JPH06157626A - Cationically polymerizable and curable composition - Google Patents
Cationically polymerizable and curable compositionInfo
- Publication number
- JPH06157626A JPH06157626A JP33985392A JP33985392A JPH06157626A JP H06157626 A JPH06157626 A JP H06157626A JP 33985392 A JP33985392 A JP 33985392A JP 33985392 A JP33985392 A JP 33985392A JP H06157626 A JPH06157626 A JP H06157626A
- Authority
- JP
- Japan
- Prior art keywords
- group
- cationically polymerizable
- sulfur
- compd
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims description 21
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 19
- 239000011593 sulfur Substances 0.000 claims abstract description 19
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 7
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 125000003118 aryl group Chemical group 0.000 claims abstract description 5
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 3
- 125000003710 aryl alkyl group Chemical group 0.000 claims abstract description 3
- 125000004350 aryl cycloalkyl group Chemical group 0.000 claims abstract description 3
- 125000004391 aryl sulfonyl group Chemical group 0.000 claims abstract description 3
- 125000000732 arylene group Chemical group 0.000 claims abstract description 3
- 150000001875 compounds Chemical class 0.000 claims description 39
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 9
- 239000004480 active ingredient Substances 0.000 claims description 3
- 229910052757 nitrogen Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 125000001316 cycloalkyl alkyl group Chemical group 0.000 claims description 2
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 2
- PCLIMKBDDGJMGD-UHFFFAOYSA-N N-bromosuccinimide Chemical compound BrN1C(=O)CCC1=O PCLIMKBDDGJMGD-UHFFFAOYSA-N 0.000 abstract description 8
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000460 chlorine Substances 0.000 abstract description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract description 2
- 238000005299 abrasion Methods 0.000 abstract description 2
- 229910052801 chlorine Inorganic materials 0.000 abstract description 2
- 150000001412 amines Chemical class 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 2
- JHRWWRDRBPCWTF-OLQVQODUSA-N captafol Chemical compound C1C=CC[C@H]2C(=O)N(SC(Cl)(Cl)C(Cl)Cl)C(=O)[C@H]21 JHRWWRDRBPCWTF-OLQVQODUSA-N 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 19
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 19
- -1 aromatic diazonium salts Chemical class 0.000 description 13
- 239000000126 substance Substances 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 239000000243 solution Substances 0.000 description 11
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 238000000016 photochemical curing Methods 0.000 description 4
- GLBQVJGBPFPMMV-UHFFFAOYSA-N sulfilimine Chemical compound S=N GLBQVJGBPFPMMV-UHFFFAOYSA-N 0.000 description 4
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000002841 Lewis acid Substances 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- VDQQXEISLMTGAB-UHFFFAOYSA-N chloramine T Chemical compound [Na+].CC1=CC=C(S(=O)(=O)[N-]Cl)C=C1 VDQQXEISLMTGAB-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 150000007517 lewis acids Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 125000001010 sulfinic acid amide group Chemical group 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 229940052303 ethers for general anesthesia Drugs 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 229960000834 vinyl ether Drugs 0.000 description 2
- HIYIGPVBMDKPCR-UHFFFAOYSA-N 1,1-bis(ethenoxymethyl)cyclohexane Chemical compound C=COCC1(COC=C)CCCCC1 HIYIGPVBMDKPCR-UHFFFAOYSA-N 0.000 description 1
- ZXHDVRATSGZISC-UHFFFAOYSA-N 1,2-bis(ethenoxy)ethane Chemical compound C=COCCOC=C ZXHDVRATSGZISC-UHFFFAOYSA-N 0.000 description 1
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- LLMLGZUZTFMXSA-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzenethiol Chemical compound SC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl LLMLGZUZTFMXSA-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 125000004800 4-bromophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Br 0.000 description 1
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 1
- GJEZBVHHZQAEDB-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hexane Chemical compound C1CCC2OC21 GJEZBVHHZQAEDB-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- AHVOFPQVUVXHNL-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate Chemical compound COC(=O)C(C)=C.CCCCOC(=O)C=C AHVOFPQVUVXHNL-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000004651 carbonic acid esters Chemical class 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000004440 column chromatography Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000003997 cyclic ketones Chemical class 0.000 description 1
- 150000004294 cyclic thioethers Chemical class 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- WASQWSOJHCZDFK-UHFFFAOYSA-N diketene Chemical compound C=C1CC(=O)O1 WASQWSOJHCZDFK-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- ZKQFHRVKCYFVCN-UHFFFAOYSA-N ethoxyethane;hexane Chemical compound CCOCC.CCCCCC ZKQFHRVKCYFVCN-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 1
- 230000002070 germicidal effect Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- QFQXAVRUGZXRHM-UHFFFAOYSA-N hex-1-ene-1,6-diol Chemical compound OCCCCC=CO QFQXAVRUGZXRHM-UHFFFAOYSA-N 0.000 description 1
- KDCIHNCMPUBDKT-UHFFFAOYSA-N hexane;propan-2-one Chemical compound CC(C)=O.CCCCCC KDCIHNCMPUBDKT-UHFFFAOYSA-N 0.000 description 1
- ARZLUCYKIWYSHR-UHFFFAOYSA-N hydroxymethoxymethanol Chemical class OCOCO ARZLUCYKIWYSHR-UHFFFAOYSA-N 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical compound NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000012038 nucleophile Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- HDBWAWNLGGMZRQ-UHFFFAOYSA-N p-Vinylbiphenyl Chemical group C1=CC(C=C)=CC=C1C1=CC=CC=C1 HDBWAWNLGGMZRQ-UHFFFAOYSA-N 0.000 description 1
- 125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 125000003386 piperidinyl group Chemical group 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- HNKJADCVZUBCPG-UHFFFAOYSA-N thioanisole Chemical compound CSC1=CC=CC=C1 HNKJADCVZUBCPG-UHFFFAOYSA-N 0.000 description 1
- NBOMNTLFRHMDEZ-UHFFFAOYSA-N thiosalicylic acid Chemical compound OC(=O)C1=CC=CC=C1S NBOMNTLFRHMDEZ-UHFFFAOYSA-N 0.000 description 1
- 229940103494 thiosalicylic acid Drugs 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polyethers (AREA)
- Polymerization Catalysts (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は新規なカチオン重合硬化
性組成物、さらに詳しくは、実用的な時間内のエネルギ
ー線の照射及び/又は比較的低温で重合若しくは硬化し
うる、カチオン重合性化合物と特定の含イオウ化合物と
を有効成分として含有して成るカチオン重合硬化性組成
物に関するものである。FIELD OF THE INVENTION The present invention relates to a novel cationically polymerizable curable composition, more specifically, a cationically polymerizable compound capable of being polymerized or cured at a relatively low temperature by irradiation with energy rays within a practical period of time. And a specific sulfur-containing compound as an active ingredient.
【0002】[0002]
【従来の技術】近年、エポキシ樹脂などのカチオン重合
性化合物の光若しくは熱重合は、その硬化物の物性が優
れることから注目されている。特に、光重合性高分子材
料は、省エネルギー性、省スペース性、無公害性の観点
から、とりわけ塗料分野において注目されているもの
の、一般にエポキシ樹脂を光重合させることは困難であ
った。ところが、最近、カチオン重合用の触媒として、
ルイス酸の芳香族ジアゾニウム塩に関する報告がなされ
(英国特許第1321263号明細書、アメリカ特許第
3205157号明細書)、このものはエポキシ樹脂に
対する光重合開始剤として有用であることが報告され
た。しかしながら、この芳香族ジアゾニウム塩は光分解
によりルイス酸以外に窒素ガスを放出するため、塗膜化
した場合に、塗膜が発泡するなどの欠点を有していた。
また、ルイス酸の芳香族ヨードニウム塩や第VIA族オニ
ウム塩も同様にエポキシ樹脂のカチオン重合触媒として
有用であることが報告されている(特公昭52−142
77号公報、特公昭52−14278号公報、特開昭5
5−65219号公報、英国特許第1526923号明
細書、英国特許第1516511号明細書、英国特許第
1518141号明細書、米国特許第4069054号
明細書)。しかしながら、これらの公知のオニウム塩を
用いたエポキシ樹脂などの紫外線照射による光重合にお
いては、深部まで硬化させることが一般に困難であるた
め、より硬化性の高い開始剤の開発が強く望まれている
のが実状である。2. Description of the Related Art In recent years, photo- or thermal-polymerization of a cationically polymerizable compound such as an epoxy resin has attracted attention because of its excellent physical properties. In particular, photopolymerizable polymer materials have attracted attention especially in the field of coating materials from the viewpoints of energy saving, space saving, and pollution-free, but it is generally difficult to photopolymerize an epoxy resin. However, recently, as a catalyst for cationic polymerization,
There have been reports on aromatic diazonium salts of Lewis acids (British Patent No. 1321263, U.S. Pat. No. 3,205,157), which were reported to be useful as photopolymerization initiators for epoxy resins. However, since this aromatic diazonium salt releases nitrogen gas in addition to the Lewis acid by photolysis, it has a defect that the coating film foams when formed into a coating film.
It has also been reported that aromatic iodonium salts of Lewis acids and Group VIA onium salts are similarly useful as cationic polymerization catalysts for epoxy resins (Japanese Patent Publication No. 52-142).
77, Japanese Patent Publication No. 52-14278, and Japanese Patent Laid-Open No. 5
5-65219, British Patent No. 1526923, British Patent No. 1516511, British Patent No. 1518141, US Patent No. 4069054). However, in photopolymerization of an epoxy resin or the like using these known onium salts by ultraviolet irradiation, it is generally difficult to cure to a deep portion, and therefore the development of an initiator having higher curability is strongly desired. Is the actual situation.
【0003】[0003]
【発明が解決しようとする課題】本発明は、このような
事情のもとで、実用的な時間内のエネルギー線の照射及
び/又は比較的低温で重合硬化し、塗膜硬化に対しても
気泡が生成せず、良質な硬化塗膜を与えるカチオン重合
硬化性組成物を提供することを目的としてなされたもの
である。Under the circumstances described above, the present invention is capable of irradiating an energy ray within a practical period of time and / or polymerizing and curing at a relatively low temperature to cure a coating film. The purpose of the present invention is to provide a cationically polymerizable curable composition that does not generate bubbles and gives a cured coating film of good quality.
【0004】[0004]
【課題を解決するための手段】本発明者らは、カチオン
重合性化合物の開始剤について鋭意研究を重ねた結果、
特定の含イオウ化合物が、カチオン重合性化合物をエネ
ルギー線の照射及び/又は比較的低温下に重合させ、良
質な硬化塗膜をも与えることを見い出し、この知見に基
づいて本発明を完成するに至った。すなわち、本発明
は、(A)カチオン重合性化合物、及び(B)一般式Means for Solving the Problems As a result of intensive studies on the initiator of a cationically polymerizable compound, the present inventors have found that
It was found that a specific sulfur-containing compound polymerizes a cationically polymerizable compound under irradiation of energy rays and / or at a relatively low temperature to give a cured coating film of good quality, and based on this finding, the present invention was completed. I arrived. That is, the present invention provides (A) a cationically polymerizable compound, and (B) a general formula
【0005】[0005]
【化2】 [Chemical 2]
【0006】(式中のR1、R2及びR3は、それぞれ炭
素数1〜30のアルキル基、ハロゲン化アルキル基、ア
リール基、ハロゲン化アリール基、アリールスルホニル
基、アラルキル基、アルケニル基、シクロアルキル基、
シクロアルキルアルキル基、アリールシクロアルキル
基、アルキレン基、アリーレン基、アラルキレン基又は
オキサアルキレン基であり、それらはたがいに同一であ
ってもよいし、異なっていてもよく、Xは酸素原子又は
窒素原子、m、n及びpはそれぞれ0又は1である)で
表される含イオウ化合物を有効成分として含有して成る
カチオン重合硬化性組成物を提供するものである。(In the formula, R 1 , R 2 and R 3 are each an alkyl group having 1 to 30 carbon atoms, a halogenated alkyl group, an aryl group, a halogenated aryl group, an arylsulfonyl group, an aralkyl group, an alkenyl group, Cycloalkyl group,
A cycloalkylalkyl group, an arylcycloalkyl group, an alkylene group, an arylene group, an aralkylene group or an oxaalkylene group, which may be the same or different from each other, and X is an oxygen atom or a nitrogen atom. , M, n and p are each 0 or 1), and a cationic polymerization curable composition comprising a sulfur-containing compound represented by the formula (1) as an active ingredient.
