JPH06233196A - Small camera device - Google Patents

Abstract

PURPOSE:To provide a compact CCD camera while including a CCD drive processing circuit by a simple production process. CONSTITUTION:A CCD unit 13 storing a CCD element 1 and a flexible substrate 15' mounted by a CCD unit drive processing circuit are folded and stored in a camera housing 17. At the same time, the insulator sheets 15e and 15f are formed in a single body with respective islands 15a-15c of the flexible substrate 15' containing circuit parts in order to secure insulation among electronic parts arranged opposite to each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a CCD (solid-state image pickup).
The present invention relates to a small camera using an element, and more particularly to a small camera device with improved productivity.

[0002]

2. Description of the Related Art In recent years, cameras using image pickup devices, particularly CCD devices, have been miniaturized, and they are widely used for medical purposes such as endoscopes, crime prevention, and visual inspection of printed circuit boards. Has become. This small camera is CC
Although it is composed of a D element and its peripheral circuit, in order to improve the marketability, a CCD drive processing circuit is built in the camera to extend the camera cable. For example, by incorporating the horizontal transfer circuit and the peripheral circuit of the CCD element in the camera body, the
The extension of the cable of about 0 m can be extended to about 30 m, and the advantage that the range of applications can be widened is obtained.

FIG. 3 shows a mounting structure of a small camera incorporating a conventional CCD drive processing circuit. Figure 3
(A) is a CCD element, a plastic filter 2 is attached on the CCD element 1, and a plurality of external connection bonding pads 3 are formed around the CCD element 1 to take out the output. Figure 3 (b) is a CCD
The structure of the element 1 is shown as a unit. Generally, the CCD element 1 is die-bonded to the central portion of the concave portion 4a of the ceramic substrate 4 having the concave portion 4a, and the gold wire 5 is formed.
Thus, the connection land 6 and the bonding pad 3 are connected by wire bonding.

Furthermore, in order to take out the output of the CCD element 1 to the outside, from the connection land 6 through the through hole 7,
It is pulled out to the lower surface of the ceramic substrate 4 and connected to the external connection land 8. The external connection land 8 has a structure in which a connection pin 10 is brazed with a silver solder 9. A glass plate 11 for protecting the CCD element 1 is fixed on the ceramic substrate 4 with an adhesive 12.

The ceramic packaged C of FIG.
The CD unit 13 is, as shown in FIG.
On the flexible substrate 15 such as polyimide to which electronic components for drive processing circuits such as 4a and 14b are soldered,
The CCD unit 13 is connected by soldering via the connection pin 10.

A driving IC is mounted on the flexible substrate 15.
16a, 16b, etc. are connected by wire bonding or soldering such as a flat package. In this way, the chip components 14a and 14b and the driving IC 16 are
The flexible board 15 on which electronic components for drive processing circuits such as a and 16b are mounted is housed in the camera housing 17 by bending or rolling.

Here, when the flexible substrate 15 is housed in the camera housing 17 by bending or the like, the insulating sheets 21a and 21b are provided to insulate the chip parts and the like which are in a layout relationship facing each other when being bent. Need to intervene. The camera cable 18 is connected by the connection pin 19 and the connector 20 which are soldered to the flexible substrate 15. When a horizontal transfer circuit and a CCD peripheral circuit are incorporated in the camera housing 17 as a drive processing circuit for the CCD element 1, the electronic component that needs to be mounted on the flexible substrate 15 is, for example, a logic for horizontal drive processing. 2 circuit ICs, 9 resistors, 9 capacitors
It is necessary to mount one unit and two transistors.

However, in the above-mentioned conventional mounting structure, when the flexible board is folded and housed in the camera housing 17, the insulating sheets 21a, 21a are provided to insulate the electronic components which are in a facing relationship by bending.
It is necessary to interpose a spacer such as b. If the size of the camera is further reduced in the future, it is considered that the manufacturability will be significantly reduced. Therefore, a structure that is simpler and suitable for miniaturization has been desired.

[0009]

In the above-mentioned conventional small-sized camera device, the CC device and the CC device are provided in the same housing.
Since the D element has a built-in drive processing circuit, there is a problem that manufacturability is inferior when further downsizing is attempted.

The present invention provides a compact camera device capable of improving manufacturability while incorporating a drive processing circuit to achieve miniaturization.

[0011]

According to another aspect of the present invention, there is provided a compact camera device in which a flexible substrate on which at least a CCD device and a processing circuit for driving the CCD device are mounted is folded and housed in a housing, and the flexible substrate is folded to store the flexible substrate. It is characterized in that a spacer, which insulates between electronic components arranged to face each other when housed in a housing, is integrally formed on the flexible substrate.

[0012]

With the above structure, when the flexible board is folded and housed in the housing, it is possible to realize insulation between the electronic parts arranged opposite to each other by the spacer integrally formed with the flexible board. .

[0013]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 illustrates an embodiment of the present invention. In the figure, the same parts as those in FIG.

First, chip components 14a and 14b such as a chip capacitor which constitutes a drive processing circuit for the CCD element 1 in the CCD unit 13 are soldered to a flexible substrate 15 'made of, for example, polyimide, and then the CCD element 1 is driven. The processing drive ICs 16a, 16b, etc. are mounted at predetermined locations on the flexible substrate 15 'by, for example, a wire bonding method.

It goes without saying that the drive processing drive IC may be mounted by soldering a flat package, but in this embodiment, the bare chip mounting is taken as an example from the viewpoint of downsizing the camera. If further miniaturization is required, flip chip mounting is also possible.

Further, the flexible substrate 15 'on which the CCD drive processing circuit is mounted is provided with an external connection pin 19 on one side.
The state in which the CCD unit 13 is attached to the other side is a configuration for mounting in the camera housing 17.

FIG. 2 is a view of the flexible substrate 15 'of FIG. 1 in a developed state before mounting. In FIG. 2, the flexible substrate 15 'includes an island 15a on which the CCD unit 13 is mounted, an island 15b on which chip components 14a and 14b and the like are mounted, an island 15c on which drive processing drive ICs 16a and 16b and the like are mounted, and connection pins 19. Island 15 to attach
d and the islands 15a and 15b are integrally formed.
Insulating sheets 15e and 15f are also integrally formed on the respective surfaces.

As shown in FIG. 1, the insulating sheet 15e is between the islands 15a and 15b, and the insulating sheet 15f is between the islands 15a and 15b.
In the state of being respectively interposed between b and 15c, they are sequentially bent and housed in the camera housing 17. As a result, even if the electronic components are attached to the islands 15a and 15b of the flexible substrate 15 'so as to face each other and are in close proximity to each other, the short circuits of the circuits formed on the islands 15a and 15b do not occur. The same can be said for the insulating sheet 15f interposed between the islands 15b and 15c. As a result, the camera housing 17
Flexible substrate 1 that is sequentially folded and stored inside
It is possible to prevent a short circuit in the 5'circuit.

As described above, in the above-described embodiment, the insulating sheets 15e and 15f between the facing electronic components are integrally formed with the flexible substrate 15 ', so that the conventional process such as attaching an insulating tape is not required. Therefore, it is possible to realize mounting in a CCD compact camera which is more productive.

[0020]

As described above, according to the small-sized camera device of the present invention, it is possible to realize a small-sized camera with a CCD while including the CCD drive processing circuit by a simpler manufacturing process.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining an embodiment of the present invention.

FIG. 2 is a development view showing the flexible board used in FIG. 1 in an expanded manner.

FIG. 3 is a sectional view of a conventional CCD unit.

FIG. 4 is a sectional view of a conventional small camera using the unit of FIG.

[Explanation of symbols]

1 ... CCD element, 13 ... CCD unit 13, 15 '...
Flexible substrates, 15a-15c ... Islands 15a-15
c, 15e, 15f ... Insulating sheet, 17 ... Camera housing.

Claims (1)

[Claims] 1. A small camera device in which a flexible substrate on which at least a CCD device and a processing circuit for driving the CCD device are mounted is folded and housed in a housing, and when the flexible substrate is folded and housed in the housing, A small camera device, characterized in that a spacer for insulating between electronic parts arranged facing each other is integrally formed on the flexible substrate.