JPH06214391A - Negative photoresist composition - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a negative photoresist composition excellent in various properties such as sensitivity and resolution in an exposure region using deep ultraviolet rays (including excimer laser etc.) as a light source. A negative photoresist composition comprising a photoacid generator containing at least one sulfonic acid ester of an N-hydroxyimide compound, an alkali-soluble resin, a crosslinking agent and an imide compound.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a negative photoresist composition suitable for deep ultraviolet (including excimer laser) lithography.

[0002]

2. Description of the Related Art In recent years, submicron pattern formation has been required as the degree of integration of integrated circuits increases. In particular, excimer laser lithography is available at 64 and 256M.
It has attracted attention because it enables the manufacture of DRAMs. With such a change in the light source, the resist is required to have the following new performances in addition to the conventional performances such as heat resistance, residual film rate, and profile. A) High sensitivity to the above light source. B) High resolution. In view of such circumstances, so-called chemically amplified resists utilizing an acid catalyst and a chemical amplification effect have been proposed. The function of this resist is to change the solubility of the exposed part and the unexposed part in the developing solution by the reaction using the acid generated from the photo-acid generator as a catalyst upon irradiation with light. Alternatively, a positive type) photoresist is obtained.

As the photo-acid generator used in the chemically amplified resist, a halide represented by 2,4,6-tris (trichloromethyl) -s-triazine has been widely used. However, in this system, since the acid generated is hydrogen halide which easily diffuses, the acid also diffuses to the unexposed portion, so a fine pattern cannot be obtained.

Further, JP-A-1-293339 and JP-A-3-2933
223862 describes negative and positive photoresists that generate aryl sulfonic acid using a compound containing a sulfonic acid ester group as a photoacid generator. In these systems, an acid that is relatively difficult to diffuse is generated, so that it is possible to prevent the acid from diffusing into the unexposed area, but it is not sufficient in terms of sensitivity and resolution, and 64M and 256M D
It does not meet the required performance for manufacturing a RAM.

[0005]

The present invention provides a negative photoresist composition excellent in sensitivity and resolution while maintaining various properties such as heat resistance, residual film rate, coating property and profile.

[0006]

The present invention is characterized by containing a photoacid generator containing at least one sulfonic acid ester of an N-hydroxyimide compound, an alkali-soluble resin, a crosslinking agent and an imide compound. It is a negative photoresist composition.

Examples of sulfonic acid esters of N-hydroxyimide compounds include those represented by the general formula (I)

[0008]

[Chemical 3]

(In the formula, R ¹ represents an optionally substituted arylene, alkylene or alkenylene group,
R ² represents an optionally substituted alkyl or aryl group. ) And the like.

The arylene group represented by R ¹ is a monocyclic or bicyclic group, preferably phenylene or naphthylene. Examples of preferred substituents on the arylene group include a halogen atom, a nitro group and an acetylamino group. Similarly, as the alkylene group, linear or branched ones can be mentioned, and those having 1 to 6 carbon atoms are preferable. Particularly preferred is ethylene or propylene group. Examples of preferable substituents on the alkylene group include a halogen atom, a lower alkoxy group, and a monocyclic aryl group. Similarly, examples of the alkenylene group include those having 2 to 4 carbon atoms, and a vinylidene group and the like are preferable. A monocyclic aryl group etc. are mentioned as a preferable substituent of an alkenylene group.

Examples of the alkyl group represented by R ² include linear, branched or cyclic ones, preferably linear ones having 1 to 8 carbon atoms. Examples of preferable substituents on the alkyl group include a halogen atom and a lower alkoxy group. Similarly, the aryl group may be monocyclic or bicyclic, and preferably monocyclic. Suitable ester represented by the general formula (I) includes, for example,

[0012]

[Chemical 4]

[0013]

[Chemical 5]

And the like.

The ester represented by the general formula (I) can be obtained, for example, by GF Jaubert, Ber., 28 , 360 (1895), DE Ames.
Et al., J. Chem. Soc., 3518 (1955) or MA Stolberg.
Et al., J. Amer. Chem. Soc., 79 2615 (1957) and other general formulas (III).

[0016]

[Chemical 6]

(Where R is¹Has the same meaning as above
It ) Cyclic N-hydroxy imide compound represented by
Formula R²-SO₂Cl (in the formula, R ²Has the same meaning as above
To do. ) And sulfonic acid chloride,
For example, L. Bauer et al., J. Org. Chem.,twenty four, 12
93 (1959) etc.
It

The ester represented by the general formula (I) may be used alone or in combination of two or more kinds.

Examples of the alkali-soluble resin include the resins described in Japanese Patent Application No. 4-15009. Preferably

[0020]

[Chemical 7]

A novolak resin, a vinylphenol resin, an isopropenylphenol resin, a copolymer of vinylphenol and styrene obtained by condensing a compound represented by the formula (1) and an aldehyde (the ratio of vinylphenol in the copolymer is 50). Mol% or more) or a copolymer of isopropenylphenol and styrene (the ratio of isopropenylphenol in the copolymer is preferably 50 mol% or more).

The molecular weight of the alkali-soluble resin is GP
The polystyrene reduced weight average molecular weight determined by the C method is 10
0 to 10000, preferably 1500 to 8000,
Particularly preferably, those of 2000 to 5000 are mentioned.
The alkali-soluble resins may be used alone or in combination of two or more. Further, these resins and copolymers can also be used as a mixture with a hydrogenated resin of poly (vinylphenol).

The cross-linking agent is, for example, Japanese Patent Application No. 4-15009.
And those containing a methylol group or a methylol ether group described in No. Preferably, for example

[0024]

[Chemical 8]

And the like. The cross-linking agent containing a methylol group or a methylol ether group may be used alone or in combination of two or more.

The imide compound is preferably, for example, one represented by the general formula (II)

[0027]

[Chemical 9]

(In the formula, R ³ represents an optionally substituted arylene, alkylene or alkenylene group, and R ⁴
Represents a hydrogen atom or an optionally substituted alkyl or aryl group. ). The compound shown by these is mentioned. Examples of the alkylene group represented by R ³ include linear or branched ones, and preferably those having 1 to 6 carbon atoms. Particularly preferred is ethylene or propylene group. Examples of preferable substituents on the alkylene group include a halogen atom, a lower alkoxy group, and a monocyclic aryl group. Similarly, examples of the alkenylene group include those having 2 to 6 carbon atoms, preferably vinylidene group and the like. A monocyclic aryl group etc. are mentioned as a preferable substituent of an alkenylene group. Similarly, the arylene group may be a monocyclic or bicyclic group, preferably phenylene or naphthylene. Examples of preferred substituents on the arylene group include a halogen atom, a nitro group and an acetylamino group. R ³ is preferably an alkylene or alkenylene group which absorbs little light at 248 nm when a KrF excimer laser (wavelength 248 nm) is used as a light source.

The alkyl group represented by R ⁴ is a straight chain,
Examples thereof include branched or cyclic ones, preferably linear ones having 1 to 8 carbon atoms. Examples of preferable substituents on the alkyl group include a halogen atom and a lower alkoxy group. Similarly, the aryl group may be monocyclic or bicyclic, and preferably monocyclic. Suitable imide compounds represented by the general formula (II) include, for example,

[0030]

[Chemical 10]

And the like. These imide compounds may be used alone or in combination of two or more.

The preferred composition ratio in the negative photoresist composition is 50 to 95% by weight of alkali-soluble resin, 1 to 30% by weight of crosslinking agent, 1 to 20% by weight of photoacid generator, and imide compound.
0.01 to 10% by weight. If necessary, various additives commonly used in the art, such as a sensitizer, a dye and an adhesion improver, may be added to the negative photoresist composition.

Usually, a photoresist solution is prepared by mixing the above negative photoresist composition with a solvent so as to be 10 to 50% by weight in the total mixture. Examples of the solvent used in this case include ethyl cellosolve acetate, methyl cellosolve acetate, ethyl cellosolve,
Methyl cellosolve, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether, ethyl lactate, butyl acetate, ethyl pyruvate, 2-heptanone, cyclohexanone, methyl isobutyl ketone or Examples include xylene. The said solvent is used individually or in combination of 2 or more types.

[0034]

INDUSTRIAL APPLICABILITY The negative photoresist composition of the present invention is not only excellent in various properties such as heat resistance, residual film rate, coating property and profile, but also exposed to a deep ultraviolet ray (including excimer laser) light source. Has high sensitivity and high resolution. Therefore, the resolution and contrast in the linography by the light source can be remarkably improved, and a highly precise fine photoresist pattern can be formed.

[0035]

EXAMPLES The present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. In the examples, the number of parts means part by weight unless otherwise specified.

Reference Example 1 3.5 g of N-hydroxysuccinimide was dissolved in 45 g of a 5% sodium carbonate aqueous solution, and 3.9 g of methanesulfonyl chloride was added dropwise at room temperature. After completion of dropping, the reaction solution was stirred at room temperature for 2 hours. Then, add 300 ml of water to the reaction mixture.
It was poured into and the precipitated crystal was filtered. The crystals were washed with water until the washing liquid became neutral, and then recrystallized from a mixed solvent of acetone / hexane to obtain N-hydroxysuccinimide methanesulfonic acid ester.

Reference Example 2 Melamine 12.6 g, 37% formalin 64.9 ml and water 5
To 0 ml of the mixture, 25% caustic potash was added to adjust the pH to 10. Then, the mixture was stirred at 60 to 70 ° C for 10 minutes. After the reaction solution became cloudy, it was poured into 200 ml of cold methanol and the precipitated crystals were filtered. The crystals were washed with cold methanol and dried under reduced pressure to obtain hexamethylolmelamine. To a mixture of 20 g of hexamethylolmelamine and 200 ml of methanol, 0.5 ml of 1.8% hydrochloric acid was added under reflux. After dissolution
The mixture was stirred under reflux for 10 minutes. After neutralizing with 2.7% caustic potash, it was filtered. The filtrate was concentrated under reduced pressure at 50 ° C. or lower to obtain crude hexamethylolmelamine hexamethyl ether. HPLC
The analytical purity was 73%. Crude hexamethylol melamine hexamethyl ether was purified by silica gel column chromatography (n-hexane / acetone = 3/1) to obtain pure hexamethylol melamine hexamethyl ether having a purity of 90%.

Example 1 8.1 parts of resin A [linker CST-70 (manufactured by Maruzen Petrochemical); weight average molecular weight 2900, copolymer of p-hydroxystyrene and styrene (molar ratio 70/30)], resin B
[Linker PHM-C (manufactured by Maruzen Petrochemical); weight average molecular weight 5200, hydrogenated product of poly p-hydroxystyrene]
5.4 parts, 1.0 part of purified hexamethylolmelamine hexamethyl ether (crosslinking agent) obtained in Reference Example 2, 1.0 part of N-hydroxysuccinimide methanesulfonic acid ester (photoacid generator) obtained in Reference Example 1 and succinic acid 0.54 part of the imide was dissolved in 50 parts of diethylene glycol dimethyl ether. This solution was filtered through a Teflon filter having a pore size of 0.1 μm to prepare a resist solution. This was washed with a conventional method on a silicon wafer with a spin coater to 0.7 μ
It was applied to a thickness of m. Then, the silicon wafer was prebaked on a hot plate at 100 ° C. for 1 minute. Next, the coating film after prebaking was passed through a chromium mask having a pattern, and a KrF excimer laser stepper (manufactured by Nikon Corporation, NSR-1755 EX8A, having an exposure wavelength of 248 nm).
Exposure was carried out using NA = 0.45). After the exposure, the wafer was heated on a hot plate at 105 ° C. for 1 minute to crosslink the exposed portion. This was developed with a 2.0% by weight aqueous solution of tetramethylammonium hydroxide to obtain a negative pattern. As a result of observing the formed pattern with an electron microscope, it was found that a fine pattern of 0.20 μm was resolved with an exposure dose of 46 mJ / cm ² (248 nm).

Example 2 The same operation as in Example 1 was carried out except that the amount of succinimide was changed to 0.26 part. It was found that a 0.20 μm fine pattern could be resolved with an exposure dose of 44 mJ / cm ² (248 nm).

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takehiro Kusumoto 3-1,98 Kasugadinaka, Konohana-ku, Osaka City Sumitomo Chemical Co., Ltd. No. 1 98 Sumitomo Chemical Co., Ltd.

Claims (3)

[Claims] 1. A negative photoresist composition comprising a photoacid generator containing at least one sulfonic acid ester of an N-hydroxyimide compound, an alkali-soluble resin, a crosslinking agent and an imide compound. 2. A sulfonic acid ester of an N-hydroxyimide compound is represented by the general formula (I): The ester represented by the formula (wherein R ¹ represents an optionally substituted arylene, alkylene or alkenylene group, and R ² represents an optionally substituted alkyl or aryl group). Negative photoresist composition. 3. The imide compound is represented by the general formula (II): (Wherein R ³ represents an optionally substituted arylene, alkylene or alkenylene group, and R ⁴ represents a hydrogen atom or an optionally substituted alkyl or aryl group). The negative photoresist composition as described in 1 or 2.