【0007】以下、本発明を詳細に説明する。本発明組
成物において、(A)成分として用いられるカチオン重
合性化合物は、カチオン重合性モノマーや分子中にカチ
オン重合しうる官能基を有するカチオン重合性ポリマー
である。このようなものとしては、例えばビスフェノー
ルA[2,2−ビス(4−ヒドロキシフェニル)プロパ
ン]又はそのアルキレンオキシド付加体とエピクロロヒ
ドリンとの反応によって得られるグリシジルエーテル及
びエポキシノボラック樹脂;1個以上の脂環官能性基を
有する多価アルコールのポリグリシジルエーテル、シク
ロヘキセン又はシクロペンテン環含有化合物を過酸化水
素や過酸などの適当な酸化剤でエポキシ化することによ
り得られるシクロヘキセンオキシド又はシクロペンテン
オキシド含有化合物などの脂環式エポキシ樹脂;水素添
加ビスフェノールA又はそのアルキレンオキシド付加体
とエピクロロヒドリンとの反応により得られるグリシジ
ルエーテル;1,6−ヘキセンジオールのグリシジルエ
ーテル、グリセリンのトリグリシジルエーテル、ポリエ
チレングリコールのジグリシジルエーテル、ポリプロピ
レングリコールのジグリシジルエーテル、エチレングリ
コール、プロピレングリコール、グリセリンなどの脂肪
族多価アルコールに1種又は2種以上のアルキレンオキ
シド(例えばエチレンオキシド、プロピレンオキシド)
を付加させることにより得られるポリエーテルポリオー
ルのポリグリシジルエーテルなどのエポキシ化合物;ア
ルキルビニルエーテル類;ビニルエーテル基がポリマー
の側鎖にエステル結合により導入されたビニルエーテル
基含有アクリル樹脂誘導体;エポキシド及びエピスルフ
ィドなどの環状エーテル及び環状チオエーテル類;環状
ケトン類;ラクトン類;オキセタン類;スチレン類;ア
クロレイン;4−ビニルビフェニルなどのビニルアレン
類;ビニルシクロヘキセンなどの脂環式ビニル化合物;
イソブチレン;ブタジエンやイソプレンなどのジエン
類;フェノール/ホルムアルデヒド樹脂などのフェノー
ル樹脂;尿素/ホルムアルデヒド樹脂及びメラミン/ホ
ルムアルデヒド樹脂などのアミノプラスト樹脂;メチロ
ール化合物;ポリアクリル酸アミド又はポリメタクリル
酸アミド誘導体などのポリカルボン酸アミドのメチロー
ルエーテル類;ウレタン基を有するアルキド樹脂及びN
−メチロールアミドの炭酸エステルを含む樹脂などのカ
チオン重合性モノマーあるいはカチオン重合性ポリマー
が挙げられる。これらの中で、ビニルエーテル類及びエ
ポキシ樹脂などが好ましく用いられる。また、ビニルカ
ルバゾール、ビニルエーテル及びジケテンなどの酸−重
合性又は酸−硬化性エチレン性不飽和化合物も使用する
ことが可能であり、さらには酸により硬化しうる架橋性
結合剤含有樹脂状化合物も包含される。これらのカチオ
ン重合性化合物は単独で用いてもよいが、所望の性能に
応じて適宜2種以上を組み合わせて用いるのが好まし
い。本発明組成物においては、(B)成分として、一般
式The present invention will be described in detail below. The cationically polymerizable compound used as the component (A) in the composition of the present invention is a cationically polymerizable monomer or a cationically polymerizable polymer having a functional group capable of undergoing cationic polymerization in the molecule. Examples thereof include glycidyl ether and epoxy novolac resin obtained by reacting bisphenol A [2,2-bis (4-hydroxyphenyl) propane] or its alkylene oxide adduct with epichlorohydrin; Cyclohexene oxide or cyclopentene oxide obtained by epoxidizing a polyglycidyl ether of a polyhydric alcohol having an alicyclic functional group, cyclohexene or a cyclopentene ring-containing compound with a suitable oxidizing agent such as hydrogen peroxide or peracid Alicyclic epoxy resins such as compounds; glycidyl ether obtained by reaction of hydrogenated bisphenol A or its alkylene oxide adduct with epichlorohydrin; glycidyl ether of 1,6-hexenediol, triglyceride of glycerin Ethers, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, ethylene glycol, propylene glycol, aliphatic polyhydric alcohol to one or two or more alkylene oxides such as glycerin (e.g. ethylene oxide, propylene oxide)
An epoxy compound such as a polyglycidyl ether of a polyether polyol obtained by adding a vinyl ether group; an acrylic resin derivative containing a vinyl ether group in which a vinyl ether group is introduced into a side chain of a polymer through an ester bond; a cyclic group such as an epoxide and an episulfide Ethers and cyclic thioethers; cyclic ketones; lactones; oxetanes; styrenes; acrolein; vinylarenes such as 4-vinylbiphenyl; alicyclic vinyl compounds such as vinylcyclohexene;
Isobutylene; dienes such as butadiene and isoprene; phenolic resins such as phenol / formaldehyde resins; aminoplast resins such as urea / formaldehyde resins and melamine / formaldehyde resins; methylol compounds; polyacrylic acid amides or polymethacrylic acid amide derivatives Methylol ethers of carboxylic acid amides; alkyd resins having urethane groups and N
-Cationically polymerizable monomers or polymers such as resins containing carbonic acid ester of methylolamide. Among these, vinyl ethers and epoxy resins are preferably used. Further, it is also possible to use acid-polymerizable or acid-curable ethylenically unsaturated compounds such as vinylcarbazole, vinyl ether and diketene, and further include a crosslinkable binder-containing resinous compound which can be cured by an acid. To be done. These cationically polymerizable compounds may be used alone, but it is preferable to use a combination of two or more kinds as appropriate according to the desired performance. In the composition of the present invention, as the component (B), a compound represented by the general formula
【0008】[0008]
【化3】 [Chemical 3]
【0009】(式中のR1、R2、R3、X、m、n及び
pは前記と同じ意味をもつ)で表される含イオウ化合物
が用いられる。前記一般式[1]におけるR1、R2及び
R3の具体例としては、メチル基、エチル基、イソプロ
ピル基、n−プロピル基、n−ブチル基、イソブチル
基、t−ブチル基、フェニル基、ベンジル基、p−トリ
ル基、p−トシル基、p−クロロフェニル基、p−ブロ
モフェニル基などを好ましく挙げることができる。また
−(X)n−R2基としては、モルホリノ基やピペリジニル
基などの環状アミノ基も好ましく挙げることができる。
前記一般式[1]で表される含イオウ化合物、例えばス
ルフィルイミンは、スルフィドとクロラミンTとをメタ
ノール中で混合し、次いで希水酸化ナトリウム水溶液に
注ぎ、50℃程度の温度で1〜5時間放置することによ
り製造することができるし、また、スルフィドとクロラ
ミンTとをメタノール中で混合し、そこへ酢酸を添加し
