punch pins. Process,
The green sheet that has gone through the peeling step is placed on the mold with the printing surface facing upwards, and the green sheet that has undergone the punching step is placed on the mold with the film surface facing upwards to form the green sheet film. A first thermocompression bonding step of peeling and thermocompression bonding to form a laminated sheet; a second printing step of printing a conductor pattern on the formed laminated sheet and filling a conductor into the punching holes; and a second printed Third placing step of placing the laminated sheet on the mold, and blanking 3
A punching step of making a hole in the first green sheet with a punch pin, a fourth placing step of placing the punched green sheet on the die with the film surface facing upward, and a film of the green sheet placed on the die And a second thermocompression bonding step of peeling and thermocompression-bonding to form a laminated sheet, and a third printing step of printing a conductor pattern on the formed laminated sheet and filling the punching holes with a conductor. In order to form a substrate and form a multi-layer substrate having four or more layers, the above steps are repeated, and finally, sintering is performed at a high temperature.