JPH06122857A - Conductive adhesive and method for adhering - Google Patents
Conductive adhesive and method for adheringInfo
- Publication number
- JPH06122857A JPH06122857A JP31259492A JP31259492A JPH06122857A JP H06122857 A JPH06122857 A JP H06122857A JP 31259492 A JP31259492 A JP 31259492A JP 31259492 A JP31259492 A JP 31259492A JP H06122857 A JPH06122857 A JP H06122857A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- conductive
- magnetic field
- conductors
- ferromagnetic particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 55
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 12
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 32
- 239000004020 conductor Substances 0.000 claims abstract description 26
- 239000002245 particle Substances 0.000 claims abstract description 23
- 230000005291 magnetic effect Effects 0.000 claims abstract description 22
- 238000007747 plating Methods 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000002923 metal particle Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011553 magnetic fluid Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005307 ferromagnetism Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は確実な導通が得られる
導電性接着剤及び接着方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive adhesive and a bonding method capable of ensuring reliable conduction.
【０００２】[0002]
【従来の技術】従来の導電性接着剤は、例えば図３に示
すようなハードディスク等に用いられるモータのシール
部において使用されている。同図において、上記シール
部は、永久磁石５１とリング状のポールピース５２、５
３とから成るシール体５４と、シャフト５６の外周面と
上記ポールピース５２、５３の内周面との間隙に介装さ
れる磁性流体５５とから構成されている。このシール体
５４と磁性流体５５とが共働してシャフト５６の軸方向
の空気流を遮断し、ホコリ等の内部流入を防止してい
る。導電性接着剤５９は、シール体５４の固定、及びシ
ール体５４からモータハブ５８に至る導通を可能にして
シール体５４のアースをとるために、ポールピース５３
と、ハウジング５７と、モータハブ５８との間に塗布さ
れている。なお６０は密封用接着剤である。2. Description of the Related Art A conventional conductive adhesive is used, for example, in a seal portion of a motor used for a hard disk as shown in FIG. In the figure, the above-mentioned seal portion is composed of a permanent magnet 51 and a ring-shaped pole piece 52, 5.
3 and a magnetic fluid 55 interposed in the gap between the outer peripheral surface of the shaft 56 and the inner peripheral surfaces of the pole pieces 52, 53. The seal body 54 and the magnetic fluid 55 work together to block the axial air flow of the shaft 56 and prevent the inflow of dust and the like. The conductive adhesive 59 fixes the seal body 54 and allows conduction from the seal body 54 to the motor hub 58 to ground the seal body 54 so as to ground the seal body 54.
Is applied between the housing 57 and the motor hub 58. Reference numeral 60 is a sealing adhesive.
【０００３】[0003]
【発明が解決しようとする課題】ところで上記導電性接
着剤は、上記導通を得るために導電性の金属粉を接着剤
中に含有させている。しかしこの金属粉は、塗布当初は
均一な分散状態にあるために一方の面から他方に至る導
電回路を形成しているものの、その後沈降、凝集等によ
って未硬化のうちに偏在してしまう。このため上記回路
が壊れ、この状態で接着剤が硬化するため、硬化後は充
分な導通が得られない場合がある。また導通を確実に得
ようとして金属粉の含有量を増加すると、逆に接着剤の
接着力が低下するという問題が生じる。By the way, in the above conductive adhesive, conductive metal powder is contained in the adhesive in order to obtain the above conduction. However, this metal powder forms a conductive circuit from one surface to the other since it is in a uniformly dispersed state at the beginning of application, but thereafter it is unevenly distributed while being uncured due to sedimentation, aggregation and the like. As a result, the circuit is broken, and the adhesive cures in this state, so that sufficient conduction may not be obtained after curing. In addition, when the content of the metal powder is increased in order to surely obtain conduction, there is a problem that the adhesive force of the adhesive is reduced.
【０００４】この発明は上記従来の欠点を解決するため
になされたものであって、その目的は、接着力を低下さ
せることなく導通が確実に得られる導電性接着剤及び接
着方法を提供することにある。The present invention has been made in order to solve the above-mentioned conventional drawbacks, and an object thereof is to provide a conductive adhesive and a bonding method capable of surely obtaining conduction without lowering the adhesive force. It is in.
【０００５】[0005]
【課題を解決するための手段】そこで請求項１の導電性
接着剤は、一対の導電体１、２間に介装されて、この両
導電体１、２を導通可能に接着固定する導電性接着剤に
おいて、未硬化接着剤５に、少なくとも表面が導電性を
有する強磁性粒子３を分散させていることを特徴として
いる。Therefore, the conductive adhesive according to claim 1 is interposed between a pair of conductors 1 and 2 so that the conductors 1 and 2 can be conductively bonded and fixed. In the adhesive, the uncured adhesive 5 is characterized in that at least the ferromagnetic particles 3 having conductivity are dispersed.
【０００６】また請求項２の導電性接着剤は、上記強磁
性粒子３の表面に、金、銀等の高導電性メッキ層４を形
成したことを特徴としている。The conductive adhesive of claim 2 is characterized in that a highly conductive plated layer 4 of gold, silver or the like is formed on the surface of the ferromagnetic particles 3.
【０００７】さらに請求項３の接着方法は、一対の導電
体１、２を導通可能に接着固定する接着方法において、
未硬化接着剤５に、少なくとも表面が導電性を有する強
磁性粒子３を分散し、この強磁性粒子３が分散している
未硬化接着剤５を上記両導電体１、２間に介装し、一方
の導電体１から他方の導電体２方向に磁場を作用させ、
上記磁場を作用させた状態で上記未硬化接着剤５を硬化
させることを特徴としている。Further, the bonding method according to claim 3 is a bonding method for bonding and fixing a pair of conductors 1 and 2 in a conductive manner.
The uncured adhesive 5 is dispersed with at least the ferromagnetic particles 3 having a conductive surface, and the uncured adhesive 5 in which the ferromagnetic particles 3 are dispersed is interposed between the conductors 1 and 2. , A magnetic field is applied from one conductor 1 to the other conductor 2,
It is characterized in that the uncured adhesive 5 is cured while the magnetic field is applied.
【０００８】[0008]
【作用】上記請求項１の導電性接着剤及び請求項３の接
着方法では、一方の導電体１から他方の導電体２方向に
磁場を作用させると、両導電体１、２間に介装された未
硬化接着剤５中の強磁性粒子３が磁束の流れに沿うよう
に連接して柱状化するので、一方の導電体１と他方の導
電体２とが上記柱状化した強磁性粒子３を介して接続さ
れる。この強磁性粒子３は少なくとも表面が導電性を有
しているので、上記連接して柱状化した強磁性粒子３
は、一方の導電体１から他方の導電体２に至る導電回路
となる。そして磁場を作用させた状態で接着剤５を硬化
させると、強磁性粒子３はそのまま固定されるので磁場
の作用を解除しても上記導電回路は形成されたままとな
る。According to the conductive adhesive of the above-mentioned claim 1 and the bonding method of the above-mentioned claim 3, when a magnetic field is applied from one conductor 1 to the other conductor 2, it is interposed between the conductors 1 and 2. Since the ferromagnetic particles 3 in the uncured adhesive 5 are connected to each other along the flow of the magnetic flux to be columnar, one of the conductors 1 and the other conductor 2 has the columnar ferromagnetic particles 3 described above. Connected via. Since at least the surface of the ferromagnetic particles 3 has conductivity, the ferromagnetic particles 3 which are columnarly connected to each other are columnar.
Is a conductive circuit from one conductor 1 to the other conductor 2. Then, when the adhesive 5 is cured in a state where a magnetic field is applied, the ferromagnetic particles 3 are fixed as they are, and therefore the conductive circuit remains formed even if the action of the magnetic field is released.
【０００９】また請求項２の導電性接着剤は、強磁性粒
子３の表面に金、銀等の高導電性メッキ層４を形成して
いるので、上記導電回路の導電性の向上を図れる。Further, in the conductive adhesive of the second aspect, since the highly conductive plating layer 4 of gold, silver or the like is formed on the surface of the ferromagnetic particles 3, the conductivity of the conductive circuit can be improved.
【００１０】[0010]
【実施例】次にこの発明の導電性接着剤及び接着方法の
具体的な実施例について、図面を参照しつつ詳細に説明
する。図１は磁場を作用させる以前の接着剤層の内部状
態を、図２は磁場を作用させている接着剤層の内部状態
をそれぞれ模式的に示す断面図である。両図において、
１、２は導電性を有する部材（導電体）であり、５は
熱、紫外線、超音波等によって硬化する接着剤である。
この接着剤５中には、図１に示すように、その表面に高
導電性メッキ層４が形成され、強磁性を有する金属粒子
（強磁性粒子）３を分散させている。この強磁性金属粒
子３は、粒径が２０〜３０μｍ程度であり、その材質は
鉄、ニッケル、コバルト及びこれらの合金等である。な
お分散量は接着剤５の粘度、磁場の強さ等によって調節
するものである。また高導電性メッキ層４は、例えば
金、銀によって形成されている。Next, specific examples of the conductive adhesive and the bonding method of the present invention will be described in detail with reference to the drawings. FIG. 1 is a sectional view schematically showing the internal state of the adhesive layer before the magnetic field is applied, and FIG. 2 is a sectional view schematically showing the internal state of the adhesive layer being operated by the magnetic field. In both figures,
Reference numerals 1 and 2 denote conductive members (electric conductors), and 5 denotes an adhesive that is cured by heat, ultraviolet rays, ultrasonic waves, or the like.
As shown in FIG. 1, a highly conductive plating layer 4 is formed on the surface of the adhesive 5, and metal particles (ferromagnetic particles) 3 having ferromagnetism are dispersed therein. The ferromagnetic metal particles 3 have a particle size of about 20 to 30 μm, and the material thereof is iron, nickel, cobalt and alloys thereof. The amount of dispersion is adjusted by the viscosity of the adhesive 5 and the strength of the magnetic field. The high-conductivity plating layer 4 is made of, for example, gold or silver.
【００１１】以上のように図１は上記接着剤５を部材
１、２間に介装した状態、つまり強磁性金属粒子３が分
散する未硬化の接着剤５を一方の部材１の下面１ｂに塗
布し、この塗布面に他方の部材２の上面２ａが密接する
ように押圧した状態を示すものである。上記の接着剤５
において、塗布後、接着剤が未硬化のときに一方の部材
１から他方の部材２方向に磁場を作用させると、強磁性
金属粒子３は強磁性を有するので磁化される。このため
図２に示すように、強磁性金属粒子３は一端側に偏在す
ることなく、上記磁束の方向に沿うように連接して柱状
化し、一方の部材１の下面１ｂと他方の部材２の上面２
ａを接続することになる。この強磁性金属粒子３はその
表面に金銀等の高導電率を有する導電性メッキ層４を形
成しているので、強磁性金属粒子３が連接して柱状化す
ることによって、一方の部材１の下面１ｂから他方の部
材２の上面２ａに至る導電回路が形成されることにな
る。そして磁場の作用を継続したままで接着剤５に熱、
紫外線、超音波等を作用させて硬化させると、強磁性金
属粒子３はそのままの状態で固定されるので導電回路も
固定できる。したがって磁場の作用を解除しても導電回
路は壊れることはない。As described above, FIG. 1 shows a state in which the adhesive 5 is interposed between the members 1 and 2, that is, the uncured adhesive 5 in which the ferromagnetic metal particles 3 are dispersed is attached to the lower surface 1b of one member 1. It shows a state in which the upper surface 2a of the other member 2 has been applied and pressed so that the upper surface 2a of the other member 2 closely contacts the applied surface. Adhesive 5 above
In, when a magnetic field is applied from one member 1 to the other member 2 while the adhesive is uncured after application, the ferromagnetic metal particles 3 have magnetism and thus are magnetized. Therefore, as shown in FIG. 2, the ferromagnetic metal particles 3 are not unevenly distributed on one end side but are connected and columnar along the direction of the magnetic flux, and the lower surface 1b of one member 1 and the other member 2 are formed. Upper surface 2
a will be connected. Since the ferromagnetic metal particles 3 have a conductive plating layer 4 having high conductivity such as gold and silver formed on the surface thereof, the ferromagnetic metal particles 3 are connected to form a columnar shape, so that one member 1 A conductive circuit from the lower surface 1b to the upper surface 2a of the other member 2 is formed. Then, heat the adhesive 5 while continuing the action of the magnetic field,
If the ferromagnetic metal particles 3 are fixed as they are by applying ultraviolet rays, ultrasonic waves, or the like, the conductive circuit can also be fixed. Therefore, even if the action of the magnetic field is released, the conductive circuit is not broken.
【００１２】以上の説明のように上記実施例における導
電性接着剤及び接着方法においては、接着剤５を塗布後
未硬化のうちに一方の部材１から他方の部材２の方向に
磁場を作用させて、接着剤５中の強磁性粒子３によって
一方の部材１から他方の部材２へ至る導電回路を形成
し、その後接着剤５を硬化させることによって上記導電
回路を固定するようにしているので、両部材１、２間の
導通を確実に得ることができる。As described above, in the conductive adhesive and the bonding method in the above embodiments, the magnetic field is applied from one member 1 to the other member 2 while the adhesive 5 is not yet cured after being applied. Then, the conductive particles from the one member 1 to the other member 2 are formed by the ferromagnetic particles 3 in the adhesive 5, and the adhesive 5 is cured to fix the conductive circuit. It is possible to reliably obtain conduction between the members 1 and 2.
【００１３】また磁場の作用によって強磁性金属粒子３
を連接して柱状化し導電回路を形成するので、強磁性金
属粒子３の含有量は、導電回路の形成に必要な量だけで
充分であり、従来のようにその量を余分に増加させなく
ても導通を確実に得ることができる。したがって含有量
の増加による接着剤５の接着力の低下を抑制できる。Ferromagnetic metal particles 3 are also generated by the action of a magnetic field.
Since they are connected to form a columnar shape to form a conductive circuit, the content of the ferromagnetic metal particles 3 is sufficient only for forming the conductive circuit, and the amount is not increased excessively as in the conventional case. Can surely obtain conduction. Therefore, it is possible to suppress the decrease in the adhesive strength of the adhesive 5 due to the increase in the content.
【００１４】そして強磁性金属粒子３の表面には高導電
性のメッキ層４を形成しているので、この強磁性金属粒
子３が連接して柱状化して形成する導電回路の導電性を
向上できる。このため一段と確実な導通を得ることがで
きる。Since the highly conductive plating layer 4 is formed on the surface of the ferromagnetic metal particles 3, the conductivity of the conductive circuit formed by connecting the ferromagnetic metal particles 3 into a columnar shape can be improved. . Therefore, more reliable conduction can be obtained.
【００１５】[0015]
【発明の効果】以上のように請求項１の導電性接着剤及
び請求項３の接着方法では、接着剤が未硬化のうちに磁
場を作用させることによって強磁性粒子による導電回路
を形成し、その後接着剤を硬化させることによってこの
回路を固定するようにしているので、両導電体間の導通
を確実に得ることができる。さらに強磁性粒子の含有量
は導電回路の形成に必要な量のみでよいので、接着剤の
接着力の低下を抑制できる。As described above, in the conductive adhesive of claim 1 and the bonding method of claim 3, a magnetic field is applied while the adhesive is uncured to form a conductive circuit by ferromagnetic particles, After that, since the circuit is fixed by hardening the adhesive, it is possible to surely obtain conduction between both the conductors. Further, since the content of the ferromagnetic particles is only required to form the conductive circuit, it is possible to suppress the decrease in the adhesive force of the adhesive.
【００１６】また請求項２のようにすれば、一段と確実
な導通を得ることができる。According to the second aspect, more reliable conduction can be obtained.
【図１】この発明の実施例の磁場作用前の接着剤層の内
部状態を模式的に示す断面図である。FIG. 1 is a sectional view schematically showing the internal state of an adhesive layer before the action of a magnetic field according to an example of the present invention.
【図２】上記実施例の磁場作用後の接着剤層の内部状態
を模式的に示す断面図である。FIG. 2 is a cross-sectional view schematically showing the internal state of the adhesive layer after the action of a magnetic field in the above example.
【図３】従来例の使用状態を説明する図である。FIG. 3 is a diagram illustrating a usage state of a conventional example.
１ 導電体 ２ 導電体 ３ 強磁性粒子 ４ 高導電性メッキ層 ５ 接着剤 1 Conductor 2 Conductor 3 Ferromagnetic Particle 4 Highly Conductive Plating Layer 5 Adhesive
Claims (3)
て、この両導電体（１）（２）を導通可能に接着固定す
る導電性接着剤において、未硬化接着剤（５）に、少な
くとも表面が導電性を有する強磁性粒子（３）を分散さ
せていることを特徴とする導電性接着剤。1. A conductive adhesive, which is interposed between a pair of conductors (1) and (2) to bond and fix both conductors (1) and (2) in a conductive manner, wherein an uncured adhesive ( 5) A conductive adhesive characterized in that at least ferromagnetic particles (3) having conductivity on the surface are dispersed.
等の高導電性メッキ層（４）を形成したことを特徴とす
る請求項１の導電性接着剤。2. The conductive adhesive according to claim 1, wherein a highly conductive plating layer (4) of gold, silver or the like is formed on the surface of the ferromagnetic particles (3).
接着固定する接着方法において、未硬化接着剤（５）
に、少なくとも表面が導電性を有する強磁性粒子（３）
を分散し、この強磁性粒子（３）が分散している未硬化
接着剤（５）を上記両導電体（１）（２）間に介装し、
一方の導電体（１）から他方の導電体（２）方向に磁場
を作用させ、上記磁場を作用させた状態で上記未硬化接
着剤（５）を硬化させることを特徴とする接着方法。3. An uncured adhesive (5) in a bonding method for bonding and fixing a pair of conductors (1) and (2) in a conductive manner.
And ferromagnetic particles having at least surface conductivity (3)
And the uncured adhesive (5) in which the ferromagnetic particles (3) are dispersed are interposed between the both conductors (1) and (2),
A bonding method, wherein a magnetic field is applied from one conductor (1) to the other conductor (2), and the uncured adhesive (5) is cured in the state where the magnetic field is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31259492A JPH06122857A (en) | 1992-10-09 | 1992-10-09 | Conductive adhesive and method for adhering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31259492A JPH06122857A (en) | 1992-10-09 | 1992-10-09 | Conductive adhesive and method for adhering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06122857A true JPH06122857A (en) | 1994-05-06 |
Family
ID=18031083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31259492A Pending JPH06122857A (en) | 1992-10-09 | 1992-10-09 | Conductive adhesive and method for adhering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06122857A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5769996A (en) * | 1994-01-27 | 1998-06-23 | Loctite (Ireland) Limited | Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors |
| US5851644A (en) * | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
| US5916641A (en) * | 1996-08-01 | 1999-06-29 | Loctite (Ireland) Limited | Method of forming a monolayer of particles |
| US6180226B1 (en) | 1996-08-01 | 2001-01-30 | Loctite (R&D) Limited | Method of forming a monolayer of particles, and products formed thereby |
| JP2002158051A (en) * | 2000-11-17 | 2002-05-31 | Jsr Corp | Anisotropic conductive sheet |
| US6402876B1 (en) | 1997-08-01 | 2002-06-11 | Loctite (R&D) Ireland | Method of forming a monolayer of particles, and products formed thereby |
| KR20020075329A (en) * | 2002-08-12 | 2002-10-04 | 최장렬 | Adhesives Contained Ferromagnetic Substance |
| US6977025B2 (en) | 1996-08-01 | 2005-12-20 | Loctite (R&D) Limited | Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
-
1992
- 1992-10-09 JP JP31259492A patent/JPH06122857A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5769996A (en) * | 1994-01-27 | 1998-06-23 | Loctite (Ireland) Limited | Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors |
| US6110399A (en) * | 1994-01-27 | 2000-08-29 | Loctite (Ireland) Limited | Compositions and method for providing anisotropic conductive pathways and bonds between two sets of conductors |
| US5851644A (en) * | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
| US6149857A (en) * | 1995-08-01 | 2000-11-21 | Loctite (R&D) Limited | Method of making films and coatings having anisotropic conductive pathways therein |
| US5916641A (en) * | 1996-08-01 | 1999-06-29 | Loctite (Ireland) Limited | Method of forming a monolayer of particles |
| US6180226B1 (en) | 1996-08-01 | 2001-01-30 | Loctite (R&D) Limited | Method of forming a monolayer of particles, and products formed thereby |
| US6977025B2 (en) | 1996-08-01 | 2005-12-20 | Loctite (R&D) Limited | Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
| US6402876B1 (en) | 1997-08-01 | 2002-06-11 | Loctite (R&D) Ireland | Method of forming a monolayer of particles, and products formed thereby |
| JP2002158051A (en) * | 2000-11-17 | 2002-05-31 | Jsr Corp | Anisotropic conductive sheet |
| KR20020075329A (en) * | 2002-08-12 | 2002-10-04 | 최장렬 | Adhesives Contained Ferromagnetic Substance |
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