JPH06216581A - Electronic component mounting device - Google Patents

Abstract

(57) [Summary] [Purpose] To improve the tact of component mounting on multi-sided boards. [Electronic parts are grouped into high speed, medium speed, and low speed according to mounting speed, and a mounted substrate, which is a multi-chambered substrate provided with first and second component mounting patterns, is moved by an XY table, In an electronic component mounting apparatus that sequentially mounts components for each group over the first and second component mounting patterns of the mounted substrate, the electronic component mounting for high-speed mounting is the first component mounting pattern → the second component mounting pattern. Electronic component mounting for medium speed mounting is performed in the order of the second component mounting pattern → first component mounting pattern, and electronic component mounting for low speed mounting is performed in the first component mounting pattern → first The order of the first and second component mounting patterns is
The distance and the number of movements across the second component mounting pattern are reduced to improve the mounting tact.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components on a mounting substrate.

[0002]

2. Description of the Related Art In recent years, with the progress of electronics, there has been a demand for further improvement in productivity of electronic component mounting apparatuses, and in particular, improvement of mounting tact has become an issue.

A conventional electronic component mounting apparatus will be described below with reference to FIGS. FIG. 4 is a schematic perspective view of the electronic component mounting apparatus. As shown in FIG. 4, in the electronic component mounting apparatus, the nozzle 2 as a component attaching / detaching device for adsorbing and mounting the electronic component 1 and the mounted substrate (printed circuit board) 3 are fixed and movable in XY directions. An XY table 4, a plurality of types of electronic components 1 designated by a predetermined number (for example, Z number) are mounted in a laterally parallel posture, and a component supply unit 5 movable in a predetermined direction, and an electronic component A control unit 6 that controls the entire component mounting apparatus is provided.

Then, the nozzle 2 that sucks the electronic component 1 while moving the XY table 4 to which the mounting substrate 3 is fixed is moved.
The electronic component 1 is mounted at an arbitrary position on the mounted substrate 3 by lowering the and stopping the suction operation. The component supply unit 5 sequentially moves in a predetermined lateral direction to guide the electronic component 1 to a position below the nozzle 2, and then the nozzle 2 is lowered to suck the electronic component 1.

By the way, in this type of electronic component mounting apparatus, a plurality of circuits having the same pattern are provided on one mounted substrate 3 in the same direction in a predetermined direction (for example, a direction along the substrate carrying direction), and the mounted substrate is mounted. In some cases, a multi-chambered board is used in which a plurality of electronic components 1 are mounted on the board 3 and then cut to produce a plurality of boards having the same pattern.

The mounting operation of the electronic component mounting apparatus on this multi-sided board will be described with reference to FIGS. In FIG. 5, reference numeral 10 denotes mounting data, which indicates a pattern data portion 10a indicating the position of each component mounting pattern (hereinafter, abbreviated as a pattern) on the multi-sided board and the position of a block (electronic component arranging location) in the pattern. The block data section 10b shown in FIG. Pattern data section 10
In a, an offset value is recorded for each pattern (here, the first and second patterns P1 and P2) of the multi-layered substrate. In the block data section 10b, the coordinates of the mounting position of each block with respect to one pattern and the Z number of the electronic component 1 to be mounted are recorded.

Here, in FIG. 6, 3a is a first pattern (P1) on the mounted substrate 3 which is a multi-chambered substrate.
Area 3b, the second pattern (P
It corresponds to the area of 2). Further, Z1 to Z5 are electronic components 1 arranged in the respective blocks N1 to N5 on the mounting substrate 3.
Then, Z1 and Z2 are small-sized, Z3 is a medium-sized, and Z4 and Z5 are large-sized electronic components 1. The mounting tacts are high speed, medium speed, and low speed, respectively. Thus, the reason why the mounting tact is divided by speed is due to the inertia of the electronic component 1, and is determined by the suction force of the nozzle 2 and the adhesion force with the mounted substrate 3. Then, it is necessary to mount the electronic components Z1 and Z2 to be mounted on the mounted substrate 3 at a high speed first. That is, when the large-sized electronic components Z4 and Z5 to be mounted at low speed are mounted and then the mounted substrate 3 is moved at high speed by the XY table 4, the mounted electronic components Z4 and Z5 are displaced or dropped due to their inertia. Therefore, the electronic components Z1 and Z2 to be mounted at high speed are mounted first.

Therefore, conventionally, the steps have been implemented in the order shown in the flowchart of FIG. First, in step # 11, the electronic components Z1 and Z2 for high-speed mounting are mounted on the blocks N1 and N2 of the first pattern P1. And step # 12
Then, the second pattern P is used for the electronic components Z1 and Z2 for high-speed mounting.
2 blocks N1 and N2.

Next, in step # 13, the electronic component Z3 for medium speed mounting is mounted on the block N3 of the first pattern P1. Then, in step # 14, the electronic component Z3 for medium speed mounting is mounted on the block N3 of the second pattern P2.

In step # 15, electronic component Z for low-speed mounting
4, Z5 are mounted on the blocks N4, N5 of the first pattern P1. Then, in step # 16, the electronic components Z4 and Z5 for low-speed mounting are placed in the blocks N4 and N of the second pattern P2.
Implement in 5.

The movement of the XY table 4 and the component supply unit 5 (actually, the XY table 4 and the component supply unit 5 respectively move in the opposite directions of the arrows) at this time, the operation is shown in FIG. , (B) will be described.

The electronic components 1 are mounted on the mounting substrate 3 in the order of the arrows shown in FIG. 3A, and the XY table 4 is moved correspondingly. Where electronic component Z
The mounting tact is reduced because it takes a moving time depending on the distance between 1 to Z5, but especially the first pattern P1 (9a).
Then, since the moving distance across the second pattern P2 (9b) is long and the number of times is as many as 5, the mounting tact is significantly reduced.

The electronic component Z1 in the component supply unit 5
Z5 are adsorbed in the order of the arrows shown in FIG.
Here, although the mounting tact decreases according to the distance between the electronic components Z1 to Z5, the mounting tact is always moved to the adjacent electronic components Z1 to Z5, and there is no place where the movement distance is particularly long.
There is almost no decrease in mounting tact.

[0014]

However, in the mounting method by the electronic component mounting apparatus having the above-mentioned conventional structure,
Since the distance of movement across the regions 3a and 3b of the second patterns P1 and P2 is long and the number of times is as many as 5 times, the movement time of the XY table 4 is increased and the mounting tact is reduced.

The present invention solves the above problems, and an object of the present invention is to provide an electronic component mounting apparatus capable of improving the mounting tact.

[0016]

In order to solve the above problems, the present invention provides a plurality of component mounting patterns of the same shape provided in the same direction on a mounted substrate fixed to a fixing member in a predetermined direction. The electronic components are grouped into a plurality of groups according to the mounting speed for mounting on the mounting board, and the fixed supporting unit that fixes the mounting board is moved relatively by the moving device with respect to the component attaching / detaching device to which the electronic components are attached. Then, in the electronic component mounting apparatus that sequentially mounts the electronic components grouped into a plurality of groups on the mounted substrate for each of the plurality of component mounting patterns in each group, when shifting to the mounting of the electronic components of the next group, The electronic components of the next group are continuously mounted in the same component mounting pattern as the last component mounting pattern in the group immediately before the transition, and the pattern of the group immediately before is transferred. In down mounting order reverse pattern mounting order are those having a control means for controlling so as to mount the electronic components of the next group.

[0017]

With the above structure, when mounting electronic components in groups according to the mounting speed for each pattern on a mounted substrate such as multi-chambering, the movement distance across the patterns is shortened and the number of times is also reduced. , XY table and other moving devices have a shorter moving time, and the mounting tact time is improved.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The appearance of the electronic component mounting apparatus is the same as that shown in FIG. 4, and the contents of the pattern data section and the arrangement of electronic components on the multiple-mounting mounted substrate are the same as those shown in FIGS. Therefore, the same reference numerals are given to those having the same function, and the description thereof will be omitted.

In this electronic component mounting apparatus, the control unit 6
Thus, the electronic component mounting apparatus is controlled as shown in the flowchart of FIG. First, in step # 1, high-speed mounting electronic components Z1 and Z2 are mounted on blocks N1 and N2 of a first component mounting pattern (hereinafter abbreviated as a first pattern) P1. Then, in step # 2, the electronic component Z for high-speed mounting
1 and Z2 are mounted on the blocks N1 and N2 of the second component mounting pattern (hereinafter abbreviated as the second pattern) P2.

Next, in step # 3, the electronic component Z3 for medium speed mounting is mounted on the block N3 of the second pattern P2. Then, in step # 4, the electronic component Z for medium-speed mounting
3 is mounted in the block N3 of the first pattern P1. That is, following the mounting of the electronic components Z1 and Z2 for high-speed mounting on the second pattern P2, the next group of electronic components Z3 for medium-speed mounting is mounted on the same second pattern P2, and the second pattern P2 is further mounted. To the first pattern P1 and the electronic component Z3 for medium speed mounting of the next group is mounted in the pattern mounting order opposite to the pattern mounting order of the immediately preceding group.

Electronic component Z for low-speed mounting in step # 5
4, Z5 are mounted on the blocks N4, N5 of the first pattern P1, and at step # 6, electronic parts Z4, Z for low-speed mounting are mounted.
5 is mounted on the blocks N4 and N5 of the second pattern P2. That is, following the mounting of the electronic component Z3 for medium-speed mounting on the first pattern P1, the electronic component Z4 for low-speed mounting, which is the next group, is mounted on the same first pattern P1, and further from the second pattern P2. The electronic components Z4 and Z5 for low-speed mounting in the next group are moved to the first pattern P1 and in the pattern mounting order opposite to the pattern mounting order in the immediately preceding group.
Implement.

