JPH06163224A - Composition for bond magnet and bond magnet - Google Patents

Abstract

PURPOSE:To increase the mechanical strength by a method wherein a composition for bond magnet contains an epoxy resin and specific additive compound which is solid at specific temperature, a resin binder containing bismalein imide thoriazine resin which is solid at specific temperature as well as magnetic particles having specific anisotropical magnetic field. CONSTITUTION:This composition for bond magnetic contains an epoxy resin which is solid at 25 deg.C, fluorine containing organic compound, isocyanuric acid ester, organic compound expressed by formula I (where R1 represents acyl radical containing olefin unsaturated coupling, R2 represents alkylene radical or alkenylene radical, Ar represents hydrogen atoms or allyl radical), a vinyl benzyl compound which is solid at 25 deg.C expressed by formula II, organosiloxane having reactive radical at both ends expressed by formula III (where R3, R5 represent alkyl radical or cycloalkyl radical, R4 represents reactive organic radical), resin binder, etc., containing bismalein imide/thoriazine resin as well as the magnetic particles having anisotropical magnetic field exceeding 50kOe.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition which gives a bonded magnet excellent in magnetic properties and bending strength.

[0002]

2. Description of the Related Art Rare earth-based permanent magnets are being applied in a wide range of fields such as general home appliances, communication / audio equipment, medical equipment, and general industrial equipment due to their excellent magnetic properties. Among them, the bond-type magnet is made by mixing magnetic powder with a resin binder and press-molding, so (1) dimensional accuracy is high and it can be molded into a complicated shape compared to a sintered-type magnet. , (2) High uniformity of quality and performance, (3) Good yield, good machinability, etc.

However, if the compounding ratio of the resin binder is increased in order to increase the mechanical strength of the obtained bonded magnet, for example, the bending strength, the ratio of the magnetic powder decreases correspondingly, so that the magnetic characteristics of the bonded magnet deteriorate. There is. On the other hand, in recent years, bond magnets used in small motors, audio equipment, OA equipment, etc. have high magnetic properties due to the demand for downsizing of equipment, and also have excellent mechanical strength, especially bending strength, which does not cause cracks or chips during assembly. What is required is required.

In order to satisfy such conflicting requirements of improving the magnetic properties and the mechanical strength of the magnet, it has been proposed to perform press molding using a liquid epoxy resin as a binder at room temperature. . That is, when the epoxy resin is used, the bending strength can be maintained high even if the ratio of the resin is kept low and the magnetic characteristics of the magnet are improved.

[0005]

However, when an epoxy resin which is liquid at room temperature is used as a binder, the powder flow characteristics are remarkably deteriorated and press molding tends to be difficult.
There is another new problem that mass productivity is greatly impaired.

In view of the above circumstances, an object of the present invention is to obtain not only excellent magnetic properties and bending strength of the obtained magnet, but also good powder flow properties even if the ratio of the binder resin is kept low. And a bond magnet obtained by the composition.

[0007]

[Means for Solving the Problems] In order to achieve the above object, the present inventors have conducted various studies on resins used as binders for bond magnets. It was found that a composition was obtained, and the present invention was completed.

That is, the present invention includes (A) a solid epoxy resin at 25 ° C., (B) (b-1) a fluoroalkyl group in one molecule, and an epoxy group and / or a hydroxyl group. Fluorine organic compound; (b-2) isocyanuric acid ester obtained by substituting a hydrogen atom of at least one imino group of isocyanuric acid with an alkenyl group or an alkynyl group; (b-3) general formula (1):

[0009]

[Chemical 7] (In the formula, R ₁ is an acyl group containing an olefinic unsaturated bond, R ₂ is an alkylene group or an alkenylene group, Ar is a hydrogen atom or an aryl group, and n is 1 or 2
An organic phosphorus compound represented by the formula: (b-4) a reactive diluent having at least two epoxy groups in one molecule; (b-5) a general formula (2):

[0010]

[Chemical 8] (Wherein A is a divalent organic group); (b-6) Epoxystyrene; (b-7) Epoxy resin having a polysulfide bond in the main chain; (b-8) General formula (3):

