JPH0617686Y2 - Thermocompression bonding tool for plastic sheets - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention is a tool for thermocompressing and joining plastic sheets (such as vinyl chloride, nylon and polyester), especially carrier tapes and seal tapes used for packaging electronic parts ( The present invention relates to a thermocompression bonding tool used for resealing work with (top tape).

[Prior Art] Conventionally, a carrier tape is sealed by a taping device. However, when the seal is partially peeled such as when the seal is peeled off or when parts are replaced, re-seal is expensive as a dedicated stationary type. It was set on the corrector or taping device and resealing work was performed.

[Problems to be solved by the device]

In the above-mentioned conventional method, even when re-sealing several mm to several cm, peel off the seal by taping appearance inspection or temporarily fix the peeled part with adhesive tape so that parts do not fall off, then, I had to set the corrector and remove the adhesive tape to perform the re-sealing work, but it had the disadvantage of requiring a lot of work, and had the problem that productivity would be poor unless a large amount of expensive correctors were purchased. .

An object of the present invention is to provide a thermocompression-bonding tool for a plastic sheet that solves the above problems.

[Differences from the Prior Art of Invention]

While the conventional carrier tape repair device described above uses an electric heater as a heat source, the present invention has a difference in that the heat generated by a transistor (semiconductor) is used.

[Means for Solving the Problems]

To achieve the above object, in a thermocompression bonding tool for a plastic sheet according to the present invention, a heat radiating plate and a receiving plate for thermocompressing the plastic sheet and a leaf spring for applying a constant pressure between the heat radiating plate and the receiving plate during thermocompression bonding. A transistor having a stopper and a heat source of the heat dissipation plate, the temperature of which is controlled by a temperature sensor, is used.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

1 (a) and 1 (b) are views showing an embodiment of the present invention.

In the drawing, an arm 1b is pivotally supported around a pin 1c on a base 1a so that the arm 1b can be opened and closed, and a heat radiating plate 8 for thermocompression bonding and a receiving plate 3 are disposed to face each other at the tips of the base 1a and the arm 1b. The transistor 2 is attached to the plate 8 and the receiving plate 3 is held by the plate spring 6. A coil spring 4 is stretched between the base 1a and the arm 1b, and a stopper 5 for limiting the position of the arm 1b is provided.

The transistor 2 is always kept at a constant temperature by an external controller 9 and has a temperature sensor 7. Further, the transistor 2 is fixed to the arm 1b via a heat buffer material, and the heat radiating plate 8 thereof directly serves as a heat source (heater chip).

FIG. 1 (b) shows a state in which the thermocompression bonding tool is manually closed. When the thermocompression bonding tool is closed, the closing angle of the arm 1b of the thermocompression bonding tool is limited by the stopper 5 with respect to the base 1a.
The heat dissipation plate 8 of the transistor 2 is received by the receiving plate 3, and the receiving plate 3 is given a constant tension by the leaf spring 6.

Next, the operation of the carrier tape thermocompression bonding tool will be described.

The transistor 2 of the heat source supplies a constant current by the constant current circuit of the external controller 9 to prevent thermal runaway, and controls the temperature by bringing the temperature sensor 7 into contact with the transistor 2 as shown in FIG.

A carrier tape 10 and a seal tape 11 to be thermocompression-bonded (re-sealed) between the heat sink 8 and the receiving plate 3 of the transistor 2 kept at this constant temperature are as shown in FIGS. 1 (b) and 2. When sandwiched, the arm 1b of the thermocompression bonding tool stops at the stopper 5.
The closing angle is limited by the carrier tape 10 and the seal tape 11 sandwiched between the heat sink 8 of the transistor 2 and the receiving plate 3.
Is applied with a leaf spring 6.

Through this series of operations, the carrier tape 10 and the seal tape 11
The pressure applied to is constant, and uniform thermocompression bonding (resealing) can be obtained by combining with a temperature-controlled heat source. By using a transistor as a heat source as in the embodiment, a compact thermocompression bonding tool which can be operated by one hand can be obtained.

Since the present invention is a thermocompression bonding tool for plastic sheets,
Needless to say, this tool can be used as it is for stopping bags such as vinyl bags and is not limited to resealing work of carrier tapes, and its utility value is great.

[Effect of device]

As described above, the present invention makes it possible to easily perform thermocompression bonding of a plastic sheet such as a carrier tape, and by using a transistor, it is compact and saves space.
Long life, low power consumption, low running cost,
Since the price of the main unit can be made much lower than before, it has the effect of reducing capital investment.

[Brief description of drawings]

FIG. 1 (a) is a side view showing an embodiment of the present invention, and FIG. 1 (b) is a side view.
Is a side view showing a state in which the thermocompression bonding tool is closed, and FIG. 2 is a front view of the same. 1 ... Thermocompression bonding tool, 2 ... Transistor 3 ... Receiving plate, 4 ... Spring 5 ... Stopper, 6 ... Leaf spring 7 ... Temperature sensor, 8 ... Heat sink 9 ... Controller, 10 ... Carrier tape 11 …… Seal tape

Claims (1)

[Scope of utility model registration request] 1. A heat-dissipating plate and a receiving plate for thermocompression-bonding a plastic sheet, and a leaf spring and a stopper for applying a constant pressure between the heat-dissipating plate and the receiving plate at the time of thermo-compression bonding. A thermocompression bonding tool for plastic sheets, which uses a transistor with temperature control.