The movement of the XY table 4 and the component supply unit 5 at this time (actually, the XY table 4 and the component supply unit 5 move in the opposite direction of the arrow) is shown in FIGS. This will be described using b).

The electronic components 1 are mounted on the mounting substrate 3 in the order of the arrows shown in FIG. 2A, and the XY table 4 is moved so as to correspond thereto. That is, the number of movements across the first and second patterns P1 and P2 is 3
This is only the number of times, which is less than the number of times that the number of times was 5 in the past, and the distance traveled when moving to the next group is obviously shortened. On the other hand, the number of movements and the distance when the electronic component 1 is supplied to the component supply unit 5 are the same as in the conventional case.

With the above structure, the moving time of the XY table 4 can be reduced, and the mounting tact can be improved. Further, in the case of the above-described embodiment, the mounting data may be described separately in the pattern portion 10a and the block portion 10b, and each movement operation may be controlled based on each data. Before starting the production of, the mounting data may be regarded as one board in conformity with all points of the actual operation and converted into new mounting data by one calculating system by the calculating means. In this case, the converted and generated mounting data becomes as shown in the mounting data 11 of FIG.
Based on this mounting data 11, it may be configured to operate in the same manner as the above-mentioned moving operation.

In the above embodiment, the case where the multi-chambered substrate is fixed to the XY table 4 has been described.
Needless to say, the present invention can also be applied to a case where a plurality of substrates having the same pattern are arranged in parallel in a predetermined direction on the XY table 4 and fixed, and electronic components are mounted on these mounted substrates at once.

[0026]

As described above, according to the present invention, when shifting to mounting the electronic component of the next group by the control means, within the same component mounting pattern as the last component mounting pattern in the group immediately before shifting. Next, the electronic components of the next group are mounted, and by mounting the electronic components of the next group in the pattern mounting order opposite to the pattern mounting order of the immediately preceding group, the movement distance between the patterns is shortened, and Since the number of times is reduced, the mounting tact can be improved, and the production performance of the electronic component mounting apparatus can be improved.

[Brief description of drawings]

FIG. 1 is a flowchart showing an operation at the time of mounting of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2A is a diagram showing a movement operation of an XY table during mounting of the electronic component mounting apparatus, and FIG. 2B is a diagram showing a movement operation of a component supply unit during mounting of the electronic component mounting apparatus.

FIG. 3 is a diagram showing a concept of mounting data of an electronic component mounting apparatus according to another embodiment of the present invention.

FIG. 4 is an overall perspective view of an electronic component mounting apparatus

FIG. 5 is a diagram showing a concept of mounting data of an electronic component mounting apparatus.

FIG. 6 is a diagram showing a correspondence relationship between mounting data of an electronic component mounting apparatus and a mounted substrate.

FIG. 7 is a flowchart showing an operation at the time of mounting of a conventional electronic component mounting apparatus.

FIG. 8A is a diagram showing a movement operation of an XY table during mounting of a conventional electronic component mounting apparatus, and FIG. 8B is a diagram showing a movement operation of a component supply unit during mounting of a conventional electronic component mounting apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Nozzle (component attachment / detachment device) 3 Mounted substrate 3a Region of first component mounting pattern on mounted substrate 3b Region of second component mounted pattern on mounted substrate 4 XY table (fixing member and moving device) 5 Component supply unit 6 Control unit (control means) P1 First component mounting pattern P2 Second component mounting pattern Z1, Z2 Electronic component for high-speed mounting Z3 Electronic component for medium-speed mounting Z4, Z5 Electronic component for low-speed mounting

Claims (2)

[Claims] 1. A plurality of component mounting patterns having the same shape are provided in the same direction in a predetermined direction on a mounted substrate fixed to a fixing member, and a plurality of sets are formed for each mounting speed at which the electronic component is mounted on the mounted substrate. By moving the fixed supporting portion, which fixes the mounted substrate, to the component attaching / detaching device to which the electronic components are attached by the moving device, the electronic components divided into a plurality of groups are grouped into groups. In an electronic component mounting apparatus that sequentially mounts the plurality of component mounting patterns on the mounted substrate, when transitioning to mounting of the next group of electronic components, the same component mounting pattern as the last component mounting pattern in the group immediately before the transition Then, the electronic components of the next group are mounted in the same group, and the electronic components of the next group are mounted in the reverse pattern mounting order of the immediately preceding group. An electronic component mounting apparatus comprising a control means for controlling to mount a child component. 2. The electronic component mounting apparatus according to claim 1, further comprising arithmetic means for converting in advance the position of the electronic component on the entire mounted substrate fixed to the fixing member into position data in one coordinate system.