たのちに、水酸化ナトリウム水溶液に注ぎ、放置するこ
とによっても製造することができる。この反応式を次に
示す。A sulfur-containing compound represented by the formula (wherein R 1 , R 2 , R 3 , X, m, n and p have the same meanings as described above) is used. Specific examples of R 1 , R 2 and R 3 in the general formula [1] include methyl group, ethyl group, isopropyl group, n-propyl group, n-butyl group, isobutyl group, t-butyl group and phenyl group. , Benzyl group, p-tolyl group, p-tosyl group, p-chlorophenyl group, p-bromophenyl group and the like can be preferably mentioned. Also - as the 2 groups (X) n -R, it may also be mentioned preferably cyclic amino group such as a morpholino group or a piperidinyl group.
The sulfur-containing compound represented by the general formula [1], for example, sulfilimine, is obtained by mixing sulfide and chloramine T in methanol, and then pouring the mixture into a dilute aqueous sodium hydroxide solution at a temperature of about 50 ° C. for 1-5. It can be produced by leaving it for a while, or it can be produced by mixing sulfide and chloramine T in methanol, adding acetic acid thereto, and then pouring it into an aqueous solution of sodium hydroxide and letting it stand. You can This reaction formula is shown below.
【0010】[0010]
【化4】 [Chemical 4]
【0011】また、スルホンイミドアミドは、スルフィ
ンアミドをN−ブロモコハク酸イミド(NBS)若しく
は塩素ガスと反応させ、次いで二級アミンと反応させる
方法により製造することができる。この反応式を次に示
す。The sulfonimide amide can be produced by a method in which sulfinamide is reacted with N-bromosuccinimide (NBS) or chlorine gas and then with a secondary amine. This reaction formula is shown below.
【0012】[0012]
【化5】 [Chemical 5]
【0013】一般式[1]で表される含イオウ化合物、
例えばスルホンイミドアミドを製造する場合、該スルフ
ィンアミドとN−ブロモコハク酸イミド(NBS)若し
くは塩素ガスとの反応温度は−30℃〜10℃の範囲が
好ましく、反応温度は5分ないし5時間程度である。ま
た、スルフィンアミドとNBS若しくは塩素ガスの仕込
みモル比は1:0.1ないし1:10の範囲が好まし
い。次いで、得られた塩素付加物と二級アミンとを反応
させる際の仕込みモル比は1:0.1ないし1:50の
範囲が好ましく、またその際の反応温度及び反応時間は
−20〜50℃及び1〜40時間の範囲が好ましい。本
発明組成物において、(B)成分として使用される含イ
オウ化合物は、通常室温で固体である。したがって、こ
れらの化合物は、通常汎用な有機触媒に1種又は2種以
上を組み合わせて溶解させ、(A)成分のカチオン重合
性化合物中に配合させるのが好ましい。この際使用され
る有機溶媒については、該含イオウ化合物を任意の割合
にて溶解させるものであれば、特に制限はない。このよ
うな溶媒としては、例えば塩化メチレン、クロロホル
ム、アセトニトリル、ジメチルスルホキシド、ジメチル
ホルムアミド、四塩化炭素、メタノール、エタノール、
イソプロパノールなどのアルコール系溶媒などを好まし
く挙げることができる。また、該含イオウ化合物を溶解
させる溶媒としては、脂肪族高級アルコールのモノグリ
シジルエーテルや、フェノール、クレゾール又はこれら
のアルキレンオキシドを付加させることにより得られる
ポリエーテルアルコールのモノグリシジルエーテル、さ
らには、トリエチレングリコールジビニルエーテル、シ
クロヘキサンジメタノールジビニルエーテル、ジグリシ
ジルエーテル、ジグリシジルエステルなどの多官能性ビ
ニルエーテル基あるいは多官能性エポキシ基などの官能
基を有する化合物を反応希釈剤として、(A)成分のカ
チオン重合性化合物中に、単独又は前記の汎用の有機溶
媒と併用して加えることも可能である。A sulfur-containing compound represented by the general formula [1],
For example, in the case of producing sulfonimide amide, the reaction temperature of the sulfinamide and N-bromosuccinimide (NBS) or chlorine gas is preferably in the range of -30 ° C to 10 ° C, and the reaction temperature is about 5 minutes to 5 hours. is there. The molar ratio of sulfinamide and NBS or chlorine gas charged is preferably in the range of 1: 0.1 to 1:10. Next, when the obtained chlorine adduct is reacted with the secondary amine, the charged molar ratio is preferably in the range of 1: 0.1 to 1:50, and the reaction temperature and reaction time at that time are -20 to 50. C. and a range of 1 to 40 hours are preferred. In the composition of the present invention, the sulfur-containing compound used as the component (B) is usually solid at room temperature. Therefore, it is preferable to dissolve one of these compounds in a combination of generally used organic catalysts, or to mix them in the cationically polymerizable compound as the component (A). The organic solvent used at this time is not particularly limited as long as it can dissolve the sulfur-containing compound in an arbitrary ratio. Examples of such a solvent include methylene chloride, chloroform, acetonitrile, dimethyl sulfoxide, dimethylformamide, carbon tetrachloride, methanol, ethanol,
Preferable examples include alcohol solvents such as isopropanol. Further, as a solvent for dissolving the sulfur-containing compound, a monoglycidyl ether of an aliphatic higher alcohol, a phenol, cresol or a monoglycidyl ether of a polyether alcohol obtained by adding an alkylene oxide thereof, further, tri A compound having a functional group such as a polyfunctional vinyl ether group such as ethylene glycol divinyl ether, cyclohexane dimethanol divinyl ether, diglycidyl ether or diglycidyl ester or a polyfunctional epoxy group is used as a reaction diluent, and the cation of the component (A) is used. It is also possible to add it to the polymerizable compound alone or in combination with the above-mentioned general-purpose organic solvent.
【0014】本発明の重合性組成物においては、カチオ
ン重合を損なわない範囲で、希釈のために前記の溶媒
や、改質のために非反応性樹脂やプレポリマーなどを配
合させることも可能である。また、電気特性を改良する
目的などのために、有機カルボン酸や酸無水物を使用し
たり、あるいはゴム弾性をもたせるなどの目的でポリオ
ールを混合させることも可能である。本発明のカチオン
重合性組成物においては、エネルギー線の照射及び/又
は加熱により、重合若しくは硬化させる場合(A)成分
のカチオン重合性化合物100重量部に対して、(B)
成分の含イオウ化合物を0.001〜50重量部、好ま
しくは0.01〜10重量部の割合で配合するが、最適
な該(B)成分の配合量は、(A)成分のカチオン重合
性化合物の性質(例えばエポキシ当量)やエネルギー線
の照射量、所望の硬化時間、硬化温度、湿度などによっ
て適宜選ばれる。該エネルギー線については、(B)成
分の含イオウ化合物の分解を誘発するエネルギーを有す
るものであればよく、特に制限はないが、例えば、高・
低水圧水銀ランプ、キセノンランプ、メタルハライドラ
ンプ、殺菌灯、レーザー光などから得られる150nm〜
900nmの波長を有する電磁波エネルギー線や電子線、
X線放射線などの高エネルギー線が好ましく用いられ
る。In the polymerizable composition of the present invention, it is possible to add the above-mentioned solvent for dilution and a non-reactive resin or prepolymer for modification within a range not impairing the cationic polymerization. is there. It is also possible to use an organic carboxylic acid or an acid anhydride for the purpose of improving the electrical properties, or to mix a polyol for the purpose of imparting rubber elasticity. In the cationically polymerizable composition of the present invention, when it is polymerized or cured by irradiation with energy rays and / or heating, (B) is added to 100 parts by weight of the cationically polymerizable compound as the component (A).
The sulfur-containing compound as a component is blended in a proportion of 0.001 to 50 parts by weight, preferably 0.01 to 10 parts by weight. The optimum blending amount of the component (B) is the cationic polymerization property of the component (A). It is appropriately selected depending on the properties of the compound (for example, epoxy equivalent), the amount of energy ray irradiation, the desired curing time, the curing temperature, the humidity and the like. The energy ray is not particularly limited as long as it has an energy that induces the decomposition of the sulfur-containing compound as the component (B), and, for example, high energy
150nm ~ obtained from low water pressure mercury lamp, xenon lamp, metal halide lamp, germicidal lamp, laser light, etc.
Electromagnetic energy beam or electron beam having a wavelength of 900 nm,
High-energy rays such as X-ray radiation are preferably used.
【0015】エネルギー線への暴露時間は、エネルギー
線の強度にもよるが、通常は0.5秒ないし10分間の
範囲で選ばれる。なお、比較的厚い塗装物については、
それ以上の時間を必要に応じてかけることも可能であ
る。またカチオン重合反応を促進させるために、加熱を
併用することも必要に応じて可能であり、その際の加熱
温度は0〜150℃の範囲が好ましい。本発明の重合性
組成物を加熱により重合若しくは硬化させる場合の硬化
温度及び時間は0〜200℃及び10秒ないし1時間の
範囲が好ましい。また、該含イオウ化合物の熱的活性を
高める目的で、あるいは硬化時間を短縮させる目的で、
第三の成分としてチオフェノール、ペンタクロロチオフ
ェノールなどのチオフェノール及びその誘導体、チオサ
リチル酸などの弱塩基性求核試薬、Cu、Co、Snな
どの有機金属化合物を硬化促進剤として用いることがで
き、その際カチオン重合性化合物100重量部に対して
0.01〜20重量部の範囲にて添加させることが好ま
しい。本発明の重合性組成物は、通常液状なものである
が、用途によっては不活性な顔料、染料、充填剤、静電
防止剤、難燃剤、ゲル化防止剤、流れ調整剤、界面活性
剤、密着性改良剤、加工助剤、粘度調整剤、増感剤、促
進剤、紫外線吸収剤、表面改質剤などを混合して用いる
ことも可能である。The exposure time to the energy rays depends on the intensity of the energy rays, but is usually selected in the range of 0.5 seconds to 10 minutes. For relatively thick coated objects,
It is possible to spend more time than that. Further, in order to accelerate the cationic polymerization reaction, it is possible to use heating in combination, and the heating temperature at that time is preferably in the range of 0 to 150 ° C. When the polymerizable composition of the present invention is polymerized or cured by heating, the curing temperature and time are preferably 0 to 200 ° C. and 10 seconds to 1 hour. Further, for the purpose of enhancing the thermal activity of the sulfur-containing compound or for shortening the curing time,
As the third component, thiophenols such as thiophenol and pentachlorothiophenol and their derivatives, weakly basic nucleophiles such as thiosalicylic acid, and organometallic compounds such as Cu, Co and Sn can be used as curing accelerators. In that case, it is preferable to add it in the range of 0.01 to 20 parts by weight with respect to 100 parts by weight of the cationically polymerizable compound. The polymerizable composition of the present invention is usually in a liquid state, but it is an inert pigment, a dye, a filler, an antistatic agent, a flame retardant, an antigelling agent, a flow control agent, a surfactant depending on the use. It is also possible to mix and use an adhesion improver, a processing aid, a viscosity modifier, a sensitizer, an accelerator, an ultraviolet absorber, a surface modifier and the like.
【0016】[0016]
【実施例】次に、実施例及び比較例により本発明をさら
に詳細に説明するが、本発明はこれらの例によってなん
ら限定されるものではない。 製造例1 N−トシルメチルフェニルスルフィルイミン
の製造 チオアニソール1.24g(10ミリモル)を、メタノ
ール500ミリリットルと0.5N硫酸水溶液100ミ
リリットルとの混合溶液に溶解させ、メタノール100
ミリリットルにクロラミンT2.50g(11ミリモ
ル)を溶解させたものを加え、室温で0.5時間反応さ
せたのちに、希水酸化ナトリウム水溶液3リットル中に
注いだ。次いで、反応混合物をクロロホルム300ミリ
リットルで2回抽出したのち、水洗、乾燥後溶媒を留去
し、アセトン−ヘキサン混合溶媒から再結晶することに
より、収率50%で、以下の構造を有するN−トシルメ
チルフェニルスルフィルイミン1.46gが得られた。EXAMPLES The present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples. Production Example 1 Production of N-tosylmethylphenylsulfilimine 1.24 g (10 mmol) of thioanisole was dissolved in a mixed solution of 500 ml of methanol and 100 ml of 0.5N sulfuric acid aqueous solution, and methanol 100 was added.
A solution prepared by dissolving 2.50 g (11 mmol) of chloramine T in milliliter was added, and after reacting at room temperature for 0.5 hour, it was poured into 3 liter of dilute aqueous sodium hydroxide solution. Then, the reaction mixture was extracted twice with 300 ml of chloroform, washed with water, dried and evaporated to remove the solvent, and recrystallized from an acetone-hexane mixed solvent to give N-having the following structure in a yield of 50%. 1.46 g of tosylmethylphenylsulfilimine were obtained.
【0017】[0017]
【化6】 [Chemical 6]
【0018】製造例2 N−p−トリル−メチルスルホ
ンイミドモルホリドの製造 N−p−トリル−メチルスルフィンアミド1.69g
(10ミリモル)を四塩化炭素85ミリリットル中に溶
解させ、0〜5℃に冷却し、これにN−ブロモコハク酸
イミド1.8g(10ミリモル)を加え、0℃にて30
分間撹拌を行った。さらにモルホリン2.4g(14ミ
リモル)を加え0℃で3時間、次いで室温下にて6時間
撹拌を行った。反応混合物を水で洗浄を行い、硫酸マグ
ネシウムにて乾燥を行ったのち、30wt%エーテル−ヘ
キサンを展開溶媒としたカラムクロマトグラフィーで精
製を行うことにより、収率74%で以下の構造を有する
N−p−トリル−メチルスルホンイミドモルホリド2.
12gが得られた。Production Example 2 Production of Np-tolyl-methylsulfonimide morpholide 1.69 g of Np-tolyl-methylsulfinamide
(10 mmol) was dissolved in 85 ml of carbon tetrachloride, cooled to 0 to 5 ° C., 1.8 g (10 mmol) of N-bromosuccinimide was added thereto, and the mixture was stirred at 0 ° C. for 30 minutes.
Stir for minutes. Further, 2.4 g (14 mmol) of morpholine was added, and the mixture was stirred at 0 ° C. for 3 hours and then at room temperature for 6 hours. The reaction mixture was washed with water, dried over magnesium sulfate, and then purified by column chromatography using 30 wt% ether-hexane as a developing solvent to give N having the following structure in a yield of 74%. -P-Tolyl-methylsulfonimide morpholide 2.
12 g was obtained.
【0019】[0019]
【化7】 [Chemical 7]
【0020】製造例2の方法に準じて、以下の製造例3
〜7に示す化合物の製造を行った。 製造例3 N−p−トリル−3−クロロプロピルスルホンイミドモ
ルホリドThe following Production Example 3 was carried out according to the method of Production Example 2.
The compounds shown in ~ 7 were prepared. Production Example 3 N-p-tolyl-3-chloropropylsulfonimide morpholide
【0021】[0021]
【化8】 [Chemical 8]
【0022】製造例4 N−p−トリル−シクロヘキシルスルホンイミドモルホ
リドProduction Example 4 Np-tolyl-cyclohexylsulfonimide morpholide
【0023】[0023]
【化9】 [Chemical 9]
【0024】製造例5 N−p−トリル−p−クロロフェニルシクロプロピルス
ルホンイミドモルホリドProduction Example 5 Np-tolyl-p-chlorophenylcyclopropylsulfonimide morpholide
【0025】[0025]
【化10】 [Chemical 10]
【0026】製造例6 N−p−ブロモフェニル−メチルスルホンイミドモルホ
リドProduction Example 6 Np-bromophenyl-methylsulfonimide morpholide
【0027】[0027]
【化11】 [Chemical 11]
【0028】製造例7 N−メチルスルホンイミドジモルホリドProduction Example 7 N-methylsulfonimide dimorpholide
【0029】[0029]
【化12】 [Chemical 12]
【0030】製造例8 ビニルエーテル基含有アクリル
樹脂の製造 撹拌機、還流管、温度計、窒素導入口を備えた5000
ミリリットルの4つ口フラスコにキシレン1357gを
仕込み、80℃に昇温し、そこへメタクリル酸メチル1
712g、ブチルアクリレート682gの混合物にアゾ
ビスイソブチロニトリル115gを溶かし、滴下を行っ
た。滴下後さらに熟成を4時間行いメチルメタクリレー
ト−ブチルアクリレート共重合樹脂溶液を収量3870
g(加熱残分:62wt%)で得た。次いで、得られた樹
脂溶液485g、4−ヒドロキシブチルビニルエーテル
84g、ナトリウムメチラートの28wt%メタノール溶
液6.9gを仕込み、150℃、14時間反応を行っ
た。反応終了後、キョーワード700SN(協和化学社
製)15.0gを添加させ、90℃、1時間で反応させ
た。反応後ろ過により分散物を除去したところ、ビニル
オキシブチル基[CH2=CHO(CH2)4 -]が共重合物
中のエステル基中に導入された樹脂が樹脂溶液として収
率820g(加熱残分:35wt%)で得られた。なお、
1H−NMRによりビニルオキシブチル基の導入率(樹
脂中のモノマーに対する導入化率)を求めたところ17
モル%であった。Production Example 8 Production of Vinyl Ether Group-Containing Acrylic Resin 5000 equipped with stirrer, reflux tube, thermometer, nitrogen inlet
In a milliliter 4-necked flask, 1357 g of xylene was charged, the temperature was raised to 80 ° C., and methyl methacrylate 1 was added thereto.
115 g of azobisisobutyronitrile was dissolved in a mixture of 712 g and 682 g of butyl acrylate, and the mixture was added dropwise. After dropping, aging was continued for 4 hours to obtain a methyl methacrylate-butyl acrylate copolymer resin solution in a yield of 3870.
g (heating residue: 62 wt%). Then, 485 g of the obtained resin solution, 84 g of 4-hydroxybutyl vinyl ether, and 6.9 g of a 28 wt% methanol solution of sodium methylate were charged and reacted at 150 ° C. for 14 hours. After completion of the reaction, 15.0 g of Kyoward 700SN (manufactured by Kyowa Chemical Co., Ltd.) was added and reacted at 90 ° C. for 1 hour. Was removed a dispersion by a reaction after filtration, vinyl oxy butyl group [CH 2 = CHO (CH 2 ) 4 -] yield as the resin is a resin solution introduced in the ester group copolymer in 820 g (heating Residue: 35 wt%). In addition,
When the introduction rate of vinyloxybutyl groups (introduction rate to the monomer in the resin) was determined by 1 H-NMR, it was
It was mol%.
【0031】実施例1 製造例1で得られたスルフィルイミン0.1gを塩化メ
チレン5gに溶解させ、次いで製造例8で得られたビニ
ルエーテル基含有アクリル樹脂溶液29gを加え、ビニ
ルエーテル基含有樹脂溶液を調製した。この調製液をエ
アースプレー塗装にてブリキ板上に塗布(膜厚35μ
m)し、500ワット超高圧水銀ランプ[ウシオ電機
(株)USH−500D:照射距離400mm]で45秒室
温下にて照射を行い硬化膜を生成させた。得られた硬化
膜に対してキシレンラビングを行った結果及びヌープ硬
度の測定を行った結果について第1表に示した。 実施例2 実施例1において、製造例1で得られたスルフィルイミ
ンの代わりに製造例2で得られたスルホンイミドアミド
を用いた以外は、実施例1に従って光硬化を行った。そ
の結果を第1表に示す。Example 1 0.1 g of the sulfilimine obtained in Production Example 1 was dissolved in 5 g of methylene chloride, and then 29 g of the vinyl ether group-containing acrylic resin solution obtained in Production Example 8 was added to the solution, and the vinyl ether group-containing resin solution was added. Was prepared. Apply this preparation on a tin plate by air spray coating (film thickness 35μ
m), and a 500 watt ultra-high pressure mercury lamp [USHIO INC.
USH-500D: Irradiation distance 400 mm] was irradiated for 45 seconds at room temperature to form a cured film. Table 1 shows the results of performing xylene rubbing on the obtained cured film and the results of measuring the Knoop hardness. Example 2 In Example 1, the photocuring was performed according to Example 1 except that the sulfonimidamide obtained in Production Example 2 was used instead of the sulfilimine obtained in Production Example 1. The results are shown in Table 1.
【0032】比較例1 実施例1において、スルフィルイミンを用いなかったこ
と以外は、実施例1に従って光硬化を行った。その結果
を第1表に示す。 比較例2 実施例1において、スルフィルイミンの代わりにトリフ
ェニルスルホニウムテトラフルオロボレート(Ph3S+
BF4 -)を用いた以外は、実施例1に従って光硬化を行
った。その結果を第1表に示す。Comparative Example 1 Photocuring was carried out in the same manner as in Example 1 except that sulfimimine was not used. The results are shown in Table 1. Comparative Example 2 In Example 1, instead of sulfilimine, triphenylsulfonium tetrafluoroborate (Ph 3 S +
BF 4 -) except using, was photocured according to Example 1. The results are shown in Table 1.
【0033】実施例3〜7 製造例3〜7にて製造された含イオウ化合物をそれぞれ
用いた以外は、実施例1に従って光硬化を行った。その
結果を第1表に示す。 実施例8〜14 実施例1において、ビニルエーテル基含有アクリル樹脂
溶液の代わりに、エポキシ樹脂「エピコート828」
[油化シェルエポキシ(株)製]を用い、かつ製造例1〜
7で得られた含イオウ化合物をそれぞれ用いた以外は、
実施例1に従って光硬化を行った。その結果を第1表に
示す。 実施例15、16 実施例1、2において、光硬化の代わりに加熱硬化(1
00℃、15分)を行った以外は、実施例1に準じて実
施した。その結果を第1表に示す。Examples 3 to 7 Photocuring was carried out according to Example 1 except that the sulfur-containing compounds produced in Production Examples 3 to 7 were used. The results are shown in Table 1. Examples 8 to 14 In Example 1, instead of the vinyl ether group-containing acrylic resin solution, the epoxy resin “Epicoat 828” was used.
[Oilized Shell Epoxy Co., Ltd.] is used and Production Examples 1 to
Except that each of the sulfur-containing compounds obtained in 7 was used.
Photocuring was carried out according to Example 1. The results are shown in Table 1. Examples 15 and 16 In Examples 1 and 2, heat curing (1
The same procedure as in Example 1 was carried out except that the heating was carried out at 00 ° C for 15 minutes. The results are shown in Table 1.
【0034】[0034]
【表1】 [Table 1]
【0035】注 1)キシレンラビング:5枚重ねしたネル布にキシレン
を浸し、中指で固定して塗膜上を20回往復させた後の
塗膜の状態を観察した。○:未変化、△:一部損傷、
×:一部溶解 2)ヌープ硬度:(株)島津製作所製のM型微小硬度計に
て20℃で測定した。数値の大きいほど硬いことを示
す。 第1表に示すように、本発明のカチオン重合硬化性組成
物に用いられる含イオウ化合物はカチオン重合性能が従
来公知の開始剤に比べ著しく高く、実用性の高いもので
あることが明白である。Note 1) Xylene rubbing: Xylene was dipped in five flannel cloths, fixed with a middle finger, and reciprocated over the coating film 20 times. Then, the state of the coating film was observed. ○: unchanged, △: partial damage,
X: Partially dissolved 2) Knoop hardness: Measured at 20 ° C. with an M-type micro hardness meter manufactured by Shimadzu Corporation. The larger the value, the harder it is. As shown in Table 1, it is apparent that the sulfur-containing compound used in the cationically polymerizable curable composition of the present invention has significantly higher cationic polymerization performance than conventionally known initiators and is highly practical. .
【0036】[0036]
【発明の効果】本発明の重合性組成物は新規なものであ
り、エネルギー線の照射により塗膜硬化に対しても気泡
が生成せず、さらにエネルギー線の照射による硬化性能
が著しく高く、良質の塗膜が得られ、厚塗りの塗膜を製
造することができる。また、加熱によっても高温、長時
間の硬化条件を必要とせず良好な硬化塗膜を製造するこ
とができる。本発明の重合性組成物は金属、ゴム、プラ
スチック、紙、セラミック、木材、成形部品の材料に応
用することができ、具体的な用途としては、美観あるい
は保護を目的とした耐久性塗料を作るための塗料組成物
にとりわけ応用することが可能である。さらに、本発明
の重合性組成物は密着性、耐薬品性、耐摩耗性、絶縁性
などに優れるため、インキ、接着剤、フォトレジスト、
ラミネート、植込用コンパウンド、絶縁塗料やその他の
用途に使用することができる。INDUSTRIAL APPLICABILITY The polymerizable composition of the present invention is novel, does not generate bubbles even when the coating film is cured by the irradiation of energy rays, and has extremely high curing performance by the irradiation of energy rays. Thus, a thick coating film can be produced. Further, even by heating, a good cured coating film can be produced without requiring high temperature and long time curing conditions. The polymerizable composition of the present invention can be applied to materials for metals, rubbers, plastics, papers, ceramics, woods, and molded parts, and as a specific application, a durable paint for the purpose of aesthetics or protection is prepared. It has particular application to coating compositions for Further, the polymerizable composition of the present invention is excellent in adhesion, chemical resistance, abrasion resistance, insulation, etc., and therefore, ink, adhesive, photoresist,
It can be used in laminates, implant compounds, insulating paints and other applications.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C08G 65/04 NQE 9167−4J C09D 5/00 PNV 6904−4J 163/00 PKB 8830−4J ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display location C08G 65/04 NQE 9167-4J C09D 5/00 PNV 6904-4J 163/00 PKB 8830-4J
Claims (1)
一般式 【化1】 (式中のR1、R2及びR3は、それぞれ炭素数1〜30
のアルキル基、ハロゲン化アルキル基、アリール基、ハ
ロゲン化アリール基、アリールスルホニル基、アラルキ
ル基、アルケニル基、シクロアルキル基、シクロアルキ
ルアルキル基、アリールシクロアルキル基、アルキレン
基、アリーレン基、アラルキレン基又はオキサアルキレ
ン基であり、それらはたがいに同一であってもよいし、
異なっていてもよく、Xは酸素原子又は窒素原子、m、
n及びpはそれぞれ0又は1である)で表される含イオ
ウ化合物を有効成分として含有して成るカチオン重合硬
化性組成物。1. A cationically polymerizable compound (A), and (B)
General formula: (R 1 , R 2 and R 3 in the formula each have 1 to 30 carbon atoms.
Alkyl group, halogenated alkyl group, aryl group, halogenated aryl group, arylsulfonyl group, aralkyl group, alkenyl group, cycloalkyl group, cycloalkylalkyl group, arylcycloalkyl group, alkylene group, arylene group, aralkylene group or An oxaalkylene group, which may be identical to each other,
May be different, X is an oxygen atom or a nitrogen atom, m,
A cationic polymerization curable composition comprising as an active ingredient a sulfur-containing compound represented by n and p each being 0 or 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33985392A JPH06157626A (en) | 1992-11-26 | 1992-11-26 | Cationically polymerizable and curable composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33985392A JPH06157626A (en) | 1992-11-26 | 1992-11-26 | Cationically polymerizable and curable composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06157626A true JPH06157626A (en) | 1994-06-07 |
Family
ID=18331444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33985392A Pending JPH06157626A (en) | 1992-11-26 | 1992-11-26 | Cationically polymerizable and curable composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06157626A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011509952A (en) * | 2008-01-17 | 2011-03-31 | バイエル・シエーリング・ファーマ アクチエンゲゼルシャフト | Sulfoximine-substituted quinazoline derivatives as immunomodulators, their preparation and use as pharmaceuticals |
-
1992
- 1992-11-26 JP JP33985392A patent/JPH06157626A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011509952A (en) * | 2008-01-17 | 2011-03-31 | バイエル・シエーリング・ファーマ アクチエンゲゼルシャフト | Sulfoximine-substituted quinazoline derivatives as immunomodulators, their preparation and use as pharmaceuticals |
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