JPH06226791A - Resin sealing device - Google Patents

Abstract

PURPOSE:To provide a resin sealing device which can replace a chase in molded closed state and damage of a parting surface can be prevented. CONSTITUTION:An upper chase 18 of an upper mold base 16 is removable in molds closed state. A lower chase 32 of a lower mold base 20 is removable in the molds closed state. An elastic member 64 for separating parting surfaces of the chases 18, 32 by an elastic force in a state that the molds are closed and a driving mechanism does not exerts a mold clamping force and elastically deforming in a state that the mechanism exerts the clamping force to bring the parting surfaces of the chases 18 and 32 into contact with one another is provided in the chase 18 and/or the chase 32.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing device, and more specifically, an upper mold base and an upper chase that can be horizontally slid on and removed from the upper mold base. A lower mold base that can be moved relative to the upper mold base, and a lower mold base that can be horizontally slid on and removed from the lower mold base. The lower mold chase that can be engaged with the chase and the upper mold base and the lower mold base are moved relative to each other, and a mold clamping force is applied to the upper mold base or the lower mold base in the mold closed state. The present invention relates to a resin sealing device including a drive mechanism for driving the resin sealing device.

[0002]

2. Description of the Related Art Conventionally, an upper mold base, an upper chase that can be horizontally slid on and removed from the upper mold base, and a relative movement relative to the upper mold base. A lower mold base that is capable of sliding, and a lower mold chase that can be slid in the horizontal direction with respect to the lower mold base and can be attached and detached, and that can be engaged with the upper mold chase when the mold is closed; As a resin sealing device including a drive mechanism that relatively moves the mold base and the lower mold base relative to each other and applies a mold clamping force to the upper mold base or the lower mold base in the mold closed state, , JP-A-62
-269328, JP-A-62-269329, JP-A-62-269330, JP-A-63-8.
There is a technique disclosed in Japanese Patent No. 2718.

In these resin sealing devices, the upper chase and the lower chase can be exchanged when the semiconductor device to be molded is changed. At the time of this replacement, the upper chase and the lower chase are opened through the drive mechanism, and the upper chase before the replacement is slid horizontally with respect to the upper mold base to be removed from the upper mold base. . The lower chase before replacement is also slid in the horizontal direction with respect to the lower mold base to be removed from the lower mold base.
After that, slide the new upper mold chase horizontally to the upper mold base to attach and detach it to the upper mold base, and slide the new lower mold chase horizontally to the lower mold base to lower mold. The replacement is completed by mounting from the mold base.

[0004]

However, the above-mentioned conventional resin sealing device has the following problems. When exchanging the upper chase and the lower chase, the conventional device opens the upper chase and the lower chase and separates the upper chase and the lower chase from the upper mold base and the lower mold base separately. Let Next, since new upper chase and lower chase are separately attached to the upper mold base and the lower mold base, at least 5 steps are required for the replacement work, which is an obstacle to improving work efficiency. Further, the upper chase and the lower chase must always be used in combination with a predetermined upper chase and the lower chase. However, when exchanging the upper chase and the lower chase, handling the upper chase and the lower chase separately from the upper mold base and the lower mold base may cause an error in the combination of the two. There is. Moreover, if the upper chase and the lower chase are handled separately, a wide space is required as a working and storage space. Furthermore, if the upper chase and the lower chase are handled separately, the parting surfaces of the two may become dirty or damaged.

Therefore, the present inventor has proposed to perform the upper chase and the lower chase in the mold closed state when exchanging the upper chase and the lower chase. However, the party of the upper chase and the lower chase is proposed. If the contact surfaces are
There was a problem that the parting surface would be damaged by shock, vibration, etc., and this was not achieved. Therefore, the present invention provides a resin sealing device capable of performing the upper mold chase and the lower mold chase in the mold closed state when exchanging the upper mold chase and the lower mold chase, and preventing damage to the parting surface. With the goal.