[0011]

[Chemical 9] (Here, R ₃ and R ₅ may be the same or different,
An alkyl group or a cycloalkyl group, R ₄ is a reactive organic group, and n is an average number of 0 to 20), and an organosiloxane having a reactive group at both terminals;
And (b-9) general formula (4): R _6- (X _a -Y _b -Z _c ) _n -R ₇ (4) (In the formula, R ₆ and R ₇ may be the same or different, A glycidyloxyalkyl group, a hydroxyl group or a hydroxyalkyl group; a and b are integers of 0 or more and a + b ≠ 0
And c and n are positive integers; when X is plural, they may be the same or different, and the formula (5):

[0012]

[Chemical 10] Alternatively, it is a group represented by the formula (6): —CH ₂ —CH═CH—CH ₂ — (6), and Y is Y when there are plural groups.
May be the same or different, and formula (7):

[0013]

[Chemical 11] Or, formula (8):

[0014]

[Chemical 12] Z is a group represented by the formula (9): —CH ₂ —CH═CH—CH ₂ — (9), and X, Y and Z are randomly arranged. Good. ), At least one compound selected from the group consisting of polybutadiene, and (C) a resin binder containing a bismaleimide / triazine resin solid at 25 ° C. and an anisotropic magnetic field of 50
The present invention provides a composition for a bonded magnet containing a magnetic powder of kOe or more. Furthermore, the present invention provides a bond magnet obtained by curing the composition for a bond magnet. Hereinafter, the present invention will be described in detail.

Magnetic Powder The magnetic powder used in the present invention has an anisotropic magnetic field (H _A ) of
Any magnetic powder of 50 kOe or more can be used without particular limitation. Therefore, as long as this condition is satisfied, it is possible to use a magnetic powder that is usually used in bonded magnets, for example, rare earth cobalt-based such as SmCo ₅ , Sm ₂ (CoFeZrV) ₁₇ ,
Rare earths such as Nd-Fe-Co-B system, Nd-Dy-Fe-B system, Nd-Fe-B system-iron-boron system, Sm-Fe-N system, Nd-Fe-Ti-
Examples include magnetic powders such as N type and Nd-Fe-VN type.

When the magnetic powder is the rare earth-iron-boron system exemplified above, it is particularly preferable to use the alloy powder by the liquid quenching method. That is, according to the liquid quenching method, the alloy of the required composition is melted by a method such as high frequency induction heating, and the resulting molten metal is sprayed onto a high-speed rotating copper or aluminum roll to be rapidly cooled to a thickness of several tens of microns. It is a ribbon. Magnetic powder is obtained by subjecting this ribbon to an appropriate heat treatment to reduce the average crystal grain size to 3000 liters or less, and then subjecting it to dry or wet pulverization with a stamp mill, ball mill or the like. Generally, the particle size of the magnet powder is preferably 35 mesh (JIS) or less.

The epoxy resin as the resin binder (A) can be used without any limitation as long as it is solid at 25 ° C., for example, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin. , Linear aliphatic epoxide type epoxy resin, aliphatic epoxide type epoxy resin and the like, and these may be used alone or in combination of two or more kinds.

The amount of the epoxy resin (A) compounded in the resin binder is usually 5 to 50% by weight, preferably 10 to 30% by weight, and it is difficult to obtain sufficient bending strength if the amount is too small or too large.

The compound used as the component (B) will be described below. (b-1) Fluorine-containing organic compound The fluoroalkyl group contained in the fluorine-containing organic compound preferably has 1 to 20 carbon atoms. In addition, a part of the hydrogen atoms of the corresponding alkyl group may be replaced with fluorine atoms or all the hydrogen atoms may be replaced,
A perfluoroalkyl group in which all hydrogen atoms are substituted is preferred. Further, the fluorine compound needs to have at least one of an epoxy group and a hydroxyl group. Examples of such a fluorine-containing organic compound include 3- (2-perfluorohexyl) ethoxy-1,2-dihydroxypropane, N
-N-propyl-N-2,3-dihydroxypropyl perfluorooctyl sulfonamide, 3- (2-perfluorohexyl) ethoxy-1,2-epoxypropane, N
-N-propyl-n-2,3-epoxypropyl perfluorooctylsulfonamide and the like are mentioned, and these are
They can be used alone or in combination of two or more.

(B-2) Isocyanuric acid ester The organic group of the ester moiety of isocyanuric acid ester is, for example, an alkenyl group such as vinyl, propenyl, butenyl, pentenyl, an alkynyl group such as ethynyl, an arylalkenyl such as styryl and cinnamyl. Groups and the like. Specific examples of the isocyanuric acid ester include mono-, di-, triallyl isocyanurate, mono-, di-, trimetallyl isocyanurate, mono-, di-, trivinyl isocyanurate, mono-, di-, tri-. 1-
Propenyl isocyanurate, mono-, di-, triisopropenyl isocyanurate, mono-, di-, tri-1
-Butenyl isocyanurate, mono-, di-, tri-2
-Butenyl isocyanurate, mono-, di-, tripentene isocyanurate, mono-, di-, triethynyl isocyanurate, mono-, di-, tristyryl isocyanurate, mono-, di-, tricinnamyl isocyanurate, etc. Is mentioned. These can be used alone or in combination of two or more.

(B-3) Organophosphorus Compound In the general formula (1) representing an organophosphorus compound, examples of the acyl group R ₁ containing an olefinic unsaturated bond include an acryloyl group, a methacryloyl group, a cinnamoyl group, and oleoyl. Examples of the alkylene group represented by R ₂ include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group and a heptylene group, and examples of the alkenylene group include a propenylene group and a vinylene group. Examples of the aryl group represented by include a phenyl group, a tolyl group, a xylyl group, and a naphthyl group.

Specific examples of the organic phosphorus compound include mono (2-acryloyloxyethyl) dihydrogen phosphate and mono (2-methacryloyloxyethyl).
Dihydrogen phosphate, di (2-acryloyloxyethyl) monohydrogen phosphate, di (2-methacryloyloxyethyl) monohydrogen phosphate, diphenyl (2-acryloyloxyethyl) phosphate, diphenyl (2-methacryloyloxyethyl) phosphate And the like. These can be used alone or in combination of two or more. Examples of the organophosphorus compound include AR-100, AR-200, MR-100, MR- under trade names from Daihachi Chemical Industry Co., Ltd.
You may use what is marketed by 200, AR-260, and MR-260.

(B-4) Reactive Diluent The reactive diluent can be used without particular limitation as long as it has at least two epoxy groups in one molecule. Examples of such reactive diluents include cyclohexanedimethanol diglycidyl ether, trimethylolethane triglycidyl ether, trimethylolpropane triglycidyl ether, aliphatic polyol polyglycidyl ether, polyglycol diepoxide, castor oil polyglycidyl ether. , 1,4
-Butanediol diglycidyl ether and the like,
These can be used alone or in combination of two or more.

(B-5) Vinylbenzyl Compound The vinylbenzyl compound represented by the general formula (2) is characterized by having vinylbenzyl groups at both ends in one molecule. As the methylene group, an alkylene group such as an ethylene group, a phenylene group, a naphthylene group, a divalent carbon hydrogen group such as an arylene group such as a phenanthrylene group,
Divalent ether groups such as methylenedioxy group and ethylenedioxy group, divalent acyl groups such as malonyl group, glutaryl group and phthalosol group, divalent groups such as imino group, hydrazo group, azoxy group and ureyl group. Examples thereof include nitrogen organic groups and the like, or mixtures thereof.

(B-6) Epoxy Styrene Epoxy styrene can be used without particular limitation as long as it has a purity of 85% by weight or more.

(B-7) Polysulfide bond-containing epoxy
As the epoxy resin having a polysulfide bond (-(S) _n- , n is an integer of 2 or more) in the resin main chain, one produced by a known polymerization method can be used, and for example, Toraythiocol Flep 10, Flep 5 manufactured by KK
Commercially available products such as 0 and Flep 60 (trade name) can be used.

(B-8) Organosiloxane Alkyl group R contained in the organosiloxane of the general formula (3)
Examples of R ₃ and R ₅ include a methyl group, ethyl group, propyl group, butyl group, etc., examples of the cycloalkyl group include cyclohexyl group, and examples of the reactive organic group R ₄ include glycidyl ether group. , Vinyl group, methacryloxy group, halogen group, alkoxy group, amide group,
Imide group, carboxyl group, amino group, ester group, etc.,
Further, an organic group such as a methacryloxy group, a vinylbenzyl group, a hydroxyphenyl group, an epoxidized cyclohexyl group, or an alicyclic epoxy group having these reactive groups can be mentioned. N in the formula is a number of 0 to 20, preferably 4 to 10
Is the range. These organosiloxanes may be used either individually or in combination of two or more.

(B-9) Polybutadiene Polybutadiene can be used without particular limitation as long as it is a compound represented by the above formula (4), but in order to obtain a better bending strength or a resin is used in the composition. In order to facilitate uniform dispersion in the above, it is preferable that in formula (4), 500 ≦ n ≦ 4000 and the epoxy equivalent is 200 or more.
These can be used alone or in combination of two or more. The polybutadiene can be produced by a known polymerization method, and can be produced by Denarex R-45EPI.
, Which are commercially available under the trade names such as Denalex R-45EPT (manufactured by Nagase & Co., Ltd.) can be used. The compound (b-
1) to (b-9) can be used alone or in combination of two or more.

The blending amount of the component (B) is the epoxy resin (A) 1
Generally, 0.2 to 600 parts by weight is preferable per 00 parts by weight. However, if the component (B) is not solid at 25 ° C, 0.2
-100 parts by weight is preferred. If the blending amount of the component (B) is too small, sufficient bending strength cannot be obtained, and if it is too large, heat resistance and bending strength are remarkably lowered.

The bismaleimide / triazine resin as the component (C) is known as a kind of thermosetting polyimide resin having an imide group in the molecule and containing two components of bismaleimides and triazines as main components. This resin may be solid or liquid at 25 ° C., but in the present invention, the solid one is used as it is or in the state of being dissolved in a solvent such as methyl ethyl ketone or dimethylformamide.

As such a bismaleimide / triazine resin, for example, that sold under the trade name BT resin by Mitsubishi Gas Chemical Co., Inc. may be used. (C) component is (A)
40 to 2,000 parts by weight per 100 parts by weight of the ingredient. If the component (C) is too little or too much, sufficient bending strength cannot be obtained. The content of the binder resin in the composition of the present invention is preferably 0.5 to 5 parts by weight per 100 parts by weight of the magnetic powder,
Furthermore, 1 to 3 parts by weight is more preferable.

Other Components In addition to the above magnetic powder and binder resin, the composition for bonded magnets of the present invention may be a known Si-based, Ti-based or
An Al-based coupling agent, a resin curing agent, a curing accelerator (curing catalyst), etc. can be added alone or in combination. Examples of Si-based, Ti-based, and Al-based coupling agents include vinyltriethoxysilane, γ-aminopropyltriethoxysilane, N- (β-aminoethyl) -γ-aminopropyltrimethoxysilane, and N-
(Β-aminoethyl) -γ-aminopropylmethyldimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane,
γ-glycidoxypropylmethyldimethoxysilane, γ
-Methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, isopropyltriisostearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate,
Isopropyltri (N-aminoethyl-aminoethyl)
Typical examples include titanate, tetraoctyl bis (ditridecyl phosphite) titanate, isopropyl trioctanoyl titanate, isopropyl dimethacrylisostearoyl titanate, isopropyl tridecyl benzene sulfonyl titanate and acetoalkoxy aluminum diisopropylate. By mixing these by a dry method, a wet method, an integral blending method, or the like, the adhesion of the obtained bonded magnet to the substrate can be improved. As the resin curing agent, for example, a single polyamine type curing agent, a modified polyamine type curing agent, an acid anhydride type curing agent, a polyphenol type curing agent, a polymercaptan type curing agent, an anionic polymerization type curing agent, a cationic polymerization type A hardening agent etc. are mentioned. As the curing accelerator, tertiary amines, imidazoles,
Examples thereof include organic metal salts, chlorides and organic peroxides. Two or more kinds of resin curing agents and curing accelerators may be used in combination as required.

Preparation of Composition The composition of the present invention is obtained by mixing the required components. The mixing method is not particularly limited, and for example, a wet method for dissolving the above resin and other organic components in an organic solvent such as methyl ethyl ketone, mixing with magnetic powder, and then drying to obtain a composition, for example, a ribbon blender, a tumbler, and now. Any of a dry method in which required components are collectively mixed in a mixer such as a termixer, a Henschel mixer, or a super mixer may be used. The composition thus obtained is in the form of powder having high fluidity.

Manufacture of Bonded Magnet In the manufacture of a magnet, the composition obtained is press-molded by various compression-molding devices and then heat-treated to cure the binder resin. After that, a bonded magnet is obtained by magnetizing in a magnetic field. Press molding of the composition is usually 4
It carried out under a pressure of ~8t / cm ^2, curing of the binder resin 1
It may be heated at a temperature of about 20 to 190 ° C for about 0.5 to 3 hours.

Uses The bond magnet obtained by curing the composition of the present invention is useful in a wide range of fields including general home appliances, communication equipment, audio equipment, medical equipment, and general industrial equipment.

[0036]

The binder resin used in the composition of the present invention comprises an epoxy resin (A), an additive (B) and a bismaleimide / triazine resin (C), each of which is used alone. Compared with the case, a higher cross-linking ratio is obtained when cured, and the adhesive strength between the magnetic powder and the resin layer is significantly increased, so it is considered that excellent bending strength can be obtained with a resin amount smaller than the conventional resin amount. To be Further, both of the resins (A) and (C) are solid at 25 ° C, and some of the organic compounds (B) are liquid at 25 ° C, but the composition is still not tacky. , Shows good powder flowability.

[0037]

EXAMPLES The present invention will be described in more detail with reference to examples.

Materials The materials used in the following examples are as follows. Magnetic powder Magnetic powder I: Nd-Fe-B type magnetic powder (trade name: MQP-B, manufactured by General Motors, USA), anisotropic magnetic field: 70.4 kOe Magnetic powder II: SmCo ₅ type magnetic powder (trade name: RCo ₅ alloy, Sumitomo Metal Mining Co., Ltd., anisotropic magnetic field: 246 kOe, average particle size
10 μm

Epoxy Resin Epoxy Resin I: Cresol novolac type epoxy resin, solid at 25 ° C. (trade name: EOCN-1025, manufactured by Nippon Kayaku Co., Ltd.) Epoxy Resin II: phenol novolac type epoxy resin, solid at 25 ° C. (product Name: EPPN-201, manufactured by Nippon Kayaku Co., Ltd.) Epoxy resin III: Bisphenol A type epoxy resin,
Solid at 25 ° C (trade name: Epicoat 1001, made by Yuka Shell Epoxy Co., Ltd.) Epoxy resin IV: Bisphenol A type epoxy resin, 25
Liquid at ℃ (trade name: Epikote 828, Yuka Shell Epoxy Co., Ltd.)

Bismaleimide / triazine resin BT resin I: solid at 25 ° C. (trade name: BT-2100, manufactured by Mitsubishi Gas Chemical Co., Inc.) BT resin II: solid at 25 ° C. (trade name: BT-2170, Mitsubishi Gas Co., Ltd.) Chemical Co., Ltd. BT resin III: Solid at 25 ° C (trade name: BT-4480, manufactured by Mitsubishi Gas Chemical Co., Inc.) BT resin IV: Liquid at 25 ° C (trade name: BT-3109, Mitsubishi Gas Chemical ( Co., Ltd.)

-(1) Fluorine-containing organic compound Nn-propyl-n-2,3-epoxypropyl perfluorooctyl sulfonamide (MF-130, manufactured by Tochem Products Co., Ltd.)

