JPH0582996B2 - - Google Patents
Info
- Publication number
- JPH0582996B2 JPH0582996B2 JP60261647A JP26164785A JPH0582996B2 JP H0582996 B2 JPH0582996 B2 JP H0582996B2 JP 60261647 A JP60261647 A JP 60261647A JP 26164785 A JP26164785 A JP 26164785A JP H0582996 B2 JPH0582996 B2 JP H0582996B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper foil
- light transmittance
- clad laminate
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はフレキシブル印刷回路板用の銅張り積
層板に関するものである。近年情報機器の発達に
伴ない、入力の容易化のため、デイスプレイ上か
ら直接ペンや指頭で入力する平面デイスプレイ方
式が注目され、これに用いる透明導電フイルムが
種々検討されている。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a copper-clad laminate for flexible printed circuit boards. BACKGROUND ART In recent years, with the development of information devices, flat display systems that allow input directly from the display with a pen or fingertip have attracted attention in order to facilitate input, and various transparent conductive films for use in this system have been studied.
本発明は透明導電フイルムの１種として透明性
の優れたフレキシブル印刷回路板の製造に適する
銅張り積層板を提供せんとするものである。 The present invention aims to provide a copper-clad laminate suitable for manufacturing flexible printed circuit boards with excellent transparency as a type of transparent conductive film.
（従来の技術と問題点）
フレキシブル銅張り積層板は、普通ポリエチレ
ンテレフタレート（PET）、ポリイミド等のプラ
スチツクフイルムを基材として、これに銅箔が接
着剤で積層された構成である。(Prior Art and Problems) A flexible copper-clad laminate usually has a base material of a plastic film such as polyethylene terephthalate (PET) or polyimide, and a copper foil is laminated thereon with an adhesive.
一般に銅箔としては電解銅箔またはロール圧延
法による圧延銅箔が使用される。電解銅箔を使用
した場合にはその表面が平滑でないため接着性に
問題ないので粗面化せずそのまま用いられている
が、これに印刷回路を形成した場合には透明性が
悪く、平行光線透過率が40％以下しか得られない
という問題点があつた。 Generally, as the copper foil, an electrolytic copper foil or a rolled copper foil by a roll rolling method is used. When electrolytic copper foil is used, its surface is not smooth, so there is no problem with adhesion, so it is used as is without roughening, but when a printed circuit is formed on it, its transparency is poor and parallel light rays The problem was that the transmittance was only 40% or less.
一方、圧延銅箔は表面が平滑であるため表面を
粗面化加工せずそのままを積層板として用いた場
合には接着性が悪いので実用化されておらず、接
着性をよくするために通常、この表面を粗面化加
工（粗面度10以上）したものが用いられている。
しかしながらこのような銅張り積層板は表面を粗
面加工した銅箔を使用しているので、これをエツ
チングによつて銅を取り除くと接着剤面がすりガ
ラス状の半透明として表われ、フイルム基材の平
行光線透過率は20％以下となる。これは銅箔の粗
面度が高いので、この粗面がそのまま転写された
状態になるという理由によるものと考えられる。 On the other hand, rolled copper foil has a smooth surface, so if it is used as a laminate without roughening the surface, it has poor adhesion, so it has not been put to practical use. , the surface of which has been roughened (roughness of 10 or more) is used.
However, such copper-clad laminates use copper foil with a roughened surface, so when the copper is removed by etching, the adhesive surface appears as a frosted glass-like translucent surface, which makes the film base material The parallel light transmittance of is 20% or less. This is thought to be due to the fact that the copper foil has a high degree of roughness, so this rough surface is transferred as is.
上記したとおり従来の銅張り積層板を印刷回路
を形成させたとき平行光線透過率がよくないとい
う問題点があつた。 As mentioned above, when a printed circuit was formed using a conventional copper-clad laminate, there was a problem in that the parallel light transmittance was not good.
（発明の構成）
本発明はこの点にかんがみ透明性の優れたフレ
キシブル印刷回路板に適した銅張り積層板を提供
するものであつて、その要旨とするところは、透
明性のフイルム基材、接着剤および表面粗度が
1.5〜５の範囲内にある圧延銅箔とを積層一体化
してなり、かつ該銅箔をエツチング除去した際の
平行光線透明率が60％以上、全光線透過率が80％
以上であることを特徴とするフレキシブル銅張り
積層板にある。(Structure of the Invention) In view of this point, the present invention provides a copper-clad laminate having excellent transparency and suitable for a flexible printed circuit board. Adhesive and surface roughness
It is made by laminating and integrating rolled copper foil within the range of 1.5 to 5, and when the copper foil is etched away, the parallel light transparency is 60% or more and the total light transmittance is 80%.
There is a flexible copper-clad laminate having the above characteristics.
以下これをさらに詳しく説明する。 This will be explained in more detail below.
本発明のフレキシブル銅張り積層板は3800〜
7500Åの可視光線域の平行光線透過率が80％以上
で印刷回路基板としても充分なフレキシブル物性
をもつ、ポリエチレンテレフタレート（PET）、
ポリエーテルエーテルケトン、ポリエーテルスル
ホン、ポリカーボーネート等のプラスチツクフイ
ルムを用いるが、これらの中でもPETフイルム
が優れている。 The flexible copper-clad laminate of the present invention is 3800~
Polyethylene terephthalate (PET) has a parallel light transmittance of 80% or more in the visible light range of 7500 Å, and has sufficient flexible physical properties to be used as a printed circuit board.
Plastic films such as polyether ether ketone, polyether sulfone, and polycarbonate are used, and among these, PET film is excellent.
本発明ではフイルム基材をそのまま使用できる
があらかじめ無機ガス中で低温プラズマ処理して
その表面を活性化するのが望ましく、これによ
り、圧延銅箔との強固な接着が得られる。 In the present invention, the film base material can be used as it is, but it is preferable to activate its surface by subjecting it to low-temperature plasma treatment in an inorganic gas in advance, thereby obtaining strong adhesion to the rolled copper foil.
この場合の処理は、減圧可能な低温プラズマ発
生装置内に前記フルムを保持し、0.01〜10トルの
低温下に無機ガスを通気しながら電極間に、たと
えば10KHz〜100のHzの高周波電力を印加するこ
とによつて行われる。放電周波数帯としては、前
記高周波のほかに低高周波、カイクロ波、さらに
は直流なども用いることができる。 In this case, the process involves holding the above-mentioned flume in a low-temperature plasma generator that can reduce the pressure, and applying high-frequency power of, for example, 10 KHz to 100 Hz between the electrodes while aerating inorganic gas at a low temperature of 0.01 to 10 Torr. It is done by doing. As the discharge frequency band, in addition to the above-mentioned high frequency, low high frequency, cyclowave, and even direct current can be used.
フイルム基材の透明度はこの処理によつて影響
されず、処理前と同じ光線透過率である。 The transparency of the film substrate is not affected by this treatment and has the same light transmittance as before treatment.
圧延銅箔は厚さ17〜35μｍで、表面粗度（真の
表面積を見掛けの幾何学的面積で割つた値）が
1.5〜５、好ましくは1.5〜３の範囲内のものを用
いる。表面粗度が５以上ではフイルムの透明性が
失われ、1.5以下では製箔が困難となる。接着剤
としては無色透明で熱硬化型のものが必要であ
り、例えば熱硬化性ポリエステル樹脂、熱硬化性
アクリル樹脂が適当である。 Rolled copper foil has a thickness of 17 to 35 μm and a surface roughness (true surface area divided by apparent geometric area).
A value within the range of 1.5 to 5, preferably 1.5 to 3 is used. If the surface roughness is 5 or more, the transparency of the film will be lost, and if it is less than 1.5, it will be difficult to make foil. The adhesive must be colorless, transparent, and thermosetting; for example, thermosetting polyester resin and thermosetting acrylic resin are suitable.
本発明のフレキシブル銅張り積層板は、フイル
ム基材そのまま、もしくはあらかじめ低温プラズ
マ処理したフイルム基材面に、接着剤を塗布乾燥
した後、これに圧延銅箔を積層し、加熱ロールで
圧着一体化することによつて得られる。 The flexible copper-clad laminate of the present invention is made by applying an adhesive to the film base material as it is or to the surface of the film base material that has been previously treated with low-temperature plasma and drying it, then laminating rolled copper foil thereon and crimping it together with a heated roll. obtained by doing.
この銅張り積層板はフレキシブルでしかも銅箔
の接着性が強固であつて、フレキシブル印刷回路
板として充分な特性を具備している。 This copper-clad laminate is flexible and has strong adhesion to the copper foil, and has sufficient characteristics as a flexible printed circuit board.
すなわち、銅箔上にホトレジスト法またはスク
リーン印刷法で印刷回路を作成でき、エツチング
によつて銅を除去した後は、平行光線透過率が60
％以上、全光線透過率が80％以上の高い透明性を
もつているが、これは従来のフレキシブル印刷回
路用銅張り積層板に比べて、格別に優れたもので
ある。 That is, printed circuits can be created on copper foil by photoresist method or screen printing method, and after removing the copper by etching, the parallel light transmittance is 60.
It has high transparency with a total light transmittance of over 80%, which is exceptionally superior to conventional copper-clad laminates for flexible printed circuits.
本発明のフレキシブル銅張り積層板は、透明性
を必要とするデイスプレイ等のフレキシブル印刷
回路板に有用である。以下、本発明の実施態様を
実施例を挙げて説明するが、本発明はこれに限定
されるものではない。また、実施例中の剥離強度
は、JIS Ｃ 6481、透過率はJIS Ｋ 7105に準拠
する。 The flexible copper-clad laminate of the present invention is useful for flexible printed circuit boards such as displays that require transparency. Hereinafter, embodiments of the present invention will be described with reference to Examples, but the present invention is not limited thereto. Further, the peel strength in the examples is based on JIS C 6481, and the transmittance is based on JIS K 7105.
実施例 １
厚さ100μｍのPETフイルム（東レ製ルミラー
Ｔ）に透明な熱硬化性アクリル酸エステル接着剤
を該接着剤が乾燥硬化したとき20μｍとなるよう
に塗布し、乾燥したのち、厚さ35μｍの圧延銅箔
（表面粗度３）と張り合せ120℃で40分間50Kg／cm2
の圧力で加熱加圧して積層板を得た。得られた銅
張り積層板の銅箔をエツチングして全部除去し
た。この接着剤付フイルムの透明性を測定したと
ころ平行光線透過率は79％全光線透過率は90％で
あつた。また接着剤との接着力を測定したところ
剥離強度は0.08Kg／cmであつた。なお、このもの
は印刷回路の作成には十分であつた。Example 1 A transparent thermosetting acrylic ester adhesive was applied to a 100 μm thick PET film (Toray Lumirror T) so that the adhesive would have a thickness of 20 μm when dry and hardened, and after drying, the film would have a thickness of 35 μm. Laminated with rolled copper foil (surface roughness 3) at 120℃ for 40 minutes at 50Kg/cm 2
A laminate was obtained by heating and pressing at a pressure of . The copper foil of the obtained copper-clad laminate was completely removed by etching. When the transparency of this adhesive film was measured, the parallel light transmittance was 79% and the total light transmittance was 90%. Furthermore, when the adhesive force with the adhesive was measured, the peel strength was 0.08 kg/cm. Note that this product was sufficient for making printed circuits.
実施例 ２
厚さ100μｍのPETフイルム（東レ製ルミラー
Ｔ）にポリエステル系の熱硬化型接着剤を乾燥時
で15μｍになるような厚さに塗布し、乾燥した
後、厚さ35μｍの圧延銅箔（表面粗度３）と張り
合せ、120℃で40分間50Kg／cm2の圧力で加熱加圧
して積層板を得た。Example 2 A polyester thermosetting adhesive was applied to a 100 μm thick PET film (Toray Lumirror T) to a dry thickness of 15 μm, and after drying, a 35 μm thick rolled copper foil was applied. (surface roughness: 3) and heated and pressed at 120° C. for 40 minutes at a pressure of 50 kg/cm 2 to obtain a laminate.
このようにして得られた銅張り積層板の銅箔を
エツチングして全部除去した。この接着剤付フイ
ルムの接着剤面は銅箔の平滑光沢面を写した状態
であつて、これらの透明性を測定したところ。平
行光線透過率は80％、全光線透過率は88％であつ
た。 The copper foil of the copper-clad laminate thus obtained was completely removed by etching. The adhesive side of this adhesive film mirrored the smooth, glossy surface of the copper foil, and its transparency was measured. The parallel light transmittance was 80% and the total light transmittance was 88%.
なお、前記PETフイルムは、あらかじめ低温
プラズマ処理して表面を活性化したものであるた
め、フレキシブルであるにも係らず、接着剤との
接着性は強固で剥離強度は1.5Kg／cm以上であつ
た。またプリント回路製造工程に使用される薬品
や溶剤にも耐性があつた。 The surface of the above-mentioned PET film has been activated by low-temperature plasma treatment, so although it is flexible, it has strong adhesion with adhesives and has a peel strength of 1.5 kg/cm or more. Ta. It was also resistant to chemicals and solvents used in the printed circuit manufacturing process.
さらに、この銅張り積層板フレキシブル印刷回
路板として、ホトレジスト法により線幅100μｍ、
線間隔500μｍの回路を作成し、その透明性を測
定したところ、平行線透過率は65％、全光線透過
率は80％であつた。 Furthermore, as this copper-clad laminate flexible printed circuit board, the line width is 100μm by photoresist method.
When a circuit with a line spacing of 500 μm was prepared and its transparency was measured, the parallel light transmittance was 65% and the total light transmittance was 80%.
比較例 １
実施例１において圧延銅箔として表面粗度10の
ものを用いた以外は、同一条件で銅張り積層板を
得た。Comparative Example 1 A copper-clad laminate was obtained under the same conditions as in Example 1 except that a rolled copper foil with a surface roughness of 10 was used.
得られた積層板の物性を測定したところ平行光
線透過率18％、全光線透過率60％、剥離強度1.0
Kg／cmであつた。 Measurement of the physical properties of the obtained laminate revealed parallel light transmittance of 18%, total light transmittance of 60%, and peel strength of 1.0.
It was Kg/cm.
Claims (1)
度が1.5〜５の範囲内にある圧延銅箔とを積層一
体化してなり、かつ該銅箔をエツチング除去した
際の平行光線透過率が60％以上、全光線透過率が
80％以上であることを特徴とするフレキシブル銅
張り積層板。1 It is made by laminating and integrating a transparent film base material, an adhesive, and a rolled copper foil with a surface roughness in the range of 1.5 to 5, and the parallel light transmittance when the copper foil is etched away is 60. % or more, the total light transmittance is
A flexible copper-clad laminate characterized by a copper-clad laminate of 80% or more.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26164785A JPS62122193A (en) | 1985-11-21 | 1985-11-21 | flexible copper clad laminate |
| US06/928,396 US4806432A (en) | 1985-11-21 | 1986-11-10 | Copper-foiled laminated sheet for flexible printed circuit board |
| EP19860402584 EP0223716B1 (en) | 1985-11-21 | 1986-11-20 | A copper-foiled laminated sheet for flexible printed circuit board |
| DE8686402584T DE3677714D1 (en) | 1985-11-21 | 1986-11-20 | PLATE LAMINATED WITH COPPER FOR FLEXIBLE PRINTED CIRCUIT BOARD. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26164785A JPS62122193A (en) | 1985-11-21 | 1985-11-21 | flexible copper clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62122193A JPS62122193A (en) | 1987-06-03 |
| JPH0582996B2 true JPH0582996B2 (en) | 1993-11-24 |
Family
ID=17364805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26164785A Granted JPS62122193A (en) | 1985-11-21 | 1985-11-21 | flexible copper clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62122193A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5756547B1 (en) * | 2014-04-28 | 2015-07-29 | 株式会社Ｓｈカッパープロダクツ | Surface-treated copper foil and laminate |
| JP5695253B1 (en) * | 2014-06-23 | 2015-04-01 | 株式会社Ｓｈカッパープロダクツ | Copper-clad laminate and flexible printed wiring board using the copper-clad laminate |
| JP5732181B1 (en) * | 2015-02-05 | 2015-06-10 | 株式会社Ｓｈカッパープロダクツ | Copper-clad laminate and flexible printed wiring board using the copper-clad laminate |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55132095A (en) * | 1979-04-02 | 1980-10-14 | Kazuo Terada | Method of fabricating printed board |
| JPS59205791A (en) * | 1983-05-09 | 1984-11-21 | 住友電気工業株式会社 | transparent printed circuit board |
| JPS6027402A (en) * | 1983-07-23 | 1985-02-12 | Nippon Kokan Kk <Nkk> | rolled steel foil |
-
1985
- 1985-11-21 JP JP26164785A patent/JPS62122193A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62122193A (en) | 1987-06-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |