JPH06204697A - Electronic component automatic mounting apparatus - Google Patents

Abstract

PURPOSE:To prevent contact of a suction nozzle with an upper surface of a board by eliminating to mount or mounting an electronic component at a position deviated in an allowable range if an interference of the upper surface of the board surrounding a recess with the nozzle is judged by judging means. CONSTITUTION:After a component is recognized by a recognition unit 16, entire chip component 4 and suction nozzle 12 are introduced into a recess 88 or not is judged. Then, when a recognized positional deviation is corrected to be mounted, whether the nozzle 12 is brought into contact with the board 5 and an upper surface 87 or not is judged. In the case of judging the contact, an end of the nozzle 12 is so deviated in an opposite direction from the deviating direction as to be fed by a clearance a from the end of the recess 88. If it falls within the allowable range of the deviation, it is deviated thus and mounted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component automatic mounting apparatus which sucks an electronic component by a suction nozzle and mounts the component at a position to be mounted in a recess formed in a printed circuit board.

[0002]

2. Description of the Related Art A device for automatically mounting electronic components of this type is disclosed in Japanese Patent Laid-Open No. Hei 2
Japanese Patent Laid-Open No. 288398/1998 discloses that an electronic component whose suction nozzle is sucked by a component supply device recognizes a positional shift with respect to the suction nozzle by a component recognition device, and then the positional shift causes an XY table on which a printed circuit board is placed. It is corrected by movement and is mounted at the position where the substrate should be mounted.

Although not disclosed in the publication, some printed circuit boards have a recess formed in the upper surface thereof and an electronic component is mounted in, for example, the center of the recess as shown in FIG.

[0004]

However, when an electronic component is mounted on a printed circuit board as shown in FIG. 12 by applying the technique of the above publication, the suction nozzle sucks the end portion of the electronic component. As shown in FIG. 13, in the case of protruding from the upper surface of the component, if the protrusion is large and the thickness of the component is smaller than the depth of the recess, the misalignment is corrected and the component is mounted in the center of the recess. When this is attempted, there is a drawback in that it hits the upper surface of the printed circuit board, which is higher than the lower surface of the recess around the recess.

Therefore, according to the present invention, when the electronic component is mounted in the recess formed in the printed board, the suction nozzle does not hit the upper surface of the substrate even when the suction nozzle is out of the component. The purpose is to do so.

[0006]

Therefore, according to the present invention, an electronic component automatic mounting apparatus for sucking an electronic component by a suction nozzle and mounting the component at a position to be mounted in a recess formed in a printed circuit board is provided. Recognition means for recognizing the positional deviation of the component with respect to the suction nozzle, and relative movement driving means for correcting the positional deviation based on the recognition result of the recognizing means to change the relative positional relationship between the suction nozzle and the printed circuit board in the plane direction. And a judgment means for judging whether or not the suction nozzle interferes with the upper surface of the substrate surrounding the recess when the positional displacement is corrected by driving the relative movement driving means based on the recognition result of the recognition means. And a control means for controlling the drive of the suction nozzle so as not to mount the component when the determination means determines that there is interference with the component.

Further, according to the present invention, in an electronic component automatic mounting apparatus for sucking an electronic component by a suction nozzle and mounting the component at a position to be mounted in a recess formed on a printed circuit board, the position of the component with respect to the suction nozzle. Recognition means for recognizing the deviation, relative movement driving means for correcting the positional deviation based on the recognition result of the recognition means to change the relative positional relationship between the suction nozzle and the printed board in the plane direction, and the recognition means Based on the result, when the positional deviation is corrected by driving the relative movement driving means, a judging means for judging whether the upper surface of the substrate surrounding the recess interferes with the suction nozzle, and the judging means is a component. When it is determined that there is interference, the control for controlling the relative movement drive means to mount the component at a position displaced from the position to be mounted by an allowable range. It is provided with a means.

[0008]

According to the structure of the first aspect, when the judging means judges that the suction nozzle and the upper surface of the substrate interfere with each other when the relative movement driving means corrects the positional deviation based on the recognition result of the recognizing means, the control means The drive of the suction nozzle is controlled so that no component is mounted.

According to the second aspect of the present invention, when the determination means determines that the suction nozzle and the upper surface of the substrate interfere with each other when the relative movement drive means corrects the positional deviation based on the recognition result of the recognition means, the control means determines. The relative movement drive means is controlled to change the horizontal relative positional relationship between the suction nozzle and the printed circuit board, and the component is mounted at a position displaced from the position to be mounted within an allowable range.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

In FIG. 2, (1) is an XY table which is moved in the X and Y directions by driving the X-axis servo motor (2) and the Y-axis servo motor (3). A printed circuit board (5) on which a chip component (4) is mounted is placed below.

As shown in FIGS. 12 and 13, recesses (88) are formed in the upper surface (87) of the printed board (5) at each component mounting position, and the chip component (88) is formed at the center of the recess (88). 4) is attached. The chip part (4) is a rectangular parallelepiped as shown in FIG. 14 (some are not), and the recess (88) has a rectangular shape, the bottom surface of which is a plane parallel to the top surface (87) of the printed circuit board. Is. The nozzle rotation positioning device (60) to be described later makes an angle swing so that each side of the chip part (4) and each side of the recess (87) are parallel to each other so that the chip part (4) is mounted. The mounting angle data, which will be described later, is created as such. Therefore, the distance between the side surface of the component (4) and the side surface of the recess (88) is shown in FIG.
It is the same in the two left-right directions (X direction of the printed circuit board) and the same in the vertical directions (Y direction of the printed circuit board). In the chip part (4), the foot pattern (89) formed on the bottom surface of the recess (88) has the electrode (90) formed on the back surface of the part (4) in advance.
9) It is soldered via the solder paste or the like applied on top. The foot pattern (89) is provided so that the component (4) is mounted in the center of the recess (88) and is not offset to the electrode of the component (4). In the case of this embodiment, the long side of the concave portion (88) is X in FIG.
Direction or the Y direction (that is, the recesses (88) are formed in two directions orthogonal to each other), and therefore the chip component (4) is 0 °, 9 °.
It will be attached with an angle swing of either 0 degree or 180 degrees (when there is polarity). The long sides of the chip parts (4) are directed in the same direction and are supplied by the supply device (7), and the chip parts (4) are angled as described above according to the direction of the recesses (88). Also,
The depth of the recess (88) is larger than the thickness of the chip part (4).

Reference numeral (6) is a component supply table on which a large number of component supply devices (7) are arranged, and the guide (10) is rotated by the rotation of the ball screw (9) driven by the component supply servomotor (8).
And is moved in the left-right direction in FIG.

A plurality of suction head portions (13) provided with a plurality of suction nozzles (12) on the lower surface for picking up and carrying the chip component (4) from the component supply device (7) are installed at the periphery thereof. The rotary disc is intermittently rotated by the rotation of the rotary disc servomotor (14) shown in FIG. 6 via an index unit (21) described later. The suction head portion (13) is provided corresponding to the intermittent rotation pitch.

(I) is a suction station for taking out the chip component (4) from the component supply device (7).

(II) is a recognition station for recognizing the state of the chip component (4) sucked by the suction nozzle (12) by the recognition device (16).

(III) is a nozzle rotation correction station for correcting the rotation of the chip component (4), and corrects the angle of the component (4) to the mounting angle based on the recognition result by the recognition device (16). To rotate the nozzle (12).

(IV) is a mounting station for mounting the chip component (4) on the printed circuit board (5) after completion of the work in the nozzle rotation correction station (III).

Reference numeral (V) is a discharge station for discharging the chip component (4) which is recognized by the recognition device (16) and which is, for example, a chip component (4) which is vertically adsorbed or is adsorbed.

(VI) is a suction nozzle (1) corresponding to the chip component (4) to be sucked at the suction station (I).
In the nozzle selection station for selecting 2), a gear (not shown) provided on the outer diameter portion of the suction head portion (13) is moved by a drive system (not shown), meshed with the gear, and then rotated. Drive gear servomotor (17) (Fig. 6
The desired suction nozzle (12) is selected by the rotation of the drive gear (18) by the rotation of (see).

The turntable (11) will be described below with reference to FIGS. 4 and 5.

Reference numeral (19) is a motor (1) so as to surround an upper portion of a cylindrical portion (20) formed on the upper portion of the rotating disk (11).
4) A hollow cylindrical cylindrical cam member for guiding the rotating disk, which is suspended and fixed to the mount (22) of the index unit (21) that converts the rotation of 4) into the intermittent rotation of the rotating disk (11). A cam (23) is formed on the peripheral edge of the lower end of the cam member (19) over substantially the entire circumference thereof, and a spring (25) is provided on the upper surface of the cam (24) so as to cover the upper end of each suction head part (13). The provided roller (26) rotates while being pressed,
Each suction head part (13) according to the shape of the cam (24)
Rotates with the turntable (11) while moving up and down. That is,
Each suction head portion (13) has a pair of guide bars (27).
Is erected so as to vertically pass through the turntable (11), and a mounting member (28) rotatably provided with a roller (26) is fixed to the upper end of the rod (27). Therefore, each suction head part (13) is supported by the turntable (11) so as to be vertically movable. When the suction head (13) is moved downward to suck the chip component (4) at the suction station (I) and when the chip component (4) is mounted on the printed circuit board (5) at the mounting station (IV). In the main body base (30) of the electronic component automatic mounting apparatus, only one desired one of the plurality of suction nozzles (12) is lowered.
It is regulated by a stopper plate (31) provided on the.

Reference numeral (32) is a hose as a connecting body which communicates with a vacuum pump (not shown). The other end of each hose (33) is connected to a connecting hose (33) which is embedded through the rotary disk (11), and the connecting hose (33) has a switching valve (34) and a horizontally long intake passage (35). , Through the central intake passage (36) to communicate with the vacuum pump.

Reference numeral (37) is a suction type suction clutch solenoid for restricting the lowering of the suction head portion (13) at the suction station (I) to stop the suction operation, if necessary, and of the cam mechanism (38). The lever (39) so that the suction head vertical movement lever (39) is not lowered by driving.
It has an abutment lever (40) for abutting against. That is, when the clutch solenoid (37) is demagnetized, the contact lever (40) contacts the vertical movement lever (39),
The vertical movement lever (39) is prevented from being lowered.
The same structure is also provided in the mounting station (IV).

Next, the nozzle rotation correction station (II
The nozzle rotation positioning device (60) of I) will be described with reference to FIG.

Reference numeral (61) is a nozzle rotating motor as a drive source for rotating the suction nozzle (12) by θ, and the nozzle is fitted in the aligning body (64) through the coupling (63) on the output shaft (62). A nozzle rotating rod (66) described later is attached to the rotating body (65) so as to be vertically movable. It should be noted that a ball spline may be used to move up and down.

The numeral (66) is the nozzle rotating body (65).
A nozzle rotation rod having a nozzle rotation fitting portion (67) at its lower end, the pin (69) protruding outward from the vertically elongated hole (68) provided in the nozzle rotation body (65). It is provided. The nozzle rotation fitting portion (67) is formed so as to become narrower toward the lower end so as to fit with the fitting groove (15). Further, the nozzle rotating rod (66) is provided with an engaging portion (71) for engaging the spring (70) with the bottom surface of the nozzle rotating body (65), and the engaging portion (71) is illustrated. A rocking lever (7) attached via a rod end (73) to a vertical movement lever (72) that is vertically moved by a cam as a drive source.
4) is locked, and the nozzle lever rod (66) is biased by the spring (70) while the swing lever (74) swings up and down in accordance with the vertical movement of the vertical movement lever (72). Moved up and down.

In FIG. 6, reference numeral (80) is a CPU (81).
A recognition device (16) is connected with the interface connected to. (82) is a RAM as a storage device
Then, the center position data of each suction nozzle (12),
NC data, parts library data, nozzle library data, etc. are stored. Reference numeral (83) is a ROM for storing a program relating to the mounting operation of the chip component (4)
Is.

The respective data stored in the RAM (82) will be described.

As shown in FIG. 7, the NC data indicates the mounting position (X coordinate data, Y coordinate data) and the mounting direction on the printed circuit board (5) for each step indicating the mounting sequence of the component (4). The mounting angle data and the part type (hereinafter referred to as “type”) are stored. The control command "E" indicates the end of the step.

As shown in FIG. 8, the parts library data includes, for each part type, part thickness data indicating the thickness of the part (4), external dimensions (X direction, Y direction) nozzle type, and X direction and Y direction. How much is the part concerned (4)
Positional deviation allowance value (X direction, Y
Each data of (direction) is stored. The X direction and the Y direction are different from those in FIG. 12, and are for the component (4) whose long side direction is the X direction. The positional deviation allowance value is an allowable amount of positional deviation in which the electrode (90) of the component (4) can be electrically connected to the foot pattern (89) of the board (5) or the strength of soldering is taken into consideration. It shows how much the chip component (4) is displaced to the left or right or up and down from the position where it should be mounted, and has the same allowable value in both the positive and negative directions.

Further, the recess (88) corresponds to each type of chip component (4), and the recess (8) is oriented in the direction in which the chip component (4) is mounted.
8) is formed. Although the data of the concave portion (88) corresponding to the type of the component (4) is stored in the parts library data, it corresponds to each type of the component (4) without considering the direction in which the concave portion (88) is formed. One set of data regarding the recess (88) may be stored.

The data on the recess (88) is given by the recess (8
8) A dimension in the X direction (X direction of the component (4)) and a dimension in the Y direction.

As shown in FIG. 9, the nozzle library data is data in which the outer shape (diameter) of each nozzle type is stored. Also, each suction nozzle (12)
The center position data is stored in the RAM (82) for each of the suction nozzles (12) attached to the suction heads (13) provided on the turntable (11).

The suction nozzle (12) does not always suck the central portion of the chip component (4) when sucking the chip component (4), and therefore the movement of the XY table (1) is corrected, but if the displacement is large. The suction nozzle (12) may stick out from the upper surface of the chip part (4), and when this sticking out is large, when the chip part (4) is mounted at a position to be corrected and mounted, the recessed portion is formed as shown in FIG. The suction nozzle (12) is disengaged from the (88) and the recess (8)
It will hit the upper surface (87) around 8).

As shown in FIGS. 10 and 11, the ROM (83) stores a program for determining whether the suction nozzle (12) interferes with the printed circuit board (5) due to the displacement. At this time, the clearance value “α” with respect to the dimension of the concave portion (88) in the X direction and the Y direction.
Is stored. That is, an amount indicating how far the end of the suction nozzle (12) and the end of the recess (88) can be to determine that the suction nozzle (12) does not hit the upper surface (87) of the substrate (5). Is. The clearance is RAM (8
It may be settable by being stored in 2). The setting may be made for each recess (88), each suction nozzle (12) (nozzle type or each nozzle attached individually), or each chip component (4) type.

Calculation formulas used for judgment and the like will be described with reference to the flowcharts of FIGS. 10 and 11.

Whether the entire length of the component in the X direction fits in the recess (88) (is it smaller than the dimension of the recess in the X direction) is determined by the following calculation formula. Here, “A” is the dimension of the chip component (4) in the X direction, and “CPX” is the protrusion amount of the suction nozzle (12) in the positive direction of the component in the X direction (right direction in FIG. 15), “CMX”. Is the minus direction of the component in the X direction (see FIG. 15).
In the left direction, the amount of protrusion of the suction nozzle (12), "L
"X" is the dimension of the recess (88) in the X direction. If this formula does not hold, it cannot be installed.

[0039]

[Equation 1]

Whether the entire length of the component in the Y direction falls within the recess (88) (whether it is smaller than the dimension of the recess in the Y direction) is determined by the following calculation formula. Here, “B” is the dimension of the chip component (4) in the Y direction, and “CPY” is the protrusion amount of the suction nozzle (12) in the plus direction (upward in FIG. 15) of the component, “CMY”. Is the minus direction of the Y direction of the parts (Fig. 15
Is the amount of protrusion of the suction nozzle (12) in the downward direction, and “LY” is the dimension of the concave portion (88) in the Y direction.
(These protrusion amounts are calculated by the recognition process.)

[0041]

[Equation 2]

When the recognized positional deviation in the X direction is corrected and moved, the suction nozzle (12) and the upper surface (87) of the substrate (5).
The following formula is used to determine whether or not the two interfere with each other.
Since the position to be mounted after correcting the positional deviation is the center of the recess (88), it can be calculated regardless of the value of the positional deviation. When this formula is established, in the X direction, the positional deviation can be corrected and moved as it is for mounting.

In the case of Expression 1 and Expression 2, "α" is doubled and subtracted from LX or LY because a margin must be provided at both ends.

[0044]

[Equation 3]

When the recognized positional deviation in the Y direction is corrected and moved, the suction nozzle (12) and the upper surface (87) of the substrate (5).
The following formula is used to determine whether or not the two interfere with each other.
When this formula is established, in the Y direction, the displacement can be corrected and moved to mount the device.

[0046]

[Equation 4]

The following formula is used to judge whether the chip component (4) can be mounted within the range of the positional deviation allowable value in the X direction by mounting the chip component (4) at a position displaced from the mounting position. “DX” is a positional deviation allowable value in the X direction. When this calculation formula is satisfied, the chip component (4) can be mounted on the printed circuit board (5) by correcting the amount of the left side of the inequality in the X direction.

[0048]

[Equation 5]

The following formula is used to determine whether the chip component (4) can be mounted within the range of the positional deviation allowable value in the Y direction by mounting the chip component (4) at a position displaced from the mounting position. "DY" is a positional deviation allowable value in the Y direction. When this calculation formula is satisfied, the chip component (4) can be mounted on the printed circuit board (5) by correcting and moving the amount of the left side of the inequality in the Y direction.

[0050]

[Equation 6]

The amount of movement in the X direction in the case of mounting with the position shifted from the mounting position shown in the flowchart is "g"
If the movement amounts in the X and Y directions are “gY”, then both are given by the following equations.

[0052]

[Equation 7]

With the above-mentioned structure, the operation will be described below.

First, when the printed circuit board (5) is placed on the XY table (1), the component supply section servo motor (8)
The component supply table (6) is moved by the drive of, and the component supply device (7) that supplies the product type "R1" of step "1" of the NC data is on standby at the suction station (I). The rotation of the turntable (11) causes the suction station (I) to move next.
The nozzle (12) moving to the component take-out position of (1) rotates the suction head part (13) by the rotation of the drive gear (18) driven by the drive gear servomotor (17) at the nozzle selection station (VI). The nozzle type corresponding to the moved product type “R1” is selected. The nozzle type is determined by the CPU (81) based on the part library data of the product type "R1" stored in the RAM (82).

Then, the vertical movement lever (59) is lowered by driving the cam mechanism (53), the swing lever (56) is swung downward, and the nozzle positioning fitting portion (48) is spring (51). While being biased by the suction nozzle (12)
Is abutted on the tapered portion of the fitted groove (15) provided on the upper part of the. Then, the fitting portion (74) is fitted into the fitting groove (1
The component (4) having the lower end of the suction nozzle (12) housed in the component supply device (7) while being fitted to the hose (3)
2), it is adsorbed by vacuum suction to the nozzle (12) communicating with the vacuum pump through the connection hose (33), the switching valve (34), the oblong intake passage (35) and the central intake passage (36).

Next, the suction nozzle (12) sucking the component (4) is moved to the recognition station (II) by the rotation of the turntable (11). In the recognition station (II), the recognition device (16) recognizes the component (4) sucked by the nozzle (12). It is assumed that the positions of the suction nozzle (12) and the chip component (4) on the plane are projected by the suction nozzle (12) as shown in FIG. It is assumed that the recognition device (16) captures the image of FIG. 15 as a silhouette image and performs recognition processing.

First, whether the sucked component (4) is sucked on a surface other than the surface to be sucked, that is, in a so-called standing state, or whether the wrong kind of component (4) is not sucked, etc. The quality of the component (4) is determined. If the CPU (81) determines that the product is defective from the recognition result of the recognition device (16), the component (4) is determined to be the mounting station (I).
It will be discharged to the discharge station (V) without being mounted in V). If the product is judged to be non-defective, the CPU
(81) is the center (center of rotation) of the suction nozzle (12) stored in advance for each nozzle (12).
The displacement in the X direction from the parts center recognized as "ΔX
1 ”, a positional deviation in the Y direction“ ΔY1 ”, and a suction nozzle (1
The angle deviation “Δθ1” of the component (4) with respect to 2) is calculated. Further, the protrusion amount of the suction nozzle (12) from the chip component (4) in the X direction is “CPX1” in the positive direction,
It is recognized that "0" is present in the negative direction, and the amount of protrusion in the positive direction of the Y direction is "CPY1" and "0" in the negative direction.

Next, according to the flow charts of FIGS. 10 and 11, it is judged whether or not the entire length in the X direction (the X direction of the chip part (4)) enters the recess (88).
The judgment is made by the following calculation formula using the formula 1.

[0059]

[Equation 8]

Here, "A1" is the dimension in the X direction of the chip component (4) of type "R1", and "LX1" is the dimension in the X direction of the recess (88) corresponding to the component (4). And are read from the parts library data respectively.
“A1 + CPX1” is the entire length of the image in the X direction, but if recognition processing is performed such that the overall length itself can be recognized before the amount of protrusion is recognized, that value may be used.

Since the protrusion amount "CPX1" is large and this inequality does not hold, it is judged that the chip component (4) is discharged without being mounted.

Next, the turntable (11) rotates intermittently and the suction nozzle (1) stopped at the recognition station (II).
2) rotates. Then, the suction nozzle (12) that has sucked the component (4) of the product type "R1" stops at the rotation correction station (III) after the next stop position, but does not perform the rotary positioning operation, and the mounting station ( IV)
The component (4) is ejected at the ejection station (V) without lowering the suction head portion (13).

That is, even if the suction nozzle (12) reaches the mounting station, if the clutch solenoid (37) is demagnetized, the contact lever (40) causes the contact lever (40) to move up and down.
9), the vertical movement lever (39) is prevented from being lowered, the suction nozzle (12) is not lowered, the component (4) is not mounted, and the suction nozzle () is attached to the discharge station. When 12) is reached, the part (4) is ejected.

Next, the part (4) of the above step "1"
When the nozzle (12) that is adsorbing is stopped at the recognition station (II), the next nozzle (12) is stopped at the adsorption station (I) and the product type “R2” indicated in step “2” of the NC data is displayed. The component (4) of “” is sucked in the same manner as in the case of step “1”.

Then, it is moved to the recognition station (II) in the same manner as described above. Then, according to the flowcharts of FIGS. 10 and 11, the quality of the chip component (4) is determined in the same manner as in the case of step "1", and the recognition process is performed. Images of the suction nozzle (12) and the chip component (4) are as shown in FIG. It is assumed that this state is as shown in FIG. 13 when viewed from the side.

The positional shifts ΔX2 and ΔY2 between the component center and the center position of the nozzle sucking the component (4) and the angular shift Δθ2 of the component (4) are calculated, and the protrusion amount "CMX2 in the negative direction of the X direction" is calculated. Is recognized. The protrusion amount in the other directions is “0”.

