JPH06226485A - Coating solder and lid for sealing semiconductor package stuck with coating solder - Google Patents
Coating solder and lid for sealing semiconductor package stuck with coating solderInfo
- Publication number
- JPH06226485A JPH06226485A JP3456493A JP3456493A JPH06226485A JP H06226485 A JPH06226485 A JP H06226485A JP 3456493 A JP3456493 A JP 3456493A JP 3456493 A JP3456493 A JP 3456493A JP H06226485 A JPH06226485 A JP H06226485A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- coating
- lid
- paraffin wax
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 74
- 239000011248 coating agent Substances 0.000 title claims abstract description 28
- 238000000576 coating method Methods 0.000 title claims abstract description 28
- 239000004065 semiconductor Substances 0.000 title claims abstract description 7
- 238000007789 sealing Methods 0.000 title abstract description 19
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 15
- 239000000956 alloy Substances 0.000 claims abstract description 15
- 239000012188 paraffin wax Substances 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 3
- 239000001301 oxygen Substances 0.000 abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 abstract description 3
- 239000004215 Carbon black (E152) Substances 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract description 2
- 229930195733 hydrocarbon Natural products 0.000 abstract description 2
- 150000002430 hydrocarbons Chemical class 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 9
- 239000007789 gas Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000001307 helium Substances 0.000 description 5
- 229910052734 helium Inorganic materials 0.000 description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000011800 void material Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000010731 rolling oil Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、半導体組立工程にお
ける、ＩＣ、ＬＳＩなどのＳｉチップを基板、リードフ
レーム、セラミックスパッケージなどにダイボンディン
グするはんだ付け工程で使用するコーティングはんだに
関するものであり、セラミックスパッケージを金属製あ
るいはセラミックス製リッドで封止する際にプリフォー
ムはんだを被接合物の間に挟んで接合するプリフォーム
コーティングはんだに関するものであり、さらに、プリ
フォームコーティングはんだをリッドの表面に接合した
半導体パッケージ封止用はんだ付きリッドに関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating solder used in a soldering step of die-bonding a Si chip such as IC and LSI to a substrate, a lead frame, a ceramic package, etc. in a semiconductor assembling step. The present invention relates to a preform-coated solder which is sandwiched between objects to be joined when the package is sealed with a metal or ceramic lid, and further, the preform-coated solder is joined to the surface of the lid. The present invention relates to a soldered lid for sealing a semiconductor package.
【０００２】[0002]
【従来の技術】一般に、フラックスコーティング層をは
んだ合金表面に形成してなるコーティングはんだは知ら
れており、例えは特開平４−１１１９９４号公報には、
ハロゲン化物系フラックス、特にフッ化物系フラックス
をはんだ合金の表面にコーティングしたコーティングは
んだが記載されており、また特表平３−５０５３０５号
公報には、ジカルボキシル酸フラックス剤とセルロース
誘導体の混合体フラックスをはんだ合金の表面に被覆し
てなるコーティングはんだが記載されている。2. Description of the Related Art Generally, a coating solder in which a flux coating layer is formed on the surface of a solder alloy is known. For example, Japanese Patent Laid-Open No. 4-111994 discloses
A coating solder in which a surface of a solder alloy is coated with a halide-based flux, particularly a fluoride-based flux, and Japanese Patent Publication No. 3-505305 discloses a flux mixture of a dicarboxylic acid flux agent and a cellulose derivative. Coated solder obtained by coating the surface of a solder alloy with is described.
【０００３】これらコーティングはんだは、熱交換器の
パイプ、印刷回路板あるいは電子回路板などのはんだ付
けに適用されることも知られている。It is also known that these coating solders are applied to soldering of heat exchanger pipes, printed circuit boards, electronic circuit boards and the like.
【０００４】[0004]
【発明が解決しようとする課題】しかし、上記従来のコ
ーティングはんだは、フラックスコーティング層が、水
蒸気や酸素を透過させるので、内部のはんだ合金が酸化
され易く、また、はんだ表面や被はんだ付け面の酸化物
溶解のために、フラックスに含まれる活性剤は、はんだ
付け後周辺金属の腐食を招くため洗浄の必要性がある。However, in the above-mentioned conventional coating solder, since the flux coating layer allows water vapor and oxygen to pass therethrough, the solder alloy inside is easily oxidized, and the solder surface and the surface to be soldered are not affected. Since the oxide is dissolved, the activator contained in the flux needs to be cleaned since it causes corrosion of the peripheral metal after soldering.
【０００５】そのため、上記従来のコーティングはんだ
は、高信頼性が要求され、洗浄が不可能なＩＣパッケー
ジ内のダイボンディングやパッケージ封止には使用する
ことができなかった。Therefore, the above conventional coating solder is required to have high reliability and cannot be used for die bonding or package sealing in an IC package which cannot be cleaned.
【０００６】そのため、通常、パッケージ内などの高信
頼性が要求される位置のはんだ付けには、フラックスを
使用せず、Ｎ2 やＮ2 ＋Ｈ2 雰囲気で、被接合材と接合
材の間にコーティングの無いプリフォームはんだを挟
み、はんだ融点以上に昇温してはんだ付けを行ってい
る。Therefore, normally, for soldering at a position where high reliability is required in a package or the like, no flux is used, and a N 2 or N 2 + H 2 atmosphere is used to separate the material to be bonded between the materials to be bonded. The preform solder without coating is sandwiched and the temperature is raised to above the melting point of the solder for soldering.
【０００７】しかし、かかるコーティングのないプリフ
ォームはんだを用いたはんだ付けは被接合材と接合材の
間にボイドが生じ、接合強度が落ち、密封性や放熱性、
熱疲労封止寿命が短いなどの問題点があった。However, in the soldering using the preform solder without such a coating, a void is generated between the materials to be bonded and the bonding material is deteriorated, and the sealing property, the heat radiation property,
There are problems such as a short thermal fatigue sealing life.
【０００８】本発明者は、このプリフォームはんだにお
けるボイドの発生機構についての研究を行った結果、以
下の理由によるものであることも判明した。As a result of research on the void generation mechanism in the preform solder, the present inventor has also found that the reason is as follows.
【０００９】すなわち、はんだ表面には必ず十〜数百オ
ングストロームの厚みの酸化膜が存在するが、この酸化
膜ははんだ付けされる平らな面に挟むだけでは酸化膜の
全面的崩壊とはならず、部分的に裂けるだけであり、こ
の酸化膜ははんだ溶融時にはんだ付け面に密着し、密着
した部分には溶融はんだが触れないためにはんだが濡れ
ない状態で残留する。That is, there is always an oxide film with a thickness of 10 to several hundred angstroms on the solder surface, but if the oxide film is sandwiched between the flat surfaces to be soldered, the oxide film will not be totally collapsed. The oxide film adheres only to the soldering surface when the solder melts, and the molten solder does not touch the adhered portion, so that the solder remains in a state where the solder does not wet.
【００１０】また、はんだ表面すなわち酸化膜表面に
は、圧延オイルの残留物や吸着水分や吸着有機物質が存
在し、はんだ付け温度である２００〜４００℃程度でガ
ス化し、さらに雰囲気ガスもはんだ溶融開始時に、はん
だ付け面とはんだの間に残留している。On the surface of the solder, that is, on the surface of the oxide film, there are rolling oil residues, adsorbed water and adsorbed organic substances, which are gasified at a soldering temperature of about 200 to 400 ° C., and the atmospheric gas is also melted. At the beginning, it remains between the soldering surface and the solder.
【００１１】かかる状態ではんだが溶融すると、酸化膜
がはんだ付け面に密着し、はんだが濡れてない状態のま
ま酸化膜表面で発生するガスと残留雰囲気ガスによっ
て、ボイドが形成され、酸化膜が部分的に裂けた領域で
は、はんだが濡れているため、発生したガスは、溶融は
んだに囲まれてはんだから出ていけず、その後さらに温
度を上げると、まだはんだが濡れていない酸化膜が密着
した領域に、酸化膜が裂けてはんだの濡れている部分か
らはんだが濡れ広がって行き、はんだ付け面は全面はん
だに濡れ、酸化膜は丸まってボイドの中に残留する。When the solder melts in such a state, the oxide film adheres to the soldering surface, and voids are formed by the gas generated on the surface of the oxide film and the residual atmosphere gas while the solder is not wet and the oxide film is formed. Since the solder is wet in the partially torn area, the generated gas is surrounded by the molten solder and cannot escape from the solder, and when the temperature is further raised after that, the oxide film that is not yet wet with solder adheres. In the region, the oxide film tears and the solder spreads from the wet part of the solder, the soldering surface wets the entire surface of the solder, and the oxide film curls and remains in the void.
