JPH06222557A - Photosensitive resin composition - Google Patents

Abstract

PURPOSE: To provide a photosensitive resin compsn. in the form of an aq. soln. or water dispersion which allows the execution of development process with a dilute aq. alkaline soln. CONSTITUTION: This compsn. contains (a) an aq. emulsion of a high-polymer compd. which has an acid value of 50 to 300mg-KOH/g and a glass transition temp. of 30 to 250 deg.C and has at least one piece of carboxyl groups in one molecule; (b) a compd. which has at least one piece of ethylenic unsatd. bond in one molecule and (c) a photopolymn. initiator which can generate free radicals by irradiation with active light as essential component.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a photosensitive resin composition containing no organic solvent. For more details,
The present invention is a photosensitive resin composition in the form of an aqueous solution or an aqueous dispersion, which can be developed with a dilute aqueous alkaline solution.
The present invention relates to a method for producing the same and a method for producing a printed circuit board using the composition.

[0002]

2. Description of the Related Art Photosensitive resin solutions and films are used as resist materials for chemical and electrochemical processing of base materials such as etching and plating in the fields of printed circuit board manufacturing, precision processing of metals and the like. It is widely used. Conventional photosensitive resin is an organic solvent solution,
Most are processed into a film from an organic solvent solution. Further, in the developing step after exposure, an organic solvent has been mainly used in the past, but in recent years, a dilute alkaline aqueous solution has come to be used as a developing solution in view of environmental problems, worker health problems and the like. However, even if the developing solution is replaced with an aqueous solution, volatilization of the organic solvent is inevitable during application of the resist, drying, or processing into a film, which causes air pollution and health problems.

[0003]

SUMMARY OF THE INVENTION The object of the present invention is to solve the above-mentioned problems, to enable development with a dilute alkaline aqueous solution, and to solve the problem of organic solvent scattering in the form of an aqueous solution or an aqueous dispersion. It is to provide a photosensitive resin composition that does not occur.

[0004]

Therefore, the present invention provides (a) an acid value of 50 to 300 mg-KOH / g and 30 to 30 mg.
An aqueous emulsion of a polymer having a glass transition temperature of 250 ° C. and having at least one carboxyl group in one molecule; (b) a compound having at least one ethylenically unsaturated bond in one molecule; and The present invention relates to a photosensitive resin composition in the form of an aqueous solution or an aqueous dispersion, characterized in that it contains a photopolymerization initiator capable of generating a free radical upon irradiation with active light;

The compound having at least one carboxyl group in one molecule used in the preparation of the component (a) of the composition of the present invention is solubilized, dispersed, suspended or emulsified in water to form an aqueous emulsion. It is also possible to dissolve, disperse, suspend, or emulsify a compound having at least one carboxyl group in one molecule in water using a surfactant called an emulsifier, but a more stable aqueous resin In order to obtain a composition solution, a monomer having at least one carboxyl group and at least one double bond in the molecule and a monomer copolymerizable therewith are emulsion-polymerized or suspension-polymerized. It is preferable to prepare an aqueous emulsion of a polymer compound by polymerizing it using the method described above.

A monomer having at least one carboxyl group and at least one double bond in the molecule for such purpose, that is, for preparing the component (a) in the composition of the present invention. Examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, crotonic acid, cinnamic acid and the like. You may use these monomers in mixture of 2 or more types.

Further, another monomer copolymerizable with a monomer having at least one carboxyl group and at least one double bond in the molecule used in the preparation of the component (a) of the composition of the present invention. As the monomer, methyl acrylate,
Use of acrylic acid ester such as ethyl acrylate, methacrylic acid ester such as methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, etc., and known polymerizable monomer such as styrene, vinyltoluene, acrylamide, acrylonitrile, butadiene, etc. You can

Polymerization methods such as emulsion polymerization and suspension polymerization in the preparation of the component (a) of the present invention are carried out by known methods and conditions. That is, a monomer having at least one carboxyl group and at least one double bond in one molecule, and another monomer copolymerizable therewith are prepared as an alkyl sulfonate or an alkylbenzene sulfonate. , Anionic surfactants such as alkyl diphenyl ether disulfonate, naphthalene sulfonic acid formalin condensate, poly oxoethylene alkyl ether sulfate, etc.,
To emulsify and suspend in water using a nonionic surfactant such as polyethylene glycol ether or polyethylene sorbitan ester, and to carry out a polymerization reaction using a water-soluble polymerization initiator such as potassium persulfate, hydrogen peroxide or ammonium persulfate. You can During the reaction, known additives may be added to the reaction solution in order to enhance the stability of the solution after the reaction.
Further, in order to control the molecular weight of the polymer, it is preferable to use a known chain transfer agent such as 1-dodecanethiol or 3-dodecanethiol.

The acid value of the polymer compound having at least one carboxyl group in one molecule obtained by the above method is preferably 50 to 300 mg / g, and 80 to 2
50 mg / g is more preferable. When the acid value is less than this value, it is difficult to perform development processing using a dilute aqueous alkali solution. Further, when the acid value is more than this value, properties such as water resistance and etching liquid resistance of the resist film are impaired.

The glass transition temperature of the polymer compound having at least one carboxyl group in one molecule obtained by the above method is preferably 30 to 250 ° C, and 50 to 200 ° C. Is more preferable. When the glass transition temperature is below this value, the resist solution remains sticky even after being applied to the substrate and dried, which is inconvenient when the negative mask is closely contacted for exposure. Further, if the glass transition temperature is above this value, it is difficult to obtain a uniform film after coating the resist solution on the substrate and drying.

The component (b) of the composition of the present invention, that is, the compound having at least one ethylenically unsaturated bond in one molecule is 2-hydroxyethyl acrylate, 2
-Hydroxypropyl acrylate, N-vinylpyrrolidone, acryloylmorpholine, methoxytetraethylene glycol acrylate, methoxypolyethylene glycol acrylate, polyethylene glycol diacrylate, N, N-dimethylacrylamide, N-methylolacrylamide, N, N-dimethylaminopropylacrylamide, N, N-dimethylaminoethyl acrylate, N, N-dimethylaminopropyl acrylate, melamine acrylate, or methacrylates corresponding to the above acrylates, diethylene glycol diacrylate, triethylene glycol diacrylate, propylene glycol diacrylate, dipropylene glycol diacrylate , Tripropylene glycol diacrylate, polyp Pyrene glycol diacrylate, phenoxyethyl acrylate, tetrahydrofurfuryl acrylate, cyclohexyl acrylate, trimethylolpropane triacrylate, glycerin diglycidyl ether diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol pentaacrylate, pentaerythritol hexaacrylate, Mention may be made of isoborneolyl acrylate, cyclopentadiene-mono or diacrylate, and the methacrylates corresponding to the above acrylates.

The above-mentioned compound having at least one ethylenically unsaturated bond in one molecule may be directly added to an aqueous emulsion of a polymer compound having at least one carboxyl in one molecule. Known emulsifiers,
After making an aqueous emulsion in advance using a dispersant,
It is desirable to add.

The above-mentioned compound having at least one ethylenically unsaturated bond in one molecule is a compound of the composition of the present invention.
Component (a), that is, an acid value of 80 to 250 mg-KOH
It is also possible to impregnate into particles of an aqueous emulsion of a polymer compound having a glass transition temperature of 50 to 200 ° C./g and having at least one carboxyl group in one molecule. Impregnation of a monomer into polymer particles dispersed, suspended or emulsified in water is described in JP-B-57-24369.
It is known as a mechanism of the seed polymerization method found in the publication.

The component (c) of the composition of the present invention, that is, a photopolymerization initiator capable of generating a free radical upon irradiation with actinic rays, includes 2-ethylanthraquinone, 2-t-butylanthraquinone, octamethylanthraquinone, 1,2. −
Quinones such as benzanthraquinone and α-such as benzoin, pivaloin and acyloin ether
Ketaldonyl alcohols, ethers, α-phenylbenzoin, α, α′-diethoxyacetophenone,
Ketones such as benzophenone and 4,4′-bisdialkylaminobenzophenone, thioxanthone derivatives,
The 2,4,5-triarylimidazolyl dimer can be mentioned. These may be used alone or in combination of two or more.

A known polymerization inhibitor may be added to the photosensitive resin composition of the present invention in order to prevent thermal polymerization during storage. Examples of these inhibitors include hydroquinone, hydroquinone monomethyl ether, pyrogallol, tertiary butyl catechol, and phenothiazine.

In the photosensitive resin composition of the present invention, if necessary, known fillers such as barium sulfate, silicon oxide, talc, clay and calcium carbonate, phthalocyanine green, titanium oxide and carbon black are also known. Conventional colorants, leveling agents, adhesion improvers, thixotropic agents,
Fillers and the like can be added.

The photosensitive resin composition of the present invention comprises (a) 50-
10 to 50 parts by weight of an aqueous emulsion of a polymer compound having an acid value of 300 mg-KOH / g and a glass transition temperature of 30 to 250 ° C. and having at least one carboxyl group in one molecule in terms of solid content; ) Compound 10 having at least one ethylenically unsaturated bond in one molecule
50 parts by weight; and (c) 1 to 20 parts by weight of a photopolymerization initiator capable of generating free radicals upon irradiation with active light; and, if necessary, other additives. At the time of mixing, it is desirable to carry out high speed stirring using a homomixer, a disperser or the like, or ultrasonic waves, heating, etc. to complete dispersion, emulsification and impregnation into particles.

The photosensitive resin composition according to the present invention is applied onto a copper-clad laminate, which is a material for printed wiring boards, by a known method such as roll coating, dip coating or screen printing, and then dried. A resist layer can be formed by carrying out. After that, the active light is irradiated through a negative mask, and then a developing treatment can be performed using a dilute alkaline aqueous solution. By using the resist pattern thus formed, a desired wiring circuit pattern can be formed by performing an etching process by a known method.

[0019]

By using the photosensitive resin composition of the present invention, a printed wiring board can be obtained by a usual method without using an organic solvent, and the resin composition of the present invention contains an organic solvent. Since it is not contained, it has an effect that environmental and health problems due to volatilization of the organic solvent do not occur.

[0020]

EXAMPLES The present invention will be specifically described below with reference to examples. The examples described below show the embodiments of the present invention, and the present invention is not limited thereto.

[0021]

Example 1 (1) Synthesis of Methyl Methacrylate / Methacrylic Acid Copolymer Aqueous Emulsion 2 g of sodium dodecylbenzenesulfonate and 2 g of Emulgen 920 (Kao Corporation nonionic surfactant) were dissolved in 300 g of deionized water. .

This was charged into a 1-liter four-necked flask equipped with a cooling tube, a thermometer, a nitrogen blowing port, and a stirrer, and 82.3 g of methyl methacrylate and 1 part of methacrylic acid were charged.
A mixture of 7.7 g and 1-dodecanethiol 0.2 g was added with stirring to emulsify. As a polymerization initiator,
A solution obtained by dissolving 0.3 g of potassium persulfate in 100 g of deionized water was added, and polymerization was carried out at 60 ° C. for 5 hours and 65 ° C. for 2 hours under a nitrogen stream to obtain an acid value of 115.5 mg in terms of solid content.
/ G, glass transition temperature calculated from the Fox equation 105.
A polymer having a solid content of 20% and having a temperature of 2 ° C. was obtained.

(2) Preparation of photosensitive resin composition solution 100 g of polymer aqueous solution obtained above; 20 g of trimethylolpropane triacrylate; 1 g of Irgacure 651 (photopolymerization initiator manufactured by Ciba-Geigy); Talc 15 g; Aerosil # 380 (fine powder silica manufactured by Nippon Aerosil Co., Ltd.) 1.5 g; Ethyl violet 0.2 g; was stirred at a high speed for 5 minutes at 10,000 rpm or more using a homomixer to obtain a photosensitive resin composition solution according to the present invention. It was

(3) Fabrication of Printed Wiring Board On one side of a 1.2 mm-thick copper-clad laminate made of glass epoxy with 25 μm copper foil stretched on both sides, a roll coater was used to obtain a dry film thickness of 20 μm. The photosensitive resin composition solution obtained above was applied so that

After drying the coating layer at 80 ° C. for 15 minutes, the resin composition according to the present invention was similarly coated on the back surface of the laminated plate,
It was dried at 0 ° C. for 20 minutes. Then, 350 mJ / cm ² of ultraviolet rays are radiated through a PET negative mask, and spray development is performed by spraying a 1% sodium carbonate aqueous solution for 30 seconds.
An etching resist pattern was obtained. Using this pattern, etching was performed with a ferric chloride / hydrochloric acid etching solution, and then the resist was peeled off with a 1% sodium hydroxide aqueous solution to obtain a desired wiring circuit pattern.

[0026]

Example 2 (1) Preparation of Acrylic Acid / Methyl Methacrylate / Ethyl Acrylate Copolymer Aqueous Emulsion 100 g of deionized water, 5 g of Emulgen 935 (Kao Corporation, nonionic surfactant), Perex SS-L 0.1 g (anionic surfactant manufactured by Kao Corporation) was dissolved. To this aqueous solution, a mixture of 25.6 g of acrylic acid, 71.6 g of methyl methacrylate, 2.8 g of ethyl acrylate and 0.2 g of 1-dodecanethiol was added with stirring.
Under a nitrogen stream, 0.05 g of potassium persulfate dissolved in 20 g of deionized water was added, and the mixture was reacted at 60 ° C. for 4 hours. After this, potassium persulfate dissolved in a small amount of water 0.0
1 g was added, and the mixture was further reacted at 60 ° C. for 2 hours to give a solid content of 43%, a solid content-based acid value of 200 mg-KOH / g, and F.
An aqueous acrylic acid / methyl methacrylate / ethyl acrylate copolymer aqueous emulsion having a glass transition temperature of 100 ° C. calculated from the equation of ox was obtained.

(2) Preparation of Photosensitive Resin Composition Solution Aqueous acrylic acid copolymer aqueous emulsion obtained above 10
0 g; Aronix M-400 (manufactured by Toagosei Co., Ltd., mixture of dipentaerythritol hexaacrylate and dipentaacrylate) 40 g; Lucirin TPO (BASF, photopolymerization initiator) 4 g; Crystal Violet 0.5 g; At high speed to obtain a photosensitive resin composition solution.

(3) Fabrication of Printed Wiring Board On one side of a 1.6 mm-thick glass-epoxy copper clad laminate having 25 μm copper foil on both sides, a dry film thickness of 30 μm was obtained by using a doctor knife. The photosensitive resin composition solution obtained above was applied so that

After the coated layer was dried at 80 ° C. for 15 minutes, the resin composition was similarly coated on the back surface of the laminated plate and dried at 90 ° C. for 20 minutes. Then 250 through a PET negative mask
Irradiation with ultraviolet rays of mJ / cm ² was carried out by spraying a 1% sodium carbonate aqueous solution for 30 seconds to develop, thereby obtaining an etching resist pattern. Using this pattern, etching was performed with a ferric chloride / hydrochloric acid etching solution, and then the resist was peeled off with a 1% sodium hydroxide aqueous solution to obtain a desired wiring circuit pattern.

[0030]

Example 3 (1) Synthesis of Styrene / Methacrylic Acid Copolymer Aqueous Emulsion In 150 g of deionized water, 1 g of Emulgen 920 (manufactured by Kao Corporation, nonionic surfactant) and 1 g of sodium dodecylbenzenesulfonate were dissolved. A mixture of 40.8 g of styrene, 9.2 g of methacrylic acid and 0.1 g of 1-dodecanethiol was added to this solution with stirring. Then
Under a stream of nitrogen, 0.15 g of potassium persulfate was added to deionized water 5
What was dissolved in 0 g was added, and after reacting at 60 ° C. for 5 hours and at 65 ° C. for 2 hours, the nitrogen stream was stopped, 0.1 g of L-ascorbic acid was added, and further reacted at 70 ° C. for 2 hours,
A styrene / methacrylic acid copolymer aqueous emulsion having a solid content of 19.1% was obtained. The styrene / methacrylic acid copolymer emulsified and dispersed in this solution had an acid value of 120 mg-KOH / g in terms of solid content, a glass transition temperature of 105.2 ° C. calculated by the Fox equation, and a diameter of 0. It had a spherical shape of 5 μm.

(2) Preparation of Photosensitive Resin Composition Solution 0.2 g of sodium laurylsulfonate was dissolved in 70 ml of deionized water, and 12 g of trimethylolpropane triacrylate and Irgacure 907 were stirred at high speed.
0.6 g (a photopolymerization initiator manufactured by Ciba-Geigy) was added and emulsified. To this solution was added 35 g of the styrene / methacrylic acid copolymer aqueous emulsion obtained in (1) above, 30 ml of acetone was added, and the mixture was stirred at 40 ° C. for 5 hours to allow the aqueous emulsion particles to contain the monomer and trimethylolpropane. Impregnated with triacrylate. After the acetone was distilled off, the particle size of the aqueous emulsion was 0.5 μm to 2.
It was increased to 8 μm.

(3) Preparation of printed wiring board A glass epoxy plate having a thickness of 1.4 mm and having a thickness of 25 on both sides.
0.7mm to 0.3m on a laminated plate with copper foil of μm
m, followed by electroless plating activation treatment, thin electroless copper plating, and electrolytic copper plating to deposit copper having a thickness of 25 μm in the through holes. Above this board
The photosensitive resin composition solution obtained in (2) is dip-coated and dried, exposed, developed, etched, and resist stripped in the same manner as in Examples 1 and 2 to obtain a printed wiring board having a desired pattern. It was

[0033]

Example 4 (1) Synthesis of Methyl Methacrylate / Methacrylic Acid Copolymer Aqueous Emulsion 2 g of Emulgen 920 and 2 g of sodium dodecylbenzenesulfonate were dissolved in 300 g of deionized water.
Methyl methacrylate 81.
A mixture of 6 g, 18.4 g of methacrylic acid and 0.2 g of 1-dodecanethiol was added and emulsified. As a polymerization initiator, 0.3 g of potassium persulfate dissolved in 100 g of deionized water was added, and the mixture was reacted at 60 ° C. for 5 hours and at 65 ° C. for 2 hours under a nitrogen stream. 0.2 g of 1 L-ascorbic acid was added, the nitrogen stream was stopped, and the temperature was further increased to 70 ° C.
The reaction was carried out for 2 hours to remove residual radicals. The solid content concentration of the obtained methyl methacrylate / methacrylic acid copolymer aqueous emulsion was 19.8%, the acid value in terms of solid content was 120 mg-KOH / g, and the glass transition temperature calculated from the Fox equation was It was 109.4 ° C.

(2) Preparation of photosensitive resin composition solution 100 g of the methyl methacrylate / methacrylic acid copolymer aqueous emulsion obtained above was added to Kayarad DPCA-2.
0 (Nippon Kayaku Co., caprolactone modified dipentaerythritol hexaacrylate) 20 g, Darocur-4
265 (manufactured by Merck & Co., a photopolymerization initiator, 2-hydroxy-
2-methyl-1-phenyl-1-propanone-1) 0.
A photosensitive resin composition solution was prepared by adding 2 g and 0.2 g of ethyl violet.

(3) Preparation of Printed Wiring Board A printed wiring board was prepared in the same manner as in Examples 1 and 2 using the photosensitive resin composition solution obtained in (2) above.

[0036]

Example 5 (1) Styrene / acrylic acid / n-butyl acrylate /
Synthesis of Methyl Methacrylate Copolymer Aqueous Emulsion 0.1 g of sodium lauryl sulfonate and 8.8 g of sodium hydrogen carbonate were dissolved in 150 g of deionized water. To this solution, 3/4 of an aqueous solution in which 2.64 g of potassium persulfate was dissolved in 50 g of deionized water was added under a nitrogen stream. After the temperature was raised at 70 ° C, styrene 1 was added to the reaction solution.
A mixture of 8.2 g and 10 g of acrylic acid was added dropwise over 2 hours. After adding the remaining potassium persulfate aqueous solution,
Methyl methacrylate 50 g, n-butyl acrylate 20
g was added dropwise over 3 hours and reacted at 70 ° C. for 3 hours,
An aqueous emulsion of styrene / acrylic acid / n-butyl acrylate / methyl methacrylate copolymer having a solid content of 29.4% was obtained. The acid value of the solid content of this copolymer is 80
The glass transition temperature calculated from the formula of mg / g, Fox is 5
It was 0 ° C.

(2) Preparation of photosensitive resin composition solution 12 g of trimethylolpropane triacrylate, G1
5 g of 01P (glycerin dimethacrylate manufactured by Kyoeisha Yushi Co., Ltd.) and 2.4 g of Irgacure 651 were mixed.
This was added to 100 g of the styrene / acrylic acid / n-butyl acrylate / methyl methacrylate copolymer aqueous emulsion obtained in (1) above while stirring at high speed to prepare a photosensitive resin composition solution.

(3) Preparation of Printed Wiring Board A printed wiring board was prepared in the same manner as in Examples 1 and 2 using the photosensitive resin composition solution obtained in (2) above.

[0039]

Comparative Example 1 (1) Synthesis of Styrene / Acrylic Acid / n-Butyl Acrylate Copolymer Aqueous Emulsion 0.1 g of sodium lauryl sulfonate and 9.32 g of sodium hydrogen carbonate were dissolved in 150 g of deionized water.
To this, 2.64 g of ammonium persulfate dissolved in 50 g of deionized water was added under a nitrogen stream and the temperature was raised to 70 ° C. A mixture of 18.2 g of styrene and 10 g of acrylic acid was added dropwise over 2 hours, and then n-butyl acrylate 81.
8 g was added dropwise over 7 hours to obtain a styrene / acrylic acid / n-butyl acrylate copolymer aqueous emulsion having a solid content of 37.2%. The acid value of the solid equivalent of the copolymer is 7
The glass transition temperature calculated from the formula of 1 mg / g Fox was −28 ° C.

(2) Preparation of photosensitive resin composition solution Using the aqueous emulsion obtained above, a photosensitive resin composition solution was prepared in the same composition and method as in Example 5.

(3) Preparation of Printed Wiring Board Using the photosensitive resin composition solution obtained above, Example 1,
The photosensitive resin composition solution was applied onto the copper-clad laminate in the same manner as in 2. After drying at 80 ° C. for 30 minutes, a uniform film was formed, but the surface was so sticky that the negative mask could not be adhered and exposed. Even after being dried at high temperature or for a long time, stickiness did not disappear.

[0042]

Comparative Example 2 (1) Synthesis of Styrene / Acrylic Acid Copolymer Aqueous Emulsion 4 g of Perex SS-L (manufactured by Kao Corporation, anionic surfactant, sodium alkyldiphenyl ether disulfonate) was dissolved in 250 g of deionized water. Styrene 9
A mixture of 4.9 g, acrylic acid 5.1 g, and 1-dodecanethiol 0.1 g was added with stirring under a nitrogen stream,
After adding 0.25 g of potassium persulfate dissolved in 50 g of deionized water, the mixture was reacted at 85 ° C. for 7 hours to give a styrene / acryl having a solid content of 25.3% and an acid value of 40 mg / g in terms of solid content. An aqueous acid copolymer emulsion was obtained. The glass transition temperature of this copolymer was 100.4 ° C. according to the Fox equation.

(2) Preparation of photosensitive resin composition solution 100 g of the aqueous emulsion obtained above, DPCA-20
25 g, Darocur 4265 1 g, and ethyl violet 0.2 g were rapidly stirred with a homomixer to obtain a photosensitive resin composition solution.

This photosensitive resin composition solution was used in Example 1,
The substrate was coated and dried in the same manner as in 2. The photosensitive resin after drying has a uniform film shape and is 200 m
After irradiation with UV light of J / cm ² , a latent image was observed, but spray development using 1% sodium carbonate was impossible.

[0045]

Comparative Example 3 By the same method as in Example 1, the monomer composition ratio was 53.8 g of methyl methacrylate and 46.
As 2 g, a methyl methacrylate / methacrylic acid copolymer aqueous emulsion having an acid value of 301.7 mg / g and a glass transition temperature of 105.5 ° C. calculated by the Fox equation was synthesized.

A photosensitive resin solution was prepared in the same manner as in Example 1, coated on a substrate, dried and exposed. When a 1% sodium carbonate aqueous solution was sprayed, the image area also swelled and peeled off, and an etching resist pattern could not be formed.

Table 1 shows the composition of the aqueous emulsions obtained in Examples 1 to 5 and Comparative Examples 1 to 3, the glass transition temperature, the acid value, and the characteristics of the photosensitive resin compositions.

[0048]

[Table 1]

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Claims (5)

[Claims] 1. (a) An aqueous emulsion of a polymer compound having an acid value of 50 to 300 mg-KOH / g and a glass transition temperature of 30 to 250 ° C. and having at least one carboxyl group in one molecule; b) a compound having at least one ethylenically unsaturated bond in one molecule; and (c) a photopolymerization initiator capable of generating a free radical upon irradiation with active light; A photosensitive resin composition in the form of an aqueous solution or an aqueous dispersion. 2. A particle of a polymer compound having at least one carboxyl group in one molecule is impregnated with a compound having at least one ethylenically unsaturated bond in one molecule. 1. The photosensitive resin composition according to 1. 3. A water-based emulsion in which the compound having at least one ethylenically unsaturated bond in one molecule is solubilized in water or dispersed, suspended or emulsified by the action of an emulsifier. 1. The photosensitive resin composition according to 1. 4. A method such as emulsion polymerization and suspension polymerization of a monomer having at least one carboxyl group and at least one double bond in the molecule and a monomer copolymerizable therewith. By using and polymerizing, 50-300 m
An aqueous emulsion of a polymeric compound having an acid value of g-KOH / g and a glass transition temperature of 30 to 250 ° C. and having at least one carboxyl group in one molecule is formed, and the emulsion is prepared with The aqueous solution or aqueous dispersion according to claim 1, wherein a compound having at least one ethylenically unsaturated bond in the molecule and a photopolymerization initiator capable of generating a free radical upon irradiation with active light are mixed. A method for producing a photosensitive resin composition of the form. 5. A method for producing a printed circuit board, wherein the composition according to claim 1 is used as an aqueous resist solution, and the irradiation resist layer is developed using a dilute alkaline aqueous solution.