JPH06177567A - Component cooling device of printed wiring board - Google Patents
Component cooling device of printed wiring boardInfo
- Publication number
- JPH06177567A JPH06177567A JP32505692A JP32505692A JPH06177567A JP H06177567 A JPH06177567 A JP H06177567A JP 32505692 A JP32505692 A JP 32505692A JP 32505692 A JP32505692 A JP 32505692A JP H06177567 A JPH06177567 A JP H06177567A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- heat
- fan
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims description 12
- 238000007664 blowing Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線基板に実
装した発熱性部品の冷却装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for heat-generating components mounted on a printed wiring board.
【０００２】[0002]
【従来の技術】従来のプリント配線基板の少なくとも一
面には、コンデンサ等の非発熱性部品と、例えば抵抗
器、トランジスタ、ＩＣ等の発熱性部品とを混在して実
装しており、電子回路の小型化のために発熱部品を接近
して実装せざるを得なかった、そこで機器にファンを取
付け冷却するため、放熱された熱風を機器外部に放出す
るものもあったが、充分とはいえなくなりつつある。ま
た近来の電子製品は小型になるにしたがいますます発熱
部品が他の部品に接近、過密配置することとなって、発
熱部品自体の放熱が充分になされず、また熱により他の
部品へ経時的に熱劣化の影響を与える可能性が増大して
いる等の問題があった。2. Description of the Related Art Non-heat-generating components such as capacitors and heat-generating components such as resistors, transistors, and ICs are mounted on at least one surface of a conventional printed wiring board in a mixed manner. In order to miniaturize, heat generating parts had to be mounted close to each other.Therefore, in order to attach a fan to the equipment to cool it, there were some that released the radiated hot air to the outside of the equipment, but this is not enough. It's starting. In addition, as recent electronic products become smaller, the heat-generating components are closer to other components and are more densely arranged, resulting in insufficient heat dissipation of the heat-generating components themselves, and the heat generated by the heat-generating components to other components over time. However, there is a problem that the possibility of heat deterioration is increasing.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、上記従来の
問題点に鑑みなされたもので、プリント配線基板に搭載
した発熱部品を集中的に冷却することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems of the prior art, and an object thereof is to intensively cool heat-generating components mounted on a printed wiring board.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するため
に本発明では、電子機器の筐体内にプリント配線基板を
配置し、多数の電子部品を実装せしめる同プリント配線
基板に開孔し、同開孔部分を覆うように前記電子機器装
置の作動開始と同時に作動せしめるマイクロファンを同
プリント配線基板に装着すると共に、同ファンの上方吹
き出し方向に対向する位置に発熱性部品を配置した。In order to solve the above-mentioned problems, according to the present invention, a printed wiring board is arranged in a housing of an electronic device, and a hole is formed in the printed wiring board on which a large number of electronic components are mounted. A micro fan that operates simultaneously with the start of operation of the electronic device is mounted on the printed wiring board so as to cover the opening portion, and a heat-generating component is arranged at a position facing in the upward blowing direction of the fan.
【０００５】[0005]
【作用】上記構成によれば、プリント配線基板に開孔
し、同開孔部分を覆うようにマイクロファンを同プリン
ト配線基板に装着すると共に、同ファンの上方吹き出し
方向に対向する位置に発熱性部品を配置する。装置の作
動開始と同時にマイクロファンを作動させ発熱部品を集
中的に冷却する。According to the above construction, a hole is formed in the printed wiring board, the micro fan is mounted on the printed wiring board so as to cover the opening portion, and the heat generating property is provided at a position facing in the upward blowing direction of the fan. Place the parts. Simultaneously with the start of operation of the device, the micro fan is activated to intensively cool the heat-generating components.
【０００６】[0006]
【実施例】本発明の実施例を添付図面を参照して詳細に
説明する。部品冷却装置の構造は、図１に示すように、
１はプリント配線基板で、中央部に空気取り入れ用の孔
１ａが設けられ、孔１ａの上部にマイクロファン２が装
着されている。３は発熱部品で、同発熱部品３の側部と
プリント配線基板１の上面を支持部材４で保持されてい
る。上記構成において、マイクロファン２は装置が作動
すると回転し、空気取り入れ用の孔１ａから冷気５を吸
引し、吸引した冷気５を発熱部品３の下部に吹き付ける
ことで発熱部品３を集中的に冷却する。他の実施例で
は、図２に示すように、発熱部品３はリード線６が側部
に設けられ、同リード線６はプリント配線基板１の裏面
に半田付け７されている。そして発熱部品３を保持する
と共に、発熱部品３とプリント配線基板１の銅箔を電気
的に接続している。上記構成において、マイクロファン
２は装置が作動すると回転し、空気取り入れ用の孔１ａ
から冷気５を吸引し、吸引した冷気５を発熱部品３の下
部に吹き付けることで発熱部品３を集中的に冷却する。Embodiments of the present invention will be described in detail with reference to the accompanying drawings. The structure of the component cooling device is as shown in FIG.
