JPH0588761U - Soldering device - Google Patents

Abstract

(57) [Summary] [Purpose] To detect the change in height of the parts to be soldered and to hold the heat source in the proper position for soldering. [Structure] The nozzle 1 and the sensor 7 are supported by a support block 8, and the distance α between the nozzle 1 and the sensor 7 is detected. The beam irradiation device 6 also has a support block 8
It is supported by the fine movement feed mechanism 9 and is movable relative to the soldering surface 5 together with the nozzle 1 and the like. The position of the nozzle 1 due to the difference in height of the electronic component 3 is detected by the sensor 7, and the height of the beam irradiation position 6 can be finely adjusted to the optimum position.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a soldering device, and more particularly, to a soldering device for electronic components using a beam heat source.

[0002]

[Prior Art]

 Conventionally, as a soldering device of this type, a device in which a beam heat source is fixed at a predetermined height with respect to a soldering position of an electronic component or the like to be soldered, and soldering is performed at this fixing position is generally used. Are known.

[0003]

[Problems to be solved by the device]

 However, the conventional method of irradiating the beam with the height of the heat source fixed is the ideal position because of the deformation of the soldering surface of the component, including warpage, and the difference in height and thickness of each component. There is an inconvenience that the beam cannot be emitted and soldering failure and component damage occur.

[0004]

[The purpose of the device]

 The present invention improves the disadvantages of the conventional example, and in particular, provides a soldering device capable of performing beam irradiation from an appropriate position even when the size of a component to be soldered changes. Its purpose.

[0005]

[Means for Solving the Problems]

 The present invention is a support block provided so as to be movable relative to the soldering surface via a fine movement feed mechanism, and is supported by the support block so as to be movable in the axial direction, and is also capable of adsorbing parts to be soldered. Between the nozzle that mounts it on the soldering surface, the pressing means that biases this nozzle toward the soldering surface, the sensor that detects the axial position of the nozzle, and the part to be soldered and the soldering surface. And a heat source for heating the solder interposed between the solder block and the heat source. The heat source is supported by the support block, and the relative distance between the solder surface and the soldering surface can be finely adjusted according to the sensor signal. It has a structure such as that provided in the. This is intended to achieve the above-mentioned object.

[0006]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows the overall configuration of the soldering apparatus according to this embodiment. In this figure, the nozzle 1 is supported by a support block 8 so as to be movable in the axial direction. The nozzle 1 is provided with an air passage 1a in the inner axial direction, the lower end side of the air passage 1a in the drawing is opened to an electronic component 3 as a soldered component, and the suction force of a pump (not shown) is used. It is provided so that it can be mounted on the soldering surface 5 while adsorbing the electronic component 3. A pressure coil spring 2 as a biasing means is wound around the outer periphery of the nozzle 1, and the biasing force of the pressure coil spring 2 can press the electronic component 3 against the soldering surface 5. It has become.

The support block 8 is provided so as to be movable relative to the soldering surface 5 by a fine movement feed mechanism 9. Further, a photoelectric or capacitance type sensor 7 is provided at a position spaced apart from the upper end of the nozzle 1 in the axial direction by a predetermined distance, and the relative distance α is detected by the sensor 7 and detected by a control device (not shown). The value is designed to be given. A beam irradiation device 6 as a heat source is supported at a lateral position of the support block 8. The irradiation surface 6a of the beam irradiation device 6 is directed toward the solder interposed between the electronic component 3 and the soldering surface 5.

Next, the operation of this embodiment will be described. The fine movement feed mechanism 9 lowers the entire unit including the support block 8 and the like, so that the electronic component 3 is mounted on the soldering surface 5 by the nozzle 1 and then the unit is continuously lowered. Therefore, the sensor 7 detects the distance α between the head portion of the nozzle 1 and the sensor 7.

Further, the fine movement feed mechanism 9 detects an error between the known height B of the electronic component 3 and the actual measured value based on the detected value of α, and corrects the error to correct the soldering surface 5 of the electronic component 3. The distance A from the beam irradiation device 6 to the irradiation surface 6a of the beam irradiation device 6 is kept constant without being influenced by the warp of the substrate, and the operation is stopped. At this time, the electronic component 3 fixes the electronic component 3 by pressing the nozzle 1 downward by the pressure coil spring 2. After that, a beam is irradiated from the irradiation surface 6a of the beam irradiation device 6 to perform soldering.

[0011]

[Effect of the device]

 As described above, according to the above-mentioned configuration of the present invention, the nozzle and the coil spring for pressing hold the electronic component to prevent the displacement of the component, detect the height of the component, and include the warp on the soldering surface of the component. By changing the height of the heat source according to the height of each of the parts, it is possible to provide a soldering device that has an unprecedented excellent effect that accurate and stable soldering can be performed.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Nozzle 2 Pressurizing coil spring 3 Electronic parts as parts to be soldered 4 Solder 5 Soldering surface 6 Beam irradiation device 7 Sensor 8 Support block 9 Fine feed mechanism

Claims (1)

[Scope of utility model registration request] 1. A support block which is provided so as to be movable relative to a soldering surface via a fine movement feed mechanism, and is supported by the support block so as to be movable in an axial direction and sucks a component to be soldered. A nozzle for mounting the nozzle on the soldering surface, a pressing means for urging the nozzle toward the soldering surface, a sensor for detecting the axial position of the nozzle, the component to be soldered and the soldering surface. A heat source for heating the solder interposed therebetween is supported by the support block, and the relative distance to the soldering surface can be finely adjusted via the fine movement feeding mechanism in response to a signal from the sensor. A soldering device, which is provided in the.