JPH06182283A - Liquid chemical nozzle - Google Patents

Abstract

PURPOSE:To apply a liquid chemical over the entire surface of a substrate without time lags by constituting the liquid chemical nozzle of a discharge surface opposing to the substrate to be treated, many discharge ports disposed on the discharge surface, a liquid chemical buffer and a liquid chemical introducing port. CONSTITUTION:The developer supplied from the liquid chemical introducing port 1 diffuses in four ways by colliding against a flow regulating plate 2 and is stored in a buffer 3. The liquid chemical discharge surface 4 is fixed by means of screws 6 to a nozzle cover 5. The developer is simultaneously discharged to the resist surface of a mask 10 from the many discharge ports 7 of the discharge surface 4 by opening a valve. The ordinarily used mask 10 is 150mm square and, therefore, the size of the discharge surface 4 is set at 150mm or larger. As a result, the developer is applied over the entire surface of the mask 10 without the time lags.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nozzle for treating a semiconductor, a liquid crystal panel and a mask thereof with a highly accurate chemical solution.

[0002]

2. Description of the Related Art The development of a semiconductor mask will be described as an example. For the mask, a chromium film is sputtered on a glass plate, a resist is applied on it, and after selectively drawing with an electron beam, development is carried out.

The developing system includes a dip system, a spray system and a paddle system. Of these, the spray method and the paddle method are used to perform development using nozzles.

In the spray method, the developing solution is sprayed from an obliquely upper direction while rotating the mask at a low speed. As the nozzle, a nozzle that expands the chemical solution in a fan shape is used.

In this spray nozzle, it is difficult to control the temperature of the developing solution in the nozzle and the pipe, and since the chemical solution is expanded in a fan shape, the chemical solution is atomized, and the heat of vaporization generated at that time causes the temperature of the developer solution to rise. There is a defect that the dimensions of the resist pattern change due to changes.

In the paddle system, the mask is rotated at an extremely low speed to drop the developing solution. Paddle nozzle has a diameter of 3
~ 4mm tube, 1 or 3 tubes, about 20
It is arranged linearly at mm intervals.

Since the developing solution is applied to the entire surface of the mask in a short time, the paddle nozzle is moved so as to scan the mask surface, but the developing solution still spreads over the entire surface of the mask in 1 to 2 seconds. It becomes longer, and there is a defect that the dimensions of the resist pattern vary due to the time difference.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to provide a nozzle that can apply a chemical solution to the entire surface of a substrate without any time difference.

Another object of the present invention is to provide a nozzle in which the temperature of the developing solution can be easily controlled.

Another object of the present invention is to provide a nozzle that does not change in temperature even if liquid is discharged.

[0011]

The present invention is characterized in that it comprises a discharge surface facing the substrate to be processed, a plurality of discharge ports arranged on the discharge surface, a chemical solution buffer and a chemical solution inlet.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings. Figure 1
FIG. 1A is a vertical cross-sectional view of the nozzle of the first embodiment of the present invention, and FIG. 1B is its AA arrow view.

The developing solution supplied from the chemical solution inlet 1 hits the current plate 2 and diffuses in all directions, and is stored in the buffer 3. The chemical liquid ejection surface 4 is fixed to the nozzle cover 5 with screws 6 and by opening a valve (not shown),
The developing solution is ejected all at once from the ejection ports 7 of the ejection surface 4 onto the resist surface of the mask 10.

A commonly used mask is 150 mm
Since it is a corner, the developer can be applied to the entire surface of the mask without any time difference by setting the size of the ejection surface 4 to be 150 mm square or more.

By making the hole diameter and hole pitch of the discharge port 7 small, it is possible to reduce coating unevenness on the mask surface. In the experiment, when the hole diameter was 1 mm and the hole pitch was 20 mm, the developing solution on the mask was connected for 0.5 seconds, and the variation in the resist size was smaller than that of the conventional spray method and paddle method.

If the discharge surface 4 is thin, when the valve is closed and the discharge of the developing solution is stopped, air enters the buffer 3 through one hole of the discharge port 7 and drips from the other discharge port 7. I will. Dripping was prevented by setting the thickness of the discharge surface 4 to 2 mm or more.

Further, if porous polypropylene or sintered metal is used for the discharge surface 4, the hole diameter of the discharge port 7 becomes the size of a micron unit and the number of holes becomes innumerable, so that there is no uneven coating of the developing solution. .

FIG. 2 is a vertical sectional view of a nozzle according to the second embodiment of the present invention.

The mask 10 is formed by making the lower side of the discharge surface 11 convex.
This is an improved nozzle that allows the upper air to easily escape to the outer periphery.

FIG. 3 is a vertical sectional view of a nozzle according to a third embodiment of the present invention. Temperature control tank 12 above the nozzle cover 5
First, a constant temperature liquid controlled by a constant temperature device (not shown) is circulated between the ports 13 and 14 to control the developing solution in the buffer 3 to a constant temperature. Replace the temperature control tank 12 with a heater,
If the temperature of the developing solution is controlled while monitoring the temperature of the developing solution in the buffer 3 with the temperature sensor 15, the temperature can be easily controlled to a high temperature.

[0021]

As described above, the present invention has the following effects.

The chemical solution can be applied to the entire surface of the substrate without any time difference.

Further, since the chemical liquid flows down without being made into fine particles, the chemical liquid does not vaporize, so that the chemical liquid having no temperature change can be applied to the substrate.

Furthermore, since the temperature of the chemical solution can be easily controlled by the buffer 3, the chemical solution having a constant temperature can be applied to the substrate.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a nozzle according to a first embodiment of the present invention and an arrow view of AA thereof.

FIG. 2 is a vertical sectional view of a nozzle according to a second embodiment of the present invention.

FIG. 3 is a vertical sectional view of a nozzle according to a third embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Chemical liquid inlet, 2 ... Rectifier plate, 3 ... Buffer, 4 ... Discharge surface, 5 ... Nozzle cover, 6 ... Screw, 7 ... Discharge port, 10 ...
Mask, 11 ... Discharge surface, 12 ... Temperature control tank, 13 ... Port,
14 ... Port, 15 ... Temperature sensor.

Claims (10)

[Claims] 1. A nozzle for treating a substrate with a chemical solution,
A chemical liquid nozzle comprising a discharge surface facing a substrate to be processed, a plurality of discharge ports arranged on the discharge surface, a chemical liquid buffer, and a chemical liquid inlet. 2. The chemical liquid nozzle according to claim 1, wherein the discharge surface has a thickness of 2 mm or more. 3. The chemical liquid nozzle according to claim 1, wherein the pitch of the discharge ports is 20 mm or less. 4. The chemical liquid nozzle according to claim 1, wherein the diameter of the discharge port is 1 mm or less. 5. The chemical liquid nozzle according to claim 1, wherein the discharge surface is a porous resin. 6. The chemical liquid nozzle according to claim 1, wherein the discharge surface is made of a porous metal. 7. The chemical liquid nozzle according to claim 1, wherein the discharge surface is substantially the same size as or larger than the substrate on which the chemical liquid treatment is performed. 8. The chemical liquid nozzle according to claim 1, wherein the discharge surface is convex downward. 9. The chemical liquid nozzle according to claim 1, wherein a straightening plate is arranged in the chemical liquid buffer. 10. The chemical liquid nozzle according to claim 1, wherein a warm heat source or a cold heat source is added to the outer periphery of the chemical liquid buffer.