Next, the CPU (81) determines X according to the flow chart according to whether the following formula using Formula 1 holds.
It is determined whether the entire length in the direction fits in the recess (88).

[0068]

[Equation 9]

Here, "A2" is the dimension in the X direction of the chip component (4) of type "R2", and "LX2" is the dimension in the X direction of the recess (88) corresponding to the component (4). And are read from the parts library data respectively.

Since the amount of protrusion "CMX2" is small and this inequality is satisfied, when the positional deviation ΔX2 in the X direction is corrected by the following calculation formula, the suction nozzle (1
It is determined whether 2) hits the upper surface (87) of the substrate (5).

[0071]

[Equation 10]

Here, "A2" is the dimension in the X direction of the chip component (4) of type "R2", and "LX2" is the dimension in the X direction of the recess (88) corresponding to the component (4). However, it is determined that this inequality does not hold and there is interference (if it is attached to the center as shown in FIG. 13, the suction nozzle (12)
Is determined to hit the upper surface (87) of the substrate (5). ) And the following calculation formula, it is determined whether or not the position is within the permissible misalignment value by mounting the device shifted from the position to be mounted. The positional deviation allowable value is “dX2” as stored in the parts library data.

[0073]

[Equation 11]

If this inequality is satisfied, it is determined that the mounting is possible by shifting in the X direction, and "CMX", which is the amount of protrusion "CMX", is larger than "CPX" being "0". So, "A2 / 2 +
The value is stored in the RAM (82) so that only CMX2- (LX2 / 2-α) ”is corrected and moved in the positive direction. That is, the left direction of FIGS. 13 and 16 (the positive direction of the X direction)
Is stored in order to move the value by the amount.

Next, it is judged whether or not the Y-direction can be mounted in the same manner as the X-direction. In this case, as shown in FIG. 16, since there is no protrusion in the Y-direction, the recognized positional deviation is detected. The value obtained by subtracting ΔY2 is stored in the RAM (82) as the correction movement amount.

If Equation 11 does not hold because "CMX2" is large, the suction nozzle (12) is not lowered in the mounting station and component mounting is not performed in the same manner as in step 1, and the discharge station is not mounted. -The chip component (4) is ejected by the operation.

Next, the suction nozzle (12) is moved to the nozzle rotation correction station by the intermittent rotation of the turntable (11).

Then, the vertical movement lever (72) is lowered by driving the cam (not shown), and the swing lever (74) is moved.
Is swung downward, and the nozzle rotation fitting part (67) is fitted into the fitted groove (15) provided in the upper portion of the suction nozzle (12) while being biased by the spring (70), The nozzle rotating motor (61) is rotated, and the suction nozzle (12) is rotated by an angle “−Δθ2” degrees to align the component (4).

Next, the turntable (11) is rotated intermittently, and the suction nozzle (12) sucks the component (4) of the type "R2".
Moves to the mounting station (IV). At the mounting station (IV), the XY table (1) is rotated by the X-axis servo motor (2) and the Y-axis servo motor (3), and the NC data of the printed circuit board (5) on the table (1) is transferred. Y coordinate "Y2" shown in step "2"
Shift so that the position of is the mounting position of component (4)
It moves after being corrected for 2 minutes, and the X coordinate "X
The position of "2" is moved to a position where the amount of movement stored in the RAM (82) is corrected.

Then, in the same manner as in the suction station (I), the suction nozzle (12) descends and the component (4)
The mounting angle "0" in the recess (88) of the printed circuit board (5).
Next, the suction nozzle (12), which has been mounted as shown in FIG. 1 after the mounting of the component (4), is moved to the discharge station (V) and the nozzle selection station (VI).

Next, the part (4) of the above step "2"
When the nozzle (12) that is adsorbing is stopped at the recognition station (II), the next nozzle (12) is stopped at the adsorption station (I) and the product type “R3” shown in step “3” of the NC data is displayed. The component (4) of "" is sucked in the same manner as in steps "1" and "2".

Then, it is moved to the recognition station (II) in the same manner as described above. Then, according to the flowcharts of FIGS. 10 and 11, the quality of the chip component (4) is determined and the recognition process is performed, as in steps “1” and “2”. Images of the suction nozzle (12) and the chip component (4) are as shown in FIG. The two-dot chain line in FIG. 17 shows the outer shape of the recess (88) when the component (4) is to be mounted at the position where it should be mounted.

The positional shifts ΔX3 and ΔY3 between the component center and the center position of the nozzle sucking the component (4) and the angular shift Δθ3 of the component (4) are calculated. Regarding the amount of protrusion, "0" is recognized in the plus and minus directions in the X direction, and "CPY3" is recognized in the plus direction and "CMY3" is recognized in the minus direction in the Y direction, but "CPY3" is recognized more than "CMY3". It shall be large.

Next, the CPU (81) determines whether or not there is interference between the suction nozzle (12) and the substrate (5) according to the flow chart, but the protrusion is "0" in the X direction, and the suction nozzle (12) ) And the upper surface (87) of the substrate (5)
It is determined that there is no interference. Therefore, the corrected movement amount in the X direction is “−ΔX3” obtained by subtracting the recognized ΔX3.
Are stored in the RAM (82).

The judgment in the Y direction is first made by the following calculation formula using the mathematical formula 2.

[0086]

[Equation 12]

If there is a protrusion on both sides, the entire length is the length of the suction nozzle (12), so this inequality holds and the suction nozzle (12) and the chip part (4) must fit into the recess (88). You can see that

Next, when the positional deviation ΔY3 is corrected in the Y direction, the suction nozzle (12) moves to the substrate (5).
The determination as to whether or not it is made is performed by the following calculation formula using the formula 4.

[0089]

[Equation 13]

Here, "B3" is the dimension in the Y direction of the component (4) of the component type "R3", and "LY3" is the dimension in the Y direction of the recess (88) corresponding to the component (4). However, if it is determined that the deviation is large and this inequality does not hold and there is an interference, whether the deviation is within the positional deviation allowable value “dY3” by shifting the position from the position to be mounted according to the following formula using Equation 6 Judgment is made. "B3""L
Y3 and “dY3” are read from the parts library data of the part type “R3” as in the case of “R2” in step 2.

[0091]

[Equation 14]

Assuming that this inequality holds, it is judged that the component (4) can be mounted without shifting by shifting in the Y direction, and since the protrusion amount in the plus direction is large, "B3 / 2 + (CPY3-CMY3 ) −
The value minus the value is stored in the RAM (82) so that the correction movement is performed by (LY3 / 2−α) ”in the negative Y direction.

Next, the suction nozzle (12) is moved to the nozzle rotation correction station by the intermittent rotation of the turntable (11), and in this case, in the same manner as in step 2, the angle "-.theta." Only the suction nozzle (12) is corrected and rotated.

Next, the suction head (13) equipped with the suction nozzle (12) is moved to the mounting station (IV) by intermittent rotation of the turntable (11), and "X" is set in the X direction.
3 ”position in the Y direction from the position of“ Y3 ”to the position where the movement amount stored in the RAM (82) as the correction movement amount is corrected as described above, and the chip component (4) is moved.
Is installed.

By repeating such an operation, the chip component (4) is sucked and mounted.

In this embodiment, after the recognition device (16) recognizes the parts, as shown in the flow charts of FIGS. 10 and 11, the chip parts (4) and the suction nozzle (12) are entirely removed. It is judged whether or not it enters the concave portion (88), and then, when attempting to mount by correcting the recognized positional deviation, the suction nozzle (12) and the substrate (5)
If the upper surface (87) of the suction nozzle (12) hits the upper surface (87) of the concave portion (88), the end portion of the suction nozzle (12) is closer to the clearance “α If it is determined that the suction nozzle (12) is in contact with the suction nozzle (12) when it is determined that the displacement is within the allowable range of the positional deviation, the displacement nozzle is mounted.
The center position of the total length including the chip component (4) and the chip component (4) is mounted at the position to be mounted indicated by the NC data, and the positional deviation allowable value “dX” or “d” is set at that position.
You may make it check whether it is in "Y". If it is checked and it is out of the range, it should not be attached. That is, the absolute value of the correction movement amount and the magnitude of the positional deviation allowable value may be compared with (CMX-CPX) / 2 or (CMY-CPY) / 2 as the correction movement amount.
For example, in the case of step 2 of NC data, FIG.
As shown in 8, the right direction (plus direction) "CMX
If the amount is smaller than "dX2" by moving by 2/2 ", it may be mounted at the position where this amount is moved.

Further, in the present embodiment, the X-direction and the Y-direction are displaced so that they do not come into contact with each other.
If it can be determined that the electrode (90) and the electrode (90) can be soldered, the electrode (90) may be attached in this way.

Further, in the present embodiment, the case where the angle of the recessed portion (88) in the θ direction is 0 degree is explained (NC data is 0 degree), but in the case of other angles, the RAM (8
New XY when the corrected movement amounts in the X and Y directions stored in 2) are swung to the mounting angle data of the NC data.
The movement amount converted into the component may be corrected and moved in the XY table (1).

Further, in this embodiment, the concave portion (8
Although the size of 8) is stored in the RAM (82), if the size is different for each place in the substrate (5),
It may be stored for each step of the NC data, or if the distance between the end of the recess (88) and the end of the component is equal regardless of the size of the component, the interval is common. It may be stored in the RAM (82).
Alternatively, although all the chip components (4) are mounted in the recesses (88) in this embodiment, the chip components (which are mounted on the upper surface (87) of the substrate (5), not in the recesses (88) ( If there is also 4) and it is mixed, the data is also NC.
It may be stored for each data or each part.

When the depth of the concave portion (88) is smaller than the thickness of the component, even if the concave portion (88) exists, it is not necessary to consider the interference between the suction nozzle (12) and the upper surface of the substrate, so that the concave portion (88) does not exist. You can think in the same way as the case.

Furthermore, although the shape of the concave portion (88) of this embodiment is rectangular, other shapes can be mounted by determining the presence or absence of interference and shifting. If the board has a step on only one side of the component (4), there is no need to judge whether or not the step can be inserted into the recess, and the component is allowed to be displaced in the direction away from the step of the board. If the interference is eliminated by shifting within the range of values, it may be mounted.

Further, in this embodiment, the interference between the concave portion (88) and the suction nozzle (12) is checked after the recognition device (16) recognizes it. It is also possible to check whether or not 4) and the suction nozzle (12) interfere with each other in the same manner as in the present embodiment, and if they can be mounted by shifting them, they can be mounted by shifting them.

[0103]

As described above, according to the present invention, when the judging means judges that the upper surface of the printed circuit board surrounding the recess and the suction nozzle interfere with each other, the mounting is not carried out or the position is shifted within an allowable range. Since the electronic component is mounted on the substrate, the suction nozzle does not hit the upper surface of the substrate.

[Brief description of drawings]

FIG. 1 is a side view showing a positional relationship between a suction nozzle that suctions a chip component and a printed circuit board.

FIG. 2 is a plan view of an electronic component automatic mounting apparatus to which the present invention has been applied.

FIG. 3 is a side view of a nozzle rotation correction station.

FIG. 4 is a side sectional view of a turntable.

FIG. 5 is a side sectional view of a turntable.

FIG. 6 is a control block diagram of the present invention.

FIG. 7 is a diagram showing NC data.

FIG. 8 is a diagram showing parts library data.

FIG. 9 is a diagram showing nozzle library data.

FIG. 10 is a diagram showing a flowchart.

FIG. 11 is a diagram showing a flowchart.

FIG. 12 is a plan view showing a printed circuit board.

FIG. 13 is a side view showing a positional relationship between a suction nozzle that has suctioned a chip component and a printed circuit board.

FIG. 14 is a perspective view showing a chip part.

FIG. 15 is an image of a suction nozzle and a chip component recognized by a recognition device. FIG. 6 is a plan view showing a positional relationship between a suction nozzle and an adjacent component.

FIG. 16 is an image of a suction nozzle and a chip component recognized by a recognition device.

FIG. 17 is an image of a suction nozzle and a chip component recognized by a recognition device.

FIG. 18 is a side view showing a positional relationship between a suction nozzle that has sucked a chip component and a printed circuit board.

[Explanation of symbols]

 (2) X-axis servo motor (relative movement driving means) (3) Y-axis servo motor (relative movement driving means) (4) Chip-shaped electronic component (component) (5) Printed circuit board (12) Suction nozzle (16) Recognition Device (recognition means) (81) CPU (judgment means) (control device)

Claims (2)

[Claims] 1. An electronic component automatic mounting apparatus for adsorbing an electronic component by a suction nozzle and mounting the component at a position to be mounted in a recess formed on a printed circuit board, the positional deviation of the component with respect to the suction nozzle is recognized. Recognition means to
Relative movement drive means for correcting the positional deviation based on the recognition result of the recognition means to change the relative positional relationship between the suction nozzle and the printed circuit board in the plane direction, and the relative movement drive means based on the recognition result of the recognition means. And a determination means for determining whether or not the upper surface of the substrate surrounding the recess interferes with the suction nozzle when the displacement is corrected by driving the An electronic component automatic mounting apparatus comprising: a control unit that controls driving of the suction nozzle so as not to mount a component. 2. An electronic component automatic mounting apparatus that suctions an electronic component by a suction nozzle and mounts the component at a position to be mounted in a recess formed on a printed circuit board, and recognizes a positional shift of the component with respect to the suction nozzle. Recognition means to
Relative movement drive means for correcting the positional deviation based on the recognition result of the recognition means to change the relative positional relationship between the suction nozzle and the printed circuit board in the plane direction, and the relative movement drive means based on the recognition result of the recognition means. And a determination means for determining whether or not the upper surface of the substrate surrounding the recess interferes with the suction nozzle when the displacement is corrected by driving the An electronic component automatic mounting apparatus comprising: a control unit that controls the relative movement drive unit so that the component is mounted at a position displaced from the position to be mounted within an allowable range.