JPH0593107U - Non-reciprocal circuit element - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] To improve productivity by enabling the use of an automatic machine when connecting the matching circuit element to the center conductor, and to avoid connection failure due to floating of the center conductor. [Structure] When the non-reciprocal circuit device 1 is formed by using a plurality of central conductors 7 so as to face each other with both main surfaces of the ferrite 6 interposed therebetween, the port electrodes 12a to 12c and the ground electrode 11 are arranged.
Using the flat plate-shaped electrode substrate 10 on which the
0 on the center conductor 7 of ferrite 6 and matching circuit element 17
˜20 are arranged, the other end 7b of each central conductor 7 is connected to the ground electrode 11, and the one end 7a and the matching circuit elements 17 to 20 are connected to the port electrodes 12a to 12c.
In addition, a concave portion 10a that absorbs the thickness due to the overlapping of the central conductors 7 is formed in the contact portion of the electrode substrate 10 with the ferrite 6.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a non-reciprocal circuit element used in the VHF, UHF, and SHF bands, for example, an isolator and a circulator, and in particular, improves workability in connecting a matching circuit element to each center conductor and improves the workability of an automatic machine. It relates to a structure that enables adoption, improves productivity, reduces manufacturing costs, and avoids connection failures due to floating center conductors.

[0002]

[Prior Art]

 In general, isolators and circulators have the function of passing signals only in the transmission direction and blocking transmission in the opposite direction, and are indispensable parts for mobile communication devices such as mobile phones and car phones. This isolator is configured such that a ferrite element consisting of ferrite and a central conductor and a permanent magnet are housed mainly in a magnetic metal case, and a DC magnetic field is applied to the ferrite element by the permanent magnet. Such an isolator is required to be small and lightweight for its application. To meet this demand, it is conceivable to reduce the diameter of ferrite, but if this is done, the length of the center conductor will also be shortened, and the inductance value of the center conductor will be reduced, and the electrical characteristics will be deteriorated.

Ferrite elements as shown in FIG. 5 and FIG. 6 have been proposed as ones that can reduce the diameter of ferrite without deteriorating such electrical characteristics. In the ferrite element 33, a band-shaped metal plate is bent into a substantially U-shape to form a center conductor 30, and the respective center conductors 30 are wound around both main surfaces 31a and 31b of a ferrite 31 and inserted. Further, they are formed so as to intersect with each other with an insulating sheet 32 at an angle of 120 degrees. According to this structure, since the central conductor 30 is wound around both main surfaces 31a and 31b of the ferrite 31, the effective length of the central conductor 30 can be increased by that much. This can contribute to the above-mentioned downsizing and weight saving. Further, in the case of forming an isolator using the ferrite element 33, conventionally, the matching circuit chip capacitors C1 and C2 are connected to one end portions 30a of the two center conductors 30 and the other end portions 30a of the center conductor 30 are connected. The chip capacitor C3 and the terminating chip resistor R are connected to the same, and these are connected to, for example, the ground plate 34 or the metal case. Further, a structure is adopted in which the other end 30b of each center conductor 30 is connected to the ground plate 34.

[0004]

[Problems to be solved by the device]

 However, in the above-described conventional isolator, since it is a troublesome work of directly connecting the chip capacitors C1 to C3 and the chip resistor R to each central conductor 30, there is a problem that the productivity is low and the manufacturing cost is increased. ..

Here, the inventors of the present invention focused on using a flat electrode substrate 40 having a port electrode 41 and an earth electrode 42 formed on the surface thereof, as shown in FIG. That is, the ferrite element 43 and the chip capacitor 44 are placed on the electrode substrate 40, the one end portion 45a of the center conductor 45 and the capacitor 44 are connected to each of the port electrodes 41, and By connecting the other end 45b of the center conductor 45 to the ground electrode 42, it becomes possible to adopt an automatic machine, and the above-mentioned conventional problems can be solved.

By the way, when such an electrode substrate 40 is used, when the ferrite element 43 is arranged on the substrate 40, the central conductors 45 are overlapped with each other at the center portion of the lower surface of the ferrite element 43. Since the insulating sheet is inserted between the conductors 45, the one end portion 45a and the other end portion 45b of the central conductor 45 are likely to be floated due to the thickness of these, and as a result, the port electrode 41 and the ground electrode 42 are formed. There is a risk of connection failure with.

An object of the present invention is to improve workability when connecting a matching circuit element to a center conductor, enable mounting by an automatic machine, improve productivity, and avoid poor connection of the center conductor. An object is to provide a non-reciprocal circuit device that can be used.

[0008]

[Means for Solving the Problems]

 In view of this, the present invention has a plurality of central conductors wound on both main surfaces of the ferrite so as to face each other with the ferrite sandwiched therebetween, and the central conductors are arranged in an electrically insulated state and crossed at predetermined intervals. Then, in the nonreciprocal circuit element in which one end of each of the central conductors is connected to the matching circuit element and the other end is connected to the ground, the flat electrode substrate on which the port electrode and the ground electrode are formed, The ferrite center conductor and matching circuit element are arranged, the other end of each center conductor is connected to the earth electrode, and one end and the matching circuit element are connected to the port electrode, and the electrode substrate is further connected. It is characterized in that a concave portion is formed at a contact portion of the ferrite.

Here, for example, a metal member is insert-formed on an insulating resin to form each electrode on the electrode substrate, and an electrode paste is screen-printed on a printed circuit board or a dielectric substrate and then baked. What formed each electrode can be adopted. Further, in the present specification, the recessed portion includes not only one having a bottom but also one having no bottom.

[0010]

[Action]

 According to the nonreciprocal circuit device of the present invention, the electrode substrate on which the port electrode and the ground electrode are formed is used, and the matching circuit device and one end of each central conductor are connected to the port electrode on the substrate. To assemble, screen-print cream solder on the port electrode and ground electrode of the above electrode board, place matching circuit elements and ferrite elements on each electrode with an automatic machine such as a chip mounter, and reflow solder them. Can be done by As a result, the labor-intensive work of directly connecting the matching circuit element to each center conductor as in the prior art can be eliminated, and the productivity can be improved and the manufacturing cost can be reduced.

Further, in the present invention, since the concave portion is formed in the ferrite portion of the electrode substrate, the concave portion can absorb the thickness due to the overlap of the central conductors on the lower surface of the ferrite and the thickness of the insulating sheet. Since the problem of floating at one end and the other end of each center conductor can be solved, connection failure can be avoided. Moreover, since the ferrite element is inserted into the recess, the entire component can be made shorter by that amount.

[0012]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 are views for explaining a non-reciprocal circuit device according to an embodiment of the present invention. In this embodiment, a case of application to a lumped constant type isolator will be described as an example. In the figure, reference numeral 1 denotes a lumped-constant type isolator, in which a ferrite element 3 is arranged in a lower yoke 2 made of magnetic metal, and an upper yoke 4 made of magnetic metal is mounted on the lower yoke 2. In addition to constituting a magnetic closed circuit, a permanent magnet 5 is attached to the back surface of the upper yoke 4, and a DC magnetic field is applied to the ferrite element 3 by the permanent magnet 5.

The ferrite element 3 is configured by inserting and attaching three central conductors 7 facing each other with the ferrite 6 sandwiched between the upper surface and the lower surface of a disk-shaped ferrite 6. Each of the core conductors 7 is formed by bending a strip-shaped metal plate into a substantially U-shape, and each of the center conductors 7 extends in the diametrical direction on both surfaces of the ferrite 6 and has an insulating sheet 8 therebetween. They are arranged in a cross shape with an angle of 120 degrees. Further, one end portion 7a of each of the central conductors 7 extends outward from the ferrite 6, and the one end portion 7a is bent downward and formed in a step shape. The other end 7b of each of the central conductors 7 slightly projects outward from the ferrite 6, and the other end 7b is formed in a stepwise shape by bending upward.

On the bottom wall of the lower yoke 2, an electrode substrate 10 characterizing this embodiment is arranged, and a ferrite element 3 is arranged at the center of the electrode substrate 10. .. The electrode substrate 10 has a flat plate shape and is manufactured by insert-forming a metal member having a shape corresponding to each electrode described later on a resin member.

Ground electrodes 11 are formed on the periphery of the ferrite element 3 of the electrode substrate 10 at intervals of 120 degrees, and each of the ground electrodes 11 is led out to the lower surface of the electrode substrate 10 to form the lower yoke. Connected to 2. On the outside of each ground electrode 11 of the electrode substrate 10, first to third port electrodes 12a to 12c are formed with a gap provided between the electrode 11 and the ground electrode 11. A groove 13 is provided between each of the electrodes 12a to 12c and the ground electrode 11, and the groove 13 prevents short-circuiting between the electrodes.

Input / output terminals 14 are formed on the left and right side surfaces of the electrode substrate 10 corresponding to the first and second port electrodes 12a and 12b, respectively. It is connected to the port electrodes 12a and 12b. Grounding terminals 15 are formed on the left and right side surfaces of the electrode substrate 10 corresponding to the third port electrodes 12c. The grounding terminals 15 are formed on the third port electrodes 12c on the upper surface of the electrode substrate 10. It extends in close proximity. The input / output terminals 14 and the ground terminal 15 are exposed to the outside from the opening 2a of the lower yoke 2. Further, ground electrodes 16 connected to the lower yoke 2 are formed at both ends of one side edge of the electrode substrate 10, and the ground electrodes 16 and the first and second port electrodes 12a and 12b are formed. A gap is formed between them.

One electrode of the chip capacitors 17 and 18 is connected to the first and second port electrodes 12 a and 12 b of the electrode substrate 10, respectively, and the other electrode is connected to the earth electrode 16. ing. Further, one electrode of the chip capacitor 19 is connected to one end of the third port electrode 12c, and the other electrode is connected to the ground terminal 15. Further, one electrode of the terminal chip resistor 20 is connected to the other end of the third port electrode 12c, and the other electrode is connected to the ground terminal 15.

Further, one end portion 7 a of each central conductor 7 of the above-described ferrite element 3 is connected to the first to third port electrodes 12 a to 12 c of the electrode substrate 10, whereby one end of each central conductor 7 is connected. The portion 7a is connected to the chip capacitors 17 to 19 and the chip resistor 20 via the port electrodes 12a to 12c. The other end 7b of each central conductor 7 is connected to each earth electrode 11 of the electrode substrate 10, so that the other end 7b of each central conductor 7 is connected to the lower yoke 2 via the ground electrode 11. It is connected to the.

A recess 10a is provided in the contact portion of the electrode substrate 10 with the ferrite element 3, and the lower portion of the ferrite element 3 is inserted into the recess 10a.

Next, the function and effect of this embodiment will be described. To assemble the isolator 1 of this embodiment, cream solder is applied to the surface of each electrode of the electrode substrate 10 by screen printing, and the substrate 10 is placed on the bottom wall of the lower yoke 2. Then, by an automatic machine such as a chip mounter, the chip capacitors 17 to 19 and the chip resistor 20 are arranged at the predetermined positions on the port electrodes 12a to 12c, and the ferrite element 3 is inserted into the recess 10a, and the central conductors are inserted. One end portion 7a of 7 is located at the port electrodes 12a to 12c, and the other end portion 7b is located at the ground electrode 11. In this state, the capacitors 17 to 19 and the central conductor 7 are connected by reflow soldering. After that, the upper yoke 4 is fitted on the lower yoke 2.

As described above, according to this embodiment, the port electrodes 12a to 12c, the ground electrode 11 and the like are formed on the electrode substrate 10, and the chip capacitors 17 to 19 and the chip resistor 20 are formed by using the electrode substrate 10. Since the one end portion 7a and the other end portion 7b of each central conductor 7 are connected to each other, it is possible to adopt an automatic machine as described above, and further, it is possible to implement by reflow soldering. As a result, it is possible to simplify the assembly as compared with the conventional case of connecting one by one, which can improve the productivity and reduce the manufacturing cost.

Further, in this embodiment, since the concave portion 10a is formed in the central portion of the electrode substrate 10 and the ferrite element 3 is inserted into the concave portion 10a, the thickness due to the overlap of the central conductors 7 on the lower surface of the ferrite 6 is increased. And the thickness of the insulating sheet 8 can be absorbed. As a result, the problem of floating one end 7a and the other end 7b of each central conductor 7 can be solved, connection failure can be avoided, and the height of the entire component can be reduced by the amount corresponding to the recess 10a. The recess 10a does not have to have a size into which the ferrite element 3 can be inserted, and may have a smaller diameter than the recess 19a when absorbing only the thickness of the central portion of the ferrite element.

In the above embodiment, the case where the electrode substrate 10 is configured by inserting a metal member formed corresponding to each electrode in an insulating resin has been described as an example. However, the present invention is a printed substrate, or An electrode substrate formed by patterning a metal film on the surface of the dielectric substrate may be adopted. For example, in the electrode substrate 25 shown in FIG. 3, after screen-printing an electrode paste on the upper surface of the dielectric substrate 26, it is baked to form the ground electrodes 11, 16, 15 and the port electrodes 12a to 12c. 11, 16 and 15 are led out to the lower surface of the substrate 26 through the through holes 27 and connected to the lower yoke, and a recess 25a into which the ferrite element 3 is inserted is formed in the center of the electrode substrate 25. This is an example of the configuration.

Further, in the above embodiment, the structure in which the central conductor 7 is wound once on both main surfaces of the ferrite 6 is taken as an example, but the present invention may be one in which the central conductor is wound twice or more. Good. Further, in the above embodiment, the isolator is taken as an example, but the present invention can be applied not only to the circulator but also to other high frequency components.

[0025]

[Effect of the device]

 As described above, according to the nonreciprocal circuit device of the present invention, the port electrode and the ground electrode are formed on the flat electrode substrate, and the one end of the center conductor and the matching circuit device are connected to the port electrode of the electrode substrate. However, since the other end of each center conductor is connected to the ground electrode, it is possible to assemble by an automatic machine, which can improve productivity and reduce manufacturing cost. Further, since the concave portion is formed in the ferrite portion of the electrode substrate, it is possible to avoid the connection failure due to the floating of the central conductor and to reduce the height of the entire component.

[Brief description of drawings]

FIG. 1 is an exploded perspective view illustrating an isolator according to an exemplary embodiment of the present invention.

FIG. 2 is a sectional view of the isolator of the above embodiment.

FIG. 3 is a perspective view showing an electrode substrate according to another example of the above embodiment.

FIG. 4 is a cross-sectional view for explaining a formation process of the present invention.

FIG. 5 is a perspective view showing a ferrite element of a conventional isolator.

FIG. 6 is a perspective view showing the structure of a conventional isolator.

[Explanation of symbols]

 1 Isolator (non-reciprocal circuit element) 6 Ferrite 7 Central conductor 7a One end 7b The other end 10,25 Electrode substrate 10a, 25a Recess 11 Earth electrode 12a-12c Port electrode 17-19 Chip capacitor (matching circuit element) 20 Chip resistance (Matching circuit element)

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Takashi Hasegawa 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Murata Manufacturing Co., Ltd. (72) Takashi Kawanami 2-26-10 Tenjin, Nagaokakyo, Kyoto Stock company Murata Manufacturing Co., Ltd. (72) Inventor Hiroki Idejima 2-26-10 Tenjin Tenjin, Nagaokakyo-shi, Kyoto Murata Manufacturing Co., Ltd.

Claims (1)

[Scope of utility model registration request] 1. A plurality of center conductors are wound on both main surfaces of ferrite so as to face each other with the ferrite sandwiched therebetween, and
A non-reciprocal circuit device in which the respective center conductors are arranged in an electrically insulated state and intersect each other at predetermined intervals, and one end of each of the center conductors is connected to a matching circuit device and the other end is connected to ground. In, in the flat electrode substrate on which the port electrode and the ground electrode are formed, the ferrite central conductor and the matching circuit element are arranged, and the other end of each central conductor is connected to the ground electrode, and one end and A nonreciprocal circuit device, wherein the matching circuit device is connected to the port electrode, and a recess is formed in a portion of the electrode substrate where the ferrite contacts.