[0006]

In order to solve the above problems, the present invention has the following constitution. That is, the upper mold base, the upper chase that can be slid in the horizontal direction with respect to the upper mold base, and can be attached and detached, and can move relative to and away from the upper mold base. A lower mold base, a lower mold chase that can be slidably attached to and detached from the lower mold base in the horizontal direction, and that can engage with the upper mold chase in a mold closed state; and the upper mold. A resin sealing device comprising: a mold base and a lower mold base that move relative to each other; and a drive mechanism that applies a mold clamping force to the upper mold base or the lower mold base in a mold closed state. The upper mold chase is attachable to and detachable from the upper mold base when the mold is closed, and the lower mold base is movable from the lower mold when the mold is closed. A chair is attachable / detachable, and the upper chase and / or the lower chase may be elastically coupled to each other in the upper mold chase and / or the lower chase when the mold is closed and the driving mechanism does not apply a mold clamping force. When the drive mechanism applies the mold clamping force, the parting surfaces of the upper part chase and the lower part chase are elastically deformed so that the parting surfaces of the upper chase and the lower chase can contact each other. Characterize. In particular, the upper mold base may be fixed to the apparatus main body, and the lower mold base may be slidable in the horizontal direction with respect to the apparatus main body so that it can be attached / detached. A chase exchanging mechanism may be provided for horizontally sliding the lower chase onto the lower mold base to attach and detach the lower chase when the lower chase is closed.

[0007]

[Operation] The operation will be described. Since the upper mold chase and the lower mold chase can be attached to and detached from the upper mold base and the lower mold base in the mold closed state, the upper mold chase and the lower mold chase can be exchanged in the mold closed state. In addition, the upper chase and / or the lower chase separates the parting surfaces of the upper chase and the lower chase from each other by elastic force when the mold is closed and the driving mechanism does not apply the mold clamping force. When the drive mechanism applies a mold clamping force, an elastic body that elastically deforms to allow the parting surfaces of the upper chase and the lower chase to contact each other is provided. It is possible to keep the parting surfaces separated from each other and prevent the parting surfaces from being damaged.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 is a perspective view of a semiconductor encapsulation device for resin-encapsulating a semiconductor chip of a semiconductor device, which is an example of a resin encapsulation device. In FIG. 1, 10 is a base part, and four guide columns 12 are erected on the upper surface. 1
Reference numeral 4 denotes a movable plate that constitutes the main body of the apparatus,
And is vertically movable along the guide column 12. An upper mold base 16 is fixed to the lower surface of the movable plate 14. Reference numeral 18 denotes an upper mold chase, which is attached to the upper mold base 16. Although the detailed structure will be described later, the upper chase 18 is the upper mold base 16
It can be attached and detached by sliding it horizontally.

A lower mold base 20 is attached to the base 10. Lower mold base 20
Are fixed on the slide portion 22. Slide part 2
2 is slidable in the direction of arrow A along a rail 24a provided on the base 10. Reference numeral 26a is a ball screw, and two (one is not shown) are arranged along each rail 24a. Each ball screw 26a is screwed with a nut 28 (one of which is not shown) fixed to the lower surface of the slide portion 22. The ball screw 26a is the base 1
It is driven by a motor 30a fixed to 0. Therefore, by driving the motor 30a, the ball screw 26a rotates, and the slide portion 22 and the lower mold base 20 can be moved along the rail 24a.
A lower chase 32 is housed in the lower mold base 20. The detailed structure will be described later, but the lower chase 3
2 can be attached to and detached from the lower mold base 20 by sliding in the horizontal direction.

Reference numeral 34 is a drive mechanism, which is a mechanism for moving the movable plate 14 up and down. The drive mechanism 34 is a motor 30b.
The pressing screw 36 rotated by the motor 30b and the nut 37 screwed with the pressing screw 36 are fixed, and the cross head 39 vertically moved by the rotation of the pressing screw 36 is connected to the cross head 39 and is moved to the movable plate 14. It includes a pair of toggle links 38 for applying a pressing force. When the movable plate 14 is moved downward by the drive mechanism 34, the upper mold chase 18 and the lower mold base 20 attached to the upper mold base 16 are attached.
The lower chase 32 attached to is approached. At this time, the engaging protrusions 40 projecting from the four sides of the upper die chase 18 and the engaging recesses 42 recessed from the four sides of the lower die chase 32 engage with each other (see FIG. 2). In this state, the parting surface of the upper die chase 18 and the parting surface of the lower die chase 32 are not in close contact with each other, and will be referred to as a die closed state for the sake of explanation. When performing resin sealing, the drive mechanism 34 further moves the movable plate 14 in order to counter the resin filling pressure, and the pressing force (the mold clamping force) is applied to the upper mold base 16 and the lower mold base 20 in the mold closed state. Force). In this state, the parting surface of the upper mold chase 18 and the parting surface of the lower mold chase 32 are in close contact with each other, which is referred to as a mold clamping state for the sake of explanation. A state in which the movable plate 14 moves upward and the upper chase 18 and the lower chase 32 are separated from each other and disengaged from each other is referred to as an upper mold open state.

Reference numeral 44 denotes a chase exchanging mechanism, which slides the lower chase 32 and the upper chase 18 together with the lower chase 32 and the upper chase 18 horizontally in the direction of arrow A in the mold closed state. Put on and take off.
The chase exchange mechanism 44 can be sequentially moved in the direction of arrow B by a carrier vehicle 46 that moves along the rail 24b. A rail 24c is fixed in the direction of arrow A on the upper surface of the transport vehicle 46, and a slide plate 48 is slidable in the direction of arrow A along the rail 24c. Slide plate 48
Is slid in the direction of arrow A by a ball screw 26b driven by a motor (not shown). A rail 24d on which upper surfaces of the upper mold chase 18 and the lower mold chase 32 in the mold closed state can slide is provided on the slide plate 48 in the arrow A direction. The attachment / detachment arm 50 is movable in the arrow A direction along the rail 24d, and an attachment / detachment rod 52 is provided at the tip of the attachment / detachment arm 50. The tip of the removable rod 52 is
The lower chase 32 can enter the engaging hole 54 that opens on the end surface, and cannot be removed from the engaging hole 54 when it has rotated 1/4. The attachment / detachment arm 50 is moved in the direction of arrow A by an arm driving device 56 (for example, a motor and a feed screw).

Next, the structures of the upper mold base 16 and the upper chase 18 will be described with further reference to FIG. The right end surface of the upper mold base 16 is the opening / closing member 5.
It can be opened and closed with 8a. Closing the opening / closing member 58a,
By fixing, the upper mold chase 18 is positioned within the upper mold base 16. As shown in FIG. 1, a horizontal guide groove 60a in the direction of arrow A is formed on the inner wall surface of the upper mold base 16. On both side surfaces of the upper chase 18, there are formed ridges 62a slidably engageable with the guide grooves 60a. Therefore, when the opening / closing member 58a is in the open state (the state shown in FIG. 1), the upper mold chase 18 slides horizontally along the guide groove 60a and can be attached to and detached from the upper mold base 16.

A spring 64, which is an example of an elastic body, is arranged in the upper chase 18. Further, a plunger 66 whose lower end is capable of projecting from the parting surface of the upper chase 18 is provided, and the spring 64 constantly biases the plunger 66 in the projecting direction. When the mold is closed by providing the spring 64 and the drive mechanism 34 does not apply the mold clamping force, the lower end of the plunger 66 protruding by the elastic force of the spring 64 contacts the parting surface of the lower mold chase 32. The parting surfaces of the upper chase 18 and the lower chase 32 are separated from each other (shown by a gap G in FIG. 2). On the other hand, when the driving mechanism 34 applies a mold clamping force to the upper mold base 16, the spring 64
Is compressed, the plunger 66 retracts into the upper chase 18, and the parting surfaces of the upper chase 18 and the lower chase 32 come into close contact with each other.

Next, the structures of the lower mold base 20 and the lower chase 32 will be described with further reference to FIG. The right end surface of the lower mold base 20 is the opening / closing member 5.
It can be opened and closed with 8b. Closing the opening / closing member 58b,
By fixing, the lower chase 32 is positioned in the lower mold base 20. As shown in FIG. 7, a horizontal guide groove 60b in the direction of arrow A is formed on the inner wall surface of the lower mold base 20. On both side surfaces of the lower chase 32, convex ridges 62b slidably engageable with the guide grooves 60b are formed. Therefore, when the opening / closing member 58b is in the open state (the state shown in FIGS. 1 and 7), the lower mold chase 32 slides horizontally along the guide groove 60b and is attachable to and detachable from the lower mold base 20.
The lower chase 32 is provided with a block 68 to which a plunger (not shown) for resin pressure feeding is attached, and the concave grooves 70 formed on both side surfaces of the block 68 are formed in the base portion 10. It is adapted to be slidably engaged with the provided engaging portion 72. The engaging portion 72 is
When the lower mold base 20 is set on the base portion 10, the lower mold base 20 corresponds to the slit 74 formed on the bottom surface of the lower mold base 20 (see FIG. 7).

Next, the replacement of the upper chase 18 and the lower chase 32 will be described with reference to FIGS. The state shown in FIG. 2 is a mold closing state in which the mold clamping force is released from the mold clamping state, and the parting surface of the upper mold chase 18 mounted in the upper mold base 16 and the lower mold base 20. Lower chase 32 installed inside
A gap G is held between the parting surface and the parting surface by the elastic force of the spring 64. When the upper chase 18 and the lower chase 32 are replaced, first, as shown in FIG. 3, the opening / closing member 58a is rotated in the arrow C direction. By this rotation, the upper mold chase 18 becomes the upper mold base 1
It can be removed from 6.

In this state, the motor 30a is driven to move the slide portion 22 and the lower mold base 20 forward (direction of arrow D). Since the opening / closing member 58b is closed, the lower chase 32 cannot be removed from the lower mold base 20. Then, when the lower mold base 20 moves forward,
The lower mold chase 32 advances together with the lower mold base 20. At that time, since the mold closed state is maintained, the engagement convex portion 40 of the upper die chase 18 and the engagement concave portion 42 of the lower die chase 32 are engaged with each other, and the upper die chase 18 has the lower die chase 32. Along with it, it moves out and comes off from the upper mold base 16 (state of FIG. 4). Next, as shown in FIG. 5, the opening / closing member 58a is rotated in the arrow E direction. By this rotation,
The lower chase 32 can be removed from the lower mold base 20.

During this time, the carrier 4 of the chase exchange mechanism 44
6, the stand-by is completed at the position shown in FIG. 1, the slide plate 48 moves in the direction of the lower mold base 20, and the detachable arm 50 also moves in the same direction. By the movement of the detachable arm 50, the tip of the detachable rod 52 enters the engaging hole 54 of the lower die chase 32. After that, the attachment / detachment rod 52 is rotated 1/4 and engaged with the engagement hole 54. In this state, when the detachable arm 50 moves in the direction away from the lower mold base 20, the upper mold chase 18 and the lower mold chase 3 in the mold closed state.
2 is integrally pulled out from the lower mold base 20 and mounted on the rail 24d (FIG. 6, arrow F). Rail 2 with upper chase 18 and lower chase 32 in the mold closed state
4D, the slide plate 48 moves in the direction away from the lower mold base 20, and the carriage 46 moves in the direction of arrow B.
Move in the direction.

Then, the new upper chase 18 and the lower chase 32 are transferred onto the rail 24d with the mold closed state, and the carrier vehicle 46 corresponds to the lower mold base 20 in the forward state (the state shown in FIG. 1). . From this state, the slide plate 48 and the attachment / detachment arm 50 move in the direction of approaching the lower mold base 20, and the upper mold chase 18 and the lower mold chase 32 in the mold closed state having the gap G are moved to the lower mold base 20.
Put it inside. Upper chase 18 and lower chase 32
When is attached to the inside of the lower mold base 20, the attachment / detachment rod 52 is rotated 1/4 and the engagement with the engagement hole 54 is released. In this state, when the detachable arm 50 moves in the direction away from the lower mold base 20, the upper chase 18 and the lower chase 32 become free with respect to the chase exchange mechanism 44. Subsequently, the opening / closing member 58b is closed and the motor 3
The lower mold base 20 and the like are retracted by driving 0a. By this retreat, the upper die chase 18 is mounted in the upper die mold base 16. When the upper die chase 18 is attached, the opening / closing member 58a is closed and the upper die chase 18
The exchange of the lower chase 32 is completed.

When exchanging the upper chase 18 and the lower chase 32, the mold can be kept closed, so that the number of steps in the exchanging work can be reduced and the work efficiency can be improved. Further, since the upper mold chase 18 and the lower mold chase 32 that can maintain the mold closed state can always maintain a predetermined combination, the upper mold chase 18 and the lower mold chase 32 of the upper mold chase 18 and the lower mold chase 32 can be used later. No mistakes will occur in the combination. . Moreover, since the upper chase 18 and the lower chase 32 can be handled in the mold closed state, the space for work and storage can be smaller than that when they are handled separately. In addition, upper chase 18 and lower chase 3
Since the two parts are not treated separately, it is possible to prevent the parting surfaces of the two parts from being soiled or damaged.

In particular, by disposing the spring 64, the parting surfaces of the upper mold chase 18 and the lower mold chase 32 are elastically exerted in the mold closed state and in the state where the drive mechanism 34 does not apply the mold clamping force. Are separated from each other,
At the time of replacement, it is possible to keep the parting surfaces of the upper chase 18 and the lower chase 32 separated from each other and prevent damage to the parting surfaces. Further, if the elastic force of the spring 64 is adjusted so that the lower surface of the ridge 62a and the bottom surface of the guide groove 60a cannot contact with each other in the mold closed state, it becomes possible to eliminate the frictional resistance between both surfaces, and the upper mold chase 18
The lower chase 32 and the lower chase 32 can be exchanged more smoothly. Although various preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. .

[0021]

When the resin sealing device according to the present invention is used,
When exchanging the upper chase and the lower chase, the mold can be kept closed, so that the number of steps in the exchanging work can be reduced and the work efficiency can be improved.
In addition, since the upper chase and the lower chase that can maintain the mold closed state can always maintain a predetermined combination, an error does not occur in the combination of the upper chase and the lower chase. . Also, since the upper chase and the lower chase can be handled in the mold closed state, the space for work and storage can be smaller than that when handled separately, and it is possible to suppress dirt and damage on both parting surfaces. Become.

In particular, by disposing the elastic body, the parting surfaces of the upper chase and the lower chase are separated from each other by the elastic force when the mold is closed and the driving mechanism does not apply the mold clamping force. Therefore, it is possible to keep the parting surfaces of the upper chase and the lower chase separated from each other at the time of replacement, and it is possible to prevent the parting surfaces from being damaged. Furthermore, if a chase exchange mechanism is provided, it is possible to automate the exchange of the chase, which is very effective.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor sealing device that is an embodiment of a resin sealing device according to the present invention.

FIG. 2 is a partial cross-sectional view showing a mold closed state in the semiconductor sealing device of the example.

FIG. 3 is a partial side view showing a procedure of chase exchange in the semiconductor sealing device of the embodiment.

FIG. 4 is a partial side view showing a procedure of chase exchange in the semiconductor sealing device of the embodiment.

FIG. 5 is a partial side view showing a chase exchange procedure in the semiconductor sealing device of the embodiment.

FIG. 6 is a partial side view showing a procedure of chase exchange in the semiconductor sealing device of the embodiment.

FIG. 7 is a partial perspective view showing a relationship between a lower mold base and a lower chase.

[Explanation of symbols]

 14 Movable plate 16 Upper mold base 18 Upper mold chase 20 Lower mold base 22 Sliding part 32 Lower mold chase 34 Drive mechanism 40 Engaging convex part 42 Engaging concave part 44 Chase exchanging mechanism 64 Spring

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display location // B29L 31:34 4F

Claims (3)

[Claims] 1. An upper mold base, an upper chase that can be slid horizontally in and out of the upper mold base, and a relative movement relative to the upper mold base. A lower mold base that is capable of sliding, and a lower mold chase that can be slidably attached to and detached from the lower mold base in the horizontal direction and that can be engaged with the upper mold chase in a mold closed state; A resin encapsulation including a drive mechanism for moving the upper mold base and the lower mold base relative to each other and for applying a mold clamping force to the upper mold base or the lower mold base in a mold closed state. In the stopping device, the upper mold chase is attachable / detachable in the mold closed state, and the lower mold base is in the mold closed state. A lower die chase is attachable and detachable, and the upper die chase and / or the lower die chase are elastically exerted on the upper die chase and / or the lower die chase by the elastic force in the die closed state and when the drive mechanism does not apply the die clamping force. An elastic body is provided which separates the parting surfaces of each other and elastically deforms when the drive mechanism applies the mold clamping force to allow the parting surfaces of the upper chase and the lower chase to contact each other. A resin sealing device characterized by the above. 2. The upper mold base is fixed to the apparatus main body, and the lower mold base is slidable in the horizontal direction with respect to the apparatus main body and can be attached and detached. Item 1. The resin sealing device according to item 1. 3. A chase exchanging mechanism for horizontally sliding the lower chase to and from the lower mold base when the upper chase and the lower chase are closed. Item 2. The resin sealing device according to item 2.