JPH0611337U - Array type surface mount components - Google Patents

Abstract

(57) [Abstract] [Purpose] To obtain an array type surface mount component that can be mounted on a circuit board or the like with a mounting electrode having a small area. [Structure] Mounting surface 1a of array type electromagnetic interference filter 1
Are provided with pedestals 10a, 10b, 11a to 11d.
Ground terminal electrodes 2a and 2b are respectively formed on the surfaces of the pedestals 10a and 10b, and a pair of input / output terminal electrodes 3a, 3b, 4a, 4b and 5a are formed on the surfaces of the pedestals 11a to 11d.
5b, 6a, 6b are formed. The terminal electrodes 2a to 6b are relay conductors 18a to 19 provided on the side surfaces of the filter 1, respectively.
It is electrically connected to the internal electrode arranged inside the filter 1 via d and the like. Further, the relay conductors 18a to 19d
Etc. are covered with an insulating film 12 provided on the side surface of the filter 1.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an array type surface mount component such as a filter, a varistor, a capacitor, a resistor and an inductor.

[0002]

[Prior art and problems]

 Conventionally, for example, the array type surface mount component shown in FIG. 8 is known. This array type surface mount component is an electromagnetic interference filter 60 with four built-in elements, and ground terminal electrodes 65a and 65b are provided at both ends, and four pairs of input / output terminal electrodes 61a, 65b are provided between the ground terminal electrodes 65a and 65b. 61b, 62a, 62b, 63a, 63b, 64a, 64b are provided at equal intervals. These terminal electrodes 61a to 65b are arranged on the mounting surface 60a of the filter array 60 and the four side surfaces around the mounting surface 60a.

As shown in FIG. 9, the filter 60 is surface-mounted on a circuit board 70. That is, the terminal electrodes 61a to 65b of the filter 60 are connected to the mounting electrodes 71a, 71b, 71c, 71d, 71e, 71f provided on the surface of the circuit board 70 via the solder 75. However, in this case, the area where the mounting electrodes 71a to 71f occupy the circuit board 70 together with the filter 60 is about 1.7 times the mounting surface 60a of the filter 60. Therefore, the circuit board 70 must be designed in a large area, which hinders the downsizing of the circuit board.

Therefore, an object of the present invention is to provide an array-type surface mount component that can be mounted on a circuit board or the like with a mounting electrode having a small area.

[0005]

[Means and actions for solving the problem]

 In order to solve the above problems, an array-type surface mount component according to the present invention comprises: (a) a convex pedestal portion provided on the mounting surface; and (b) a terminal electrode provided only on the surface of the pedestal portion. It is characterized by having.

In the above structure, since the terminal electrodes are provided only on the mounting surface, the solder fillet is reduced and the area of the mounting electrode provided on the circuit board or the like can be reduced. Further, by providing the pedestal portion, a groove is formed between the pedestal portions, so that the flux residue during soldering is easily cleaned. Further, the creepage distance between the adjacent terminal electrodes is increased by the height of the pedestal portion, and the insulation resistance between the terminal electrodes is increased.

In addition, in the array-type surface mount component according to the present invention, the electrical connection between the terminal electrode and the internal electrode disposed inside the component is achieved by the relay conductor disposed on the side surface of the component or inside the component. It is performed using the provided through hole.

[0008]

【Example】

 An embodiment of an array type surface mount component according to the present invention will be described below with reference to the accompanying drawings. [First Embodiment, FIGS. 1 to 4] A first embodiment will be described by taking an array type electromagnetic interference filter in which a terminal electrode and an internal electrode are electrically connected without using a through hole as an example.

As shown in FIGS. 1 to 3, the mounting surface 1a of the array type electromagnetic interference filter 1 is provided with pedestal portions 10a and 10b for ground terminals at both ends thereof, respectively. , 10b, pedestals 11a, 11b, 11c, 11d for input / output terminals are provided at regular intervals. Ground terminal electrodes 2a and 2b are formed on the surfaces of the pedestals 10a and 10b by a method such as sputtering or vapor deposition. Similarly, a pair of input / output terminal electrodes 3a, 3b, 4a, 4b, 5a, 5b, 6a, 6b are formed on the surfaces of the pedestals 11a to 11d, respectively. A groove 8 is formed between each pedestal portion.

The filter 1 is a stack of internal signal electrodes 14, 15, 16, 17 and an internal ground electrode 21 and an insulating material. The terminal electrode 2a is electrically connected to one end of the internal ground electrode 21 via the relay conductor 18a provided on the side surface of the filter 1, and the terminal electrode 2b has the relay conductor 18b provided on the side surface of the filter 1. It is electrically connected to the other end of the internal ground electrode 21 via the.

The terminal electrodes 3a, 4a, 5a, 6a are respectively connected to the end portions of the internal signal electrodes 14, 15, 16, 17 via relay conductors 19a, 19b, 19c, 19d provided on the side surfaces of the filter 1. The terminal electrodes 3b, 4b, 5b, 6b are electrically connected to the internal signal electrodes 14, 15, 16, 17 via relay conductors 20a, 20b, 20c, 20d provided on the side surfaces of the filter 1, respectively. It is electrically connected to the other end. The relay conductors 18 a to 20 d are covered with the insulating film 12 provided on the side surface of the filter 1.

As shown in FIGS. 2 and 3, the filter 1 is surface-mounted on the circuit board 25. That is, it is connected via solder 29 to the mounting electrodes 27a, 27b, 27c, 27d, 27e and 27f provided on the surface of the circuit board 25 in accordance with the terminal electrodes 2a to 6b of the filter 1. Since the terminal electrodes 2a to 6b are formed only on the mounting surface 1a of the filter 1 and not on the side surface of the filter 1, almost no solder fillet is generated, and the mounting electrodes 27a to 27f have a small area. You can Therefore, the area where the mounting electrodes 27a to 27f occupy the circuit board 25 together with the filter 1 is substantially the same as the mounting surface 1a of the filter 1.

Further, by forming the pedestal portions 10a to 11d, the groove 8 is formed between the adjacent pedestal portions, and the flux residue at the time of soldering is easily cleaned. Furthermore, the creepage distance between the adjacent terminal electrodes 2a to 6b is increased by the height of the pedestals 10a to 11d, and the insulation resistance between the terminal electrodes 2a to 6b is increased. As a result, the filter 1 having extremely excellent insulation reliability can be obtained.

FIG. 4 shows an electrical equivalent circuit of the filter 1. This filter 1 has four three-terminal capacitors. [Second Embodiment, FIGS. 5 to 7] A second embodiment will be described by taking an array type electromagnetic interference filter in which a terminal electrode and an internal electrode are electrically connected using a through hole as an example.

As shown in FIGS. 5 to 7, the mounting surface 31a of the electromagnetic interference filter 31 is provided with ground terminal pedestals 40a and 40b at both ends thereof, and the ground terminal pedestal 40a is provided. , 40b, pedestals 41a, 41b, 41c, 41d, 42a, 42b, 42c, 42d for input / output terminals are provided at regular intervals. Ground terminal electrodes 32a and 32b are formed on the surfaces of the ground terminal pedestals 40a and 40b. Similarly, a pair of input / output terminal electrodes 33a, 33b, 34a, 34b, 35a, 35b, 36a, 36b are formed on the surfaces of the pedestals 41a to 42d, respectively.

The filter 31 includes internal signal electrodes 44, 45, 46, 47, an internal ground electrode 51, and an insulating material 53. The terminal electrode 32a is electrically connected to one end of the internal ground electrode 51 through a through hole 55a provided inside the filter 31, and the terminal electrode 32b is provided through a through hole 55b provided inside the filter 31. And is electrically connected to the other end of the internal ground electrode 51. The terminal electrodes 33a, 34a, 35a, 36a are electrically connected to one ends of the internal signal electrodes 44-47 through through holes 56a, 56b, 56c, 56d provided inside the filter 31, respectively, and 33b, 34b, 35b and 36b are electrically connected to the other ends of the internal signal electrodes 44 to 47 through through holes 57a, 57b, 57c and 57d provided inside the filter 31, respectively.

The filter 31 has the same operation and effect as the filter of the first embodiment. [Other Embodiments] The array type surface mount device according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the invention.

The array type surface mount component may be various electronic components such as a varistor, a capacitor, a resistor and an inductor in addition to the filter, and two kinds of electric functional elements (for example, a capacitor and a resistor). It may be an array-type electronic component in which Further, the pedestal portion provided on the mounting surface does not necessarily have to be independently formed for each built-in electric functional element, but may be formed collectively for every two or three electric functional elements.

[0019]

[Effect of device]

 As is clear from the above description, according to the present invention, since the terminal electrodes are arranged only on the mounting surface, the fillet of solder is reduced, and the mounting electrodes provided on the circuit board or the like can be made to have a small area. it can. As a result, the area occupied by the mounting electrodes and the array-type surface mount component on the circuit board, etc., is approximately the same as the mounting surface of the surface mount component.

Further, since the terminal electrode is provided on the surface of the pedestal portion provided on the mounting surface, a groove is formed between the pedestal portions adjacent to each other, and the flux residue at the time of soldering is cleaned. The structure is easy. Further, the creepage distance between the adjacent terminal electrodes is increased by the height of the pedestal portion, and the insulation resistance between the terminal electrodes is increased. Therefore, an array type surface mount device having high electrical reliability between the terminal electrodes can be obtained.

[Brief description of drawings]

FIG. 1 shows a first embodiment of an array type surface mount component according to the present invention, and is a perspective view seen from the mounting surface side.

FIG. 2 is a vertical cross-sectional view taken along line X-X ′ of FIG.

FIG. 3 is a vertical cross-sectional view taken along line Y-Y ′ of FIG.

FIG. 4 is an electrical equivalent circuit diagram of the array type surface mount component shown in FIG.

FIG. 5 is a perspective view showing a second embodiment of an array type surface mount component according to the present invention, as seen from the mounting surface side.

6 is a vertical cross-sectional view taken along line X-X ′ of FIG.

FIG. 7 is a vertical cross-sectional view taken along line Y-Y ′ of FIG.

FIG. 8 shows a conventional example, and is a perspective view seen from the mounting surface side.

9 is a front view of the array type surface mount device shown in FIG. 8. FIG.

[Explanation of symbols]

1 ... Array type electromagnetic interference filter 1a ... Mounting surface 10a, 10b, 11a, 11b, 11c, 11d ... Pedestal part 2a, 2b ... Ground terminal electrode 3a, 3b, 4a, 4b, 5a, 5b, 6a, 6b ... Input / output Terminal electrodes 14, 15, 16, 17 ... Internal signal electrode 21 ... Internal ground electrodes 18a, 18b, 19a-19d, 20a-20d ... Relay conductor 12 ... Insulating film 31 ... Array type electromagnetic interference filter 31a ... Mounting surface 40a, 40b, 41a-41d, 42a-42d ... Pedestal part 32a, 32b ... Ground terminal electrode 33a, 33b, 34a, 34b, 35a, 35b, 3
6a, 36b ... Input / output terminal electrodes 44, 45, 46, 47 ... Internal signal electrode 51 ... Internal ground electrodes 55a, 55b, 56a-56d, 57a-57d ... Through holes

Claims (3)

[Scope of utility model registration request] 1. An array-type surface mount component having a plurality of electric functional elements, comprising: a convex pedestal portion provided on a mounting surface; and a terminal electrode provided only on the surface of the pedestal portion. A characteristic array type surface mount component. 2. A relay conductor disposed on the side surface of the component for electrically connecting the internal electrode and the terminal electrode disposed inside the component, and an insulating film covering the surface of the relay conductor. The array type surface mount component according to claim 1, further comprising: 3. The array-type surface mounting according to claim 1, wherein the internal electrodes arranged inside the component and the terminal electrodes are electrically connected to each other through through holes provided inside the component. parts.