【００１２】[0012]
【課題を解決するための手段】そこで、本発明者等は、
かかるボイド発生機構を考慮に入れて問題点を解決すべ
く研究を行った結果、パラフィンワックスをフラックス
コーティング層として塗布してなるコーティングはんだ
は、パラフィンワックス自体が水蒸気または酸素を通過
させる性質がなく、さらにはんだ付け温度で完全に炭化
水素ガスとなって分解蒸発するところから、はんだ合金
表面が酸化されることがなく、またコーティングはんだ
を用いて、例えば半導体パッケージ封止を行なっても回
路に悪影響を及ぼすことがなく、信頼性の高い封止を行
なうことができるという知見を得たのである。Therefore, the present inventors have
As a result of conducting research to solve the problem in consideration of the void generation mechanism, the coating solder formed by applying paraffin wax as the flux coating layer does not have the property that the paraffin wax itself allows water vapor or oxygen to pass therethrough. Furthermore, since it completely becomes a hydrocarbon gas at the soldering temperature and decomposes and evaporates, the surface of the solder alloy is not oxidized, and even if the coating solder is used to seal the semiconductor package, for example, the circuit is not adversely affected. They have obtained the knowledge that highly reliable sealing can be performed without causing any adverse effect.
【００１３】この発明は、かかる知見にもとづいてなさ
れたものであって、（１） はんだ合金表面にパラフィ
ンワックスを被覆してなるコーティングはんだまたはプ
リフォームコーティングはんだ、（２） 窓枠形状コー
ティングはんだを片面にパラフィンワックスだけを溶融
して貼付けてなる半導体パッケージ封止リッド、に特徴
を有するものである。The present invention has been made on the basis of the above findings. (1) A coating solder or preform coating solder in which the surface of a solder alloy is coated with paraffin wax, and (2) a window frame-shaped coating solder. It is characterized by a semiconductor package sealing lid in which only paraffin wax is melted and pasted on one side.
【００１４】[0014]
【実施例】工業用ガソリンに融点：９５℃のパラフィン
ワックス：１％を溶解し、コーティング溶解液を作製し
た。EXAMPLE A paraffin wax having a melting point of 95 ° C .: 1% was dissolved in industrial gasoline to prepare a coating solution.
【００１５】このコーティング溶解液に、Ｐｂ−１０％
Ｓｎはんだ合金インゴットを浸漬し、浸漬しながら上記
はんだ合金インゴットの皮むきを行い、その後はんだ合
金インゴットに上記コーティング溶解液をかけながら押
出し加工、冷間圧延およびスリッティングを行い、厚
さ：０．０７mm、幅：３５mmのはんだリボンを作製し
た。In this coating solution, Pb-10%
The Sn solder alloy ingot is dipped, the solder alloy ingot is peeled while being dipped, and then the solder alloy ingot is extruded, cold rolled and slitted while the coating solution is applied, and the thickness: 0. A solder ribbon having a width of 07 mm and a width of 35 mm was prepared.
【００１６】このはんだリボンに、さらに溶解液をかけ
ながら打抜き加工を施し、外径寸法：３０mm×３０mm、
内径寸法：２８mm×２８mmを有する窓枠状プリフォーム
はんだを成形した。This solder ribbon is punched while applying a solution to it, and the outer diameter is 30 mm × 30 mm.
A window frame-shaped preform solder having an inner diameter of 28 mm × 28 mm was molded.
【００１７】上記窓枠状プリフォームはんだを工業用ガ
ソリン中で洗浄し、乾燥せずに再度コーティング溶解液
に漬け、使用直前まで保存する。The window frame preform solder is washed in industrial gasoline, dipped in the coating solution again without being dried, and stored until just before use.
【００１８】使用直前にコーティング溶液中の窓枠状プ
リフォームはんだを取出し、乾燥窒素を吹付けながら工
業用ガソリンを蒸発させると、窓枠状プリフォームはん
だの表面に白い固体ワックスが被覆されたコーティング
プリフォームはんだが得られた。Immediately before use, the window frame preform solder in the coating solution was taken out, and industrial gasoline was evaporated while blowing dry nitrogen, so that the surface of the window frame preform solder was coated with white solid wax. A preform solder was obtained.
【００１９】一方、Ｆｅ−４２％Ｎｉ板にＮｉメッキを
施した外径：３０mm×３０mm、厚さ：０．３mmの金属製
リッドおよび上記プリフォームはんだと同形の部分がＷ
メタライズされ、さらにＮｉメッキ、Ａｕメッキされ
た、外径：３２mm×３２mm、厚さ：２mmのアルミナ製リ
ッドを用意した。On the other hand, a Fe-42% Ni plate plated with Ni has an outer diameter of 30 mm × 30 mm and a thickness of 0.3 mm, which is made of metal and has the same shape as the preform solder.
An alumina lid having an outer diameter of 32 mm × 32 mm and a thickness of 2 mm, which was metallized and further plated with Ni and Au, was prepared.
【００２０】テフロン板の上に、コーティングプリフォ
ームはんだを置き、その上に上記金属製リッドおよびア
ルミナ製リッドのシーリング部を下側として、コーティ
ングプリフォームはんだとリッドのシーリング部外径を
合せて乗せ、アイロンをリッドに軽く押し付けて白い固
体ワックスのみを溶融させることによりコーティングプ
リフォームはんだをリッドに貼付け、金属製封止用リッ
ドおよびセラミックス製封止用リッドを作製した。The coated preform solder is placed on a Teflon plate, and the coating preform solder and the lid sealing portion outer diameter are placed on top of the coated preform solder with the sealing portions of the metal lid and the alumina lid facing downward. Then, the iron was lightly pressed against the lid to melt only the white solid wax, and the coating preform solder was attached to the lid to produce a metal sealing lid and a ceramic sealing lid.
【００２１】これら金属製封止用リッドおよびセラミッ
クス封止用リッドをそれぞれ上記プリフォームはんだと
同形の部分がメタライズされたセラミックスパッケージ
の封止部に重ね、シーリング用クリップで仮固定し、こ
れを露点−６０℃以下のＮ2＋Ｈ2 混合ガス雰囲気中、
３５０℃×５分のピーク温度でパッケージ封止を行っ
た。The metal sealing lid and the ceramics sealing lid are respectively placed on the sealing portion of the ceramics package in which the same shape as the preform solder is metallized, and temporarily fixed by a sealing clip, and the dew point is set. In a N 2 + H 2 mixed gas atmosphere at -60 ° C or lower,
The package was sealed at a peak temperature of 350 ° C. for 5 minutes.
【００２２】得られた封止パッケージ各２０個を熱サイ
クル試験機に設置し、−４５℃に３０分保持したのち１
２５℃に３０分保持する熱サイクルを５００サイクル付
加したのち、フロリナート液に浸漬し、６０秒間肉眼で
観察するグロスリークテストを行ったが、泡の発生は見
られなかった。そこで、さらに上記熱サイクルを施した
封止パッケージをヘリウムボンビング装置に入れ、真空
に引いたのちＨｅガスを６kgf ／cm2 の圧力で６時間保
持し、ついで装置から取出してヘリウムディテクターに
入れ、リーク量を測定するヘリウムリークテストを行な
った結果、ヘリウムリーク量は全て１×１０-7atm ・cc
／sec 未満であり、合格値を示した。20 pieces of each of the obtained sealed packages were set in a thermal cycle tester and kept at -45 ° C. for 30 minutes, and then 1
After applying a heat cycle of holding at 25 ° C. for 30 minutes for 500 cycles, a gross leak test was conducted in which it was immersed in a Fluorinert solution and visually observed for 60 seconds, but no foam was observed. Then, the sealed package subjected to the above-mentioned heat cycle was further put in a helium bombing device, and after being evacuated, He gas was held at a pressure of 6 kgf / cm 2 for 6 hours, then taken out from the device and put in a helium detector, As a result of the helium leak test to measure the leak amount, the helium leak amount is 1 × 10 −7 atm · cc
It was less than / sec and showed a passing value.
【００２３】一方、比較のために、従来のコーティング
のない窓枠状プリフォームはんだを用いて同様にパッケ
ージ封止を２０個行い、同様にして熱サイクル試験を行
なったのち、フロリナート液に浸漬し、６０秒間肉眼で
観察するグロスリークテストを行ったところ、２０個の
うち４個に泡の発生が見られ、残りの１６個にヘリウム
リークテストを行ったところ、８個に１×１０-7atm ・
cc／sec 以上のリークが見つかり、不合格となった。On the other hand, for comparison, 20 package encapsulations were similarly carried out using a conventional unframed window frame preform solder, and a thermal cycle test was conducted in the same manner, followed by immersion in a Fluorinert solution. When a gross leak test was performed with the naked eye for 60 seconds, bubbles were observed in 4 out of 20 pieces, and a helium leak test was performed in the remaining 16 pieces, and 1 piece was found to be 1 × 10 -7 in 8 pieces. atm ・
A leak of cc / sec or more was found and the test failed.
【００２４】[0024]
【発明の効果】上述のように、この発明のコーティング
はんだを用いると、熱サイクルなどが加えられても封止
欠陥を生ずることがないところから、優れたフラックス
レスはんだ付け接合を行うことができ、電子電気部品の
信頼性を大幅に向上させるなど産業上すぐれた効果をも
たらすものである。As described above, when the coating solder of the present invention is used, a sealing defect does not occur even if a thermal cycle is applied, and therefore, excellent fluxless soldering connection can be performed. , It will bring great advantages in the industry by greatly improving the reliability of electronic and electrical parts.
Claims (4)
被覆してなることを特徴とするコーティングはんだ。1. A coated solder comprising a solder alloy surface coated with paraffin wax.
ィンワックスを被覆してなることを特徴とするコーティ
ングはんだ。2. A coated solder, characterized in that the surface of a preformed solder alloy is coated with paraffin wax.
状を有していることを特徴とする請求項２記載のコーテ
ィングはんだ。3. The coating solder according to claim 2, wherein the preform solder alloy has a window frame shape.
ィングはんだをリッドの片面にパラフィンワックスだけ
を溶融して貼付けてなることを特徴とする半導体パッケ
ージ封止用リッド。4. A lid for encapsulating a semiconductor package, wherein the coating solder having the window frame shape according to claim 3 is attached to one surface of the lid by melting only paraffin wax.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3456493A JPH06226485A (en) | 1993-01-29 | 1993-01-29 | Coating solder and lid for sealing semiconductor package stuck with coating solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3456493A JPH06226485A (en) | 1993-01-29 | 1993-01-29 | Coating solder and lid for sealing semiconductor package stuck with coating solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06226485A true JPH06226485A (en) | 1994-08-16 |
Family
ID=12417816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3456493A Pending JPH06226485A (en) | 1993-01-29 | 1993-01-29 | Coating solder and lid for sealing semiconductor package stuck with coating solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06226485A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5669548A (en) * | 1995-03-24 | 1997-09-23 | Nippondenso Co., Ltd. | Soldering method |
| JP2003078058A (en) * | 2001-08-31 | 2003-03-14 | Kinseki Ltd | Electronic component sealing method |
| US6605357B1 (en) | 1999-07-28 | 2003-08-12 | Denso Corporation | Bonding method and bonding structure of thermoplastic resin material |
-
1993
- 1993-01-29 JP JP3456493A patent/JPH06226485A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5669548A (en) * | 1995-03-24 | 1997-09-23 | Nippondenso Co., Ltd. | Soldering method |
| US6218030B1 (en) | 1995-03-24 | 2001-04-17 | Nippondenso Co., Ltd. | Soldered product |
| US6562147B2 (en) | 1995-03-24 | 2003-05-13 | Denso Corporation | Soldered product |
| US6605357B1 (en) | 1999-07-28 | 2003-08-12 | Denso Corporation | Bonding method and bonding structure of thermoplastic resin material |
| JP2003078058A (en) * | 2001-08-31 | 2003-03-14 | Kinseki Ltd | Electronic component sealing method |
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