JPH06102837B2 - How to form patina - Google Patents
How to form patinaInfo
- Publication number
- JPH06102837B2 JPH06102837B2 JP3319390A JP3319390A JPH06102837B2 JP H06102837 B2 JPH06102837 B2 JP H06102837B2 JP 3319390 A JP3319390 A JP 3319390A JP 3319390 A JP3319390 A JP 3319390A JP H06102837 B2 JPH06102837 B2 JP H06102837B2
- Authority
- JP
- Japan
- Prior art keywords
- patina
- copper
- thin film
- chemical conversion
- chloride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 241001311547 Patina Species 0.000 title claims description 71
- 238000006243 chemical reaction Methods 0.000 claims description 55
- 238000000034 method Methods 0.000 claims description 54
- 239000010949 copper Substances 0.000 claims description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 46
- 239000000126 substance Substances 0.000 claims description 46
- 229910052802 copper Inorganic materials 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 42
- 239000010409 thin film Substances 0.000 claims description 38
- 239000002585 base Substances 0.000 claims description 36
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 31
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims description 20
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 19
- 230000003647 oxidation Effects 0.000 claims description 16
- 238000007254 oxidation reaction Methods 0.000 claims description 16
- 238000007751 thermal spraying Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims description 6
- 239000012298 atmosphere Substances 0.000 claims description 5
- 229910001617 alkaline earth metal chloride Inorganic materials 0.000 claims description 4
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 claims description 3
- HWSZZLVAJGOAAY-UHFFFAOYSA-L lead(II) chloride Chemical compound Cl[Pb]Cl HWSZZLVAJGOAAY-UHFFFAOYSA-L 0.000 claims description 3
- 229910001510 metal chloride Inorganic materials 0.000 claims description 3
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 3
- 235000005074 zinc chloride Nutrition 0.000 claims description 3
- 239000011592 zinc chloride Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 23
- 238000005507 spraying Methods 0.000 description 18
- 239000007788 liquid Substances 0.000 description 15
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 12
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 12
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 12
- 229940045803 cuprous chloride Drugs 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 230000003746 surface roughness Effects 0.000 description 8
- 230000001590 oxidative effect Effects 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 6
- 229960003280 cupric chloride Drugs 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000007788 roughening Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 229940037003 alum Drugs 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 239000005750 Copper hydroxide Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 229910001956 copper hydroxide Inorganic materials 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- -1 (H) 2 } Chemical class 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- 235000019589 hardness Nutrition 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000010454 slate Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001514 alkali metal chloride Inorganic materials 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052934 alunite Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- LFYJSSARVMHQJB-QIXNEVBVSA-N bakuchiol Chemical compound CC(C)=CCC[C@@](C)(C=C)\C=C\C1=CC=C(O)C=C1 LFYJSSARVMHQJB-QIXNEVBVSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 238000010285 flame spraying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Treatment Of Metals (AREA)
Description
【発明の詳細な説明】 <産業上の利用分野> この発明は、基材との密着性に優れた緑青を生産性良く
安定して形成する方法に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to a method for stably forming patina with excellent adhesion to a substrate with good productivity.
<従来技術とその課題> 従来から、神社・仏閣の屋根材等に用いられた銅の表面
が長い年月の間に大気中の酸素,水蒸気,炭酸ガス,硫
化物乃至は塩化物等の作用によって優雅で美しい緑色の
緑青{CuCO3・Cu(OH)2,CuSO4・3Cu(OH)2,CuCl2・3Cu(O
H)2等の塩基性銅塩}に覆われることは良く知られてい
るが、この緑青層は重厚で独特の美観を醸し出すばかり
でなく防食皮膜としての作用をも発揮し、そのため緑青
に覆われた銅屋根等は数百年に及ぶ耐久性を示すことと
なる。<Prior art and its problems> The surface of copper used for roofing materials of shrines and Buddhist temples has been affected by oxygen, water vapor, carbon dioxide, sulfides or chlorides in the atmosphere for many years. With elegant and beautiful green patina {CuCO 3 · Cu (OH) 2 , CuSO 4 · 3Cu (OH) 2 , CuCl 2 · 3Cu (O
It is well known that it is covered with a basic copper salt such as (H) 2 }, but this patina is not only heavy and gives a unique appearance, but also acts as an anticorrosion film. Broken copper roofs will have a durability of several hundred years.
そこで、近年、天然に近い緑青を人工的に短期間で発生
させて基材の腐食防止や装飾乃至美術的な効果を狙った
“緑青被膜形成品”が、屋根材のみならず建築内壁材や
装飾品等にも見られるようになり、これまでにも天然に
近い緑青被膜を人工的に形成させる手段に関する提案が
数多くなされてきた。Therefore, in recent years, "green-blue film-formed products" aiming at corrosion prevention of base materials and decorative or artistic effects by artificially generating natural green-blue in a short period of time have become It has also been found in ornaments and the like, and there have been many proposals for a means for artificially forming a patina film that is close to natural.
これら従来の人口緑青形成手段を大別すると次の通りで
ある。The conventional means for forming artificial patina are roughly as follows.
(A)薬液を使った化成処理法(例えば特公昭57−5146
8号として提案された方法等), (B)薬液中で電解処理する方法(例えば特公昭55−12
117号として提案された方法等), (C)基材を化成処理した後、その上に更に塗装を施す
方法(例えば特開昭55−8491号として提案された方
法), (D)緑青色形成物質を含む塗料で塗装する方法(例え
ば特開昭55−139467号として提案された方法), (E)サンドブラストにより表面を粗面化した銅板表面
に銅又は銅合金の粉末を接着剤で接着した後、塩化アン
モニウムや硫酸アンモニウム等の人口緑青発生液を塗布
する方法(例えば特公昭57−52425号として提案された
方法等)。(A) Chemical conversion treatment method using a chemical solution (for example, Japanese Patent Publication No. 57-5146).
No. 8), (B) Electrolytic treatment in a chemical solution (eg Japanese Patent Publication No. 55-12)
No. 117), (C) a chemical conversion treatment of a base material, and then further coating (for example, the method proposed as JP-A-55-8491), (D) green blue A method of coating with a paint containing a forming substance (for example, a method proposed as JP-A-55-139467), (E) Bonding copper or copper alloy powder with an adhesive to the surface of a copper plate roughened by sandblasting After that, a method of applying an artificial green-blue generating solution such as ammonium chloride or ammonium sulfate (for example, the method proposed as JP-B-57-52425).
しかしながら、実際上、上記した人工緑青形成手段は a)緑青の発生速度が遅い, b)緑青被膜が剥離し易く、製造設備に多額の費用がか
かる, c)緑青色を安定して形成させることができず、不均一
で色調が劣る, d)緑青の密着性が良くない, e)緑青色被膜を形成するための工数が多く、生産性が
悪い, 等の問題が指摘されるものであり、更には、何れも一般
的に基材が銅又は銅合金にほぼ限定される上、発生させ
た緑青の表面を塗装等によって保護しなければ基材との
十分な密着性を保てないとの問題を有するものであっ
た。しかも、塗料膜による緑青の保護策も、塗膜組成物
の紫外線による劣化が起きるため根本的な解決策とはな
らなかった。However, in practice, the above-mentioned artificial patina forming means is a) the patina generation rate is slow, b) the patina coating is easily peeled off, and the manufacturing facility is expensive, and c) the patina is stably formed. However, there are problems such as non-uniformity and poor color tone, d) poor adhesion of patina, e) a lot of man-hours for forming patina coating, and poor productivity. Moreover, in general, the base material is generally limited to copper or a copper alloy, and sufficient adhesion with the base material cannot be maintained unless the generated patina surface is protected by painting or the like. Had the problem of. Moreover, the protection of patina from the paint film has not been a fundamental solution because deterioration of the coating composition due to ultraviolet rays occurs.
このようなことから、本発明が目的としたのは、「密着
性に優れた均一色調の緑青被膜を、基材の種類を問わず
に短時間に安定して形成し得る手段」を確立することで
あった。Therefore, the object of the present invention is to establish "a means capable of stably forming a patina film of uniform color tone having excellent adhesion in a short time regardless of the type of the base material". Was that.
<課題を解決するための手段> 本発明者等は、上記目的を達成すべく様々な観点に立っ
て鋭意研究を重ねた結果、「緑青を形成しようとする基
材表面に必要に応じて粗面化してから該基材表面に銅又
は銅合金から成る薄膜を形成し、この薄膜を特定の新規
な化成処理液で化成処理すると共に、その後にこれを強
制酸化させる処理を施すと、基材の材質に左右されるこ
となくその表面に密着性の非常に優れた均一重厚な色調
の緑青被膜を短時間で形成させることができる」との知
見を得るに至ったのである。<Means for Solving the Problems> The inventors of the present invention have conducted extensive studies from various viewpoints in order to achieve the above-mentioned object, and as a result, “the surface of the base material on which patina is formed is roughened if necessary. When a thin film made of copper or a copper alloy is formed on the surface of the base material after the surface is made flat, and the thin film is subjected to chemical conversion treatment with a specific novel chemical conversion treatment liquid, and then subjected to a treatment of forcibly oxidizing this, the base material It is possible to form a patina film of uniform and solid color tone with excellent adhesion on the surface in a short time without being influenced by the material of the above. "
本発明は、上記知見事項等に基づいて成されたものであ
り、 「緑青を形成しようとする基材表面に銅又は銅合金から
成る薄膜を形成した後、該薄膜を (イ)アリカリ金属塩化物及び/又はアリカリ土類金属
塩化物にアルミニウム粉を加えたもの, (ロ)塩化アルミニウム, (ハ)塩化第二錫, (ニ)塩化亜鉛, (ホ)塩化鉛 から選ばれる1種又は2種以上を含む処理溶液で化成処
理し、続いてこれを強制酸化処理することにより、密着
性や外観等が共に優れた緑青を短時間に安定形成し得る
ようにした点」 に特徴を有している。The present invention has been made based on the above findings and the like. “After forming a thin film of copper or a copper alloy on the surface of a base material on which patina is to be formed, the thin film is subjected to (a) alkaline metal chloride. And / or alkaline earth metal chloride to which aluminum powder is added, (b) aluminum chloride, (c) stannic chloride, (d) zinc chloride, (e) lead chloride, or one or two selected from By performing chemical conversion treatment with a treatment solution containing more than one species, and then forcibly oxidizing this, it is possible to stably form patina with excellent adhesiveness and appearance in a short time. ing.
ここで、“緑青を形成しようとする基材”とは銅及び銅
合金に代表される金属材料のみならず、セラミック,
瓦,木材,合成樹脂等の何れであっても差し支えがな
く、格別にその材質が制限されるものではない。Here, the "base material for forming patina" includes not only metal materials such as copper and copper alloys but also ceramics,
It does not matter whether it is roof tile, wood, synthetic resin, etc., and its material is not particularly limited.
以下、本発明をその作用・効果と共により詳細かつ具体
的に説明する。Hereinafter, the present invention will be described in more detail and concretely together with its action and effect.
本発明に係る緑青形成法においては、まず基材の表面に
“銅又は銅合金から成る薄膜”が形成される。薄膜の厚
さは特に限定されるものではないが、通常は1〜100μ
m程度、好ましくは5〜40μm程度とするのが良い。勿
論、膜厚が1μm未満であっても緑青の形成は可能であ
るが、この場合には薄膜に亀裂等が生じ易いため好まし
くない。一方、膜厚が100μmを超えると満足できる色
調を得ることが難しくなり、また生産コストの面でも好
ましくない。In the patina forming method according to the present invention, first, a "thin film made of copper or copper alloy" is formed on the surface of the base material. Although the thickness of the thin film is not particularly limited, it is usually 1 to 100 μm.
m, preferably about 5 to 40 μm. Of course, even if the film thickness is less than 1 μm, it is possible to form patina, but this is not preferable because cracks and the like are likely to occur in the thin film. On the other hand, when the film thickness exceeds 100 μm, it becomes difficult to obtain a satisfactory color tone, and it is not preferable in terms of production cost.
上記“銅又は銅合金から成る薄膜”を形成する手段とし
ては、めっき法,真空蒸着法,スパッタリング法,イオ
ンプレーティング法,溶射法等の公知の方法が適用でき
る。従って、基材の種類等に応じて適当な薄膜形成手段
を選択する必要があるが、ドライプロセスであって加工
が迅速な上に、広い範囲の材料が使用でき、かつ素材に
対して大きな悪影響を与えることのない“溶射法”が最
も好ましい手段と言える。As a means for forming the "copper or copper alloy thin film", known methods such as a plating method, a vacuum deposition method, a sputtering method, an ion plating method, and a thermal spraying method can be applied. Therefore, it is necessary to select an appropriate thin film forming means according to the type of base material, etc., but it is a dry process, the processing is quick, a wide range of materials can be used, and there is a great adverse effect on the materials. It can be said that the "spraying method" which does not give the above is the most preferable means.
ところで、溶射法には“フレーム溶射",“アーク溶射”
及び“プラズマ溶射”等の各種の手法があり、また溶射
原料として銅又は銅合金から成る粉末やワイヤー等も使
用できることが知られているが、本発明においては溶射
法や溶射原料に対する格別な制限はない。しかし、同じ
材料,同じ装置を使用した場合でも溶射の方法(即ち溶
射条件)が異なると違った皮膜が形成されるため、この
点での注意は必要である。例えば、雰囲気条件(酸素−
アセチレンの混合比等),溶射距離,ワイヤー供給速度
等は溶射皮膜の硬度に敏感に影響する。その他、溶射ガ
ンと被加工物の相対速度,1パス当りの皮膜厚さ,溶射中
の被加工物温度(皮膜の密着強さを高めるためには基材
を適温に予熱しておくことが好ましい),ガスや空気の
圧力並びに流量等、溶射皮膜の特性に影響を与える要素
は非常に多い。By the way, "flame spraying" and "arc spraying" are used for the spraying method.
There are various methods such as "plasma spraying", and it is known that powder or wire made of copper or copper alloy can be used as a spraying raw material, but in the present invention, there are special restrictions on the spraying method and the spraying raw material. There is no. However, even if the same material and the same equipment are used, different coatings will be formed if the method of thermal spraying (that is, the thermal spraying conditions) is different, so caution is required in this respect. For example, atmospheric conditions (oxygen-
The mixing ratio of acetylene, etc.), spraying distance, wire feed rate, etc. sensitively affect the hardness of the sprayed coating. In addition, the relative speed of the spray gun and the work piece, the film thickness per pass, the temperature of the work piece during thermal spraying (it is preferable to preheat the substrate to an appropriate temperature in order to increase the adhesion strength of the film) ), The factors such as the pressure and flow rate of gas and air that affect the characteristics of the thermal spray coating are very numerous.
更に、一般に、「溶射皮膜は同じ厚さであったとしても
“薄い層が数多く積み重なったもの”の方が“厚い層が
数少なく積み重なったもの”よりも強度が強い」と言わ
れていることも考慮する必要あある。また、1パス当り
の溶射厚を厚くすることは過熱の原因となるので、内径
溶射の場合には過熱を避けるために溶射ガンと被加工物
の相対速度を速くして1パス当りの被膜厚さを薄くする
ように特に注意することも必要である。In addition, it is generally said that "the sprayed coating has a large number of thin layers" even if the thermal sprayed coating has the same thickness as "the strength is stronger than that of a small number of thick layers". There is a need to consider. Also, increasing the spray thickness per pass causes overheating, so in the case of inner diameter spraying, in order to avoid overheating, the relative speed of the spray gun and the workpiece should be increased to increase the film thickness per pass. Special care should also be taken to reduce the thickness.
上述のように、溶射によって“銅又は銅合金から成る薄
膜”を形成する場合には、基材の種類,溶射皮膜の厚
み,目的とする表面粗さ等により適宜溶射条件等の選定
を行う必要がある。As described above, when forming a "thin film made of copper or copper alloy" by thermal spraying, it is necessary to appropriately select the thermal spraying conditions, etc., depending on the type of base material, the thickness of the thermal spray coating, the desired surface roughness, etc. There is.
これに対して、めっき法等によって“銅又は銅合金薄
膜”を形成する場合には、例えば公知の電解液組成,電
解条件等をそのまま適用するだけでも比較的安定に目的
を達成することができる。On the other hand, when the "copper or copper alloy thin film" is formed by the plating method or the like, the object can be achieved relatively stably by simply applying the known electrolytic solution composition, electrolysis conditions, etc. .
このようにして形成された“銅又は銅合金から成る薄
膜”の表面粗さは特に限定されるものではないが、薄膜
表面の粗さが3μm未満では緑青の発色度合いが低く、
一方、50μmを超えると母材と薄膜の密着強度が低下す
る傾向が見られることから、通常は3〜50μm、好まし
くは5〜40μmとするのが良い。The surface roughness of the “thin film made of copper or copper alloy” thus formed is not particularly limited, but if the surface roughness of the thin film is less than 3 μm, the degree of patina coloring is low,
On the other hand, if it exceeds 50 μm, the adhesion strength between the base material and the thin film tends to decrease, so that it is usually 3 to 50 μm, preferably 5 to 40 μm.
ところで、基材表面への“銅又は銅合金から成る薄膜”
の形成に先立って該基材表面を粗面化することは、基材
と“銅又は銅合金から成る薄膜”との密着性の向上、ひ
いては形成される緑青被膜の密着性を向上させる上で極
めて好ましいことである。従って、銅又は銅合金から成
る薄膜形成処理の前には、必要に応じて基材表面の粗面
化処理が施され、基材表面の一様な粗化と一時的な表面
の活性化が図られる。By the way, "a thin film made of copper or copper alloy" on the surface of the substrate
Roughening the surface of the base material prior to the formation of the base material improves the adhesion between the base material and the "thin film made of copper or copper alloy", and thus improves the adhesion of the patina film formed. It is extremely preferable. Therefore, prior to the thin film forming treatment made of copper or copper alloy, roughening treatment of the base material surface is performed as necessary to uniformly roughen the base material surface and temporarily activate the surface. Planned.
基材表面の粗面化法としては、一般に化学的方法(電気
化学的方法も含む)と物理的方法(機械的方法)の2種
類が知られている。前者の例としては、“酸又はアルカ
リに浸漬する方法(即ち,エッチング処理法)”や“電
解法”等が、そして後者の例としては“ブラスト法",
“ウォータージェット法",“動力工具法",“手工具法”
等を挙げることができる。従って、本発明に係る“銅又
は銅合金から成る薄膜”の形成に先立つ基材の粗面化に
際しては、該基材の種類や目的とする緑青形成品表面の
粗さ等によって粗面化法を適宜選択する必要がある。例
えば、基材が金属材料の場合には、基材表面の粗面化を
高能率で実施できる上、同時に基材表面に発生していた
錆その他の腐食生成物等の除去も成される“ブラスト
法”が好適と言える。しかも、ブラスト法では、研削材
として硅砂,スティールグリッド,スティールショッ
ト,溶融アルミナ(人造コランダム),アランダム,カ
ーボランダム,グラスビース,合成樹脂粒子等の如き各
種の硬度,粒度を持ったものが使用されるので、基材の
種類その他に合わせて好適なものを適宜選択することが
可能であることに加え、ブラスト条件により表面粗さの
調整も可能であると言う長所もある。As a method of roughening the surface of the base material, generally, two types are known, a chemical method (including an electrochemical method) and a physical method (mechanical method). Examples of the former are "method of immersing in acid or alkali (that is, etching treatment method)" and "electrolysis method", and examples of the latter are "blast method",
"Water jet method", "Power tool method", "Hand tool method"
Etc. can be mentioned. Therefore, when roughening the base material prior to forming the "copper or copper alloy thin film" according to the present invention, a roughening method is used depending on the type of the base material and the desired surface roughness of the green-blue formed product. Should be selected appropriately. For example, when the base material is a metal material, the surface of the base material can be roughened with high efficiency, and at the same time, rust and other corrosion products generated on the surface of the base material can be removed. It can be said that the “blast method” is suitable. Moreover, in the blast method, abrasives with various hardnesses and particle sizes such as silica sand, steel grid, steel shot, fused alumina (artificial corundum), alundum, carborundum, glass beads, synthetic resin particles, etc. are used. Therefore, in addition to being able to appropriately select a suitable one according to the type of the substrate and the like, there is also an advantage that the surface roughness can be adjusted by the blast condition.
なお、ブラスト法については種々の観点から種類分けが
なされており、例えば研削材の吹付け手法の観点からは
“圧縮空気によってブラストする方法”と“遠心力によ
ってブラストする方法”とに分類でき、また吹付ける研
削材の乾湿状態からは“乾式法”と“湿式法”に分類で
きるが、本発明においてはその種類の組み合わせに格別
な制限はない。It should be noted that the blast method is classified according to various viewpoints. For example, from the viewpoint of an abrasive material spraying method, it can be classified into a “blast method using compressed air” and a “blast method using centrifugal force”. Further, the dry and wet state of the abrasive to be sprayed can be classified into a "dry method" and a "wet method", but in the present invention, there is no particular limitation on the combination of the types.
粗面化処理後の基材の表面粗さは、3μm以上、好まし
くは10〜30μmとするのが良い。なぜなら、該表面粗さ
が3μm未満では“銅又は銅合金から成る薄膜”との密
着性改善効果が顕著ではないからである。一方、上記表
面粗さが50μmを超えた場合には、前記密着性は良好と
なるものの母材(基材)に生じる歪が問題となってくる
など現実的ではない。The surface roughness of the substrate after the surface roughening treatment is 3 μm or more, preferably 10 to 30 μm. This is because if the surface roughness is less than 3 μm, the effect of improving the adhesion with the “thin film made of copper or copper alloy” is not remarkable. On the other hand, when the surface roughness exceeds 50 μm, the adhesion is good, but the strain generated in the base material (base material) becomes a problem, which is not realistic.
さて、本発明において、基材の表面に“銅又は銅合金か
ら成る薄膜”が形成された後、該薄膜に本発明の大きな
特徴の1つである特定の新規な化成処理液を用いた化成
処理が施される。In the present invention, after a "thin film made of copper or copper alloy" is formed on the surface of a substrate, the thin film is subjected to a chemical conversion treatment using a specific novel chemical conversion treatment liquid which is one of the major features of the present invention. Processing is performed.
一般に、“化成処理”とは或る金属を特定条件に調整さ
れた腐食液(化成処理液)と化学反応させ、その金属の
表面に固着性のある水に不溶性の腐食生成物層を形成さ
せる処理を言い、その腐食生成物の物理的又は化学的性
質を利用して防錆,塗装下地,塑性加工用潤滑下地等へ
の適用がなされている。Generally, "chemical conversion treatment" causes a metal to chemically react with a corrosive liquid (chemical conversion treatment liquid) adjusted to specific conditions to form a water-insoluble corrosion product layer adhered to the surface of the metal. The term "treatment" refers to the application of rust-prevention, coating base, lubrication base for plastic working, etc. by utilizing the physical or chemical properties of the corrosion product.
本発明で言う化成処理もほぼ同じ概念であるが、化成処
理液が通常用いられているものとは異なる上、化成処理
の後に強制酸化処理が施される点も特異なものである。The chemical conversion treatment referred to in the present invention has almost the same concept, but is different from the one in which the chemical conversion treatment liquid is usually used, and is also unique in that the forced oxidation treatment is performed after the chemical conversion treatment.
本発明において用いる特殊な化成処理液は、前述したよ
うに (イ)アリカリ金属塩化物及び/又はアリカリ土類金属
塩化物にアルミニウム粉を加えたもの, (ロ)塩化アルミニウム, (ハ)塩化第二錫, (ニ)塩化亜鉛, (ホ)塩化鉛 から選ばれる1種又は2種以上を含む溶液(溶媒は一般
的には水であるが、水以外の溶媒であっても差し支えな
い)であり、更にはこれにミョウバン,硫酸銅,硝酸銅
等の所謂“緑青発生薬”と呼ばれている物質を添加した
ものでも良く、本発明はこれらのもの全てを包含する。
これらの化成処理液は“銅又は銅合金から成る薄膜”に
接触した場合にこれと反応して塩化第一銅(CuCl)を生
成したり、前記薄膜上或いは薄膜内で相互に反応して塩
化第一銅を生成する。The special chemical conversion treatment liquid used in the present invention is, as described above, (a) alkaline metal chloride and / or alkaline earth metal chloride to which aluminum powder is added, (b) aluminum chloride, (c) chloride chloride. A solution containing one or more selected from ditin, (d) zinc chloride, and (e) lead chloride (the solvent is generally water, but a solvent other than water may be used). In addition, substances such as alum, copper sulphate, and copper nitrate, which are so-called "green-blue generators", may be added to the above, and the present invention includes all of these.
These chemical conversion treatment liquids react with "a thin film made of copper or a copper alloy" to form cuprous chloride (CuCl), or they react with each other on or within the thin film to form chloride. Produces cuprous.
以降、本発明に係る化成処理につき、処理対象物を“溶
射によって基材上に形成した銅又は銅合金から成る薄
膜”とし、かつ化成処理液を“塩化アルミニウム水溶
液”とした場合を例に詳述するが、銅又は銅合金から成
る薄膜を溶射以外の手段で形成した場合や、化成処理液
が塩化アルミニウム水溶液以外の本発明溶液の場合であ
ってもほぼ同じ条件でほぼ同様の作用効果が奏されるこ
とが確認済みである。Hereinafter, the chemical conversion treatment according to the present invention will be described in detail with reference to a case where the object to be treated is “a thin film made of copper or a copper alloy formed on the substrate by thermal spraying” and the chemical conversion treatment liquid is “aluminum chloride aqueous solution”. As described above, when a thin film made of copper or a copper alloy is formed by a means other than thermal spraying, or when the chemical conversion treatment solution is the solution of the present invention other than an aluminum chloride aqueous solution, almost the same action and effect are obtained under substantially the same conditions. It has been confirmed that it will be played.
さて、化成処理液である塩化アルミニウムの濃度には特
に制限はないが、通常は5〜50重量%、好ましくは20〜
30重量%の水溶液が用いられ、これを“銅又は銅合金か
ら成る薄膜”に塗布,スプレー等の方法、又は該薄膜を
前記化成処理液に浸漬する等の方法で化成処理が行われ
る。The concentration of aluminum chloride, which is a chemical conversion treatment liquid, is not particularly limited, but is usually 5 to 50% by weight, preferably 20 to
A 30% by weight aqueous solution is used, and the chemical conversion treatment is performed by a method such as coating or spraying this on a "thin film made of copper or copper alloy", or by immersing the thin film in the chemical conversion treatment solution.
この処理を行うと、一瞬ではあるが“銅又は銅合金から
成る薄膜”が白色化すると共にガスの発生が認められ
る。When this treatment is performed, the "thin film made of copper or copper alloy" is whitened and gas is generated for a moment.
この反応機構については現在のところ明確に解明されて
いないが、次のような反応が進行しているのではないか
と推定される。The mechanism of this reaction has not been clarified at present, but it is presumed that the following reactions are in progress.
a)塩化アルミニウムが一部加水分解する。a) Aluminum chloride is partially hydrolyzed.
AlCl3+3H2O=Al(OH)3+3HCl …(1) b)生成した塩酸が銅又は銅合金或いは該表面上に形成
された酸化物と反応する。AlCl 3 + 3H 2 O = Al (OH) 3 + 3HCl (1) b) The generated hydrochloric acid reacts with copper or a copper alloy or an oxide formed on the surface.
2Cu+2HCl=2CuCl+H2 …(2) Cu2O+2HCl=2CuCl+H2O …(3) CuO+2HCl=CuCl2+H2O… (4) c)生成したCuClは一部不均一化反応を起こす。2Cu + 2HCl = 2CuCl + H 2 (2) Cu 2 O + 2HCl = 2CuCl + H 2 O (3) CuO + 2HCl = CuCl 2 + H 2 O (4) c) The generated CuCl partially causes a heterogeneous reaction.
2CuCl=CuCl2+Cu …(5) 実際には、上記の(1)〜(5)式の反応以外に種々の
反応(例えば(4)式の逆反応等)が起きているものと
考えられ、結局、薄膜上ではCu,Cu2O,CuO又はCu(OH)2,C
uCl,CuCl2,Al(OH)3,AlCl3等が複雑に共存しているの
ではないかと推定される。2CuCl = CuCl 2 + Cu (5) Actually, it is considered that various reactions (for example, the reverse reaction of the formula (4)) occur in addition to the reactions of the above formulas (1) to (5), After all, on the thin film, Cu, Cu 2 O, CuO or Cu (OH) 2 , C
It is presumed that uCl, CuCl 2 , Al (OH) 3 , and AlCl 3 coexist in a complicated manner.
なお、(2)式で示した反応は通常の状態では起こらな
いが、溶射皮膜等の場合には高温から急冷されると共に
母材表面に衝突した粒子の積層物であるので皮膜に熱歪
による残留応力,酸化物及び気孔等が存在しており、該
皮膜の電極電位が通常状態の同種材料に比べて卑になっ
ていることから、このような反応が起きるものと考えら
れる。そして、化成処理時にガスの発生が認められてい
ることから、(2)式の反応が起こっている可能性が非
常に高いと言える。The reaction represented by the formula (2) does not occur in a normal state, but in the case of a sprayed coating, etc., it is a laminate of particles that are rapidly cooled from a high temperature and collide with the surface of the base material. It is considered that such a reaction occurs because residual stress, oxides, pores, etc. are present and the electrode potential of the film is more base than that of the same kind material in the normal state. Further, since the generation of gas was observed during the chemical conversion treatment, it can be said that the reaction of formula (2) is very likely to occur.
一方、アルカリ金属塩化物(例えばKCl,NaCl等)及び/
又はアルカリ土類金属塩化物(例えばMgCl2,CaCl2等)
にアルミニウム粉を加えた化成処理液では、アルミニウ
ム粉の添加時に例えば次式の反応が起きる。On the other hand, alkali metal chlorides (eg KCl, NaCl, etc.) and /
Or alkaline earth metal chlorides (eg MgCl 2 , CaCl 2 etc.)
In the chemical conversion treatment liquid in which the aluminum powder is added, the reaction of the following formula occurs when the aluminum powder is added.
6NaCl+2Al+6H2O =2AlCl3+6NaOH+3H2 …(6) 従って、その後は塩化アルミニウム単独の化成処理液の
場合とほぼ同様の反応が起こっているものと考えられ
る。また、この場合には、アルミニウムと銅又は“銅の
低級酸化物”との間に局部電池が構成され、反応が促進
されている可能性もある。 6NaCl + 2Al + 6H 2 O = 2AlCl 3 + 6NaOH + 3H 2 ... (6) Therefore, then is believed to have occurred substantially the same reaction as in chemical conversion treatment solution of aluminum chloride alone. Further, in this case, there is a possibility that a local battery is formed between aluminum and copper or "a lower oxide of copper" to accelerate the reaction.
また、ミョウバン,硫酸銅,硝酸銅等の公知の緑青発生
薬を添加した化成処理液の場合には、一部は硫酸塩或い
は硝酸塩となるものの、本質的な反応としてはほぼ同じ
と考えられる。なお、このようにミョウバン,硫酸銅,
硝酸銅等を添加した場合には、最終的に(強制酸化処理
の後に)形成される緑青の色調を微妙に変化させる効果
が得られるが、余り多量に添加すると緑青の生成速度が
遅くなる。従って、上記公知の緑青発生薬を添加する場
合には、格別な制限はないもののその添加量を1〜15重
量%、好ましくは1〜5重量%程度に調整するのが良
い。Further, in the case of a chemical conversion treatment liquid to which a known patina generating agent such as alum, copper sulfate, copper nitrate or the like is added, a part thereof becomes a sulfate or a nitrate, but it is considered that the essential reaction is almost the same. In addition, alum, copper sulfate,
When copper nitrate or the like is added, the effect of subtly changing the color tone of the patina formed finally (after the forced oxidation treatment) can be obtained, but if it is added in an excessively large amount, the production speed of patina becomes slow. Therefore, in the case of adding the above-mentioned known green-blue generating agent, there is no particular limitation, but the addition amount should be adjusted to 1 to 15% by weight, preferably 1 to 5% by weight.
次に、上述のように化成処理された“銅及び銅合金より
成る薄膜”は強制酸化処理され、密着性の優れた緑青の
形成がなされる。Next, the "thin film made of copper and copper alloy" that has been subjected to the chemical conversion treatment as described above is subjected to forced oxidation treatment to form a patina having excellent adhesion.
強制酸化の手段としては、“酸化性の液体を用る方法",
“酸化性の気体を用いる方法”或いは“電解による方
法”等があるが、基材の取り扱い容易性や緑青の密着性
等を考慮した場合には“気体を用いる方法”が好ましい
と言える。As a method of forced oxidation, "method of using oxidizing liquid",
There are “method using an oxidizing gas” and “method by electrolysis”, but it can be said that the “method using a gas” is preferable in consideration of easy handling of the base material and adhesion of patina.
