JPH0613140U - Semiconductor device - Google Patents

Abstract

(57) [Summary] [Structure] The signal line 5 from the inspection circuit 4 in the IC chip 2 arranged on the silicon wafer 1 is
It is connected to the inspection electrodes 6 and 7 arranged on the scribe line 3. [Effect] By providing the inspection electrode on the scribe line, the area of the IC chip can be reduced, and the number of IC chips obtained from one silicon wafer increases.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to the arrangement of inspection electrodes of a semiconductor integrated circuit (hereinafter referred to as IC).

[0002]

[Prior art]

 Generally, IC inspection is performed using a prober device. When an IC on a silicon wafer is inspected using this prober device, signals are input to and output from the inspection device by touching the IC electrodes from the prober device with a probe having a fine tip.

In addition to the originally intended function, the IC has an inspection circuit for inspection added thereto. This is a circuit that makes it possible to easily inspect whether or not the IC formed on the silicon wafer performs the intended functional operation. Several inspection electrodes are used to inspect this inspection circuit. Needed.

However, this inspection electrode is required only for the inspection on the silicon wafer, and is unnecessary after the IC is made into a chip after the pass / fail judgment.

FIG. 2 is a plan view showing the arrangement of conventional inspection electrodes. As shown in FIG. 2, the input / output signals output from the inspection circuit 4 of the IC chip 2 regularly arranged on the silicon wafer 1 are transmitted to the inspection electrode by the signal line 5 using aluminum or polysilicon. 6 and the inspection electrode 7 are connected.

The scribe line 3 is a cut portion when the IC formed on the silicon wafer 1 is cut into chips, and no components connected to the IC are arranged.

[0007]

Since the inspection electrodes 6 and 7 are unnecessary after the IC is formed into a chip, only the area occupied by the inspection electrodes 6 and 7 in the IC chip is The chip size of is increasing.

An object of the present invention is to solve the above problems and provide an arrangement of inspection electrodes of a semiconductor device that can reduce the area of an IC chip.

[0009]

[Means for Solving the Problems]

 In the semiconductor device of the present invention, the inspection electrode is arranged on a scribe line.

[0010]

[Action]

 By disposing the inspection electrodes on the scribe line in this way, the inspection electrodes are cut from the inspection circuit inside the IC when the IC is cut into chips, but after that, the inspection electrodes are necessary. Not taken By disposing the inspection electrodes on the scribe line, the chip size of the IC can be reduced by the area occupied by this portion.

[0011]

【Example】

 An embodiment of the present invention will be described below with reference to FIGS. 1, 3, and 4.

For example, an IC has a frequency dividing circuit having multiple stages, and when inspecting this, a test circuit is added to input a test signal from a frequency dividing stage in the middle to judge whether the frequency dividing circuit is correct or incorrect. Then, the inspection is simplified by connecting the inspection electrodes to the inspection circuit. The inspection electrode in such a case is not necessary when the IC is used after the inspection, and thus can be arranged on the scribe line.

As shown in FIG. 1, an input / output signal from an inspection circuit 4 provided on an IC chip 2 formed on a silicon wafer 1 is transferred onto a scribe line 3 by a signal line 5 formed of aluminum or polysilicon. It is connected to the inspection electrodes 6 and 7 arranged at.

Since the scribe line 3 is a cutting area for cutting the IC chip 2, it has a predetermined width.

Therefore, it is not necessary to newly provide a region for disposing the inspection electrodes 6 and 7.

Therefore, the area occupied by the IC chip 2 is reduced by the area where the inspection electrodes 6 and 7 are moved and arranged on the scribe line from the IC chip 2 region.

Another embodiment of the present invention will be described with reference to FIG. As shown in FIG. 3, the inspection electrodes 6 and 7 connected to the inspection circuit 4 of the IC chip 2 are the inspection electrodes 11 and 12 connected to the inspection circuit 9 of the IC chip 8 adjacent to the IC chip 2. Place it on the scribe line 3 so that it alternates with.

By arranging in this way, it becomes possible to perform inspection without being interfered with each other's ICs, and the scribe line 3 region can be used efficiently.

Another embodiment of the present invention will be described with reference to FIG. As shown in FIG. 4, a plurality of IC chips 2 and respective inspection circuits 4 in the IC chip 8, a signal line 5 extending from the inspection circuit 9, and an inspection electrode 6 connected by a signal line 10. , 7 are commonly used by the IC chip 2 and the IC chip 8.

As a result, the number of inspection electrodes can be further reduced. At this time, if the signal from the inspection circuit is the input signal or the power supply, the inspection electrode is not commonly used and the inspection is not hindered. Further, if the inspection contents are the same, it is possible to commonly use the inspection electrodes when simultaneously inspecting a plurality of chips.

[0021]

[Effect of device]

 As is clear from the above description, in the semiconductor device of the present invention, the inspection electrode is provided on the scribe line. Therefore, since the area of the IC chip is reduced, the number of IC chips obtained from one silicon wafer is increased. Although the number of signal lines connected to the inspection circuit is two in the above description, the number of signal lines may be any number.

[Brief description of drawings]

FIG. 1 is a plan view showing a configuration of a semiconductor device according to the present invention.

FIG. 2 is a plan view showing a configuration of a semiconductor device in a conventional example.

FIG. 3 is a plan view showing the configuration of a semiconductor device according to another embodiment of the present invention.

FIG. 4 is a plan view showing the structure of a semiconductor device according to another embodiment of the present invention.

[Explanation of symbols]

 1 Silicon Wafer 2 IC Chip 3 Scribe Line 4 Test Circuit 5 Signal Line 6, 7 Test Electrode

Claims (1)

[Scope of utility model registration request] 1. A semiconductor device in which an inspection electrode for inspecting an inspection circuit is arranged on a scribe line.