-(2) Isocyanuric acid ester triallyl isocyanurate (trade name: TAIC, manufactured by Nippon Kasei Co., Ltd.)

-(3) Organophosphorus compound Organophosphorus compound I: Diphenyl (2-acryloyloxyethyl) phosphate (trade name: AR-260, manufactured by Daihachi Chemical Industry Co., Ltd.) Organophosphorus compound II: Mono (2- Mixture of acryloyloxyethyl) dihydrogen phosphate and di (2-acryloyloxyethyl) monohydrogen phosphate (trade name: AR-200, manufactured by Daihachi Chemical Industry Co., Ltd.)

-(4) Reactive Diluent Reactive Diluent I: Cyclohexanedimethanol diglycidyl ether (trade name: Herooxy 107, manufactured by Rhone Poulenc (France)) Reactive Diluent II: Aliphatic Polyol Polyglycidyl Ether (Product name: Heroxy 84, manufactured by Rhone Poulin (France))

-(5) Vinylbenzyl compound Vinylbenzyl compound I: trade name: V-300, manufactured by Showa Highpolymer Co., Ltd., solid at 25 ° C. Vinylbenzyl compound II ^* : trade name: V-400, manufactured by Showa Highpolymer Co., Ltd., liquid at 25 ° C.

-(6) Epoxy styrene Epoxy styrene (Merck (Germany))

-(7) Epoxy resin having polysulfide bond in the main chain Flep 10 (manufactured by Toraythiokol Co., Ltd.) Flep 50 (manufactured by Toraythiokol Co., Ltd.) Flep 60 (manufactured by Toraythiokol Co., Ltd.)

-(8) Organosiloxane Organosiloxane I: α, ω-bis (3-glycidoxypropyl) polydimethylsiloxane (the above general formula
In (3), n = 4, trade name: TSL-9946, manufactured by Toshiba Silicone Co., Ltd. Organosiloxane II: α, ω-bis (vinyl) polydimethylsiloxane (n = 4 in the general formula (3),
Product name: TSL-9646, manufactured by Toshiba Silicone Co., Ltd. Organosiloxane III: α, ω-bis (3-glycidoxypropyl) polydimethylsiloxane (the above general formula)
In (3), n = 8, trade name: TSL-9986, manufactured by Toshiba Silicone Co., Ltd.)

-(9) Glycidyl group-containing polybutadiene Trade name: Denarex R-45 EPI, manufactured by Nagase & Co., Ltd.

Hardener: Dicyandiamide However, it was used only when the binder resin did not contain a bismaleimide / triazine resin.

Curing accelerator: 3-hydroxypyridine (manufactured by Kanto Chemical Co., Inc.) However, it was used only when the binder resin did not contain a bismaleimide / triazine resin.

Preparation of Composition As shown in Tables 1 to 19, 100 parts by weight of the magnetic powder in each Example and Comparative Example was compounded with the components shown in the table in the indicated amounts. In the comparative example in which the resin content was only the epoxy resin, 3% by weight of the curing accelerator and 10% by weight of the curing agent of the epoxy resin were mixed with 10% of methyl ethyl ketone based on the total amount of the resin.
The solution was added in the state of a double diluted solution. After mixing and stirring, 30
The composition was obtained by completely evaporating methyl ethyl ketone under reduced pressure (10 ^-1 Torr) at ℃. The powder flow characteristics of each composition were evaluated as follows. The results are shown in Tables 1 to 19.

Evaluation of powder flow characteristics : Composition of the mold (outer diameter
20mmφ, inner diameter 18mmφ, depth 35mm)
The amount of powder in the mold was weighed. 2 or more when the amount of powder is 2g or more
Less than g was evaluated as x. In general, the compositions rated ◯ were smooth, while the compositions rated x showed tackiness that was prone to agglomeration.

The compositions obtained in the manufacture and evaluation of the magnets of the respective Examples and Comparative Examples were fed into a press mold and press-molded at a molding surface pressure of 5.7 ton / cm ² (however, with SmCo ₅ magnetism). Molding was performed in a magnetic field only when powder was used) to obtain a plate-like sample composed of a compact having a length of 80 mm, a width of 10 mm, and a thickness of 4 mm. Then, each of the plate-like samples was heat-treated in the air at 185 ° C. for 3 hours to cure the binder resin in the samples to obtain bonded magnet samples. The bending strength and magnetic properties of these samples were evaluated by the following methods. The results are shown in Tables 1 to 19.

Bending strength : Bending strength was obtained and evaluated according to ASTM D-790.

Magnetic properties : Measured at room temperature with a Thiophie type self-recording magnetometer.

[0057]

[Table 1]

[0058]

[Table 2]

[0059]

[Table 3]

[0060]

[Table 4]

[0061]

[Table 5]

[0062]

[Table 6]

[0063]

[Table 7]

[0064]

[Table 8]

[0065]

[Table 9]

[0066]

[Table 10]

[0067]

[Table 11]

[0068]

[Table 12]

[0069]

[Table 13]

[0070]

[Table 14]

[0071]

[Table 15]

[0072]

[Table 16]

[0073]

[Table 17]

[0074]

[Table 18]

[0075]

[Table 19]

[0076]

As is clear from the above description, the composition for bonded magnets of the present invention is excellent not only in the magnetic properties and bending strength of the obtained magnet but also in the powder flow properties. , Molding workability is good and high productivity can be realized,
Suitable for mass production.

Claims (3)

[Claims] 1. (A) a solid epoxy resin at 25 ° C., (B) (b-1) a fluorine-containing organic compound having a fluoroalkyl group in one molecule and having an epoxy group and / or a hydroxyl group; (b-2) Isocyanuric acid ester in which at least one hydrogen atom of an imino group of isocyanuric acid is substituted with an alkenyl group or an alkynyl group; (b-3) General formula (1): (In the formula, R ₁ is an acyl group containing an olefinic unsaturated bond, R ₂ is an alkylene group or an alkenylene group, Ar is a hydrogen atom or an aryl group, and n is 1 or 2
An organic phosphorus compound represented by the formula: (b-4) a reactive diluent having at least two epoxy groups in one molecule; (b-5) the general formula (2): A vinylbenzyl compound represented by the formula (wherein A is a divalent organic group) and solid at 25 ° C .; (b-6) epoxy styrene; (b-7) epoxy having a polysulfide bond in the main chain. Resin; (b-8) General formula (3): (Wherein R ₃ and R ₅ are alkyl groups or cycloalkyl groups which may be the same or different, R ₄ is a reactive organic group, and n is an average of 0 to 20) An organosiloxane having reactive groups at both ends; and (b-9) general formula (4): R _6- (X _a -Y _b -Z _c ) _n -R ₇ (4) (wherein R ₆ and R ₇ may be the same or different and each is a glycidyloxyalkyl group, a hydroxyl group or a hydroxyalkyl group; a and b are integers of 0 or more and a + b ≠ 0.
And c and n are positive integers; when X is plural, they may be the same or different and are represented by the formula (5): Alternatively, it is a group represented by the formula (6): —CH ₂ —CH═CH—CH ₂ — (6), and Y is Y when there are plural groups.
May be the same or different and have the formula (7): Alternatively, formula (8): Z is a group represented by the formula (9): —CH ₂ —CH═CH—CH ₂ — (9), and X, Y and Z are randomly arranged. Good. ), Polybutadiene, and at least one compound selected from the group consisting of, and (C) a resin binder containing a solid bismaleimide / triazine resin at 25 ° C. and an anisotropic magnetic field of 50
A composition for a bonded magnet, which comprises a magnetic powder of kOe or more. 2. The composition according to claim 1, wherein the resin binder is 0.2 to 60 parts by weight of component (B) per 100 parts by weight of component (A).
0 parts by weight, (C) component 40 to 2,000 parts by weight,
The resin binder is 0.5 per 100 parts by weight of the magnetic powder.
~ 5 parts by weight of the composition. 3. A bonded magnet obtained by curing the composition according to claim 1 or 2.