酸化性の気体としては空気や酸素ガス等が一般的である
が、処理速度(即ち緑青の形成速度)を考えた場合には
オゾン(O3)が最も好ましく、強制酸化にはオゾン含有
雰囲気中に曝す手法が推奨される。この場合、オゾン濃
度には特に制限はなく、通常のオゾン発生器によって雰
囲気中にオゾンを混入する程度で十分である。Air and oxygen gas are generally used as the oxidizing gas, but ozone (O 3 ) is the most preferable when considering the processing speed (that is, the formation rate of patina). The method of exposure to water is recommended. In this case, the ozone concentration is not particularly limited, and it is sufficient that ozone is mixed into the atmosphere by a normal ozone generator.
そして、化成処理を施した“銅又は銅合金より成る薄
膜”をオゾンによって強制酸化する場合、該強制酸化処
理は化成処理によって生成した化成処理膜が乾燥してし
まう前に実施することが望ましい。つまり、化成処理膜
に湿気(水分)が十分に存在する状態で(好ましくは化
成処理後直ちに)オゾン含有雰囲気中へ入れて酸化する
と、より短時間で密着性の極めて優れた緑青皮膜を形成
することができる。When the chemical conversion-treated "thin film made of copper or copper alloy" is forcibly oxidized by ozone, the forced oxidation treatment is preferably performed before the chemical conversion treatment film formed by the chemical conversion treatment is dried. That is, when the chemical conversion treatment film is sufficiently oxidized (preferably immediately after chemical conversion treatment) in an ozone-containing atmosphere in the presence of sufficient moisture (moisture), a patina film having excellent adhesion is formed in a shorter time. be able to.
この“化成処理した銅又は銅合金薄膜の強制酸化”によ
る緑青の形成機構については現在のところ明確に解明さ
れていないが、この処理により生成した緑青がX線回折
によって化学的に安定な塩基性塩化第二銅{CuCl2・3C
u(OH)2}であると確認されている。従って、次のような
反応が進行しているのではないかと推測される。The formation mechanism of patina due to the "forced oxidation of the chemical conversion treated copper or copper alloy thin film" has not been clarified at present, but the patina produced by this treatment is chemically stable by X-ray diffraction cupric chloride {CuCl 2 · 3C
u (OH) 2 } has been confirmed. Therefore, it is speculated that the following reactions may be in progress.
イ)塩化第一銅がオゾン酸化により塩化第二銅と水酸化
銅になる。B) Cuprous chloride becomes cupric chloride and copper hydroxide by ozone oxidation.
6CuCl+3H2O+O3 =3CuCl2+3Cu(OH)2 …(7) ロ)銅及び/又は酸化銅がオゾン酸化又は加水分解によ
り水酸化銅となる。6CuCl + 3H 2 O + O 3 = 3CuCl 2 + 3Cu (OH) 2 (7) b) Copper and / or copper oxide becomes copper hydroxide by ozone oxidation or hydrolysis.
3Cu+3H2O+O3=3Cu(OH)2 …(8) 3Cu2O+6H2O+O3=6Cu(OH)2 …(9) CuO+H2O=Cu(OH)2 …(10) ハ)塩化第二銅と水酸化銅が反応し、塩基性塩化第二銅
(緑青)が生成する。3Cu + 3H 2 O + O 3 = 3Cu (OH) 2 (8) 3Cu 2 O + 6H 2 O + O 3 = 6Cu (OH) 2 (9) CuO + H 2 O = Cu (OH) 2 (10) c) With cupric chloride Copper hydroxide reacts to form basic cupric chloride (pale blue).
CuCl2+3Cu(OH)2=CuCl2・3Cu(OH)2 …(11) なお、当然のことながら、これらの反応は単独ではなく
同時平行的に進み、最終的には化学的に安定な化合物で
ある緑青(塩基性塩化第二銅)になるものと考えられ
る。CuCl 2 + 3Cu (OH) 2 = CuCl 2 · 3Cu (OH) 2 (11) Of course, these reactions are not independent, but proceed in parallel at the same time, and finally they are chemically stable compounds. It is considered to be patina (basic cupric chloride).
化成処理した銅又は銅合金薄膜の強制酸化処理時間は、
オゾン処理(オゾン含有雰囲気に曝す処理)を例にした
場合、オゾン濃度及びオゾン含有ガス量等によっても異
なるが、市販のオゾン発生器を用いれば通常は約10〜60
分程度で十分である。ただ、市販のオゾン発生器を用い
た処理では約10秒程度で表面の色が変化することから、
この程度の時間で反応が開始するものと考えられる。The forced oxidation treatment time of the chemical conversion treated copper or copper alloy thin film is
When ozone treatment (exposure to ozone-containing atmosphere) is taken as an example, it usually varies from about 10 to 60 if a commercially available ozone generator is used, although it depends on the ozone concentration and the amount of ozone-containing gas.
Minutes are enough. However, since the surface color changes in about 10 seconds with the treatment using a commercially available ozone generator,
It is considered that the reaction starts within this time.
強制酸化処理が終了した後、緑青が形成した基材は好適
には乾燥を兼ねた養生を行う。この養生では特に加熱す
る必要はなく、通常、室温で2〜24時間行えば十分であ
る。After the forced oxidation treatment is completed, the substrate on which patina is formed is preferably subjected to curing that also serves as drying. In this curing, it is not particularly necessary to heat, and it is usually sufficient to carry out at room temperature for 2 to 24 hours.
このようにして、密着性の極めて優れた均一色調の緑青
を短時間で形成することができる。In this way, it is possible to form a patina of uniform color tone with extremely excellent adhesion in a short time.
続いて、本発明を実施例によって更に具体的に説明す
る。Next, the present invention will be described more specifically by way of examples.
<実施例> 実施例1 まず、予め脱脂された銅板(360mm幅×360mm長×0.3mm
厚)を準備し、粒径#50〜#250のアランダム粉を用い
た空気圧1.5〜5kg/cm2(ゲージ圧)での吹付けブラスト
処理によって銅板表面の粗面化処理を行った。<Example> Example 1 First, a degreased copper plate (360 mm width x 360 mm length x 0.3 mm) was preliminarily degreased.
(Thickness) was prepared, and the surface of the copper plate was roughened by spray blasting using an alundum powder having a particle size of # 50 to # 250 at an air pressure of 1.5 to 5 kg / cm 2 (gauge pressure).
次に、前記銅板粗化面に銅ワイヤーを用いて厚さ25μm
の溶射膜(銅)を形成した。Next, using a copper wire on the roughened surface of the copper plate, the thickness is 25 μm.
Sprayed film (copper) was formed.
なお、この時の溶射条件は 溶射方法:アーク溶射(メテコ社製の4RC型機を使
用), 溶射距離:150mm±80mm, 溶射ガン速度:40m/min, ピッチ:20〜30mm, 使用電圧:35V, 使用電流:50A, エアーギャップ:Fine, エアー圧:80psi(5.6kg/cm2), 銅ワイヤー:1.6mmφ×2本, であった。The spraying conditions at this time are as follows: Spraying method: arc spraying (using a Metco 4RC type machine), spraying distance: 150 mm ± 80 mm, spraying gun speed: 40 m / min, pitch: 20-30 mm, working voltage: 35 V , Working current: 50A, Air gap: Fine, Air pressure: 80psi (5.6kg / cm 2 ), Copper wire: 1.6mmφ × 2 pcs.
次いで、前記銅溶射膜に化成処理液である塩化アルミニ
ウム30重量%の水溶液を刷毛で均一に塗布して化成処理
を行い、生成膜が湿気を十分含有しているうちにオゾン
酸化ボックス(0.2m3)に装入し、オゾン発生器{コー
ヨーテックス(株)製のKW−701型機,O3発生量:約9g/
hr}よりオゾン含有空気を3l/minの割合で15分間吹き込
んだ。Then, the copper sprayed film is subjected to a chemical conversion treatment by uniformly applying a 30% by weight aqueous solution of aluminum chloride, which is a chemical conversion treatment liquid, with a brush, and while the product film contains sufficient moisture, an ozone oxidation box (0.2 m 3 ) and put it into an ozone generator (KW-701 model by Koyotex Co., Ltd., O 3 generation rate: approx. 9 g /
hr} was blown with ozone-containing air at a rate of 3 l / min for 15 minutes.
この強制酸化処理の後、緑青が形成された銅板をオゾン
酸化用ボックスより取り出して室温で8時間の乾燥を兼
ねた養生を行った。After this forced oxidation treatment, the copper plate on which patina was formed was taken out from the ozone oxidation box and cured for 8 hours at room temperature, which also served as drying.
そして、“上述した本発明法により形成された緑青",
“30年以上経過した天然緑青",“市販品の人工緑青板”
及び“市販品の人工緑青スレート”につき、各緑青表面
の状態をSEM(走査型電子顕微鏡)にて観察した。Then, “pale blue formed by the method of the present invention described above”,
"Natural patina over 30 years", "commercial artificial patina"
Also, the state of each patina surface of "commercial artificial patina slate" was observed by SEM (scanning electron microscope).
このSEM観察写真を第1乃至4図に示す。This SEM observation photograph is shown in FIGS.
第1乃至4図の比較によっても明らかなように、本発明
法により形成された緑青は形状及び粒子の大きさ等が天
然緑青と酷似するものであることが判った。As is clear from the comparison of FIGS. 1 to 4, it was found that the patina formed by the method of the present invention is very similar in shape and particle size to the natural patina.
また、本発明法により形成された緑青は重厚な青味を帯
びた緑色の色調を呈しており、緑青被膜を指先でこすっ
ても全く剥離物を生ずることがなく、天然緑青と同等以
上に優れた密着性を有していることが確認された。In addition, the patina formed by the method of the present invention exhibits a solid bluish green color tone, and even if the patina film is rubbed with a fingertip, no peeled substance is generated at all, and it is as excellent as or better than natural patina. It was confirmed that it had good adhesion.
更に、X線回折による分析よって、本発明法により形成
された緑青は天然緑青の主成分である塩基性塩化第二銅
{CuCl2・3Cu(OH)2}であることも確認された。Further, it was also confirmed by the analysis by X-ray diffraction that the patina formed by the method of the present invention was basic cupric chloride {CuCl 2 · 3Cu (OH) 2 } which is the main component of natural patina.
しかも、“本発明法により形成された緑青”及び“天然
緑青”の断面についてそれぞれSEM観察を行ったとこ
ろ、本発明法によるものは、第5図に示す如く、基材
(銅板)の粗化面に食い込んだ溶射膜のほぼ全断面積が
緑青化して強固に基材と密着した構造となっている上、
溶射膜(緑青化したもの)中に微細な気孔の存在するこ
とが明確に認められ、第6図に示す天然緑青の場合と構
造,外観,緻密性等の点で極めて類似していることが判
った。Moreover, SEM observations were carried out on the cross sections of "green patina formed by the method of the present invention" and "natural patina," respectively. As a result of the method of the present invention, as shown in FIG. 5, the base material (copper plate) was roughened. Almost the entire cross-sectional area of the sprayed film that digs into the surface has become patina and has a structure that firmly adheres to the base material.
It is clearly recognized that fine pores are present in the thermal spray coating (patinated), and it is very similar in structure, appearance, and compactness to the case of natural patina shown in Fig. 6. understood.
実施例2 化成処理液として塩化第二錫:12重量%の水溶液を用い
た以外は、実施例1と同様の方法で緑青を形成させた。Example 2 A patina was formed in the same manner as in Example 1 except that an aqueous solution of stannic chloride: 12% by weight was used as the chemical conversion treatment solution.
このようにして得られた緑青被膜は、青色の強い色調
で、剥離物が全くない密着性の極めて優れた均一なもの
であった。The patina film thus obtained had a strong blue color tone and was a uniform one with excellent exfoliation and excellent adhesion.
実施例3 化成処理液として食塩水溶液(NaCl濃度:5重量%)にア
ルミニウム粉末を5重量%添加したものを用いた以外
は、実施例1と同様の方法で緑青を形成させた。Example 3 A patina was formed in the same manner as in Example 1 except that a salt solution (NaCl concentration: 5% by weight) containing 5% by weight of aluminum powder was used as the chemical conversion treatment liquid.
得られた緑青皮膜は、均一で天然緑青とほぼ同じ色調を
帯び、密着性の極めて優れたものであった。The obtained patina film was uniform and had almost the same color tone as that of natural patina, and had extremely excellent adhesion.
実施例4 化成処理液として塩化アルミニウム30重量%含む水溶液
にミョウバン{KAl3(SO4)2(OH)6}結晶を5重量%添加
したものを用いた以外は、実施例1と同様の方法で緑青
を形成した。Example 4 The same method as in Example 1 except that 5% by weight of alum {KAl 3 (SO 4 ) 2 (OH) 6 } crystals was added to an aqueous solution containing 30% by weight of aluminum chloride as a chemical conversion treatment solution. To form patina.
得られた緑青皮膜は、均一で剥離物の全くない密着性の
良いものであった。The obtained patina film was uniform and had good adhesion without peeling.
これらの実施例以外にも、銅又は銅合金薄膜の形成に溶
射法以外の種々の方法を、そして強制酸化手段として種
々の酸化性液体,酸化性気体を適用する方法を様々に組
み合わせた試験により、何れも本発明法に従えば前記実
施例の場合とほぼ同様に良好な結果を得られることが確
認された。In addition to these examples, various tests other than the thermal spraying method for forming a copper or copper alloy thin film, and various tests using various oxidizing liquids and methods of applying an oxidizing gas as a forced oxidation means were tested. It was confirmed that, according to the method of the present invention, good results can be obtained in almost the same manner as in the above-mentioned examples.
<効果の総括> 以上に説明した如く、この発明によれば、天然緑青とほ
ぼ同じ重厚な色調を呈すると共に密着性に極めて優れた
緑青を、格別に特殊な設備等が要することなくあらゆる
種類の基材上に短時間に安定して形成することが可能と
なり、屋根材のみならず建築内壁材や装飾品等の幅広い
分野のおける創作物の概念拡大に寄与し得るなど、産業
上、社会生活上極めて有用な効果がもたらされる。<Summary of Effects> As described above, according to the present invention, it is possible to obtain a patina having almost the same solid color tone as that of natural patina and excellent adhesion to all types without requiring special equipment. It can be stably formed on a base material in a short time, and it can contribute to the concept expansion of creative ideas in a wide range of fields such as roofing materials as well as interior wall materials and decorations. This brings about a very useful effect.
第1図は、“本発明法により形成された緑青”表面の状
態を示した走査型電子顕微鏡による金属組織写真図(倍
率:約8000倍)である。 第2図は、30年以上経過した天然緑青表面の状態を示し
た走査型電子顕微鏡による金属組織写真図(倍率:約80
00倍)である。 第3図は、“市販品の人工緑青板”表面の状態を示した
走査型電子顕微鏡による金属組織写真図(倍率:約8000
倍)である。 第4図は、“市販品の人工緑青スレート”表面の状態を
示した走査型電子顕微鏡による金属組織写真図(倍率:
約8000倍)である。 第5図は、“本発明法により形成された緑青”の断面状
態を示した走査型電子顕微鏡による金属組織写真図(倍
率:約300倍)である。 第6図は、30年以上経過した天然緑青の断面状態を示し
た走査型電子顕微鏡による金属組織写真図(倍率:約36
0倍)である。FIG. 1 is a photograph of a metal structure by a scanning electron microscope (magnification: about 8000 times) showing the state of the surface of “green-blue formed by the method of the present invention”. Figure 2 is a scanning electron microscope photograph of the metal structure showing the surface of the natural patina after 30 years (magnification: approx. 80
00 times). Fig. 3 is a photograph of a metal structure by a scanning electron microscope showing the condition of the surface of the "commercial artificial patina" (magnification: about 8000).
Times). FIG. 4 is a photograph of a metal structure by a scanning electron microscope showing the condition of the surface of the “commercial artificial green-blue slate” (magnification:
About 8,000 times). FIG. 5 is a metallographic photograph of a scanning electron microscope (magnification: about 300 times) showing a cross-sectional state of "green-blue formed by the method of the present invention". Figure 6 is a photograph of the metallographic structure of a natural patina with a scanning electron microscope showing the cross section of natural patina over 30 years (magnification: about 36
0 times).
───────────────────────────────────────────────────── フロントページの続き (72)発明者 玉野井 英雄 東京都港区虎ノ門2丁目10番1号 日本鉱 業株式会社内 (72)発明者 杉山 實 東京都品川区西五反田1丁目27番2号 甲 陽建設工業株式会社内 (72)発明者 小田原 信吾 千葉県市原市今津朝山852 甲陽建設工業 株式会社千葉製作所内 (72)発明者 中川 勝仁 千葉県市原市今津朝山852 甲陽建設工業 株式会社千葉製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hideo Tamano 2-10-1 Toranomon, Minato-ku, Tokyo Within Japan Mining Co., Ltd. (72) Inventor Minoru Sugiyama 1-2-7-2, Nishigotanda, Shinagawa-ku, Tokyo Koyo Construction Industry Co., Ltd. (72) Inventor Shingo Odawara 852 Imazu Asayama, Ichihara City, Chiba Prefecture Koyo Construction Industry Co., Ltd. Chiba Works (72) Inventor Katsuhito Nakagawa 852 Imazu Asayama City, Ichihara City, Chiba Koyo Construction Industry Co., Ltd. Chiba Works Within
Claims (4)
銅合金から成る薄膜を形成した後、該薄膜を (イ)アリカリ金属塩化物及び/又はアリカリ土類金属
塩化物にアルミニウム粉を加えたもの, (ロ)塩化アルミニウム, (ハ)塩化第二錫, (ニ)塩化亜鉛, (ホ)塩化鉛 から選ばれる1種又は2種以上を含む処理溶液で化成処
理し、続いてこれを強制酸化処理することを特徴とする
緑青の形成方法。1. A thin film made of copper or a copper alloy is formed on the surface of a base material on which patina is to be formed, and the thin film is then added to (a) alkaline metal chloride and / or alkaline earth metal chloride and aluminum powder. In addition, chemical conversion treatment with a treatment solution containing one or more selected from (b) aluminum chloride, (c) stannic chloride, (d) zinc chloride, and (e) lead chloride, and subsequently this A method for forming patina, which comprises subjecting the above to forced oxidation treatment.
に曝す処理にて行われる、請求項1に記載の緑青の形成
方法。2. The method for forming patina according to claim 1, wherein the forced oxidation after the chemical conversion treatment is performed by a treatment of exposing to an ozone-containing atmosphere.
し、その後で銅又は銅合金から成る薄膜を形成させる、
請求項1又は2に記載の緑青の形成方法。3. A surface of a substrate on which patina is formed is roughened, and then a thin film made of copper or a copper alloy is formed.
The method for forming patina according to claim 1 or 2.
成させる、請求項1乃至3の何れかに記載の緑青の形成
方法。4. The method for forming patina according to claim 1, wherein a thin film made of copper or a copper alloy is formed by thermal spraying.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3319390A JPH06102837B2 (en) | 1990-02-14 | 1990-02-14 | How to form patina |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3319390A JPH06102837B2 (en) | 1990-02-14 | 1990-02-14 | How to form patina |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03236481A JPH03236481A (en) | 1991-10-22 |
JPH06102837B2 true JPH06102837B2 (en) | 1994-12-14 |
Family
ID=12379650
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Application Number | Title | Priority Date | Filing Date |
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JP3319390A Expired - Lifetime JPH06102837B2 (en) | 1990-02-14 | 1990-02-14 | How to form patina |
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JP (1) | JPH06102837B2 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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1990
- 1990-02-14 JP JP3319390A patent/JPH06102837B2/en not_active Expired - Lifetime
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