JPH06181419A - Piezoelectric component - Google Patents

Abstract

PURPOSE:To provide the piezoelectric component with a small size and a high mechanical strength in which exfoliation or deterioration in the piezoelectric characteristic due to chipping, damage and thermal shock or the like is prevented. CONSTITUTION:A piezoelectric substrate 1 has front electrodes 61, 71, rear electrodes 63, 73, and side face lead electrodes 65, 75 formed to a side face of the piezoelectric substrate 1 through extension. A front support 4 and a rear support 5 are made of a ceramic material, and external connection terminals 13, 15 of a rear support 5 are connected to the side face lead electrodes 65, 75, with a conductive agent. The front support 4 and the piezoelectric substrate 1 are adhered with the 1st resin layer 2 and a vibration space is formed on the front side. The rear support 5 and the piezoelectric substrate 1 are adhered with the 2nd resin layer 3 and a vibration space is formed on the rear side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric component used as, for example, a filter, a resonator or an oscillator.

[0002]

2. Description of the Related Art As a prior art relating to this type of piezoelectric component, a front support and a base substrate are arranged on the front surface side and the back surface side of a piezoelectric substrate, and the piezoelectric substrate and the front support and the base substrate include an adhesive. A piezoelectric component having a sandwich structure, which is adhered via a resin layer, has been proposed. The piezoelectric substrate has a vibrating portion, and the vibrating portion includes a front electrode and a back electrode which are arranged on the front surface and the back surface of the piezoelectric substrate so as to face each other. Has a lead electrode formed as described above, and this lead electrode is connected to an external connection terminal formed on the base substrate.

[0003]

However, since the lead electrodes are formed only within the front surface and the back surface of the piezoelectric substrate, when connecting the lead electrodes to the external connection terminals formed on the base substrate, the piezoelectric electrodes are formed. It is necessary to extend the lead electrode on the substrate side to a position facing the external connection terminal of the base substrate, which leads to an increase in size of the piezoelectric substrate. In addition, since a conductive agent such as solder has an adhesive structure interposed between the opposing lead electrodes and external connection terminals, the adhesive strength tends to decrease.

Therefore, an object of the present invention is to solve the above-mentioned problems, to downsize the piezoelectric substrate, to obtain a large adhesive force, and to prevent chipping during transportation or mounting. It is an object of the present invention to provide a piezoelectric component capable of preventing damage, preventing the piezoelectric substrate from peeling off even when a thermal shock or the like is applied from the outside, and preventing deterioration of piezoelectric characteristics due to temperature change in a thermal shock test or the like.

[0005]

In order to solve the above problems, the present invention provides a piezoelectric substrate, a front support, a back support,
A piezoelectric component having a first resin layer and a second resin layer, wherein the piezoelectric substrate includes a vibrating section and a side surface lead electrode, and the vibrating section faces a front surface and a back surface of each other. Including the arranged front and back electrodes, the side surface lead electrode is formed to extend to the side surface, the front support and the back support are made of a ceramic material, the front surface side of the piezoelectric substrate and The back support has an external connection terminal at a position corresponding to the side surface lead electrode portion, and the external connection terminal is connected to the side surface lead electrode portion by a conductive agent. The resin layer of 1 is
It is interposed between the front support and the surface of the piezoelectric substrate to bond them to each other, and forms a vibrating space around the vibrating portion on the surface side of the piezoelectric substrate.
The resin layer is interposed between the back support and the back surface of the piezoelectric substrate to bond them to each other and form a vibration space around the vibrating portion on the back surface side of the piezoelectric substrate.

[0006]

The piezoelectric substrate includes a front electrode and a back electrode whose vibrating portions are arranged on the front surface and the back surface so as to face each other.
The first resin layer and the second resin layer form a vibration space around the vibrating portion on the front surface side and the back surface side of the piezoelectric substrate, and therefore are required for the piezoelectric vibration by the first resin layer and the second resin layer. A piezoelectric component that secures a wide space can be obtained.

The front support and the back support are made of a ceramic material and are disposed on the front surface side and the back surface side of the piezoelectric substrate, respectively. The first resin layer and the second resin layer are the front support and the back support, respectively. The mechanical strength is reinforced on both surface sides because they are interposed between the front surface of the piezoelectric substrate and between the back support and the back surface of the piezoelectric substrate, respectively, to bond them. Therefore, chipping or damage during transportation or mounting is prevented, and peeling of the piezoelectric substrate is less likely to occur even when a thermal shock or the like is applied from the outside.

Since the front support and the back support are made of a ceramic material, the coefficients of linear expansion between the piezoelectric substrate and the front support and the back support are close to each other, so that stress due to thermal shock or the like may occur. It becomes smaller and the piezoelectric characteristics are not deteriorated. The advantage of this action becomes clearer when the front support and the back support are made of a material having a different linear expansion coefficient from that of the piezoelectric substrate, such as a glass / epoxy substrate. When the front support and the back support are made of glass / epoxy substrate, etc., the machine caused by the difference in the linear expansion coefficient between the piezoelectric substrate and the front support and the back support due to the temperature change in the thermal shock test. Dynamic stress is applied, and charges are generated on the piezoelectric substrate by the piezoelectric effect. The stress direction is different between the low temperature side and the high temperature side, and the generated charges are alternating charges. For this reason, electric charges are generated in the direction opposite to that during polarization, the polarization disappears, and the piezoelectric characteristics deteriorate. According to the present invention, such deterioration of piezoelectric characteristics can be prevented.

The piezoelectric substrate has side surface lead electrode portions formed by extending the side surfaces of the piezoelectric substrate, and the back support has external connection terminals at positions corresponding to the side surface lead electrode portions.
Since the external connection terminals are connected to the side surface lead electrodes by a conductive agent, the area or length of the lead electrodes on the front surface or back surface of the piezoelectric substrate should be used when connecting the front or back electrodes to the external connection terminals of the back support. Even if the length is shortened, the front surface electrode or the back electrode can be reliably connected to the external connection terminal of the back support by utilizing the side surface lead electrode portion extended to the side surface. Therefore, the shape of the piezoelectric substrate can be reduced, and the connection strength is increased.

Since the external connection terminals of the back support are electrically connected to the lead electrodes, the back support can be connected to an external circuit using the external connection terminals. Therefore, it is possible to prevent the phenomenon of solder erosion of the lead electrode led out from the vibrating electrode. Since the external connection terminals of the back support can be formed as a thick film, the effect of solder erosion can be substantially ignored.

[0011]

FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention,
2 is a front view, FIG. 3 is a front cross-sectional view, FIG. 4 is a cross-sectional view taken along line A4-A4 in FIG. 3, and FIG. 5 is A in FIG.
5 is a cross-sectional view taken along the line 5-A5, and FIG. 6 is A6-A6 in FIG.
It is sectional drawing on a line. Reference numeral 1 is a piezoelectric substrate, 2 is a first resin layer, 3 is a second resin layer, 4 is a front support, and 5 is a back support.

The piezoelectric substrate 1 has vibrating portions 6 and 7. Each vibrating section 6, 7 includes front electrodes 61, 71 and back electrodes (62, 63), (72, 73) formed on the front surface and the back surface of the piezoelectric substrate 1 so as to face each other. The front electrodes 61 and 71 are commonly connected to the lead electrode 8. The lead electrode 8 is also electrically connected to the capacitor electrode 9 provided on the surface of the piezoelectric substrate 1.

The back electrodes 62 and 72 are electrically connected to each other through the capacitor electrode 10 facing the capacitor electrode 9, and the back electrodes 63 and 73 are piezoelectric by the lead electrodes 64 and 74 formed on the piezoelectric substrate 1. It is guided to the ends of both corners of the substrate 1. The lead electrodes 64, 74 extend from the side surface of the piezoelectric substrate 1 to form the side surface lead electrode portion 6
5 and 75. Regarding the electrode arrangement, contrary to the illustration, the electrodes (62, 63) and (72, 73) may be used as front electrodes and the electrodes 61 and 71 may be used as back electrodes.

Further, on the back surface side of the piezoelectric substrate 1, a lead electrode 11 facing the lead electrode 8 on the front surface side is provided. The lead electrode 11 is electrically connected to the lead electrode 8 on the front side by the side surface lead electrode portion 111 formed by extending the side surface of the piezoelectric substrate 1. The front electrode, the back electrode, the capacitor electrode, the lead electrode, and the side surface lead electrode can be simultaneously formed by, for example, electroless plating.

The first resin layer 2 includes a cavity layer 21 and a sealing layer 2.
2 and the adhesive layer 23, and the second resin layer 3 also includes the cavity layer 31, the sealing layer 32, and the adhesive layer 33.

The cavity layers 21 and 31 have cavity portions (211 and 212) and (311 and 31) at portions corresponding to the vibrating portions 6 and 7, respectively.
2), and is in close contact with the piezoelectric substrate 1. The cavities (211, 212) and (311, 312) are the front electrodes 61 and 71 and the back electrodes (62 and 63) of the vibrating sections 6 and 7,
The openings 213 and 31 are provided at positions apart from (72, 73).
Have three. Cavities (211, 212), (31
1, 312) are front electrodes 61, 71 and back electrodes (62,
63) and (72, 73) are formed so as to surround the vibrating portion, and a part of the vibrating portion is passed through a narrow passage to form the opening 2
13 and 313.

The sealing layers 22 and 32 are made of an insulating resin and adhere to the cavity layers 21 and 31 to close the openings 213 and 313. It is desirable that the sealing layers 22 and 32 be formed of an ultraviolet curable resin.

The front support 4 is made of a ceramic material such as alumina and is adhered onto the sealing layer 22 by an adhesive layer 23.

The back support 5 is made of a ceramic material such as alumina and is adhered to the surface of the sealing layer 32 constituting the second resin layer 3 by the adhesive layer 33. Back support 5
Is provided on the second resin layer 3 side. External connection terminals 13 to 15 are attached to the edges of the back support 5. The external connection terminals 13 to 15 are formed by a thick film forming technique, a plating technique or a combination thereof.

Upon assembly, the second resin layer 3, the piezoelectric substrate 1, the first resin layer 2 and the front support 4 are provided on the back support 5.
Are laminated and integrated. The side surface lead electrode portions 65, 111, 75 connected to the lead electrodes 64, 11 and 74 provided on the back surface side of the piezoelectric substrate 1 are arranged so as to face the external connection terminals 13 to 15 provided on the back support 5. . And
The side surface lead electrode portions 65, 111 and 75 are conductively connected to the external connection terminals 13 to 15 by the conductive agents 16 to 18 (see FIG. 2) such as solder or conductive paint.

As described above, the piezoelectric substrate 1 includes the vibrating section 6,
A front electrode 6 having a front surface 7 and a rear surface 7 arranged to face each other.
1, 71 and back electrodes (62, 63), (72, 73), and the first resin layer 2 and the second resin layer 3 have cavity portions (211, 212), (311) on one surface side. 312)
Since the one surface side is overlapped with the front surface and the back surface of the piezoelectric substrate 1 and the cavity portions (211, 212) and (311, 312) form a vibration space around the vibration portions 6 and 7, the cavity portion is formed. The necessary vibration space can be reliably formed by (211 and 212) and (311 and 312).

Since the front support 4 and the back support 5 are made of a ceramic material and are provided on the surfaces of the first resin layer 2 and the second resin layer 3, respectively, the first resin layer 2
Also, the mechanical strength is reinforced on both surface sides of the second resin layer 3. Therefore, chipping or damage during transportation or mounting is prevented, and peeling of the piezoelectric substrate 1 is less likely to occur even when a thermal shock or the like is applied from the outside.

Moreover, since the front support 4 and the back support 5 are made of a ceramic material, the linear expansion coefficient between the piezoelectric substrate 1 and the front support 4 and the back support 5 is close to each other, and The stress caused by impact or the like is reduced, and the deterioration of piezoelectric characteristics is eliminated. For example, the typical value of the linear expansion coefficient of the piezoelectric substrate 1 is 6 × 10 ⁻⁶ , and the front support 4 and the back support 5 are
7.5 x 10 when is composed of 96% alumina
^-6 . Therefore, the difference in the linear expansion coefficient between the piezoelectric substrate 1 and the front support 4 and the back support 5 becomes small, and the deterioration of the piezoelectric characteristics becomes extremely small even if the piezoelectric substrate 1 undergoes a temperature change in a thermal shock test or the like. As an example, at −55 ° C. for 30 minutes, +1
Even if a thermal shock test was carried out for 500 cycles at 25 ° C. for 30 minutes as one cycle, almost no characteristic deterioration could be recognized.

The piezoelectric substrate 1 has side surface lead electrode portions 65, 75, 111 formed by extending the back electrodes 62, 72, 11 to the side surfaces of the piezoelectric substrate 1, and the back support 5 is a side surface lead. The external connection terminals 13 to 15 are provided at positions corresponding to the electrode portions 65, 75 and 111, and the external connection terminals 13 to 15 are attached to the side surface electrode portions 65, 75 and 111 by the conductive agents 16 to 18 such as solder or conductive paint. Since the back electrodes 62, 72, 11 are connected, the external connection terminals 13 of the back support 5 are connected.
15 to 15, even if the area or length of the lead electrodes 64 and 74 on the front surface and the back surface of the piezoelectric substrate 1 is shortened, the side surface lead electrode portions 65 and 7 extended to the side surfaces.
The back electrodes 62, 72, and 11 can be reliably connected to the external connection terminals 13 to 15 of the back support 5 by using the elements 5 and 111.
Therefore, the shape of the piezoelectric substrate 1 can be reduced and the connection strength is increased.

In the embodiment, the front electrodes 61 and 71 are electrically connected to the lead electrode 11 provided on the back surface side by the lead electrodes 8 and the side surface lead electrodes 111, and the back electrodes 63 and 73 are other leads provided on the back surface side. The back support 5 is electrically connected to the electrodes 64 and 74, and the back support 5 has external connection terminals 13 to 15 on its outer surface. The external connection terminals 13 to 15 are side surface lead electrode portions 65.
Unlike the conventional case, the cap-shaped terminal fitting made of a thin metal plate is unnecessary because it is electrically connected to 111 and 75. Therefore, the number of parts is reduced, and the structure for extracting the vibrating portion is simplified. Since the cap-shaped terminal metal fitting is unnecessary, the reliability is not deteriorated due to the warp or breakage of the cap-shaped terminal metal fitting.

In the piezoelectric substrate 1, the front electrodes 61 and 71 are electrically connected to the lead electrodes 11 provided on the back surface by the lead electrodes 8 and the side surface lead electrodes 111, and the back electrodes 63 and 7 are provided.
Since 3 is electrically connected to the lead electrodes 64 and 74 provided on the back surface side, the front electrodes 61 and 71 and the back electrodes 63 and 74 can be drawn out on the same back surface side. For this reason,
The external lead-out paths of the vibrating portions 6 and 7 are shortened, and advantages such as a reduction in lead inductance and an accompanying improvement in characteristics can be obtained.

The back support 5 has external connection terminals 13 ...
15, the external connection terminals 13 to 15 are electrically connected to the side surface lead electrode portions 65, 111, and 75.
The external connection terminals 13 to 15 provided in the above become the external connection terminals. Therefore, it is possible to prevent the solder erosion phenomenon of the lead electrodes 64, 11, 74 which are derived from the vibrating portions 6, 7 and are made of a thin film. External connection terminals 13 to 1 of the back support 5
Since No. 5 can be formed as a thick film, the effect of solder erosion can be substantially ignored.

FIG. 7 is an exploded perspective view of another embodiment of the piezoelectric component according to the present invention, and FIG. 8 is an enlarged sectional view of the end of the piezoelectric component shown in FIG. The figure shows an example of a piezoelectric component used as a three-terminal resonator. In the figure,
~ The same reference numerals as those in Fig. 6 denote the same components.

The piezoelectric substrate 1 has a vibrating portion 6. The vibrating section 6 includes a front electrode 61, a back electrode 62, and a capacitor electrode 11 formed on the front surface and the back surface of the piezoelectric substrate 1 so as to face each other. The front electrode 61 has a lead electrode 67, and the lead electrode 67 is connected to a side surface lead electrode portion 69 provided on the side surface of the piezoelectric substrate 1. The lead electrode 67 is also electrically connected to the capacitor electrode 68 provided on the surface of the piezoelectric substrate 1.

The back electrode 62 has a lead electrode 64, and the lead electrode 64 is connected to a side surface lead electrode portion 65 provided on the side surface of the piezoelectric substrate 1. The lead electrode 64 is also electrically connected to the capacitor electrode 66 provided on the surface of the piezoelectric substrate 1. The capacitor electrode 11 is connected to the side surface lead electrode portion 111 provided on the side surface of the piezoelectric substrate 1. The front electrode, the back electrode, the capacitor electrode, the lead electrode, and the side surface lead electrode can be simultaneously formed by, for example, electroless plating.

The first resin layer 2 is an adhesive layer, and the second resin layer 3 is also an adhesive layer. First resin layer 2 and second
The resin layer 3 has a hollow portion 211 at a portion corresponding to the vibrating portion 6,
311 is attached to the piezoelectric substrate 1.

The front support 4 is made of a ceramic material such as alumina, and the piezoelectric substrate 1 is formed by the first resin layer 2.
Is glued to the surface of. The back support 5 is also made of a ceramic material such as alumina and is bonded to the back surface of the piezoelectric substrate 1 by the second resin layer 3. The back support 5 has external connection terminals 13 to 15 attached to its edges.

Upon assembly, the second resin layer 3, the piezoelectric substrate 1 and the first resin layer 2 are laminated on the back support 5 and bonded and integrated. The side surface lead electrode portions 65, 111, 69 provided on the side surface of the piezoelectric substrate 1 are arranged so as to face the external connection terminals 13 to 15 provided on the back support 5.
Then, the conductive agents 16 to 18 such as solder or conductive paint or conductive paint are applied to electrically connect the external connection terminals 13 to 15 to the side surface lead electrode portions 65, 111 and 69.

As described above, the piezoelectric substrate 1 has the front electrode 6
1, the back electrode 62 and the capacitor electrode 111 are the piezoelectric substrate 1
Side electrode portions 65, 6 formed to extend to the side surfaces of the
9 and 11, the back support 5 has external connection terminals 13 to 15 at positions corresponding to the side surface lead electrode portions 65, 111 and 69, and the external connection terminals 13 to 15 are conductive agents 16 to. 18, the side surface lead electrode portions 65, 111, 6
Since the lead electrodes 64 and 67 on the front surface and the back surface of the piezoelectric substrate 1 are reduced in area or length, the surface electrodes 61, Back electrode 62 and capacitor electrode 11
Can be reliably connected to the external connection terminals 13 to 15 of the back support 5. Therefore, the shape of the piezoelectric substrate 1 can be reduced and the connection strength is increased.

FIG. 9 is an exploded perspective view of another embodiment of the piezoelectric component according to the present invention, and FIG. 10 is an enlarged end sectional view of the piezoelectric component shown in FIG. The figure shows an example of a piezoelectric component used as a two-terminal type resonator. In the figure, the same reference numerals as those in FIGS. 7 and 8 denote the same components.

The vibrating portion 6 is formed on the front surface and the back surface of the piezoelectric substrate 1 so as to face each other, and the front electrode 61 and the back electrode 6 are provided.
Equipped with 2. The front electrode 61 has a lead electrode 67,
The lead electrode 67 is connected to the side surface lead electrode portion 69 provided on the side surface of the piezoelectric substrate 1. The back electrode 62 has a lead electrode 64, and the lead electrode 64 is connected to a side surface lead electrode portion 65 provided on the side surface of the piezoelectric substrate 1. The back support 5 has external connection terminals 13 and 15 at positions corresponding to the side surface lead electrode portions 65 and 69.
5 is the side surface lead electrode portions 65 and 6 by the conductive agents 16 and 18.
9 (see FIG. 10). Front electrode,
The back electrode, the capacitor electrode, the lead electrode, and the side surface lead electrode can be simultaneously formed by, for example, electroless plating.

As described above, the piezoelectric substrate 1 has the front electrode 61.
And the back electrode 62 has side surface lead electrode portions 65 and 69 formed to extend to the side surface of the piezoelectric substrate 1, respectively,
The back support 5 has external connection terminals 13 and 15 at positions corresponding to the side surface lead electrode portions 65 and 69.
3, 15 are formed by the conductive agents 16 and 18 on the side surface lead electrode portion 6
5 and 69, the side surface lead electrode portions 65 and 69 extended to the side surfaces are used even if the area or length of the lead electrodes 64 and 67 on the front surface and the back surface of the piezoelectric substrate 1 is shortened. Then, the front electrode 61 and the back electrode 6
2 can be reliably connected to the external connection terminals 13 and 15 of the back support 5. Therefore, the shape of the piezoelectric substrate 1 can be reduced and the connection strength is increased.

Although illustration is omitted, various electrodes formed on the front side and the back side of the piezoelectric substrate 1 have the shapes shown in the embodiments,
Not limited to the number, it is possible to adopt various modes.

[0039]

As described above, according to the present invention, the following effects can be obtained. (A) The piezoelectric substrate has a front electrode, a back electrode, and side surface lead electrode portions formed to extend on the side surfaces of the piezoelectric substrate,
The back support has external connection terminals at positions corresponding to the side surface lead electrode portions, and since the external connection terminals are connected to the side surface lead electrode portions by a conductive agent, the connection of the lead electrodes on the front and back surfaces of the piezoelectric substrate Even if the area or length is shortened, the side surface lead electrode portion can be used to reliably connect the front surface electrode and the back electrode to the external connection terminal of the back support. Therefore, it is possible to provide a small-sized piezoelectric component having a high connection strength. (B) The piezoelectric substrate includes a front electrode and a back electrode in which the vibrating portion is arranged on the front surface and the back surface so as to face each other, and the first resin layer and the second resin layer have a cavity portion on one surface side. However, since the one surface side is overlapped with the front surface and the back surface of the piezoelectric substrate and the hollow portion forms the vibration space around the vibrating portion, the necessary vibration space can be reliably formed by the hollow portion. (C) Since the front support and the back support are made of a ceramic material and are provided on the surfaces of the first resin layer and the second resin layer, respectively, they are chipped or damaged during transportation or mounting. It is possible to provide a highly reliable piezoelectric component in which peeling does not easily occur in the piezoelectric substrate even when a thermal shock or the like is applied from the outside. (D) Since the front support and the back support are made of a ceramic material, the linear expansion coefficient between the piezoelectric substrate and the front support and the back support is close to each other, and stress due to thermal shock or the like is not generated. It is possible to provide a highly reliable piezoelectric component which is small in size and has extremely little deterioration in piezoelectric characteristics due to temperature fluctuations.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention.

FIG. 2 is a front view of a piezoelectric component according to the present invention.

FIG. 3 is a front sectional view of a piezoelectric component according to the present invention.

FIG. 4 is a cross-sectional view taken along the line A4-A4 in FIG.

5 is a cross-sectional view taken along the line A5-A5 of FIG.

6 is a cross-sectional view taken along the line A6-A6 of FIG.

FIG. 7 is an exploded perspective view of another embodiment of the piezoelectric component according to the present invention.

8 is an enlarged cross-sectional view of an end portion of the piezoelectric component shown in FIG.

FIG. 9 is an exploded perspective view of a piezoelectric component according to still another embodiment of the present invention.

FIG. 10 is an enlarged sectional view of an end portion of the piezoelectric component shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Piezoelectric substrate 6, 7 Vibrating part 61, 71 Front electrode 62, 72, 63, 73 Back electrode 65, 75, 111, 69 Side lead electrode part 2 First resin layer 3 Second resin layer 4 Front support 5 Back support

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masaro Taniguchi 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDC Corporation (72) Ikuo Kato 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDC Within the corporation

Claims (5)

[Claims] 1. A piezoelectric substrate, a front support, a back support,
A piezoelectric component having a first resin layer and a second resin layer, wherein the piezoelectric substrate includes a vibrating portion and a side surface lead electrode, and the vibrating portion faces a front surface and a back surface of each other. A front electrode and a back electrode are arranged, the side surface lead electrode is formed to extend to the side surface, the front support and the back support is made of a ceramic material, the surface side of the piezoelectric substrate and The back support has an external connection terminal at a position corresponding to the side surface lead electrode portion, and the external connection terminal is connected to the side surface lead electrode portion by a conductive agent. The resin layer 1 is interposed between the front support and the surface of the piezoelectric substrate to bond them to each other and form a vibration space around the vibrating portion on the front surface side of the piezoelectric substrate, The second resin layer is A piezoelectric component which is interposed between the back support and the back surface of the piezoelectric substrate to bond them to each other and forms a vibration space around the vibration portion on the back surface side of the piezoelectric substrate. 2. The at least two vibrating parts are provided, and each of the vibrating parts is divided into the front electrode or the back electrode,
The piezoelectric component according to claim 1, wherein one of the divided electrodes is connected to each other between the vibrating portions, the other of the divided electrodes is connected to a lead electrode, and the lead electrode is connected to the side surface lead electrode. . 3. The piezoelectric substrate has a capacitor, and the capacitor is composed of a pair of capacitor electrodes provided so as to face each other on the front surface and the back surface of the piezoelectric substrate, and one of the capacitor electrodes is divided. The piezoelectric component according to claim 2, wherein the piezoelectric component is connected to one of the electrodes, and the other of the capacitor electrodes is connected to the side surface lead electrode. 4. The piezoelectric substrate has two sets of capacitors, wherein one of a pair of capacitor electrodes is common and the other is an individual electrode individually opposed to the common electrode. , The common electrode is provided on the back side of the piezoelectric substrate, the individual electrode is provided on the front side of the piezoelectric substrate,
The piezoelectric component according to claim 1, which is connected to the side surface lead electrode and the front electrode. 5. The piezoelectric component according to claim 1, wherein the front electrode and the back electrode are connected to the side surface lead electrode.