Reference numeral 1 denotes a printed wiring board having a hole 1a for air intake in the center thereof, and a microfan 2 mounted on the upper portion of the hole 1a. Reference numeral 3 denotes a heat-generating component, and a side portion of the heat-generating component 3 and an upper surface of the printed wiring board 1 are held by a supporting member 4. In the above configuration, the micro fan 2 rotates when the device operates, sucks the cool air 5 from the air intake hole 1a, and blows the sucked cool air 5 to the lower portion of the heat generating component 3 to intensively cool the heat generating component 3. To do. In another embodiment, as shown in FIG. 2, the heat-generating component 3 is provided with a lead wire 6 on its side portion, and the lead wire 6 is soldered 7 to the back surface of the printed wiring board 1. The heat generating component 3 is held and the heat generating component 3 and the copper foil of the printed wiring board 1 are electrically connected. In the above structure, the micro fan 2 rotates when the device is operated, and the air intake hole 1a is formed.
The cool air 5 is sucked from the air, and the sucked cool air 5 is blown to the lower portion of the heat generating component 3 to intensively cool the heat generating component 3.
【０００７】他の実施例では、図３に示すように、発熱
部品８は保持部９によりマイクロファン２の上部に固着
されている。マイクロファン２は装置が作動すると回転
し、空気取り入れ用の孔１ａから冷気５を吸引し、吸引
した冷気５を発熱部品８の下部に吹き付けることで発熱
部品８を集中的に冷却し、温風１２は上部に排出され
る。他の実施例では、図４に示すように、発熱部品８は
マイクロファン２の上部に直接固着され、例えば、発熱
部品８の側部にリード線１０が設けられ、同リード線１
０はマイクロファン２の支持部材に組み込まれた導通部
１１を経由してプリント配線基板１の裏面に半田付け７
されている。マイクロファン２は装置が作動すると回転
し、空気取り入れ用の孔１ａから冷気５を吸引し、吸引
した冷気５を発熱部品８の下部に吹き付けることで発熱
部品８を集中的に冷却し、温風１２は上部に排出され
る。In another embodiment, as shown in FIG. 3, the heat generating component 8 is fixed to the upper portion of the micro fan 2 by a holding portion 9. When the device operates, the micro fan 2 rotates, sucks the cool air 5 from the air intake hole 1a, and blows the sucked cool air 5 to the lower portion of the heat generating component 8 to cool the heat generating component 8 intensively, thereby warming the hot air. 12 is discharged to the upper part. In another embodiment, as shown in FIG. 4, the heat-generating component 8 is directly fixed to the upper part of the microfan 2, and for example, the lead wire 10 is provided on the side of the heat-generating component 8 and the lead wire 1 is provided.
0 is soldered to the back surface of the printed wiring board 1 via the conducting portion 11 incorporated in the supporting member of the microfan 7.
Has been done. When the device operates, the micro fan 2 rotates, sucks the cool air 5 from the air intake hole 1a, and blows the sucked cool air 5 to the lower portion of the heat generating component 8 to cool the heat generating component 8 intensively, thereby warming the hot air. 12 is discharged to the upper part.
【０００８】[0008]
【発明の効果】以上のように本発明においては、発熱部
品はマイクロファンで集中的に冷却されるので、各発熱
部品は均一に冷却され冷却効率が向上する。また従来の
ように高発熱部品に隣接する部品が熱影響による性能低
下を招くことが無くなる等の効果は大きい。As described above, in the present invention, since the heat-generating components are intensively cooled by the microfan, the heat-generating components are uniformly cooled and the cooling efficiency is improved. Further, there is a great effect that the components adjacent to the high heat-generating component are not deteriorated in performance due to the heat influence as in the conventional case.
【図１】本発明のプリント配線基板の部品冷却装置の一
実施例を示す要部断面図である。FIG. 1 is a sectional view of an essential part showing an embodiment of a device for cooling a printed wiring board according to the present invention.
【図２】本発明のプリント配線基板の部品冷却装置の他
の実施例を示す要部断面図である。FIG. 2 is a cross-sectional view of essential parts showing another embodiment of the component cooling device for a printed wiring board according to the present invention.
【図３】本発明のプリント配線基板の部品冷却装置の他
の実施例を示す要部断面図である。FIG. 3 is a cross-sectional view of essential parts showing another embodiment of the component cooling device for a printed wiring board according to the present invention.
【図４】本発明のプリント配線基板の部品冷却装置の他
の実施例を示す要部断面図である。FIG. 4 is a cross-sectional view of essential parts showing another embodiment of the component cooling device for a printed wiring board according to the present invention.
