JPH06112313A - Cleavage device for stripe work - Google Patents

Abstract

PURPOSE:To perform cleavage and inspection automatically and speedily by providing a means for detecting a defect of a chip by recognizing the image of the chip and a means for taking out good chips and then aligning them on a chip tray. CONSTITUTION:The title device is provided with a transfer unit for taking out the stripe work on a work tray 45 and then carrying it to a specific position and at the same time for aligning the chips which are cleaved from the work onto a chip tray 46. Then, it is also provided with a cutting unit 16 for cleaving the work by applying it to the work while positioning the work and at the same time swinging a cutter and an image recognition unit 17 for reading the images of the chips. Further, it is provided with a tray guide unit 18 for moving the work tray 45 to an exchange position and a transport position and at the same time switching a plurality of chip trays 46, thus automating cleavage operation easily.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for cleaving a strip-like work for producing a semiconductor laser chip by cleaving a strip-like work such as a crystal bar made of GaAs single crystal. .

[0002]

2. Description of the Related Art For example, when a semiconductor laser chip is manufactured, a multilayer epitaxial layer is formed on the surface of a crystal substrate such as GaAs or Inp, and then this crystal substrate is cleaved into a crystal bar having a constant width. . Further, as shown in FIG. 23 (a), the crystal bar-1 is attached to a band-shaped adhesive tape 2, and as shown in FIG. 23 (b), the adhesive tape 2 is pulled from one end. Then, the crystal bar-1 is pushed from above as indicated by arrows A and A. Then, the crystal bar-1 is split along the linear scratches (cleavage lines) carved on the surface, and the chips 3 ...
Is created. The above cleavage line is drawn on the surface of the crystal bar-1 by point scribing using a scriber.

After the crystal bar-1 is made into chips, the adhesive tape 2 is stretched and the chips 3 are separated as shown in FIG. 23 (c). At this time, as shown in FIG. 23 (c), the chips 3a ...
, But these chips 3a ... Are returned to the step of forming into chips as shown in FIG.
In addition to this, the crystal bar-1 may be cleaved using a knife or a knife.

[0004]

By the way, in the conventional method as described above, the chips 3 ... May be damaged by receiving an excessive force during cleavage. For this reason, after the chips 3 ... Are cracked or chipped, or defects on the chip surface are visually inspected using a microscope, only non-defective chips are selected and arranged on the tray. Therefore, very laborious work is required until the chips 3 are cleaved and aligned on the tray. Moreover, since tweezers were used for handling the chips 3, ...
... was easily scratched, which was a factor for increasing the defect occurrence rate. Moreover, the conventional cleaving work is inefficient because it takes a lot of time for cleaving and inspecting. An object of the present invention is to provide a cleaving device that can perform cleaving and inspection automatically and at high speed.

[0005]

In order to achieve the above object, the present invention takes out strip-shaped works arranged on a work tray and conveys them to a predetermined position.
A transfer unit that aligns the chips cleaved from the work on the chip tray; a cutting unit that positions the work and cleaves the work while swinging the cutter to cleave the work; An image recognition unit for capturing an image, a tray guide unit for moving the work tray between the exchange position and the transport position, and a plurality of chip trays for switching the chip trays are provided. In addition, the present invention enables the cleaving and inspection of the strip work to be performed automatically and at high speed.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. The same parts as those described in the section of the prior art are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 1 shows a first embodiment of the present invention.
Reference numeral 11 in the figure is a cleaving device. This cleavage device 1
1, a transparent or semi-transparent door 13 is arranged on the upper front surface of a rectangular box-shaped main body 12, and a working chamber 14 is formed inside the door 13. Then, in the working chamber 14, as shown in FIG. 2, a transfer unit 15 (as a chip alignment means), a cutting unit 16, a microscope unit 17 as an image recognition unit (and a defect detection means), and a (chip alignment) Tray guide unit 1 (as a means)
8 are provided.

Of these, the transfer unit 15
Are installed on the y-axis table 20 which moves along the x-axis table 19 as shown in FIG. Further, the transfer unit 15 is provided with a bar suction head 21 and a chip suction head 22 facing downward, and each head 21, 22 is connected to a negative pressure source (not shown). The chip suction head 22 is a chip suction nozzle 2 protruding downward.
2a. In addition, each head 21, 22 is a cam 2
It is independently connected to the head drive motors 25 and 26 via 3 and 24, and moves up and down as the cams 23 and 24 rotate.

The cutting unit 16 is shown in FIGS.
As shown in FIG. 6, a positioning slide 27 and a positioning slide 2 for positioning the crystal bar as a strip-shaped work.
7, a pusher 28 arranged in the vicinity of 7, a cutter 29 for cleaving the crystal bar, and a moving base 3 for moving the cutter 29.
0, and a moving stage 31 for adjusting the position of the cutter 29.

The positioning slide 27 has, for example, two plates 32a and 32b (described later) as shown in FIG.
The slanted surface is brought into contact with the upper edge portion of the crystal bar-1 to sandwich the crystal bar-1 from the side. The pusher 28 is a crystal bar.
1 comes into contact with the rear side from the rear, pushes the crystal bar-1, pushes it out to the cleavage position, and then retreats and separates from the crystal bar-1. That is, the crystal bar-1 partially contacts the plates 32a and 32b only in the upper edge portion in the longitudinal direction, and
It is held in a non-fixed state in the front-rear direction.

The cutter 29 is a blade 3 whose tip is sharpened.
3 has a blade 3 attached to the cutter head 34
3 is facing down. The cutter 29 is driven by the linear actuator 35 and swings in the width direction of the crystal bar-1 to cleave the crystal bar-1.

That is, as shown in FIGS. 5 and 6, the cutter 29 is pivotally supported by the cutter head 34 at its upper portion, and the cutter head 34 is pivotally supported by the cutter driving base 36 at its lower portion. The cutter drive base 36 has a linear actuator.
The actuator 35 is fixed via an actuator holder 37, and the linear actuator 35 has a piston 38, which is capable of projecting and retracting, brought into contact with the cutter head 34. further,
A spring 38 is installed between the actuator holder 37 and the cutter head 34.

As shown in FIGS. 7 and 8, the blade 33 of the cutter 29 has a V-shaped cross section at its tip. Furthermore, the blade 33 is stepped, and the side surface 3 of the blade 33 is
Strip-shaped straight portion 40, 40 extending linearly along the width direction of the blade 33 is formed on each of the blades 9, 39 symmetrically with respect to the axis of the blade 33. And this straight part 4
0 and 40 are formed substantially parallel to the axis of the blade 33. That is, the blade 33 dents the portion where the straight portions 40, 40 are located.

The linear actuator 35 is a piston 38.
Is displaced in the protruding direction, the cutter head 34 is pushed by the piston 38, and is rotationally displaced about the connecting portion 41 with the cutter driving base 36. And the cutter head 34
, The horizontal end of the cutter goes down, and the cutter 2
9 is rotationally displaced together with the cutter head 34.

Here, as shown in FIG. 5, the connecting portion 41 between the cutter head 34 and the cutter driving base 36 is substantially level with the surface of the base plate 42 on which the crystal bar-1 is placed. positioned. The base plate 42 is made of a material such as transparent glass, on which the supplied crystal bar-1 is placed.

The locus of movement of the blade 33 of the cutter 29 draws an arc passing through the edge portion of the crystal bar-1 with the connecting portion 41 between the cutter head 34 and the cutter driving base 36 being substantially at the center.
Then, as shown in FIG. 6, the blade 33 moves in the width direction of the crystal bar-1, hits the crystal bar-1, and cuts the crystal bar-1.

As shown in FIGS. 7 and 8, when the blade 33 hits the crystal bar-1 and enters the crystal bar-1, a crack runs in the crystal bar-1, and the crystal bar-1 is cleaved to form a chip. 3 is created. And, even after the crystal bar-1 is cracked, the blade 33
Moves somewhat downward, and further enters between the crystal bar-1 and the chip 3 to separate the crystal bar-1 and the chip 3.

Since the cutter 29 is pivotally supported by the cutter head 34, the impact force when the blade 33 hits the crystal bar-1 is suppressed to a necessary and sufficient level, and an excessive force is applied to the crystal bar-1. It is prevented from joining. Furthermore, the contact depth and contact speed of the blade 33 are adjusted so that excessive internal stress does not occur in the crystal bar-1.

A plate 32 for holding the crystal bar-1
As will be described later, a and 32b are provided with relief grooves for preventing interference with the cutter 29, and the cutter 29 swings without contacting the plates 32 and 32.

The sandwich plates 32a and 32b are shown in FIG.
Further, as shown in FIG. 10, they are formed in a rectangular shape and are arranged in parallel on the base plate 42 and face each other in parallel while being separated from each other. Further, a slide guide path 43 is formed between the sandwiching plates 32a and 32b, and the crystal bar-1 is provided in the slide guide path 43 in the longitudinal direction of the sandwiching plates 32a and 32b. It is supplied while following the direction. Further, the sandwiching plates 32a and 32b move horizontally along the upper surface of the base plate 42 and change the interval between them to adjust the width of the slide guide path 43. Here, the thickness of the sandwich plates 32a and 32b is set to be larger than the thickness of the crystal bar-1.

Further, for example, one sandwiching plate 2b
Is connected to a spring 44 as shown in FIG. 10, and is biased by the spring 44 so as to approach the other sandwiching plate 32a. The one sandwiching plate 32b pressurizes the crystal bar-1 as indicated by an arrow B in FIG.
It is pressed against the 2a.

Clamping inclined surfaces 45a and 45b are formed on the side surfaces of the two clamping plates 32a and 32b facing each other, and the clamping inclined surfaces 45a and 45b are sandwiched between the clamping plates 3.
2a, 32b upper surfaces 46a, 46b to lower surfaces 47a, 4b
It is inclined to gradually separate as it goes to 7b. The sandwiching inclined surfaces 45 a and 45 b are in contact with the upper edge portions 48 and 48 of the crystal bar-1, and the crystal bar-1 is pressed against the base plate 42.

That is, the sandwiching plates 32a, 32b and the crystal bar-1 are in line contact with each other, and the crystal bar-1 has its edge portions 48, 48 in contact with the intermediate portions of the sandwiching inclined surfaces 45a, 45b. There is.

Further, escape grooves 49a and 49b are formed in the sandwiching plates 32a and 32b. This escape groove 4
9a and 49b are upper and lower surfaces 46a, 46b, 47a and 47b of the sandwiching plates 32a and 32b and the sandwiching inclined surface 4.
The openings 5a and 45b are located on the same straight line, face each other, and extend in the width direction of the sandwich plates 32a and 32b. Further, the inner portions of the escape grooves 49a and 49b, that is, the closed ends are formed in a semicircular shape.

The tips of the sandwiching plates 32a, 32b are notched except the sandwiching claws 50a, 50b.
A flank 51 is provided at the tip of the clamping plates 32a and 32b.
a and 51b and position regulation surfaces 52a and 52b are formed. The flanks 51a and 51b are holding bodies 32a and 32b, respectively.
Adjacent to the upper surfaces 46a and 46b of the
They are inclined so as to separate from each other as they move away from 46b. That is, the flanks 51a and 51b are inclined in the opposite direction to the sandwiching inclined surfaces 45a and 45b.

The position restricting surfaces 52a and 52b extend substantially perpendicular to the upper surface of the base plate, and the flanks 51a and 51b.
Is adjacent to. The position regulating surfaces 52a and 52b extend along the longitudinal direction of the sandwich plates 32a and 32b.
Opposite parallel to each other. Here, the position regulation surface 52
Clamping inclined surfaces 45a and 45b are left below a and 52b, and the remaining clamped inclined surfaces 45a and 45b are adjacent to the position regulating surfaces 52a and 52b.

The sandwiching claw portions 50a and 50b are adjacent to the escape grooves 49a and 49b, and the escape grooves 49a and 49b.
Are located closer to the tip ends of the sandwich plates 32a and 32b. The holding claw portions 50a and 50b are the holding inclined surface 4
Edges 48, 48 of the crystal bar-1 are pressed by 5a, 45b, and they project so as to approach each other while covering a part of the crystal bar-1.

Here, the sandwiching inclined surfaces 45a and 45b of the sandwiching plates 32a and 32b, the flanks 51a and 51b, and the position restricting surfaces 52a and 52b are each smoothly mirror-finished.

The microscope unit 17 is shown in FIGS.
As shown in FIG.
A small microscope 54 is provided as a defect detecting unit with the arrow pointing upward. The small microscope 54 observes the cleavage position of the crystal bar-1 through the base plate 42, captures the state of cleavage and the image of the cleaved chip 3 and sends it to an image processing unit (not shown). Then, the presence or absence of the shape defect or the surface defect of the chip 3 is judged by the image processing unit.

As shown in FIG. 12, the tray guide unit 18 includes bar trays 55 and 4 as work trays.
One chip tray 56 ... (Only two are shown) are mounted. Further, the tray guide unit 18 moves the bar tray 55 by using the air cylinder 57 as a drive source,
The position of the bar tray 55 is switched between the exchange position and the transfer position. Also, the chip trays 56 ...
The index tables 59 are mounted on the index table 59 at substantially equal intervals and are guided to the vicinity of the bar tray 55 one by one as the index table 59 is rotationally displaced.

Further, tray sensors 60 ... Are provided below the index table 59. The number of the tray sensors 60 ... Is set so as to correspond to, for example, the chip trays 56.
Each detects the presence or absence of the chip tray 56 .... Further, the address sensor 6 is provided near the index table 59.
The address sensor 61 faces the side surface of the index table 59 and detects the index address of the index table 59. Next, the operation of the above-mentioned cleavage device 11 will be described.

First, as shown in FIG. 2, crystal bar-1 arranged on the bar tray 45 of the tray guide unit 18 ...
One of them is adsorbed and taken out by the bar adsorption head 21 of the transfer unit 15. Then, the transfer unit 15 moves to convey the crystal bar-1 to a predetermined position of the cutting unit 16.

After the crystal bar-1 is conveyed to the cutting unit 16, the positioning slide 27 holds the crystal bar-1 in a non-fixed state, and the cutter 29 is driven to cleave the crystal bar-1. The created image of the chip 3 is taken into the small microscope 54, and the presence or absence of shape defect and surface defect of the chip 3 is judged.

The defective chip is removed, and a proper chip 3 having no defect is held by the chip suction head 22 and conveyed to the tray guide unit 18 and returned. The chips 3 conveyed to the tray guide unit 18 are placed on the chip tray 56. Then, the proper chips 3 ... Are sequentially conveyed to the tray guide unit 18, and the chip tray 5
6 are aligned.

After a predetermined number of chips are placed on one chip tray 56, the index table 59 is driven, the chip trays 56 are switched, and another chip tray 56 is guided to a predetermined position. It

In the cutting unit 16,
As shown in FIG. 9, the crystal bar-1 is extruded by the pusher 28 and moves while sliding on the base plate 42,
You will be guided to a predetermined position above. Crystal Ba-1
Cleaved lines 1a ... (Only one is shown) are divided into a plurality of sections in the longitudinal direction, and the cleaved lines 1a.

The image of the cleavage line 12 located at the most tip is captured by the small microscope 54, and the position of the cleavage line 1a coincides with the position of the cutting edge of the cutter head 34 based on the captured image data. The crystal bar-1 is positioned so that Here, the width of the cleavage line 1a is set to, for example, about 5 μm. Further, an arrow C indicated by a chain line in FIG. 9 indicates the optical axis of the small microscope 54.

The pusher 28 is retracted, and the crystal bar-1 is held only by the sandwiching plates 32a and 32b. At this time, the crystal bar-1 holds only the upper edge portions 48, 48 between the holding inclined surfaces 45a, 45 of the holding plates 32a, 32b.
It is in contact with b and is not fixed in the longitudinal direction. Here, the backward movement amount of the pusher 28 is 0.5, for example.
It is set to mm.

The cutter 29 swings, the cutter head 34 reaches the cleavage line 1a, and the crystal bar-1 is cut off at its tip to be made into chips. Then, the chip 3 is separated from the crystal bar-1. When the chip 3 is manufactured, the cutter head 34
The chip 3 is separated by using the impact when the blade edge reaches the crystal bar-1, and the separation of the chip 3 proceeds along the pre-engraved cleavage line 1a. Then, the chip 3 is manufactured without the cutter head 34 reaching the base plate 42.

When the chip 3 is separated, a gap is created between the chip 3 and the crystal bar-1. The image of the chip 3 is captured by the small microscope, and the shape of the chip 3 is detected. Then, chipping, length, pick (defect), etc. of the chip 3 are recognized.

After this, the pusher 28 pushes out the crystal bar-1, and the next cleavage line 1a is sent above the small microscope 54 and detected. At this time, the chip 3 is extruded together with the crystal bar-1 while being in close contact with the tip surface of the crystal bar-1, and the take-out coordinates of the chip 3 are obtained at the same time when the cleavage line 1a is detected. Then, the capillary (not shown) descends to reach the central portion of the chip 3 and adsorbs the chip 3 to rise. The tip 3 is picked up by a capillary and flanks 51a formed on the sandwich plates 32a and 32b.
It is carried through the space between 51b.

After the chip 3 is taken out, an arrow D is shown in FIG.
As shown by, the air gun 62 blows out the ionized air downward. Then, an electrostatic removal blow is performed, and the upper surface of the base plate 42 and the sandwiching plates 32a, 32.
Static electricity on the side surface of b is removed. Further, the air-gun 62 prevents dust from adhering to the cleavage surface (light emitting surface) of the chip 3 and cleans the cleavage powder on the base plate 42. Then, these operations are repeated, and the chips 19 ... Are sequentially cut out from the crystal bar 9.

That is, in the cleavage device 11 as described above, the transfer unit 15 and the transfer unit 15 are provided on one device.
A cutting unit 16, a microscope unit 17, and a tray guide unit 18 are provided. Then, the cleaving device 11 employs a parallel transfer type transfer structure. Therefore, it is possible to perform all the operations from the transportation of the crystal bar-1 to the alignment of the chips 3 ... Automatically and at high speed.

Further, since the small microscope 54 for taking in the image of the chip 3 and the transfer unit 15 for aligning the chips on the chip tray 56 are provided, the work of selecting the good chips and aligning them on the chip tray 56 is performed. It can be done easily. Therefore, the chips 3 ... Can be manufactured with high yield. Further, since the chip suction head 22 is used for handling the chip 3, the chip 3 ...
Are less likely to be damaged, and the incidence of defects can be reduced.

Further, since the blades 33 of the cutter 29 are provided with the straight portions 40, 40, as shown in FIG.
When the blade 33 cuts into the crystal bar-1, the contact between the blade 33 and the electrode gold plating layer 63 of the crystal bar-1 is interrupted. Therefore, it is possible to prevent soft gold from adhering to the blade 33 when the blade 33 moves up, and it is possible to always perform stable cleaving work.

In this embodiment, the blade 33 is provided with flat straight portions 40, 40. However, as shown in FIG. 13, for example, the blade 33 has semicircular relief grooves 64, 6.
4 may be formed to interrupt the contact between the blade 33 and the electrode gold plating layer.

Further, in the cutting unit 16, the holding plates 32a, 32b are provided with a holding inclined surface 45a,
45b is provided, and sandwiching plates 32a and 32b are provided.
Is the edge portion 4 of the crystal bar-1 that holds the sandwiched inclined surfaces 45a and 45b.
It is sandwiched while hitting 8, 48. Therefore, the crystal bar-1 can be held while the sandwiching plates 32a and 32b are only partially brought into contact with the crystal bar-1.

Further, the holding plates 32a, 32b are provided with relief grooves 49a, 49b, respectively.
Since a and 49b are located in the moving path of the cutter 29, the crystal bar-1 can be cleaved while being held by the sandwiching plates 32a and 32b.

Further, the sandwiching plates 32a, 32b are provided with sandwiching claw portions 50a, 50b, and the sandwiching claw portions 50a, 50b cover the part of the crystal bar-1 to be separated, so that they are cleaved. The scattered chips 3 can be prevented. Then, by these things, the crystal bar can be easily fixed and the chip can be easily held, and further, the cleavage operation can be easily automated.

In this embodiment, the small microscope 5
Although 4 is arranged below the crystal bar-1, the present invention is not limited to this, and the optical microscope 54 may be arranged above the crystal bar-1, for example.

Next, a second embodiment of the present invention will be described with reference to FIGS. 14 and 15. The same parts as those in the first embodiment described above are designated by the same reference numerals, and the description thereof will be omitted.

As shown in both figures, the clamping plate 71
Clamping claws 50a and 50b are formed on a and 71b, and facing inclined surfaces 72a and 72b facing the crystal bar-1 are formed on the clamping claws 50a and 50b. The opposed inclined surfaces 72a and 72b are inclined similarly to the sandwiched inclined surfaces 45a and 45b, and the gap E is set between the opposed inclined surfaces 72a and 72b and the sandwiched inclined surfaces 45a and 45b by setting the deviation amount E. ing.

That is, the distance between the two opposed inclined surfaces 72a and 72b is generally set wider than the distance between the two sandwiched inclined surfaces 50a and 50b, and as shown in FIG. 15, the opposed inclined surfaces 72a and 72b. Is separated from crystal bar-1. The crystal bar-1 is held by the holding inclined surfaces 50a and 50b, and the holding claw portions 50a and 50b are held by the crystal bar.
Not in contact with 1. And, the cleavage line 1 of crystal bar-1
The portion closer to the tip than a is separated from the sandwich plates 32a and 32b, and this portion is held in a non-fixed state. Here, the value of the deviation amount D is set to, for example, 10 μm. The tip portion of the crystal bar-1 is cleaved in a non-fixed state, and the produced chip 3 has a capillary 7
Picked up by 3.

With such sandwiching plates 71a and 71b, a crack can be made to run at a desired position, and it is possible to always obtain an optimum cleavage plane along the crystal boundary surface.

That is, when the holding claws 50, 50b are in contact with the crystal bar-1, stress concentration is considered to occur at the contact point of the crystal bar-1, but generally cracks generated during cleavage are Since it runs from the contact position of the cutter 29 toward the stress concentration portion, it becomes difficult to cleave the crystal bar-1 along the cleavage line 1a. However, as described above, if the sandwiching claw portions 50a and 50b are not in contact with the crystal bar-1a, stress concentration can be prevented from occurring and the crack can be easily run to a desired position.

Next, a third embodiment of the present invention will be described with reference to FIGS. The same parts as those in the above-mentioned respective embodiments are designated by the same reference numerals, and the description thereof will be omitted.

As shown in both figures, the stage plate 81 holds the sandwiching plates 32a and 32b and the base plate 42, and the base plate 42 is formed in the recess formed in the stage plate 81. It is fitted. A sliding path 82 is formed on the surface of the stage plate 81.
Is protruding, and the holding plate 32b on the movable side is fitted in the sliding path 82. And the clamping plate 32b
Slides along the sliding path 82 while being biased by the spring 44, and comes into contact with and separates from the crystal bar-1.

A push-up pin 83 is inserted upward in the stage plate 82, and the push-up pin 83 makes its tip reach a cushion 84 arranged below the base plate 42. A spring 85 is externally mounted on the push-up pin 83, and the spring 85 biases the push-up pin 83 downward.

A wedge 86 having a screw portion on the outer periphery is horizontally screwed into the stage plate 82, and a taper portion 87 at the tip of the wedge 86 is located at an intermediate portion in the axial direction of the push-up pin 82. Into the through hole 88 formed in the. With the tightening and tightening of the wedge 86,
The push-up pin 82 is guided by the taper portion 87 and moves up and down.

When the wedge 86 is tightened, the push-up pin 82 pushes up the base plate 42 through the cushion, and the base plate 42 comes into close contact with the sandwiching plates 32a and 32b. On the other hand, when the wedge 86 is loosened, the push-up pin 82 is lowered while being biased by the spring 85, and the base plate 42 is released. Then, the base plate 42 can be cleaned and replaced.

Next, a fourth embodiment of the present invention will be described with reference to FIGS.
It will be described with reference to FIG. The same parts as those in the above-mentioned respective embodiments are designated by the same reference numerals, and the description thereof will be omitted. In each drawing, the cutter 91 is arranged on the base plate 42 and is located almost directly above the crystal bar-1. The cutter 91 is supported by a cutter support mechanism (not shown) so as to be vertically movable. Further, the cutter 3 has a wedge-shaped blade edge directed downward, and when descending, the crystal bar
1. The escape groove 49 of the sandwiching plates 32a and 32b sandwiching 1
It enters into a and 49b and reaches the crystal bar-1.

That is, as shown in FIGS. 18 to 19B, the crystal bar-1 is pushed out by the pusher 28, moves while sliding on the base plate 42, and is guided to a predetermined position on the base plate 42. To be done. Cleavage lines 1a ... (Only one is shown) are engraved in the crystal bar-1, and the cleavage lines 1a.

The image of the cleavage line 1a located at the most tip is captured by the small microscope 54, and the position of the cleavage line 1a coincides with the position of the cutting edge of the cutter 91 based on the captured image data. So that the crystal bar-1 is positioned.

The cutter 91 descends and the cutting edge of the cutter 91 reaches the cleavage line 1a, and as shown in FIG. 20 (c), the crystal bar-1 is cut at its tip to be made into chips. And
The chip 3 is separated from the crystal bar-1. When the chip 3 is manufactured, the impact of the blade edge of the cutter 91 reaching the crystal bar-1 is used, and the chip 3 is separated along the pre-engraved cleavage line 1a. Then, the chip 3 is produced without the cutter 91 reaching the base plate 42.

When the chip 3 is separated, FIG.
As shown in, a gap is created between the chip 3 and the crystal bar-1. The image of the chip 3 is captured by the small microscope 54, and the shape of the chip 3 is detected. Then, chipping, length, pick (defect), etc. of the chip 3 are recognized.

After that, the pusher 28 pushes out the crystal bar-1 as shown by the arrow E of the alternate long and short dash line in FIG. 21 (e), and the next cleavage line 1a is sent above the small microscope 54 and detected. At this time, the chip 3 is extruded together with the crystal bar-1 while closely adhering to the tip surface of the crystal bar-1, and the cleavage line 1a
At the same time as the detection of, the take-out coordinates of the chip 3 are obtained. Then, as shown in FIG. 21F, the capillary 73 descends and reaches the central portion of the chip 3, and the chip 3 is adsorbed and raised. The chip 3 is picked up by the capillary 73 and carried through the space between the flanks 51a and 51b formed on the sandwiching plates 32a and 32b.

After the chip 3 is taken out, an electrostatic elimination blow is performed as shown by an arrow F in FIG. Then, these operations are repeated, and the chips 3 ... Are sequentially cut out from the crystal bar-1.

As shown in FIG. 22, a scattering prevention cover 92 in the shape of a square bar having a step portion at the tip is provided, and the scattering prevention cover 92 is inserted into the slide guide path 43 to prevent the scattering prevention cover 92. It is also possible to prevent the scattering of the chips 3 by covering the tip of the crystal bar-1 with the tip. Further, the present invention can be variously modified without departing from the gist thereof.

[0069]

As described above, according to the present invention, the strip-shaped works arranged on the work tray are taken out and conveyed to a predetermined position, and the chips cleaved from the work are placed on the chip tray. Transfer unit to align
A cutting unit that positions the work and cleaves the work while swinging the cutter to open the work, an image recognition unit that captures the image of the chip, a work tray replacement position and a transport position. And move it to
A plurality of chip trays are provided and a tray guide unit for switching these chip trays is provided. In addition, the present invention enables the cleaving and inspection of the strip work to be performed automatically and at high speed.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention.

FIG. 2 is a perspective view showing a main part of the first embodiment of the present invention.

FIG. 3 is a perspective view showing a transfer unit partially broken away.

FIG. 4 is a perspective view showing a cutting unit partially broken away.

FIG. 5 is a side view schematically showing a drive mechanism of the cutter.

FIG. 6 is an explanatory view showing the action of the cutter.

FIG. 7 is an explanatory view showing an enlarged operation of the cutter.

FIG. 8 is an explanatory view showing an enlarged operation of the cutter.

FIG. 9 is an enlarged perspective view showing a sandwiching plate and its peripheral portion.

FIG. 10 is a perspective view showing a sandwiching plate and its peripheral portion.

FIG. 11 is an explanatory diagram showing how static electricity is removed.

FIG. 12 is a perspective view showing a tray guide unit partially broken away.

FIG. 13 is an explanatory diagram showing a modified example of the cutter blade.

FIG. 14 is a perspective view showing a main part of a second embodiment of the present invention.

15 is a sectional view taken along line IV-IV in FIG.

FIG. 16 is a perspective view showing a main part of a third embodiment of the present invention.

FIG. 17 is a cross-sectional view taken along the line VV in FIG.

FIG. 18 is a perspective view showing a main part of a fourth embodiment of the present invention.

FIG. 19 is an explanatory view showing the operation of the fourth embodiment of the present invention.

FIG. 20 is an explanatory view showing the operation of the fourth embodiment of the present invention.

FIG. 21 is an explanatory view showing the operation of the fourth embodiment of the present invention.

FIG. 22 is a perspective view showing a modified example.

23 (a) to 23 (c) are explanatory views sequentially showing a conventional cleaving operation.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Crystal bar (rectangular work), 3 ... Chip, 11 ... Cleaving device, 15 ... Transfer unit (chip alignment means), 16 ... Cutting unit, 17 ... Microscope unit (image recognition unit, defect detection means) , 18 ... Tray guide unit (chip aligning means), 29 ... Cutter, 3
2a, 32b ... sandwiching plate, 33 ... cutter, 45a,
45b ... sandwiching inclined surface (inclined surface), 49a, 49b ... escape groove, 50a, 50b ... sandwiching claw portion (claw portion) 45 ... bar tray (work tray), 46 ... chip tray.

Claims (6)

[Claims] 1. A device for cleaving a strip-shaped work for cleaving a strip-shaped work to form a chip, and defect detecting means for recognizing an image of the chip to detect a defect in the chip, and an appropriate device. An apparatus for cleaving a strip-like work, comprising: chip arranging means for taking out chips and arranging them on a chip tray. 2. The strip-like work according to claim 1, further comprising a cutter for cleaving the work by hitting a corner of the work from an obliquely upper direction. Cleaving device. 3. The cleaving device for a strip-like work according to claim 1, further comprising a cutter which descends toward an upper surface of the work and cleaves the work. 4. A strip-shaped work lined up on a work tray is taken out and conveyed to a predetermined position, and at the same time, the work is formed.
A transfer unit for aligning the chips cleaved from the work on a chip tray; a cutting unit for positioning the work and cleaving the work to cleave the work while swinging the cutter; and An image recognition unit for taking in the images of the chips aligned on the chip tray, a tray guide unit for moving the work tray between the exchange position and the transport position, and having a plurality of the chip trays for switching the chip trays. A device for cleaving a strip-shaped work, which comprises: 5. The cutting unit includes a plurality of holding plates for holding and fixing strip-shaped works, and a cutter for cleaving the works by hitting the works. The sandwich plate has an inclined surface that partially contacts the work, an escape groove that is located in the movement path of the cutter and that allows the cutter to pass through, and a projecting plate that projects toward the work. The device for cleaving a strip-like work according to claim 4, further comprising: a claw portion that covers a portion of the work to be separated. 6. The strip according to claim 5, wherein the claw portion is separated from the work and the cut-off portion of the work is released from the holding plate. Device for claw-shaped work.