JPH06177183A - Bonding device for semiconductor pellet - Google Patents

Abstract

PURPOSE:To improve maintainability of a semiconductor pellet bonding device and to realize the minaturization and the light weight thereof. CONSTITUTION:A wafer frame chuck 18 for performing the delivery of a wafer between a wafer table 30 and a wafer frame magazine is installed into a movement mechanism 19 for maintaining a transfer collet 16. The movement mechanism 19 comprises a moving guide 49 provided in the transfer direction of a transfer means 12, a moving base 50 which is movable in the transfer direction of the transfer means 12 on the moving guide 49, a guide bar 52 horizontally supported to the moving base 50 to cross the moving guide at right angles and a moving element 53 which is supported to the guide bar 52 and movable in such a direction as to cross the moving guide 49 at right angles.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor pellet bonding apparatus for automatically carrying a semiconductor pellet group into and out of a semiconductor pellet supply table.

[0002]

2. Description of the Related Art A conventional semiconductor pellet bonding apparatus will be described with reference to FIG.

FIG. 4 is a plan view showing the structure of a conventional semiconductor pellet bonding apparatus.

In the semiconductor pellet bonding apparatus 1 (hereinafter referred to as the bonding apparatus 1), when performing a pellet bonding operation, first, the semiconductor pellets are accommodated in a stacked state from the wafer magazine 2 into the wafer magazine, and the semiconductor pellets (hereinafter simply referred to as pellets). The wafer ring (not shown) holding the wafer sheet to which () is attached is transferred onto the wafer table 4 by the wafer ring transfer means 3.
Then, the wafer ring conveyed onto the wafer table 4 is held and fixed in a stretched state by a stretching mechanism (not shown) of the wafer table 4.

Next, a lead frame (not shown) is supplied from the supply section 5 onto the conveying means 6. Then, the supplied lead frame is carried by the carrying means 6, and is sent to a bonding position by the bonding head 7 through a paste application process (not shown). At this bonding position, the collet 8 mounted on the bonding head 7 so as to be able to move up and down and move horizontally adsorbs the pellet whose posture is recognized by the recognition means (not shown) on the wafer table 4, and the paste is applied in the paste applying step. The lead frame is transferred onto the lead frame and bonded.
Then, the lead frame to which the pellets are bonded is sent to the storage section 9 by the carrying means 6. After that, when the transportation of all the pellets on the wafer table 4 is completed, the used wafer ring is transported to the wafer magazine 2 by the wafer ring transportation means, and the unused wafer ring is removed from the wafer magazine 2. The wafer is transferred onto the wafer table 4 and the above operation is repeated.

[0006]

However, in the above apparatus, a dedicated wafer ring transfer means 3 is provided to transfer a wafer ring (not shown) between the magazine 2 and the wafer table 4, and the collet 8 is moved. A dedicated bonding head is provided for this purpose. That is, one moving mechanism is provided for one operating means. Therefore, various mechanisms are densely packed in the limited space of the bonding apparatus 1, and as a result, the bonding apparatus 1 becomes complicated and the maintainability is deteriorated, and the apparatus itself becomes large and heavy. In addition, dedicated control means is required for each moving mechanism, which complicates control.

It is an object of the present invention to provide a compact and lightweight semiconductor pellet bonding apparatus which has a simple mechanism and is highly maintainable.

[0008]

According to the present invention, a semiconductor pellet supply table on which a semiconductor pellet group is placed, a semiconductor pellet group that holds the semiconductor pellet group, and the semiconductor pellet group is carried in and out of the supply table. Loading / unloading means, a transfer collet that moves onto a predetermined semiconductor pellet in the semiconductor pellet group and bonds the semiconductor pellet onto a lead frame, and the transfer collet and the loading / unloading means in the longitudinal direction of the lead frame. It is characterized by having first moving means for moving and second moving means for moving the transfer collet and the carry-in / carry-out means in a direction orthogonal to the moving direction of the first moving means.

[0009]

According to the present invention, carrying-in / carrying-out means for carrying in and carrying out a conductor pellet group to and from a semiconductor pellet supply table, and moving to a predetermined semiconductor pellet in the conductor pellet group on the semiconductor pellet supply table, A transfer collet for taking out the semiconductor pellet and bonding it onto a lead frame is moved by a first moving means for moving in the longitudinal direction of the lead frame and a second moving means for moving in a direction orthogonal to the moving direction of the first moving means. Since the moving means is supported by the moving means, the moving means is shared by the carrying-in / carrying-out means and the transfer collet, so that the apparatus can be simplified, and therefore maintainability is improved, and the size and weight are reduced. Is possible.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to FIGS.

FIG. 1 is a plan view showing the structure of a semiconductor pellet bonding apparatus according to the present invention. FIG. 2 shows A of FIG.
FIG. FIG. 3 is a front sectional view showing the operation of the semiconductor pellet bonding apparatus of the present invention.

In the figure, a semiconductor pellet bonding apparatus 10 is provided with a lead frame supply unit 11 (not shown), a transfer unit 12 for transferring the lead frame supplied from the supply unit 11, and a downstream side of the transfer unit 12. An accommodating portion 13 for accommodating the lead frame, a wafer ring supply means 14 provided adjacent to the transfer rail, a feed claw 15, a transfer collet 16 and a camera 17 of the lead frame, and a wafer ring chuck 1 for retaining the wafer ring.
8 (hereinafter referred to as chuck 18) is configured to have a moving mechanism 19 having a configuration to be described later.

The supply unit 11 has a stacker 20 in which lead frames arranged in parallel in the width direction of the conveying means 12 are housed in a stack, a reject space 21 in which a defective lead frame is housed, and one end of which is supported in a horizontal state. A guide bar 2 supported by 22 and provided across the transport means 12, stacker 20 and reject space 21.
3, a movable element 24 supported in the guide rod 23 and screwed with a ball screw (not shown) that is rotated by the drive of the pulse motor M1, and is movable along the guide rod 23 by the rotation of the ball screw. It has a suction nozzle 25 that is supported by the mover 24 and is screwed into a ball screw (not shown) that is rotated by the drive of the pulse motor M2 and that can be raised and lowered by the rotation of this ball screw. Further, the moving element 24 is equipped with a suction nozzle 25 and a syringe 26 for applying paste onto the island of the lead frame.

The storage unit 13 has a magazine 27 that can store lead frames in a stacked state, an elevating mechanism 28 that holds the magazine 27 up and down, and leads that are extruded from the elevating mechanism 28 by an extruding means (not shown). It has a magazine stacker 29 on which a full magazine 27 containing a frame is placed.

The wafer ring supply means 14 has a wafer table 30 and a wafer storage section 31. The wafer table 30 includes an annular base 32 having an opening in the center and a base 32.
It has substantially the same shape as that of the base 3
An enlargement table 35 which is rotatably mounted on the table 2 and is rotatable by transmitting the drive of the motor M3 by a belt 34;
Air having a hole portion 36 that loosely fits into the conical portion 33 of the enlargement table 35 and a groove portion 38 that supports the wafer ring 37 is formed. A wafer ring retainer 40 that can be raised and lowered by a cylinder 39, and a push-up guide 41 that is located in the opening of the base 32.
And a push-up unit 44 having a push-up needle 43 that moves relative to the push-up guide 41 by rotation of the cam 42.
And have. Further, the wafer storage unit 31 has a storage groove for the wafer ring 37, and a wafer magazine 45 for storing the wafer rings 37 in which semiconductor pellets P (hereinafter referred to as pellets P) group are placed in the storage groove in a stacked state. When,
An elevating mechanism 46 that holds the magazine 45 so that it can move up and down, and can position a predetermined wafer ring 37 storage groove in the magazine 45 at the transfer level, and a transfer level of the wafer ring 37 on the side opposite to the wafer table 30. The wafer ring 37 positioned on the magazine 4
5 and a pusher 47 that pushes out from inside. A transfer rail 48 is installed at a position corresponding to the transfer level of the wafer ring 37 between the wafer table 30 and the wafer storage unit 31.

Next, the moving mechanism 19 will be described.

As described above, the moving mechanism 19 includes the feed claw 1
5, the transfer collet 16, the camera 17, and the chuck 18 are held movably in the horizontal direction, but the feed claw 15 and the chuck 18 are supported so as to be movable only in the carrying direction by the carrying means 12.

A moving guide 49 provided in parallel with the conveying means 12 and having substantially the same length as the conveying means 12 supports a movable table 50 so as to be movable in the conveying direction of the conveying means 12.
The moving table 50 is screwed with a ball screw (not shown) supported by the moving guide 49, and is moved by rotating the ball screw with a pulse motor (not shown). Then, on the moving table 50, a feed claw 15 that faces the transport means 12 and can sandwich the lead frame supplied on the transport means 12 by the upper and lower claws from above and below and extends in a direction orthogonal to the moving guide 49, A guide rod 52 supported in a horizontal state is fixed by bringing a roller (not shown) mounted at the tip end into contact with a guide rail 51 arranged in parallel with the moving guide 49. The guide rod 52 supports a mover 53 movably in the longitudinal direction of the guide rod. The mover 53 is screwed with a ball screw 54 rotatably supported by the guide rod 52, and is not shown. It is moved by rotating the ball screw 54 with a pulse motor. A transfer collet 16 that can be raised and lowered by a linear motor (not shown) and a camera 17 are attached to the mover 53. The chuck 18 is hung at a position corresponding to the center of the wafer on the guide rod 52 and can be opened and closed by an air cylinder 55.

Next, the operation will be described.

As shown in FIG. 3, first, the wafer ring supply means 14 performs the supply operation of the wafer ring 37.

When the lowermost wafer ring 37 in the magazine 45 is positioned at the transfer level by the elevating mechanism 46 (FIG. 3A), the air cylinder 39 is operated to raise the wafer ring holder 40. At this time, the stroke of the air cylinder 39 is set in advance so that the groove portion 38 of the raised wafer ring retainer 40 coincides with the transfer level (FIG. 3B). Next, the movable table 50 is moved by driving a pulse motor (not shown), and the chuck 18 is moved to just before the magazine 41. When the movement of the chuck 18 is completed, the air cylinder 55 operates and the chuck 18
Is opened, and the lowermost wafer ring 37 is pushed out to the clamp position of the chuck 18 in the opened state by the operation of the pusher 47. Then, the chuck 18 is closed by the operation of the air cylinder 55, and the wafer ring 37 is held (FIG. 3C). Next, the movable table 50 moves,
The wafer ring 37 held by the chuck 18 is transferred into the groove 38 of the wafer ring retainer 40 via the transfer rail 48 and positioned (FIG. 3D). Here, since the movable table 50 is moved by driving a pulse motor (not shown), the chuck 18 can be accurately stopped at a predetermined position, and therefore the wafer ring 37 relative to the wafer table 30 can be simply moved by the chuck 18. Positioning can be performed. After that, the chuck 18 is opened by the operation of the air cylinder 55, the movable table 50 is operated, and the chuck 18 is retracted to the outside of the wafer table 30. Then, the operation of the air cylinder 39 lowers the wafer ring retainer 40 to fix the wafer ring 37, whereby the supply operation of the wafer ring 37 is completed.

Next, the supply unit 11 performs a lead frame supply operation.

The suction nozzle 25 has pulse motors M1 and M2.
Is moved to the top of the stacker 20 by the drive of and the lower part is moved down onto the lead frame in the stacker 20. When the contact of the suction nozzle 25 with the lead frame is detected by a detection means (not shown), a negative pressure is generated in the suction nozzle 25 by the vacuum device connected to the suction nozzle 25, and this negative pressure causes Lead frame is suction nozzle 2
Adsorbed on 5. After that, the suction nozzles 25 are moved onto the conveying means 12 by driving the pulse motors M1 and M2,
The negative pressure is released and the lead frame is placed on the carrier.

Next, the bonding operation of the semiconductor pellet P is performed.

When the lead frame is supplied, the moving table 50
Is moved to move the clamper 15 to the lead frame and hold the lead frame. Next, the clamper 15 is intermittently moved for each island pitch of the lead frame, and is sequentially positioned at the paste application position by the syringe 26 from the island at the head position of the lead frame, and the paste is applied onto the island. Then, the lead frame on which the paste has been applied is collectively transported onto a bonding stage (not shown) by the movement of the clamper 15. When the lead frame is conveyed onto the bonding stage, the posture of the pellet P on the wafer table 30 is recognized by the camera 17. Then, the transfer collet 16 moves onto the pellet P whose posture is recognized by the camera 17 and picks up the pellet P. At this time, the push-up unit 44 moves together with the transfer collet 16, and the push-up needle 43 is moved up in synchronization with the pickup of the pellet P by the transfer collet 16 to push up the pellet P. Transfer collet 16 that picks up pellets P
Moves to the island at the head position of the lead frame and bonds the pellet P. The above operation is repeated until the bonding of the pellet P is completed on all the islands in the positioned lead frame.

Thereafter, the accommodating portion 13 performs the accommodating operation of the lead frame.

The lead frame in which the bonding of the pellet P is completed is held by the clamper 15 and held in the magazine 27.
Be transported to. At this time, the magazine 27 has the lifting mechanism 2
The lowest storage unit is held at a position corresponding to the carrying level of the carrying means 12 by 8. Magazine 27
When the lead frames are stored therein, the elevating mechanism 28 descends for each lead frame storage pitch in the magazine 27, and sequentially stores the lead frames in the magazine 27. When the lead frames have been stored in all the storage units in the magazine 27, the elevating mechanism 28 descends to the ejection level of the magazine stacker 29, and the magazine 27 held by the elevating mechanism 28 is magazined by a pusher (not shown). The sheet is discharged onto the stacker 29.

Next, the case of replacing the wafer ring 37 on the wafer table 30 will be described.

The chuck 18 retracts from the wafer table 30 by the operation of the moving table 50, and the wafer ring retainer 40 rises by the operation of the air cylinder 39. Next, the chuck 18 is operated by the operation of the air cylinder 55.
Is opened, the chuck 18 moves to the holding position of the wafer ring. The wafer ring 37 is held by the chuck by the operation of the air cylinder 55. The chuck 18 holding the wafer ring 37 moves to the magazine 41 and stops immediately before the magazine 41. At this time, the wafer ring 37 passes through the carrier rail 48 and is fed into the magazine 41 whose empty storage portion is previously positioned at the carrier level. Next, the chuck 18 is opened by the operation of the air cylinder 55, and is retracted by a predetermined amount toward the wafer table 30. At this position, the chuck 18 is closed by the operation of the air cylinder 55. Then, the chuck 18 again moves to immediately before the magazine 41, and the wafer ring 3
The tip of the chuck 18 is brought into contact with 7, and the wafer ring 37 is completely pushed into the magazine 41. After that, the lifting means 4
6, the used wafer ring 37 positions the unused wafer ring 37 stored above the storage position at the transfer level. Then, the unused wafer ring 37 is transferred to the wafer stage 30 by the same operation as described with reference to FIG.

According to the above embodiment, the moving mechanism 19 of the transfer collet 16 is provided with the chuck 18 for transferring the wafer ring 37 between the wafer table 30 and the wafer ring magazine 41. Since it is not necessary to provide it, and therefore an extra moving mechanism can be omitted, the bonding apparatus 10 can be simplified, maintainability can be improved, and the bonding apparatus 10 itself can be reduced in size and weight. .

Further, since a plurality of operating means are moved by one moving mechanism 19, the control means for moving the operating means is unified and the control means can be simplified.

Although the wafer ring chuck 18 is attached to the guide rod 52 in the above-described embodiment, the wafer ring chuck 18 may be attached to the moving element 53.

Further, although the guide rod 52 is provided on the movable table 50 which can be moved by the moving guide 40 parallel to the conveying direction of the conveying means 12, it has been described above. A moving guide may be provided, and a guide bar that is orthogonal to the moving guide may be provided on a moving base that is movable on the moving guide. In this case, the wafer ring chuck 18 is mounted on a mover movably provided on the guide rod.

[0034]

According to the present invention, the maintainability of the semiconductor pellet bonding apparatus can be improved, and the size and weight can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view showing the configuration of a semiconductor pellet bonding apparatus of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a front sectional view showing the operation of the semiconductor pellet bonding apparatus of the present invention.

FIG. 4 is a plan view showing a configuration of a conventional semiconductor pellet bonding apparatus.

[Explanation of symbols]

 10 Semiconductor Pellet Bonding Device 11 Supplying Part 12 Conveying Means 13 Storage Part 14 Wafer Ring Supplying Means 15 Feeding Claw 16 Transfer Collet 18 Chuck 19 Moving Mechanism 49 Moving Guide 50 Moving Stand 51 Guide Rail 52 Guide Rod 53 Moving Element 54 Ball Screw 55 Air Cylinder

Claims (1)

[Claims] 1. A semiconductor pellet supply table on which a semiconductor pellet group is placed, a carry-in / carry-out means for holding the semiconductor pellet group, and carrying the semiconductor pellet group into and out of the supply table, and the semiconductor pellet. A transfer collet that moves onto a predetermined semiconductor pellet in the group and takes out the semiconductor pellet and bonds it onto a lead frame; and a first moving means that moves the transfer collet and the carry-in / carry-out means in the longitudinal direction of the lead frame. A second moving means for moving the transfer collet and the carry-in / carry-out means in a direction orthogonal to the moving direction of the first moving means.