１ プリント配線基板 １ａ 空気取り入れ用の孔 ２ マイクロファン ３ 発熱部品 ４ 支持部材 ５ 冷気 ６ リード線 ７ 半田付け ８ 発熱部品 ９ 保持部 10 リード線孔 11 導通部 12 温風 1 Printed Wiring Board 1a Air Intake Hole 2 Micro Fan 3 Heating Component 4 Supporting Member 5 Cold Air 6 Lead Wire 7 Soldering 8 Heating Component 9 Holding Port 10 Lead Wire Hole 11 Conducting Port 12 Hot Air
Claims (4)
配置し、多数の電子部品を実装せしめる同プリント配線
基板に開孔し、同開孔部分を覆うように前記電子機器装
置の作動開始と同時に作動せしめるマイクロファンを同
プリント配線基板に固着すると共に、同ファンの上方吹
き出し方向に対向する位置に発熱性部品を配置したこと
を特徴とするプリント配線基板の部品冷却装置。1. A printed wiring board is arranged in a housing of an electronic device, a hole is opened in the printed wiring board on which a large number of electronic parts are mounted, and the operation of the electronic device device is started so as to cover the hole portion. A component cooling device for a printed wiring board, characterized in that a micro fan that operates at the same time is fixed to the same printed wiring board, and heat generating components are arranged at positions facing each other in the upward blowing direction of the fan.
ァンを跨ぐように配置し、同端子を前記プリント配線基
板の銅箔回路に半田付により固定した請求項１記載のプ
リント配線基板の部品冷却装置。2. The component cooling of the printed wiring board according to claim 1, wherein the terminals of the heat-generating component are arranged so as to straddle the microfan, and the terminals are fixed to a copper foil circuit of the printed wiring substrate by soldering. apparatus.
配置し、多数の電子部品を実装せしめる同プリント配線
基板に開孔し、同開孔部分を覆うように前記電子機器装
置の作動開始と同時に作動せしめるマイクロファンを前
記プリント配線基板に装着すると共に、同ファンの上方
吹き出し方向に対向する位置に発熱性部品を配置したこ
とを特徴とするプリント配線基板の部品冷却装置。3. A printed wiring board is arranged in a housing of an electronic device, a hole is opened in the printed wiring board on which a large number of electronic components are mounted, and the operation of the electronic device device is started so as to cover the hole portion. A component cooling device for a printed wiring board, characterized in that a micro-fan which operates simultaneously is mounted on the printed wiring board, and heat-generating components are arranged at positions facing each other in an upward blowing direction of the fan.
ァン支持部材を介し前記プリント配線基板の銅箔回路に
接続した請求項３記載のプリント配線基板の部品冷却装
置。4. The component cooling device for a printed wiring board according to claim 3, wherein the terminals of the heat-generating component are connected to the copper foil circuit of the printed wiring substrate via the microfan supporting member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32505692A JP3303934B2 (en) | 1992-12-04 | 1992-12-04 | Component cooling device for printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32505692A JP3303934B2 (en) | 1992-12-04 | 1992-12-04 | Component cooling device for printed wiring boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06177567A true JPH06177567A (en) | 1994-06-24 |
| JP3303934B2 JP3303934B2 (en) | 2002-07-22 |
Family
ID=18172660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32505692A Expired - Fee Related JP3303934B2 (en) | 1992-12-04 | 1992-12-04 | Component cooling device for printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3303934B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6665181B2 (en) * | 2001-09-17 | 2003-12-16 | Fujitsu Limited | Cooling device capable of reducing thickness of electronic apparatus |
| US7474533B2 (en) | 2001-09-17 | 2009-01-06 | Fujitsu Limited | Cooling device capable of reducing thickness of electronic apparatus |
-
1992
- 1992-12-04 JP JP32505692A patent/JP3303934B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6665181B2 (en) * | 2001-09-17 | 2003-12-16 | Fujitsu Limited | Cooling device capable of reducing thickness of electronic apparatus |
| US6909604B2 (en) | 2001-09-17 | 2005-06-21 | Fujitsu Limited | Cooling device capable of reducing thickness of electronic apparatus |
| US7019970B2 (en) | 2001-09-17 | 2006-03-28 | Fujitsu Limited | Cooling device capable of reducing thickness of electronic apparatus |
| US7298616B2 (en) * | 2001-09-17 | 2007-11-20 | Fujitsu Limted | Cooling device capable of reducing thickness of electronic apparatus |
| US7474533B2 (en) | 2001-09-17 | 2009-01-06 | Fujitsu Limited | Cooling device capable of reducing thickness of electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3303934B2 (en) | 2002-07-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |