JPH06120305A - Jig for testing electrical characteristics of semiconductor devices - Google Patents

Abstract

(57) [Summary] [Object] To provide an inspection jig capable of surely inspecting the electrical characteristics of a semiconductor device in a non-packaged state without damaging the semiconductor device. A recess 10 for receiving the solder ball electrode 50 is provided at a corresponding position of the jig body 1, and the inner surface of the recess 10 is covered with a mortar-shaped conductive layer 13A and a cylindrical conductive layer 13B.
By electrically connecting the external electrode 12 to the cylindrical conductive layer 13B via the lead wiring 14, the solder ball electrode 50 electrically contacting the recess 10 and the external electrode 12 are conductively connected. In addition, the vacuum path 11 is connected to the vacuum suction device 6
By pulling a vacuum with
I tried to attract. [Effect] Since the semiconductor device is attracted to the inspection jig by the vacuum suction, the inspection jig and the solder ball electrode can be reliably electrically contacted with each other, and the inspection jig and the semiconductor device can be connected to each other. It is possible to prevent the positional deviation from occurring.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor technology and a technology particularly effective when applied to a semiconductor device inspection technology.
For example, the present invention relates to an inspection jig useful for inspecting electrical characteristics of a semiconductor device having a solder ball electrode.

[0002]

2. Description of the Related Art Conventionally, a semiconductor device on which a highly integrated circuit is formed is shipped to a user in the state of a semiconductor package sealed with a resin or ceramic. The inspection has been performed in the state of a semiconductor package in which the semiconductor device is enclosed in a package, not in the unpackaged semiconductor device alone. That is, each of the leads of the semiconductor package is electrically connected to each of the terminals for inspection provided in the inspection device, and the terminals of the inspection device and the electrodes of the semiconductor device are electrically connected to each other through the terminals and the leads. By exchanging signals,
The electrical characteristics were measured. Regarding the connection between the lead and the terminal, for example, in the case of a semiconductor package for surface mounting in which a solder ball electrode is used as the lead, a probe needle to be the terminal of the inspection device is used with a spring or the like for the solder ball electrode. It is mechanically pressed.

By the way, in recent years, in order to further miniaturize various products on which semiconductor devices are mounted, a technique of mounting unpackaged semiconductor devices, that is, semiconductor chips on the mounting boards of those products has been considered. There is. In such a chip direct mounting technique, a flip chip type semiconductor device in which a solder ball electrode (solder bump) is formed on each electrode of the semiconductor device is used.

[0004]

However, in order to inspect the electrical characteristics of the semiconductor device in the non-packaging state by applying the above-described technique for inspecting the electrical characteristics of the semiconductor package, the following problems are encountered. There is a point. That is, the problem is that the size and pitch of the solder ball electrodes in the semiconductor device (distance between the solder ball electrodes adjacent to each other) is extremely smaller than the size and pitch of the solder ball electrodes of the semiconductor package. Not only is it very difficult to make sure that all probe needles are in contact with all solder ball electrodes and to electrically connect them, but the tip of the probe needle is only slightly displaced from the semiconductor device. Therefore, the surface of the semiconductor device may be damaged or the surface of the semiconductor device may be contaminated.

The present invention has been made in view of the above circumstances, and the use thereof does not damage a semiconductor device,
It is a main object to provide a jig for inspecting electric characteristics of a semiconductor device, which can surely inspect the electric characteristics of a semiconductor device in a non-packaging state. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0006]

The typical ones of the inventions disclosed in the present application will be outlined below. That is, in the jig for inspecting the electrical characteristics of the semiconductor device of the present invention, a concave portion for receiving the solder ball electrode of the semiconductor device is provided in a corresponding portion of the jig body, and the inner surface of the concave portion is covered with a metal thin film. By electrically connecting the external electrode to the metal thin film via the lead wiring, the solder ball electrode electrically contacting the recess and the external electrode are conductively connected. Further, by connecting a vacuum path communicating with the recess to a vacuum suction device, the space closed by the recess and the solder ball electrode is vacuum-sucked.

[0007]

If the inspection jig of the above-mentioned means is used, the solder ball electrode of the semiconductor device enters into the concave portion of the jig body in an electrically contacting state, and the semiconductor device is attracted to the inspection jig by vacuum suction. To be

[0008]

(First Embodiment) A first embodiment of a jig for inspecting electric characteristics of a semiconductor device according to the present invention (hereinafter simply referred to as "inspection jig") will be described with reference to FIGS. And described below. Among them, FIG. 1 is a vertical cross-sectional view of a state in which an inspection jig is attached to a semiconductor device, FIG. 2 is a partially enlarged vertical cross-sectional view of FIG. 1, and FIG. FIG. 4 is a schematic diagram of an inspection device to which an inspection jig is connected.

This inspection jig 100 has a solder ball electrode 5
The jig body 1 is an inspection jig used to inspect the electrical characteristics of the semiconductor device 5 having 0, and the jig body 1 is not particularly limited in its number as shown in FIG. It has a multi-layered structure and is made up of a first-layer surface layer panel 1A facing the semiconductor device 5 and second-layer and lower wiring layer panels 1B, 1C, 1D. Further, the surface layer panel 1A is provided with the recesses 10 capable of electrically contacting the solder ball electrodes 50 at a plurality of positions corresponding to the solder ball electrodes 50, and each of the recesses 10 is closed by the solder ball electrodes 50. A vacuum path 11 that draws a vacuum in the recess 10 is provided. In addition, the back surface of the jig body 1, that is, the fourth
External electrodes 12 electrically connected to the recesses 10 are provided on the surface of the wiring layer panel 1D of the second layer so as to be exposed at least by the number corresponding to the recesses 10.

As shown in FIGS. 2 and 3, the recess 10 is formed by connecting a through portion 10B to a receiving portion 10A for receiving the solder ball electrode 50. The receiving portion 10A is
It is shaped like a mortar and the surface 1a of the surface panel 1A
In, the opening has a diameter larger than that of the solder ball electrode 50, and the diameter gradually decreases toward the wiring layer panel 1B. The penetrating portion 10B is hollow and vertically penetrates the surface layer panel 1A. The inner surfaces of the receiving portion 10A and the penetrating portion 10B are respectively continuous mortar-shaped conductive layers 1 made of a conductor such as metal.
It is covered with 3A and the cylindrical conductive layer 13B so that the solder ball electrode 50 electrically contacts the mortar-shaped conductive layer 13A.

The vacuum path 11 has all the recesses 1 formed in the surface layer panel 1A inside the surface layer panel 1A.
0, ... Are connected to the through portions 10B ,.
The terminal end 11a is connected to a vacuum suction device 6 (see FIG. 4) such as a rotary pump provided outside the inspection jig 100 via a tube 60.

The external electrodes 12 are connection terminals 7 of a measuring device 7 (see FIG. 4) provided outside the inspection jig 100.
0 is electrically connected to the cylindrical conductive layer 13B of the concave portion 10 and has a lead wiring 14 of a multilayer wiring structure.
Conductive connection by. That is, from the end of the cylindrical conductive layer 13B to the surface layer panel 1A and the wiring layer panel 1B.
The horizontal wiring portion 14A (wiring layer) of the first layer is provided at the boundary portion between the wiring layer panels 1B and 1C and the boundary portion of the wiring layer panels 1C and 1D. Portion 14B (wiring layer) and the horizontal wiring portion 14 of the third layer
C (wiring layer) is provided. First horizontal wiring section 14
A, horizontal wiring portion 14B of the second layer, horizontal wiring portion 14B of the second layer
And the horizontal wiring portion 14C of the third layer, and the horizontal wiring portion 14C of the third layer and the external electrode 12, respectively.
Vertical wiring portions 14D, 14E, 1 vertically penetrating C, 1D
It is electrically connected by 4F.

As shown in FIG. 4, the measuring device 7 is connected to a control device 8 such as a computer, and the control device 8 turns on / off the electric power such as current and voltage whose magnitude is controlled. A signal is output to each external electrode 12, ... Of the inspection jig 100. Further, an electric signal such as a current or a voltage caused in the semiconductor device 5 is detected by the outputted electric signal and is outputted to the control device 8. It goes without saying that the control device 8 is connected with an operation device 80 such as a keyboard and a display device 85 such as a display. These measuring devices 7,
An inspection device is constructed by the control device 8, the vacuum suction device 6, and the inspection jig 100.

Next, a method of manufacturing the inspection jig 100 having the above structure will be described. First, after the receiving portion 10A and the penetrating portion 10B are perforated to form the concave portion 10 and the vacuum path 11 is perforated to the surface layer panel 1A having an insulating property made of a glass plate material or the like, ,
The recess 10 is formed by PVD (Physi
cal vapor deposition (CVD) and chemical vapor deposition (CVD)
mortar-shaped conductive layer 13A
And the cylindrical conductive layer 13B. Alternatively, the mortar-shaped conductive layer 13A and the cylindrical conductive layer 13B may be coated by an electroless plating method or the like.

Next, the lead wiring 14 is formed in the same manner as the aluminum multi-layer wiring forming technique in the semiconductor device. Specifically, PV is provided on the back surface 1b of the surface layer panel 1A.
A conductor layer such as aluminum is deposited by the D method or the CVD method, and the first lateral wiring portion 14A having a predetermined wiring pattern is formed by the photolithography technique using a photoresist. Then, after removing the photoresist, PIQ (Polyimido Isoindro) having an insulating property is formed on the photoresist.
Quinazolinedione) etc. are applied and the wiring layer panel 1
Along with B, a through hole for the vertical wiring portion 14D is provided which vertically penetrates the wiring layer panel 1B by photolithography and etching. Further, after removing the photoresist, a second-layer horizontal wiring portion 14B is formed thereon in the same manner as the first-layer horizontal wiring portion 14A. At this time, the vertical wiring portion 14D is also made.

Similarly, if the wiring layer panels 1C and 1D, the horizontal wiring portion 14C of the third layer, the vertical wiring portions 14E and 14F and the external electrodes 12 are formed, the inspection jig 100 is completed.

The inspection jig 10 produced as described above
When using 0, as shown in FIG.
While connecting the tube 60 of the vacuum suction device 6 to
The connection terminal 70 of the measuring device 7 may be conductively connected to the external electrode 12 with solder or a conductive paste.

(Second Embodiment) A second embodiment of the inspection jig according to the present invention is shown in FIGS. 5 and 6 and will be described below.
FIG. 5 is a vertical sectional view showing a state in which the inspection jig is attached to the semiconductor device, and FIG. 6 is a partially enlarged vertical sectional view of FIG. The same members and devices as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The inspection jig 200 differs from the inspection jig 100 of the first embodiment in the following points. That is, the inspection jig 2 is opened by opening the vacuum path 11 in a portion of the surface 1 a of the jig body 1 other than the recessed portion 10 and drawing a vacuum space A between the jig body 1 and the semiconductor device 5.
The point is that the semiconductor device 5 is attracted to 00.

The vacuum path 11 extends from the surface 1a to the vacuum path 1
Vacuum vertical hole 15 that has been drilled to reach 1 ...
Is connected in communication with the gap space A. It is preferable that the vacuum vertical hole portions 15, ... Are provided so as to be located between the solder ball electrodes 50 ,.

The penetrating portion 10B of the recess 10 is the recess 1
0 mortar-shaped conductive layer 13A and first lateral wiring portion 14
It is filled with a conductor 13C such as aluminum which is conductively connected to A. The conductor 13C is formed by being deposited on the through portion 10B when the mortar-shaped conductive layer 13A or the horizontal wiring portion 14A of the first layer is applied. If the mortar-shaped conductive layer 13A and the first lateral wiring portion 14A are conductively connected, the conductor 13C does not necessarily have to be filled in the entire penetrating portion 10B.

According to the first and second embodiments described above, the recess 1
0 into the solder ball electrode 50 of the semiconductor device 5 in an electrically contacting state, and the semiconductor device 5 is attracted to the inspection jig 100 (200) by the vacuum suction device 6 via the vacuum path 11. The electrical contact between the solder ball electrode 10 and the solder ball electrode 50 is ensured, and the electrical contact resistance is reduced.
The positional deviation between (200) and the semiconductor device 5 is prevented from occurring, and the electrical characteristic inspection of the semiconductor device 5 can be reliably performed without damaging the semiconductor device 5.

Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say. For example, in the above-described first and second embodiments, the jig body 1 has the four-layer structure including the surface layer panel 1A and the wiring layer panels 1B, 1C, 1D, but is not limited to this. Needless to say, the number of layers may be 3 or less or 5 or more, and may be a single-layer structure including only the surface layer panel 1A. Further, although the lead-out wiring 14 has a multilayer wiring structure, unless the recess 10 and the external electrode 12 are electrically connected and different lead-out wirings 14 and 14 are in contact with each other and electrically short-circuited, It may have any structure. Furthermore, the surface layer panel 1A and the wiring layer panel 1
B, 1C, and 1D are not limited to those in the above-described embodiment as long as they are materials having an electrical insulating property. External electrode 12, mortar-shaped conductive layer 13A, cylindrical conductive layer 13B, conductor 13C
The lead wiring 14 is not limited to that of the above embodiment as long as it has conductivity. Furthermore, instead of conductively connecting the connection terminal 70 of the measuring device 7 to the external electrode 12 by soldering or the like, a probe needle to be a terminal of the inspection device is mechanically connected to the external electrode 12 mechanically by using a spring or the like as in the conventional case. It goes without saying that they may be pressed.

In the above description, the invention made by the present inventor was mainly applied to the electrical characteristic inspection of a single semiconductor device in a non-packaging state, which is the field of application of the invention. The present invention is not limited to this, and can be used for the electrical characteristic inspection of a packaged semiconductor device on which the semiconductor device is mounted.

[0025]

The effects obtained by the representative one of the inventions disclosed in the present application will be briefly described as follows. That is, when measuring the electrical characteristics of a semiconductor device in a non-packaging state, if this inspection jig is used, the solder ball electrode of the semiconductor device enters the recess of the jig body in an electrically contacted state, Since the semiconductor device is attracted to the inspection jig by the vacuum suction, the concave portion and the solder ball electrode are surely electrically contacted with each other, and the electrical contact resistance is reduced. The positional deviation between the semiconductor device and the semiconductor device can be prevented, and the electrical characteristic inspection of the semiconductor device can be reliably performed without damaging the semiconductor device.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a state in which an inspection jig according to a first embodiment is attached to a semiconductor device.

FIG. 2 is a partially enlarged vertical sectional view of FIG.

FIG. 3 is a cross-sectional perspective view of a main part of an inspection jig.

FIG. 4 is a schematic diagram of an inspection device to which an inspection jig is connected.

FIG. 5 is a vertical cross-sectional view showing a state in which an inspection jig according to a second embodiment is attached to a semiconductor device.

6 is a partially enlarged vertical sectional view of FIG.

[Explanation of symbols]

 1 jig body 1A surface layer panel (panel) 1B, 1C, 1D wiring layer panel (panel) 6 vacuum suction device 10 recessed portion 11 vacuum path 12 external electrode 13A mortar-shaped conductive layer (conductive layer) 13B cylindrical conductive layer (conductive layer) ) 14A, 14B, 14C horizontal wiring portion (wiring layer) 14 lead wiring 50 solder ball electrode 100, 200 inspection jig

Claims (3)

[Claims] 1. A plurality of recesses are formed on one surface of the jig body in correspondence with the solder ball electrodes, and a conductive layer electrically contacting the solder ball electrodes is formed on the inner surface of the recesses. A number of external electrodes corresponding to the recesses are formed on the other surface of the jig body, and lead wires for electrically connecting the conductive layers in the recesses to the external electrodes are formed in the jig body. A jig for inspecting the electrical characteristics of a semiconductor device. 2. A vacuum path, which is connectable to a vacuum suction device and vacuum-sucks a space closed by the recess and the solder ball electrode, is provided in the jig body. A jig for inspecting the electrical characteristics of the semiconductor device according to claim 1. 3. The jig body is formed by stacking a plurality of panels, and each of the conductive layers in the recess and the external electrode has a lead wiring of a multi-layer wiring structure including a wiring layer formed in each panel. 3. The jig for inspecting the electrical characteristics of a semiconductor device according to claim 1, wherein the jig is connected through the jig.