JPH0582203A - Copper-alloy electric socket structural component - Google Patents

Abstract

PURPOSE:To provide good thermal stress deformation resistance and heat conductivity and improve spring property by forming an electric socket component with specific-composition copper alloy. CONSTITUTION:An electric socket structural component is a composition containing 0.1-2% Mg, 0.001-0.1% P and Cu and inevitable impurities for the rest. Then, it improves its thermal stress deformation resistance without marring its heat conductivity because Mg element is solid-solved in substrate and Cu is used as main element. It also improves its spring property as well as thermal stress deformation resistance because P element has deoxidizing effect in the state of coexistance with Mg. Desired effect is obtained by the composition of Mg and P as above-mentioned and lower heat conductivity is avoided because of relatively less Sn content.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Cu alloy electric socket structural component which is excellent in heat stress deformation and thermal conductivity and has high room temperature strength and spring properties.

[0002]

2. Description of the Related Art Conventionally, a structural component of an electric socket such as a single socket or an IC socket generally has, for example, weight%.
(Hereinafter,% indicates weight%), Sn: 1.5 to 9%, P
: 0.03 to 0.35%, the balance being Cu and unavoidable impurities, and punching and bending from a Cu alloy strip or plate, or the above Cu.
It is manufactured by subjecting a material of a predetermined length cut out from an alloy wire or rod to a drill, a punch, etc., to perform drilling, punching, boring, etc.

[0003]

On the other hand, in recent years, various electric and electronic devices have been remarkably improved in performance and multifunction, and accordingly, the amount of heat generated in the electric socket tends to be further increased. Structural parts are required to have excellent heat-resistant stress-deformability (the property of being hard to be deformed by heating under stress) and thermal conductivity. However, the conventional Cu alloy electric socket structural parts described above are Although it has high room temperature strength and spring properties, it has relatively low thermal conductivity due to the relatively high content of Sn as an alloying component, and also has insufficient heat stress deformability. At present, it is not possible to satisfy the above requirements.

[0004]

Therefore, the present inventors have
From the above viewpoints, as a result of research to develop a Cu alloy electric socket structural component having particularly excellent heat stress deformation resistance and thermal conductivity, the electric socket structural component was identified as Mg: 0.1 2%, P: 0.001 to 0.
If it is made of a Cu alloy containing 1% and the balance of Cu and unavoidable impurities, the resulting Cu alloy electric socket structural component should have excellent heat stress deformation and thermal conductivity. In addition, the research result that the high strength and the spring property required for the structural parts of the socket are provided.

The present invention was made based on the above research results, and the reason why the composition of the Cu alloy constituting the structural part of the electric socket is limited as described above will be explained.

(A) Mg The Mg component dissolves in the matrix and does not impair the excellent thermal conductivity brought about by the main component Cu,
Although it has the effect of improving the heat stress deformability and further improving the room temperature strength and the machinability, if the content is less than 0.1%, the desired effect cannot be obtained on the other hand, while the content is 2%. If it exceeds, the thermal conductivity will decrease, so the content was set to 0.1 to 2%.

(B) In addition to the deoxidizing action, the P P component has the action of improving the thermal stress deformability and the spring property in the state of coexisting with the Mg component, but its content is 0. If it is less than 0.001%, the desired effect cannot be obtained, while the content thereof is less than 0.001.
If it exceeds 1%, large precipitates are likely to appear, and a tendency toward embrittlement appears, so the content is set to 0.001.
It was set at 0.1%.

[0008]

EXAMPLES Next, the electrical socket structural component of the present invention will be specifically described by way of examples. With the copper ingot melted in a graphite crucible and the hot water surface coated with charcoal powder, Mg and P were added as master alloys, and Sn was added in the form of pure Sn, and each had the composition shown in Table 1. A Cu alloy was melted and cast into a mold to form an ingot having a diameter of 80 mm and a length of 200 mm. The surface of the ingot was chamfered to a depth of 5 mm, and then 700 Hot extruding at a predetermined heating temperature within a range of up to 850 ° C. to obtain a wire having a diameter of 10 mm, and then cold drawing and intermediate annealing are repeatedly applied to this wire, and the final reduction of reduction in area: 60 %, Diameter: 2.5 mm
The present invention socket structure component materials 1 to 7 and conventional socket structure component materials 1 to 2 by subjecting these wire rods to strain relief annealing at a predetermined temperature within a range of 200 to 400 ° C. for 30 minutes. Were manufactured respectively.

[0009]

[Table 1]

Then, with respect to the various socket structure component materials obtained as a result, the residual deformation rate after stress-added heating was measured for the purpose of evaluating the thermal stress deformability, and the electrical conductivity was evaluated for the purpose of evaluating the thermal conductivity. (% IACS) was measured. Further, in order to evaluate the room temperature strength and the spring property, the room temperature tensile strength was measured, and the spring limit value was measured according to the moment formula test of JIS H3130. The results of these measurements are also shown in Table 1.

As for the residual deformation rate, a test piece having a dimension of length: 115 mm (hereinafter referred to as L ₀ ) was cut out, and this test piece had a horizontal longitudinal groove of length: 110 mm × depth: 3 mm. Bending is set on the jig so that the central part of the test piece bulges upward (the distance between both ends of the test piece at the time of: 110 mm
Is L ₁ ), and in this state, temperature: 180 ° C. to 1000
The distance between both ends of the test piece in the state where the test piece is removed from the jig after being held for a time and heated (hereinafter referred to as L ₂ ).
Was calculated and calculated according to the calculation formula: (L ₀ −L ₂₎ / (L ₀ −L ₁ ) × 100 (%).

[0012]

From the results shown in Table 1, all of the socket structure component materials 1 to 7 of the present invention have excellent room temperature strength and spring properties equivalent to those of the conventional socket structure component materials 1 and 2.
And it is clear that it has excellent thermal stress deformation and conductivity.

As described above, the electric socket structural component of the present invention has excellent heat stress deformability and thermal conductivity, as well as high room temperature strength and spring property, so that it can be used under severe conditions involving heat generation. Even in practical use, it will exhibit excellent performance over a long period of time.

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Manpei Kuwahara 128-7 Ogimachi, Aizuwakamatsu, Fukushima Prefecture Wakamatsu Plant, Mitsubishi Shindoh Co., Ltd. (72) Yoshiji Saito 1-6-2 Ginza, Chuo-ku, Tokyo Within Mitsubishi Shindoh Co., Ltd. (72) Inventor Kazushi Yashiro 1-6-2 Ginza, Chuo-ku, Tokyo Inside Mitsubishi Shindoh Co., Ltd.

Claims (1)

[Claims] 1. A Cu alloy containing, by weight, Mg: 0.1 to 2%, P: 0.001 to 0.1%, and the balance being Cu and inevitable impurities. A Cu alloy electric socket structural part characterized by: