JPH0576094U - Circuit board grounding structure - Google Patents
Circuit board grounding structureInfo
- Publication number
- JPH0576094U JPH0576094U JP1357792U JP1357792U JPH0576094U JP H0576094 U JPH0576094 U JP H0576094U JP 1357792 U JP1357792 U JP 1357792U JP 1357792 U JP1357792 U JP 1357792U JP H0576094 U JPH0576094 U JP H0576094U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- shield case
- ground
- ground plate
- grounding structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】
【目的】 電磁ノイズの発生を確実に抑制するスライド
リップ構造の回路基板の接地構造を提供すること。
【構成】 回路基板２のグランドパターンと導通し、回
路基板２をほぼ覆う接地板３を湾曲させてネジ１０によ
り回路基板２に固定し、シールドケース６に回路基板２
をスライド挿入した時、接地板３の湾曲部がシールドケ
ース６に接触する構造とした。
(57) [Abstract] [Purpose] To provide a grounding structure of a circuit board having a slide lip structure for surely suppressing generation of electromagnetic noise. [Structure] A ground plate 3 which is electrically connected to the ground pattern of the circuit board 2 and which almost covers the circuit board 2 is curved and fixed to the circuit board 2 with a screw 10, and the circuit board 2 is attached to the shield case 6.
The structure is such that the curved portion of the ground plate 3 comes into contact with the shield case 6 when the slide is inserted.
Description
【０００１】[0001]
本考案は、パーソナルコンピュータ、プリンタなどの電子機器に使用される回 路基板の接地構造に関するものである。更に詳しくは、本体外に引き出し可能な いわゆるスライドリップ構造の回路基板の接地構造に関する。 The present invention relates to a grounding structure for a circuit board used in electronic devices such as personal computers and printers. More specifically, the present invention relates to a so-called slide-lip structure circuit board grounding structure that can be pulled out from the main body.
【０００２】[0002]
図４は、従来の電子機器に用いられているスライドリップ構造の回路基板の接 地構造を説明する図である。図４において、２は回路基板であり、６は回路基板 ２をシールドするシールドケースで回路基板２はシールドケース６の中に収納さ れる。回路基板２にはグランドパターンと導通した金属製のブラケット５が、収 納時にシールドケース６の開口部に接触し塞ぐ位置に実装されている。このブラ ケット５により回路基板２はシールドケース６の入口付近で接地される。 FIG. 4 is a diagram illustrating a ground structure of a circuit board having a slide lip structure used in a conventional electronic device. In FIG. 4, 2 is a circuit board, 6 is a shield case for shielding the circuit board 2, and the circuit board 2 is housed in the shield case 6. A metal bracket 5 that is electrically connected to the ground pattern is mounted on the circuit board 2 at a position where it comes into contact with and closes the opening of the shield case 6 during storage. The circuit board 2 is grounded by the bracket 5 near the entrance of the shield case 6.
【０００３】[0003]
しかし前述の従来技術においては、コントローラ基板２とシールドケース６の 接地は、シールドケース６の入口付近でブラケット５によって行われているだけ であった為、回路基板２の接地が不十分であり電磁ノイズの発生を抑えきれない 。その為に電磁ノイズを抑える特殊な電子部品を回路基板２に実装することが必 要となっていた。また、それによりコスト高ともなっていた。 However, in the above-mentioned conventional technique, the grounding of the controller board 2 and the shield case 6 is performed only by the bracket 5 near the entrance of the shield case 6, so the grounding of the circuit board 2 is insufficient and electromagnetic waves are not generated. The generation of noise cannot be suppressed. Therefore, it is necessary to mount a special electronic component that suppresses electromagnetic noise on the circuit board 2. In addition, this also resulted in higher costs.
【０００４】 本考案は、この様な問題に鑑みなされたものであって、その目的とするところ は、電磁ノイズを抑える為の電子部品を回路基板に実装することなく、電磁ノイ ズの発生を確実に抑える接地構造を提示することにある。The present invention has been made in view of such a problem, and an object thereof is to prevent generation of electromagnetic noise without mounting an electronic component for suppressing electromagnetic noise on a circuit board. It is to present a grounding structure that can be reliably suppressed.
【０００５】[0005]
この様な課題を解決する為に、シールドケースにスライド挿入する回路基板の グランドパターン上に、導電部材からなる接地板を湾曲させて固定し、前記回路 基板をスライド挿入時に、前記シールドケースと前記接地板の湾曲部が接触する 構造とした。 In order to solve such a problem, the ground plate made of a conductive member is curved and fixed on the ground pattern of the circuit board which is slidably inserted into the shield case, and when the circuit board is slid and inserted, the shield case and the The structure is such that the curved part of the ground plate contacts.
【０００６】[0006]
図１は、本考案の実施例であるプリンタの回路基板実装部の斜視図であり、図 ２は、その断面図である。図１及び図２において、１はマザー基板であり、回路 基板２を挿入して接続するためのコネクタ８、ＩＣカードを挿入するためのコネ クタ９などが実装されている。 1 is a perspective view of a circuit board mounting portion of a printer according to an embodiment of the present invention, and FIG. 2 is a sectional view thereof. 1 and 2, reference numeral 1 denotes a mother board on which a connector 8 for inserting and connecting the circuit board 2 and a connector 9 for inserting an IC card are mounted.
【０００７】 コントローラ基板２には、マザー基板１と接続するためのコネクタ７のほかに 、図示していないがＣＰＵ，ＴＴＬ，ＲＡＭなどが実装されている。On the controller board 2, in addition to the connector 7 for connecting to the mother board 1, a CPU, TTL, RAM and the like (not shown) are mounted.
【０００８】 ３は厚み０.１ｍｍ程度の銅板、あるいはステンレス鋼板などバネ性を持った 金属板からプレス成形した接地板であり、回路基板２のグランドパターン上にネ ジ１０によって固定され接地されており、回路基板２をスライド挿入したときに 、シールドケース６と接触するように設定されている。また、接地板３の基板側 の面のネジ止め部以外の箇所には、接地板３が回路基板２に実装されている部品 と接触、ショートしないように絶縁シート４が貼り付けられている。Reference numeral 3 denotes a ground plate which is press-molded from a copper plate having a thickness of about 0.1 mm or a metal plate having a spring property such as a stainless steel plate, which is fixed on the ground pattern of the circuit board 2 by the screw 10 and grounded. It is set so as to contact the shield case 6 when the circuit board 2 is slid and inserted. An insulating sheet 4 is attached to a portion of the surface of the ground plate 3 other than the screwed portion so that the ground plate 3 does not come into contact with or short-circuit with the components mounted on the circuit board 2.
【０００９】 ５はブラケットであり、コントローラ基板２がシールドケース６にスライド挿 入されたときに、前記シールドケース６の入口部に接触し開口部を塞ぎ接地され る。Reference numeral 5 denotes a bracket which, when the controller board 2 is slid into the shield case 6, contacts the inlet of the shield case 6 and closes the opening to be grounded.
【００１０】 この様な構造にすることで、回路基板２とシールドケース６の十分な接地が行 われ、回路基板２のグランドレベルが安定し、電磁ノイズの発生が抑えられる。 図３は本考案の別の実施例を示す図である。この実施例では、接地板３を２箇 所湾曲させてグランドパターン上に６箇所で接地し、シールドケース６と接触す るところを２箇所にしている。これにより図１の例に比較して、接地板３とシー ルドケース６の接地面積を２倍にすることができ、また回路基板２の中央部で接 地されるため、回路基板２とシールドケース６の接地がより確実になされ、回路 基板２のアースが強化される。With such a structure, the circuit board 2 and the shield case 6 are sufficiently grounded, the ground level of the circuit board 2 is stabilized, and generation of electromagnetic noise is suppressed. FIG. 3 is a view showing another embodiment of the present invention. In this embodiment, the ground plate 3 is curved at two places and grounded at six places on the ground pattern, and two places are in contact with the shield case 6. As a result, compared with the example of FIG. 1, the ground area of the ground plate 3 and the shield case 6 can be doubled, and the circuit board 2 and the shield case can be grounded because they are grounded at the central portion. The grounding of 6 is made more reliable, and the grounding of the circuit board 2 is strengthened.
【００１１】[0011]
以上実施例で説明したように本考案によれば、スライド挿入する回路基板のグ ランドパターン上にシート状の導電部材で構成された接地板を湾曲させて固定し 、回路基板をスライド挿入したときにシールド板と接触するようにしているため 、スライドリップ構造の回路基板でありながら確実に接地することができる。こ のため、回路基板のグランドレベルが安定し、電磁ノイズを抑える為の電子部品 を使用しなくても電磁ノイズの発生を確実に抑えることができ、電波障害を起こ さない品質の良い電子機器を安価に提供することができる。 As described in the above embodiments, according to the present invention, when a circuit board is slid and inserted, a ground plate made of a sheet-shaped conductive member is curved and fixed on the ground pattern of the circuit board to be slid and inserted. Since the circuit board is in contact with the shield plate, the circuit board of the slide lip structure can be surely grounded. As a result, the ground level of the circuit board is stable, and the generation of electromagnetic noise can be reliably suppressed without the use of electronic components to suppress electromagnetic noise. Can be provided at low cost.
【００１２】 また、接地板を湾曲させてシールドケースに接地させているため、回路基板の 抜き差しが無理なくスムーズに行うことができるといった効果も有する。Further, since the ground plate is curved and grounded to the shield case, there is an effect that the circuit board can be smoothly inserted and removed without difficulty.
【図１】本考案の実施例であるプリンタの回路基板実装
部の斜視図。FIG. 1 is a perspective view of a circuit board mounting portion of a printer that is an embodiment of the present invention.
【図２】本考案の実施例であるプリンタの回路基板実装
部の断面図。FIG. 2 is a sectional view of a circuit board mounting portion of the printer according to the embodiment of the present invention.
【図３】本考案の別の実施例であるプリンタの回路基板
実装部の斜視図。FIG. 3 is a perspective view of a circuit board mounting portion of a printer which is another embodiment of the present invention.
【図４】従来の回路基板の接地構造を示す斜視図。FIG. 4 is a perspective view showing a conventional grounding structure of a circuit board.
１ マザー基板 ２ 回路基板 ３ 接地板 ４ 絶縁シート ５ ブラケット ６ シールドケース ７ コネクタ ８ コネクタ ９ コネクタ １０ ネジ 1 Mother Board 2 Circuit Board 3 Ground Plate 4 Insulation Sheet 5 Bracket 6 Shield Case 7 Connector 8 Connector 9 Connector 10 Screw
Claims (1)
基板のグランドパターン上に、導電部材からなる接地板
を湾曲させて固定し、前記回路基板をスライド挿入時
に、前記シールドケースと前記接地板の湾曲部が接触す
る構造としたことを特徴とする回路基板の接地構造。1. A curved plate of a ground plate made of a conductive member is fixed on a ground pattern of a circuit board slidably inserted into a shield case, and when the circuit board is slid and inserted, a curved portion of the shield case and the ground plate. A grounding structure for a circuit board, which is characterized in that it makes contact with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1357792U JPH0576094U (en) | 1992-03-16 | 1992-03-16 | Circuit board grounding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1357792U JPH0576094U (en) | 1992-03-16 | 1992-03-16 | Circuit board grounding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0576094U true JPH0576094U (en) | 1993-10-15 |
Family
ID=11837025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1357792U Pending JPH0576094U (en) | 1992-03-16 | 1992-03-16 | Circuit board grounding structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0576094U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013149688A (en) * | 2012-01-17 | 2013-08-01 | Japan Oclaro Inc | Pluggable optical communication module |
-
1992
- 1992-03-16 JP JP1357792U patent/JPH0576094U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013149688A (en) * | 2012-01-17 | 2013-08-01 | Japan Oclaro Inc | Pluggable optical communication module |
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